Anti-oxidation circuit board

Abstract

The utility model relates to the technical field of printed circuit boards, and discloses an anti-oxidation circuit board, which comprises a circuit board main body, the upper side and the lower side of the circuit board main body are fixedly connected with anti-oxidation layers, the front side and the rear side of the right part of the circuit board main body are provided with communicating circular holes, and the right side of the inner wall of each communicating circular hole is fixedly connected with an intelligent sensor. The left side of the intelligent sensor is fixedly connected with a micro repair device, the right side of the micro repair device is communicated with an air bag, a plurality of transverse grooves are formed in the top of the circuit board main body, and a communication groove is formed in the middle of the top side of the circuit board main body. According to the utility model, when the intelligent sensor detects that a preset threshold value is exceeded, the micro repairing device sprays a proper amount of antioxidant in the inner transverse groove and the communication groove onto the circuit board main body through the pressure effect of the air bag, so that the anti-oxidation state of the surface of the circuit board is quickly recovered, and stable operation is maintained.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board technology, and in particular to an antioxidant circuit board. Background Technology

[0002] In the field of modern communications, 5G base stations and satellite communication equipment have extremely high requirements for circuit boards. Anti-oxidation circuit boards, with their special materials and processes, can stably maintain the efficient transmission of circuit signals under harsh conditions such as complex electromagnetic environments, alternating high and low temperatures, and humidity. In the field of industrial control, precision instruments in automated production lines rely on anti-oxidation circuit boards to ensure precise control of the production process during long-term continuous operation. In the aerospace field, anti-oxidation circuit boards are the key to ensuring the stable operation of aircraft electronic systems and helping to explore the vast universe.

[0003] A search revealed Chinese patent publication number CN221354603U, which discloses a multilayer anti-oxidation printed circuit board, including a circuit board body. A resistor, an inductor, a diode, gold fingers, and a main chip are fixedly connected to the upper outer surface of the circuit board body. When using this device, a fan frame and fan blades can work together to fix a base plate to the lower end of the circuit board body via a connecting sleeve. The rotation of the fan blades dissipates heat from the printed circuit board, reducing the temperature of the electronic components and preventing damage to the internal components due to high temperatures during use. This effectively improves the lifespan and efficiency of the printed circuit board. However, in practical use, the surface coating is easily damaged, material modification is costly and has limited effectiveness, and encapsulation technology sacrifices portability and thermal management. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides an antioxidant circuit board, which aims to improve the existing technology where the surface coating is easily damaged, the material modification is costly and has limited effect, and the encapsulation technology sacrifices portability and thermal management.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an anti-oxidation circuit board, comprising a circuit board body, an anti-oxidation layer fixedly connected to the upper and lower sides of the circuit board body, a connecting circular hole opened on the front and rear sides of the right side of the circuit board body, a smart sensor fixedly connected to the right side of the inner wall of the connecting circular hole, a micro-repair device fixedly connected to the left side of the smart sensor, an airbag connected to the right side of the micro-repair device, multiple transverse grooves opened on the top of the circuit board body, a connecting groove opened in the middle of the top side of the circuit board body, the connecting groove being connected to the multiple transverse grooves, limit mounting holes opened at the four corners of the top of the circuit board body, and a heat dissipation support mechanism provided at the bottom of the circuit board body.

[0006] Through the above technical solution: the circuit board body is made of multi-layer composite material, possessing both good conductivity and insulation properties. The anti-oxidation layer is made of biodegradable material, which can continuously release antioxidant components from both sides of the circuit board body, inhibiting the contact reaction between oxygen and the circuit board body, and playing a preliminary anti-oxidation protection role. The intelligent sensor is set inside the circuit board body, which automatically detects the oxidation level of the circuit board every hour and transmits the detection data to the connected micro-repair device. When the oxidation value detected by the intelligent sensor exceeds the preset threshold, it will immediately send a signal to the micro-repair device, which will then start. Through the pressure of the airbag, an appropriate amount of antioxidant in the transverse groove and connecting groove in the storage unit is sprayed onto the designated oxidation area on the circuit board body. These antioxidants quickly react with the oxidized parts, neutralizing the oxidation products, thereby quickly restoring the anti-oxidation state of the circuit board surface, ensuring that the circuit board can effectively resist the performance damage caused by oxidation and maintain stable operation during long-term use.

[0007] As a further description of the above technical solution:

[0008] The heat dissipation support mechanism includes two T-shaped blocks, which are respectively fixedly connected to the bottom front and rear sides of the circuit board body. Multiple heat sinks are fixedly connected to the outer walls of the two T-shaped blocks on the front and rear sides. The bottom front and rear sides of the heat sinks are provided with notches, the outer walls of the heat sinks are provided with multiple ventilation holes, and the front and rear sides of the heat sinks are provided with inclined grooves.

[0009] The above technical solution provides the following: the T-shaped block supports the circuit board body to a certain height, facilitating airflow; the heat sink guides heat from above the circuit board body to this height, allowing for better heat dissipation under airflow; the notch facilitates the T-shaped block's engagement with the installation position; the ventilation holes further enhance heat dissipation efficiency; and the inclined grooves smooth the sides of the heat sink, reducing damage from burrs, thus improving the heat dissipation effect of the circuit board body.

[0010] As a further description of the above technical solution:

[0011] A cover block is fixedly connected to the lower middle part of the top side of the circuit board body, and a heat sink is fixedly connected to the upper middle part of the top side of the circuit board body. A heat pipe is connected to the right side of the cover block, and one end of the heat pipe is connected to the left side of the heat sink.

[0012] The above technical solution allows the cover to easily absorb heat from the top of the circuit board, and the heat is transferred to the heat sink via heat pipes. Finally, the heat sink can quickly dissipate the heat generated by the circuit board, ensuring that the circuit board operates stably within a suitable temperature range.

[0013] As a further description of the above technical solution:

[0014] Multiple diodes are fixedly connected to the top right side of the circuit board body, and multiple connection ports are fixedly connected to the top left front end of the circuit board body.

[0015] The above technical solution utilizes diodes for fast response and excellent rectification and voltage regulation performance, and the connection port allows for convenient connection to external devices to achieve data transmission.

[0016] As a further description of the above technical solution:

[0017] A slot is fixedly connected to the top right side of the circuit board body, and an electromagnetic induction block is fixedly connected to the top front side of the circuit board body.

[0018] The above technical solution provides a foundation for the circuit board to achieve functions such as wireless charging and short-range communication by using a card slot to securely hold various compatible memory cards or modules and an electromagnetic induction block to sense changes in the surrounding magnetic field.

[0019] As a further description of the above technical solution:

[0020] Multiple graphics card slots are fixedly connected to the top rear side of the circuit board body, and a signal interface is fixedly connected to the top rear right end of the circuit board body.

[0021] The above technical solution allows for close compatibility with various graphics card interfaces via the graphics card slot, ensuring stable and efficient data transmission. The signal interface facilitates easy connection to external signal sources, providing a guarantee for the circuit board to achieve rich communication and data interaction functions.

[0022] As a further description of the above technical solution:

[0023] A power interface is fixedly connected to the top rear side of the circuit board body, and all power interfaces are electrically connected to the circuit board body.

[0024] The above technical solution enables the use of various power adapters through the power interface, ensuring a stable and safe power supply to all components of the circuit board, providing reliable power support for the normal operation of the entire circuit board.

[0025] As a further description of the above technical solution:

[0026] A chip mounting slot is fixedly connected to the top right side of the main body of the circuit board, and the inner wall of the chip mounting slot is rounded.

[0027] The above technical solution achieves a high degree of compatibility between the chip mounting slot and common chip package specifications. Its inner wall is specially rounded to avoid damage to the chip pins during chip installation, ensure smoother chip insertion, and facilitate better filling of the heat dissipation medium between the chip and the mounting slot, thereby improving heat dissipation efficiency.

[0028] This utility model has the following beneficial effects:

[0029] 1. In this utility model, the antioxidant layer can continuously release antioxidant components from both sides of the circuit board body, inhibiting the contact reaction between oxygen and the circuit board body. When the intelligent sensor detects that the value exceeds the preset threshold, the micro repair device will spray an appropriate amount of antioxidant from the inner transverse groove and the connecting groove onto the circuit board body through the pressure of the airbag, thereby quickly restoring the antioxidant state of the circuit board surface and maintaining stable operation.

[0030] 2. In this utility model, the T-shaped block supports the main body of the circuit board, promoting airflow and heat dissipation. The heat sink guides the heat, the notch facilitates the installation of the T-shaped block, the ventilation hole improves heat dissipation efficiency, and the inclined groove reduces burrs, thereby optimizing the heat dissipation effect. Attached Figure Description

[0031] Figure 1 This is a perspective view of an antioxidant circuit board proposed in this utility model;

[0032] Figure 2 This is a top view of an antioxidant circuit board proposed in this utility model;

[0033] Figure 3 This is a partial exploded view of an antioxidant circuit board proposed in this utility model;

[0034] Figure 4 for Figure 3 Enlarged view of point A;

[0035] Figure 5This is a schematic diagram of a heat dissipation support mechanism for an anti-oxidation circuit board proposed in this utility model.

[0036] Legend:

[0037] 1. Circuit board body; 2. Heat dissipation support mechanism; 201. T-shaped block; 202. Heat sink; 203. Notch; 204. Ventilation hole; 205. Inclined groove; 3. Anti-oxidation layer; 4. Circular connecting hole; 5. Smart sensor; 6. Miniature repair device; 7. Airbag; 8. Horizontal groove; 9. Connecting groove; 10. Limiting mounting hole; 11. Diode; 12. Connection port; 13. Heat sink; 14. Card slot; 15. Electromagnetic induction block; 16. Graphics card slot; 17. Signal interface; 18. Cover block; 19. Heat pipe; 20. Power interface; 21. Chip mounting slot. Detailed Implementation

[0038] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0039] Reference Figure 1 , Figure 3 and Figure 4 An embodiment of this utility model provides an antioxidant circuit board, comprising a circuit board body 1, with antioxidant layers 3 fixedly connected to the upper and lower sides of the circuit board body 1, and a connecting circular hole 4 opened on the front and rear sides of the right side of the circuit board body 1, with a smart sensor 5 fixedly connected to the right side of the inner wall of the connecting circular hole 4, a micro repair device 6 fixedly connected to the left side of the smart sensor 5, and an airbag 7 connected to the right side of the micro repair device 6, with multiple horizontal grooves 8 opened on the top of the circuit board body 1, and a connecting groove 9 opened in the middle of the top side of the circuit board body 1, with the connecting groove 9 connected to the multiple horizontal grooves 8, and limit mounting holes 10 opened at the four corners of the top of the circuit board body 1, and a heat dissipation support mechanism 2 provided at the bottom of the circuit board body 1;

[0040] Specifically, the circuit board body 1 is made of multi-layer composite material, possessing both good conductivity and insulation properties. Its upper and lower sides are uniformly covered with an anti-oxidation layer 3, which is made of biodegradable material and contains antioxidants. This layer continuously releases antioxidant components from both sides of the circuit board body 1, inhibiting the contact reaction between oxygen and the circuit board body 1, thus providing initial antioxidant protection. A smart sensor 5 is embedded in the right side of the inner wall of the connecting circular hole 4 on the front and rear sides of the right side of the circuit board body 1. This sensor automatically detects the oxidation level of the circuit board every hour and transmits the detection data to a connected micro-repair device 6. When the oxidation value detected by the smart sensor 5 exceeds a preset threshold, it immediately sends a signal to the micro-repair device 6. The micro-repair device 6 then activates, using the pressure of the airbag 7 to spray an appropriate amount of antioxidant from the transverse groove 8 and connecting groove 9 within the storage unit onto the designated oxidation area on the circuit board body 1. These antioxidants quickly react with the oxidized parts, neutralizing the oxidation products and rapidly restoring the anti-oxidation state of the circuit board surface. This ensures that the circuit board can effectively resist performance damage caused by oxidation and maintain stable operation during long-term use.

[0041] Reference Figure 5 The heat dissipation support mechanism 2 includes two T-shaped blocks 201, which are fixedly connected to the bottom front and rear sides of the circuit board body 1 respectively. Multiple heat sinks 202 are fixedly connected to the outer walls of the two T-shaped blocks 201 on the front and rear sides. The bottom front and rear sides of the heat sink 202 are provided with notches 203, the outer walls of the heat sink 202 are provided with multiple ventilation holes 204, and the front and rear sides of the heat sink 202 are provided with inclined grooves 205.

[0042] Specifically, the T-shaped block 201 can support the circuit board body 1 at a certain height to facilitate airflow. At the same time, the heat sink 202 guides the heat above the circuit board body 1 to the upper part, allowing the heat to dissipate better under the airflow. The notch 203 makes it easy for the T-shaped block 201 to engage in the installation position. The ventilation hole 204 further increases the heat dissipation efficiency. The inclined groove 205 makes the sides of the heat sink 202 smooth, thereby reducing the damage from burrs and making the heat dissipation effect of the circuit board body 1 better.

[0043] Reference Figure 1 and Figure 2A cover 18 is fixedly connected to the lower middle part of the top side of the circuit board body 1, and a heat sink 13 is fixedly connected to the upper middle part of the top side of the circuit board body 1. A heat pipe 19 is connected to the right side of the cover 18, and one end of the heat pipe 19 is connected to the left side of the heat sink 13. The cover 18 can easily absorb the heat above the circuit board body 1, and transfer the heat to the top of the heat sink 13 through the heat pipe 19. Finally, the heat sink 13 can quickly dissipate the heat generated by the circuit board during operation, ensuring that the circuit board works stably within a suitable temperature range. Multiple diodes 11 are fixedly connected to the top right side of the circuit board body 1. Multiple connection ports 12 are fixedly connected to the top left front end of the circuit board body 1. The diode 11 has a fast response speed and good rectification and voltage regulation performance. It can be used to easily connect to external devices through the connection ports 12 to realize data transmission. A card slot 14 is fixedly connected to the top right side of the circuit board body 1, and an electromagnetic induction block 15 is fixedly connected to the top front side of the circuit board body 1. The card slot 14 can firmly hold various compatible memory cards or modules. The electromagnetic induction block 15 can sensitively sense changes in the surrounding magnetic field, providing basic support for the circuit board to realize functions such as wireless charging and short-range communication.

[0044] Specifically, the cover block 18 can easily absorb the heat above the main body of the circuit board 1, and the heat is transferred to the heat sink 13 through the heat pipe 19. Finally, the heat sink 13 can quickly dissipate the heat generated by the circuit board, ensuring that the circuit board works stably within a suitable temperature range. The diode 11 provides fast response speed and good rectification and voltage regulation performance. The connection port 12 can be used to easily connect to external devices to realize data transmission. The card slot 14 can securely hold various compatible memory cards or modules. The electromagnetic induction block 15 can sensitively sense changes in the surrounding magnetic field, providing basic support for the circuit board to realize functions such as wireless charging and short-range communication.

[0045] Reference Figure 1 and Figure 2The circuit board body 1 has multiple graphics card slots 16 fixedly connected to its top rear side, and a signal interface 17 fixedly connected to its top rear right side. The graphics card slots 16 can fit tightly with the interfaces of various graphics cards to ensure the stability and efficiency of data transmission. The signal interface 17 can be easily connected to external signal sources, providing a guarantee for the circuit board to realize rich communication and data interaction functions. The circuit board body 1 has a power interface 20 fixedly connected to its top middle rear side. The power interface 20 is electrically connected to the circuit board body 1. The power interface 20 can be adapted to various power adapters to ensure that the power can be stably and safely supplied to various components of the circuit board, providing reliable power support for the normal operation of the entire circuit board. The circuit board body 1 has a chip mounting slot 21 fixedly connected to its top middle right side. The inner wall of the chip mounting slot 21 is rounded. The chip mounting slot 21 is highly matched with common chip packaging specifications. Its inner wall is specially rounded to avoid damage to the chip pins during chip installation and to ensure smoother chip insertion. At the same time, it helps the heat dissipation medium to better fill between the chip and the mounting slot, improving heat dissipation efficiency.

[0046] Specifically, the graphics card slot 16 can be tightly fitted with the interfaces of various graphics cards, ensuring the stability and efficiency of data transmission. The signal interface 17 can be easily connected to external signal sources, providing a guarantee for the circuit board to realize rich communication and data interaction functions. The power interface 20 can be adapted to various power adapters, ensuring that the power supply can be stably and safely supplied to various components of the circuit board, providing reliable power support for the normal operation of the entire circuit board. The chip mounting slot 21 is highly matched with common chip package specifications, and its inner wall is specially rounded to avoid damage to the chip pins during chip installation, and also to ensure smoother chip insertion. At the same time, it helps the heat dissipation medium to better fill between the chip and the mounting slot, improving heat dissipation efficiency.

[0047] Working principle: First, the circuit board body 1 is made of multi-layer composite material, which has excellent conductivity and insulation properties. Its upper and lower surfaces are uniformly coated with an anti-oxidation layer 3. This layer is made of biodegradable material and contains antioxidants. The antioxidants can be continuously released from both sides of the circuit board body 1 to inhibit the contact reaction between oxygen and the circuit board body 1, thereby providing preliminary anti-oxidation protection. On the right side of the inner wall of the connecting circular hole 4 on the front and rear sides of the right side of the circuit board body 1, a smart sensor 5 is embedded. The smart sensor 5 is integrated inside the circuit board body 1 and can automatically detect the oxidation level of the circuit board once per hour and transmit the detection data to the connected micro-repair device 6. Once the oxidation value detected by the smart sensor 5 exceeds the preset threshold, it will immediately send a signal to the micro-repair device 6. The micro-repair device 6 is then activated. Through the pressure applied by the airbag 7, an appropriate amount of antioxidant in the transverse groove 8 and the connecting groove 9 in the storage unit is sprayed onto the specific oxidation area on the circuit board body 1. These antioxidants react quickly with the oxidation part, neutralize the oxidation products, and quickly restore the anti-oxidation state of the circuit board surface, ensuring that the circuit board can effectively resist the performance damage caused by oxidation during long-term use and maintain its stable operation.

[0048] Furthermore, through the heat dissipation support mechanism 2, the T-shaped block 201 can lift the circuit board body 1 to a certain height to promote smooth airflow. At the same time, the heat sink 202 can guide the heat generated above the circuit board body 1 to the top and dissipate the heat under the action of the airflow. The T-shaped block 201 is easy to lock into the installation position through the notch 203, while the ventilation hole 204 further improves the heat dissipation efficiency. The design of the inclined groove 205 makes the two sides of the heat sink 202 smooth, reducing the damage that burrs may cause, thereby optimizing the heat dissipation performance of the circuit board body 1.

[0049] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An antioxidant circuit board, comprising a circuit board body (1), characterized in that: Antioxidant layers (3) are fixedly connected to the upper and lower sides of the circuit board body (1). A circular hole (4) is opened on the front and rear sides of the right side of the circuit board body (1). A smart sensor (5) is fixedly connected to the right side of the inner wall of the circular hole (4). A micro repair device (6) is fixedly connected to the left side of the smart sensor (5). An airbag (7) is connected to the right side of the micro repair device (6). A number of horizontal grooves (8) are opened on the top of the circuit board body (1). A connecting groove (9) is opened in the middle of the top side of the circuit board body (1). The connecting groove (9) is connected to the multiple horizontal grooves (8). Limiting installation holes (10) are opened at the four corners of the top of the circuit board body (1). A heat dissipation support mechanism (2) is provided at the bottom of the circuit board body (1).

2. The antioxidant circuit board according to claim 1, characterized in that: The heat dissipation support mechanism (2) includes two T-shaped blocks (201). The two T-shaped blocks (201) are fixedly connected to the bottom front and rear sides of the circuit board body (1). Multiple heat sinks (202) are fixedly connected to the outer walls of the two T-shaped blocks (201) on the front and rear sides. The bottom front and rear sides of the heat sinks (202) are provided with notches (203). The outer walls of the heat sinks (202) are provided with multiple ventilation holes (204). The front and rear sides of the heat sinks (202) are provided with inclined grooves (205).

3. The antioxidant circuit board according to claim 1, characterized in that: A cover block (18) is fixedly connected to the lower middle part of the top side of the circuit board body (1), and a heat sink (13) is fixedly connected to the upper middle part of the top side of the circuit board body (1). A heat pipe (19) is connected to the right side of the cover block (18), and one end of the heat pipe (19) is connected to the left side of the heat sink (13).

4. The antioxidant circuit board according to claim 1, characterized in that: Multiple diodes (11) are fixedly connected to the top right side of the circuit board body (1), and multiple connection ports (12) are fixedly connected to the top left front end of the circuit board body (1).

5. An antioxidant circuit board according to claim 1, characterized in that: A slot (14) is fixedly connected to the top right side of the circuit board body (1), and an electromagnetic induction block (15) is fixedly connected to the top front side of the circuit board body (1).

6. The antioxidant circuit board according to claim 1, characterized in that: Multiple graphics card slots (16) are fixedly connected to the top rear side of the circuit board body (1), and a signal interface (17) is fixedly connected to the right end of the top rear side of the circuit board body (1).

7. An antioxidant circuit board according to claim 1, characterized in that: A power interface (20) is fixedly connected to the top rear side of the circuit board body (1), and the power interface (20) is electrically connected to the circuit board body (1).

8. An antioxidant circuit board according to claim 1, characterized in that: A chip mounting slot (21) is fixedly connected to the top right side of the circuit board body (1), and the inner wall of the chip mounting slot (21) is rounded.

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