Multi-layer circuit board pressing device

By using a servo motor-driven clamping and lifting assembly, combined with a slide rail structure and a heating plate, the problems of material misalignment and difficulty in removing finished products in multi-layer circuit board pressing devices are solved, achieving efficient and precise pressing and convenient unloading.

CN223626088UActive Publication Date: 2025-12-02HANGZHOU MINLI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202422808017.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-18
Publication Date
2025-12-02
Estimated Expiration
2034-11-18

AI Technical Summary

Technical Problem

Existing multilayer circuit board laminating devices are prone to material misalignment and insecure fixing under high pressure, resulting in large deviations in the finished product after lamination and making it difficult to remove the finished product.

Method used

The clamping and lifting components are driven by servo motors. The bidirectional screw and slide rail structure enables precise positioning and fixation of multi-layer circuit boards. The heating plate and pressing component improve the pressing efficiency, and the servo motor pushing component facilitates unloading.

Benefits of technology

It achieves precise positioning and efficient lamination of multilayer circuit boards, reduces lamination deviation, simplifies the finished product removal process, and improves production efficiency and safety.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a multilayer circuit board pressing device which comprises a working table, the upper end of the working table is fixedly connected with a heating plate, the left side and the right side of the working table are both fixedly connected with blanking plates, and the left side and the right side of the upper end of the working table are respectively provided with a first open groove and a second open groove. According to the multi-layer circuit board pressing device, the multi-layer circuit board to be pressed is arranged on the heating plate, the clamping assembly can be driven to move to clamp and limit the multi-layer circuit board through the arranged second servo motor and the bidirectional screw rod, and the pressing assembly on the mounting assembly is driven to descend through the arranged lifting assembly, so that the multi-layer circuit board can be pressed; in the pressing process, the heating plate and the material pressing assembly can heat the multilayer circuit board, the pressing efficiency of the multilayer circuit board can be improved, and after pressing is finished, the first servo motor and the first screw can drive the material pushing assembly to move, and the laminated multilayer circuit board is discharged through the discharging plate.
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Description

Technical Field

[0001] This utility model relates to the field of pressing device technology, and in particular to a multilayer circuit board pressing device. Background Technology

[0002] Multilayer circuit board laminating equipment is mainly used for laminating multilayer circuit boards. The production process of multilayer circuit boards mainly includes design, printing, lamination, cutting, cyanide-free metal plating, and surface treatment. Among these, lamination mainly uses high temperature and high pressure to press two or more raw material boards together. This method is mainly used to better fix electronic components, establish more stable electrical connections, improve the reliability of the circuit board, and to a certain extent ensure the safety of the circuit board in use. Cyanide-free metal plating is mainly used in the gold plating process. Using cyanide-free gold plating can effectively remove cyanide, a toxic substance, which is also conducive to improving the safety of subsequent use.

[0003] Currently, existing multilayer circuit board laminating devices may experience misalignment of the raw materials during lamination under high pressure after placement. Furthermore, the inability to effectively secure the materials during placement can lead to misalignment between materials, resulting in greater deviations in the final laminated product. Additionally, after lamination, the materials may stick to the substrate, making removal difficult or cumbersome. To overcome these disadvantages, this invention provides a multilayer circuit board laminating device. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a multilayer circuit board laminating device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a multi-layer circuit board pressing device, including a worktable, a heating plate fixedly connected to the upper end of the worktable, and feeding plates fixedly connected to both the left and right sides of the worktable. A first slot and a second slot are respectively opened on the left and right sides of the upper end of the worktable. A limit rod is fixedly connected inside the first slot, and a bidirectional screw is rotatably connected inside the second slot. Clamping components are provided on both the front and rear sides between the first slot and the second slot. A first slide rail is fixedly connected to the front end of the worktable, and a first screw is rotatably connected inside the first slide rail. A pushing component is provided on one side of the upper end of the first slide rail. A pressing component is provided above the heating plate. A lifting component is fixedly connected to the rear end of the worktable, and an installation component is provided at the front end of the lifting component.

[0006] Furthermore, a second servo motor is fixedly connected to one end of the rear side of the worktable, and the output end of the second servo motor is fixedly connected to one end of the bidirectional screw.

[0007] Furthermore, the clamping assembly includes a clamping plate, and a first connecting block is fixedly connected to both sides of the bottom end of the clamping plate. The first connecting block on one side is threadedly connected to one side of the bidirectional screw, and the first connecting block on the other side is slidably connected to the limiting rod.

[0008] Furthermore, a first servo motor is fixedly connected to one end of the first slide rail, and the output end of the first servo motor is fixedly connected to one end of the first screw.

[0009] Furthermore, the pushing assembly includes a pushing plate, and a second connecting block is fixedly connected to one side of the bottom end of the pushing plate. The second connecting block is slidably connected to the first slide rail and threadedly connected to the first screw.

[0010] Furthermore, the lifting assembly includes a second slide rail fixedly connected to the worktable, a second screw rotatably connected inside the second slide rail, a third servo motor fixedly connected to the upper end of the second slide rail, and the output end of the third servo motor fixedly connected to the upper end of the second screw.

[0011] Furthermore, the mounting assembly includes a mounting plate that is slidably connected to the second slide rail and threadedly connected to the second screw. A mounting rod is fixedly connected to the front side of the bottom end of the mounting plate. The pressing assembly includes a pressure plate that is bolted to the mounting rod, and a heating wire is provided inside the pressure plate.

[0012] The beneficial effects of this utility model are:

[0013] In use, this multi-layer circuit board pressing device places the multi-layer circuit board to be pressed on a heating plate. A second servo motor and a bidirectional screw drive the clamping assembly to move and clamp the multi-layer circuit board. A lifting assembly drives the pressing assembly on the mounting assembly to descend, thereby pressing the multi-layer circuit board. During the pressing process, the heating plate and the pressing assembly heat the multi-layer circuit board, which can improve the pressing efficiency. After pressing, the first servo motor and the first screw drive the pushing assembly to move and unload the pressed multi-layer circuit board through the unloading plate. Attached Figure Description

[0014] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 : Front view of this utility model;

[0016] Figure 2 : Schematic diagram of the installation structure of the bidirectional screw and the first limiting rod of this utility model;

[0017] Figure 3 : A schematic diagram of the clamping component structure of this utility model;

[0018] Figure 4 : A schematic diagram of the material pushing component structure of this utility model;

[0019] Figure 5 : A schematic diagram of the installation component structure of this utility model;

[0020] Figure 6 : Schematic diagram of the heating wire installation structure of this utility model.

[0021] The attached figures are labeled as follows:

[0022] 1. Workbench; 2. Heating plate; 3. Feeding plate; 4. First slide rail; 5. Pushing assembly; 6. Clamping assembly; 7. Lifting assembly; 8. Mounting assembly; 9. Pressing assembly; 10. First screw; 11. First servo motor; 12. Limiting rod; 13. First slot; 14. Second slot; 15. Bidirectional screw; 16. Second servo motor; 17. Second slide rail; 18. Second screw; 19. Third servo motor; 20. Clamping plate; 21. First connecting block; 22. Pushing plate; 23. Second connecting block; 24. Mounting plate; 25. Mounting rod; 26. Pressure plate; 27. Heating wire. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0024] like Figure 1-6As shown, a multilayer circuit board laminating device is disclosed, comprising a worktable 1, a heating plate 2 fixedly connected to the upper end of the worktable 1, and feeding plates 3 fixedly connected to both the left and right sides of the worktable 1. A first slot 13 and a second slot 14 are respectively opened on the left and right sides of the upper end of the worktable 1. A limit rod 12 is fixedly connected inside the first slot 13, and a bidirectional screw 15 is rotatably connected inside the second slot 14. Clamping components 6 are provided on the front and rear sides between the first slot 13 and the second slot 14. A first slide rail 4 is fixedly connected to the front end of the worktable 1, and a first screw 10 is rotatably connected inside the first slide rail 4. A pushing component 5 is provided on one side of the upper end of the first slide rail 4. A pressing component 9 is provided above the heating plate 2. A lifting component 7 is fixedly connected to the rear end of the worktable 1, and an installation component 8 is provided at the front end of the lifting component 7.

[0025] As shown in the figure, a second servo motor 16 is fixedly connected to one end of the rear side of the workbench 1. The output end of the second servo motor 16 is fixedly connected to one end of the bidirectional screw 15. The clamping assembly 6 includes a clamping plate 20. A first connecting block 21 is fixedly connected to both sides of the bottom end of the clamping plate 20. The first connecting block 21 on one side is threadedly connected to one side of the bidirectional screw 15, and the first connecting block 21 on the other side is slidably connected to the limiting rod 12. The second servo motor 16 drives the bidirectional screw 15 to rotate, which can drive the clamping assembly 6 to move along the limiting rod 12 through the first connecting block 21 to clamp and limit the multilayer circuit board.

[0026] As shown in the figure, a first servo motor 11 is fixedly connected to one end of the first slide rail 4. The output end of the first servo motor 11 is fixedly connected to one end of the first screw 10. The pushing assembly 5 includes a pushing plate 22. A second connecting block 23 is fixedly connected to one side of the bottom end of the pushing plate 22. The second connecting block 23 is slidably connected to the first slide rail 4 and threadedly connected to the first screw 10. The first servo motor 11 drives the first screw 10 to rotate, which can drive the pushing plate 22 to move along the first slide rail 4 through the second connecting block 23, so that the pressed multilayer circuit board is unloaded through the unloading plate 3.

[0027] As shown in the figure, the lifting assembly 7 includes a second slide rail 17 fixedly connected to the worktable 1. A second screw 18 is rotatably connected inside the second slide rail 17. A third servo motor 19 is fixedly connected to the upper end of the second slide rail 17. The output end of the third servo motor 19 is fixedly connected to the upper end of the second screw 18. The mounting assembly 8 includes a mounting plate 24, which is slidably connected to the second slide rail 17 and threadedly connected to the second screw 18. A mounting rod 25 is fixedly connected to the front side of the bottom end of the mounting plate 24. The pressing assembly 9 includes a pressing plate 26 bolted to the mounting rod 25. A heating wire 27 is provided inside the pressing plate 26. The third servo motor 19 drives the second screw 18 to rotate, which can drive the mounting assembly 8 to move along the second slide rail 17 through the mounting plate 24, thereby driving the pressing plate 26 to descend and press the multilayer circuit board. During the pressing process, the heating plate 2 and the pressing assembly 9 can heat the multilayer circuit board, which can improve the pressing efficiency of the multilayer circuit board.

[0028] Working principle: In use, the multilayer circuit board to be pressed is placed on the heating plate 2. The second servo motor 16 drives the bidirectional screw 15 to rotate, which drives the clamping component 6 to move along the limiting rod 12 through the first connecting block 21 to clamp and limit the multilayer circuit board. The lifting component 7 drives the pressing component 9 on the mounting component 8 to descend. Specifically, the third servo motor 19 drives the second screw 18 to rotate, which drives the mounting component 8 to move along the second slide rail 17 through the mounting plate 24, thereby driving the pressing plate 26 to descend and press the multilayer circuit board. During the pressing process, the heating plate 2 and the pressing component 9 can heat the multilayer circuit board, which can improve the pressing efficiency of the multilayer circuit board. After pressing, the first servo motor 11 drives the first screw 10 to rotate, which drives the pusher plate 22 to move along the first slide rail 4 through the second connecting block 23, and unloads the pressed multilayer circuit board through the unloading plate 3.

[0029] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A multilayer circuit board laminating device, comprising a worktable (1), characterized in that: A heating plate (2) is fixedly connected to the upper end of the workbench (1). A feeding plate (3) is fixedly connected to both the left and right sides of the workbench (1). A first slot (13) and a second slot (14) are respectively opened on the left and right sides of the upper end of the workbench (1). A limit rod (12) is fixedly connected inside the first slot (13). A bidirectional screw (15) is rotatably connected inside the second slot (14). A clamping assembly (6) is provided on both the front and rear sides between the first slot (13) and the second slot (14). A first slide rail (4) is fixedly connected to the front end of the workbench (1). A first screw (10) is rotatably connected inside the first slide rail (4). A pushing assembly (5) is provided on one side of the upper end of the first slide rail (4). A pressing assembly (9) is provided above the heating plate (2). A lifting assembly (7) is fixedly connected to the rear end of the workbench (1). An installation assembly (8) is provided at the front end of the lifting assembly (7).

2. The multilayer circuit board laminating device according to claim 1, characterized in that: A second servo motor (16) is fixedly connected to one end of the rear side of the workbench (1), and the output end of the second servo motor (16) is fixedly connected to one end of the bidirectional screw (15).

3. The multilayer circuit board laminating device according to claim 2, characterized in that: The clamping assembly (6) includes a clamping plate (20), and a first connecting block (21) is fixedly connected to both sides of the bottom end of the clamping plate (20). The first connecting block (21) on one side is threadedly connected to one side of the bidirectional screw (15), and the first connecting block (21) on the other side is slidably connected to the limiting rod (12).

4. The multilayer circuit board laminating device according to claim 1, characterized in that: The first slide rail (4) is fixedly connected to one end of a first servo motor (11), and the output end of the first servo motor (11) is fixedly connected to one end of the first screw (10).

5. The multilayer circuit board laminating device according to claim 4, characterized in that: The pusher assembly (5) includes a pusher plate (22), and a second connecting block (23) is fixedly connected to one side of the bottom end of the pusher plate (22). The second connecting block (23) is slidably connected to the first slide rail (4), and the second connecting block (23) is threadedly connected to the first screw (10).

6. The multilayer circuit board laminating device according to claim 1, characterized in that: The lifting assembly (7) includes a second slide rail (17) fixedly connected to the worktable (1), a second screw (18) is rotatably connected inside the second slide rail (17), and a third servo motor (19) is fixedly connected to the upper end of the second slide rail (17). The output end of the third servo motor (19) is fixedly connected to the upper end of the second screw (18).

7. The multilayer circuit board laminating device according to claim 6, characterized in that: The mounting assembly (8) includes a mounting plate (24), which is slidably connected to the second slide rail (17) and threadedly connected to the second screw (18). A mounting rod (25) is fixedly connected to the front side of the bottom end of the mounting plate (24). The pressing assembly (9) includes a pressure plate (26) bolted to the mounting rod (25). A heating wire (27) is provided inside the pressure plate (26).