Thick copper circuit board with laminated structure

By adopting a layered structure design for thick copper circuit boards, the problem of easy rusting of screws during long-term use, which is difficult to solve in existing technologies, is solved. This enables quick disassembly and fixing, improves maintenance efficiency, and accelerates heat dissipation through a heat-conducting structure.

CN223626148UActive Publication Date: 2025-12-02SUPER DRY ELECTRONICS (ZHUHAI) CO LTD
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Patent Information

Application Number
CN202423146313.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-19
Publication Date
2025-12-02
Estimated Expiration
2034-12-19

AI Technical Summary

Technical Problem

Over time, the screws on existing thick copper multilayer circuit boards are prone to corrosion, making disassembly and assembly difficult and increasing the difficulty of replacing the circuit board.

Method used

The circuit board adopts a stacked structure design, including a mounting frame, heat-conducting plate, heat-conducting pillars and heat dissipation fins. The circuit board can be quickly disassembled and fixed through a spring and pull rod mechanism, and the heat dissipation efficiency is improved by combining heat-conducting pillars and heat dissipation fins.

Benefits of technology

It enables quick disassembly and fixation of circuit boards, improving maintenance efficiency, and accelerates heat dissipation through a heat-conducting structure, while the protective frame provides pressure resistance protection.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a thick copper circuit board with a laminated structure, which comprises a mounting frame and a bottom-layer thick copper circuit board, a heat-conducting plate is arranged in the mounting frame, a plurality of groups of heat-conducting columns are arranged on the upper surface of the heat-conducting plate, a middle-layer thick copper circuit board is arranged on the upper surface of the bottom-layer thick copper circuit board, and a plurality of groups of heat-conducting columns are arranged on the middle-layer thick copper circuit board. A top-layer copper thick circuit board is arranged on the upper surface of the middle-layer copper thick circuit board, fixing blocks are symmetrically arranged on the upper surface of the mounting frame, a movable groove is formed in one side face of each fixing block, a pull rod is inserted into one side face of the inner wall of each movable groove in a penetrating mode, and a first spring is arranged on the circumferential side face of each pull rod in a sleeving mode. The pull rod is pulled to drive the clamping block to retract into the clamping groove, the clamping block does not block the check block any more, and therefore the protection frame can be turned over, and then the pull rod in the fixed block is pulled to drive the limiting block at one end to retract into the movable groove. Therefore, the bottom-layer copper-thick circuit board, the middle-layer copper-thick circuit board and the top-layer copper-thick circuit board can be detached from the mounting frame, and the circuit boards can be maintained or checked.
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Description

Technical Field

[0001] This utility model belongs to the technical field of thick copper circuit boards, and in particular relates to a thick copper circuit board with a stacked structure. Background Technology

[0002] Circuit boards, also known as printed circuit boards, are called circuit boards, aluminum-based boards, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, and printed circuit boards, among other names. Circuit boards miniaturize and visualize circuits, playing a crucial role in the mass production of fixed circuits and the optimization of electrical appliance layout.

[0003] However, existing thick copper multilayer circuit boards on the market are usually installed and fixed with screws. During long-term use, the screws are prone to corrosion, making it difficult for operators to disassemble and reassemble the screws, and increasing the difficulty of replacing the circuit board. Therefore, a thick copper circuit board with a stacked structure is proposed. Summary of the Invention

[0004] The purpose of this invention is to provide a thick copper circuit board with a layered structure to solve the existing problems.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model relates to a layered thick copper circuit board, comprising a mounting frame and a bottom layer thick copper circuit board. A heat-conducting plate is disposed within the mounting frame, and multiple sets of heat-conducting pillars are disposed on the upper surface of the heat-conducting plate. A middle layer thick copper circuit board is disposed on the upper surface of the bottom layer thick copper circuit board, and a top layer thick copper circuit board is disposed on the upper surface of the middle layer thick copper circuit board. Fixing blocks are symmetrically arranged on the upper surface of the mounting frame. A movable groove is formed on one side of each fixing block, and a pull rod is inserted through one side of the inner wall of the movable groove. A first spring is sleeved on the periphery of the pull rod, and a limit block is provided at one end of the pull rod. A protective frame is hinged to the upper surface of the mounting frame, and a stop block is disposed on one side of the protective frame located on the right side of the mounting frame. A mounting block is disposed on the right side of the upper surface of the mounting frame, and a slot is formed within the mounting block. A pulling rod is inserted through one side of the inner wall of the slot, and a locking block is provided at one end of the pulling rod. A second spring is sleeved on the periphery of the pulling rod.

[0007] Furthermore, the bottom surface of the protective frame is provided with multiple sets of hollow tubes, a sleeve is slidably connected inside the hollow tube, a third spring is provided on the upper surface inside the hollow tube, and a locking block is provided on the bottom surface of the sleeve.

[0008] Furthermore, through holes are provided in the bottom copper thick circuit board, the middle copper thick circuit board and the top copper thick circuit board. The shape and size of the heat-conducting pillar are adapted to the through holes. One end of the heat-conducting pillar is inserted into the through hole and fits against the inner wall of the through hole.

[0009] Furthermore, one end of the first spring is fixedly connected to one side of the limiting block, and the other end of the first spring is fixedly connected to one side of the inner wall of the movable groove. The bottom surface of the heat-conducting plate is provided with multiple sets of heat dissipation fins. The heat dissipation fins, the heat-conducting plate, and the heat-conducting column are made of ceramic. One end of the second spring is fixedly connected to one side of the locking block, and the other end of the second spring is fixedly connected to one side of the inner wall of the locking groove. The bottom end of the third spring is fixedly connected to the bottom surface of the inner wall of the sleeve.

[0010] This utility model has the following beneficial effects:

[0011] This invention utilizes a pull rod to retract a locking block into a slot, allowing the protective frame to flip. Pulling the lever inside the fixing block then retracts a limiting block into a movable slot, enabling the bottom, middle, and top copper-thickness circuit boards to be removed from the mounting frame for repair or inspection. During installation, simply inserting the circuit board into the mounting frame causes it to press against the limiting block, which retracts into the movable slot. When the circuit board is fully inserted into the movable slot, the limiting block is ejected by a first spring to secure it, thus improving repair efficiency.

[0012] Meanwhile, the protective frame protects the circuit board body, which not only provides pressure resistance but also does not affect the heat dissipation of the circuit board; and the installation frame is equipped with a heat-conducting plate, heat-conducting pillars and heat dissipation fins at the bottom to accelerate the heat dissipation of the circuit board. Among them, the heat-conducting pillars can vertically conduct heat out of the thick copper circuit board.

[0013] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of a thick copper circuit board with a layered structure.

[0016] Figure 2 This is a right view of a thick copper circuit board with a stacked structure.

[0017] Figure 3 for Figure 2 Cross-sectional view of section AA;

[0018] Figure 4 for Figure 2 Cross-sectional view of the CC section;

[0019] Figure 5 This is a cross-sectional view of the fixing block in this utility model.

[0020] The components represented by each number in the attached diagram are listed below: 1. Mounting frame; 101. Heat-conducting plate; 102. Heat dissipation fins; 103. Heat-conducting pillars; 104. Bottom layer copper thick circuit board; 105. Middle layer copper thick circuit board; 106. Top layer copper thick circuit board; 107. Through hole; 11. Fixing block; 110. Movable groove; 111. Pull rod; 112. Limiting block; 113. First spring; 2. Protective frame; 201. Stop block; 12. Mounting block; 120. Slot; 121. Pull rod; 123. Second spring; 124. Locking block; 21. Hollow tube; 210. Sleeve; 212. Third spring; 213. Locking block. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be understood that the terms "upper", "middle", "outer", "inner", etc., which indicate orientation or positional relationship, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] Please see Figure 1 - Figure 5As shown, this utility model is a thick copper circuit board with a layered structure, including a mounting frame 1 and a bottom thick copper circuit board 104. A heat-conducting plate 101 is provided inside the mounting frame 1. Multiple sets of heat-conducting pillars 103 are provided on the upper surface of the heat-conducting plate 101. A middle thick copper circuit board 105 is provided on the upper surface of the bottom thick copper circuit board 104. A top thick copper circuit board 106 is provided on the upper surface of the middle thick copper circuit board 105. Fixing blocks 11 are symmetrically arranged on the upper surface of the mounting frame 1. A movable groove 110 is opened on one side of the fixing block 11. A pull rod 111 is inserted through one side of the inner wall of the movable groove 110. A first spring 113 is sleeved on the periphery of the pull rod 111. A limit block 112 is provided at one end of the pull rod 111.

[0025] Furthermore, a protective frame 2 is hinged to the upper surface of the mounting frame 1. A stop block 201 is provided on one side of the protective frame 2 located on the right side of the mounting frame 1. A mounting block 12 is provided on the right side of the upper surface of the mounting frame 1. A slot 120 is provided in the mounting block 12. A pull rod 121 is inserted through one side of the inner wall of the slot 120. A locking block 124 is provided at one end of the pull rod 121. A second spring 123 is sleeved on the periphery of the pull rod 121.

[0026] Furthermore, the bottom surface of the protective frame 2 is provided with multiple sets of hollow tubes 21, and a sleeve 210 is slidably connected inside the hollow tube 21. A third spring 212 is provided on the upper surface inside the hollow tube 21, and a locking block 213 is provided on the bottom surface of the sleeve 210. One end of the second spring 123 is fixedly connected to one side of the locking block 124, and the other end of the second spring 123 is fixedly connected to one side of the inner wall of the slot 120. The bottom end of the third spring 212 is fixedly connected to the bottom surface of the inner wall of the sleeve 210.

[0027] Furthermore, through holes 107 are provided in the bottom copper thick circuit board 104, the middle copper thick circuit board 105 and the top copper thick circuit board 106. The shape and size of the heat-conducting pillar 103 are adapted to the through hole 107. One end of the heat-conducting pillar 103 is inserted into the through hole 107 and fits against the inner wall of the through hole 107. One end of the first spring 113 is fixedly connected to one side of the limiting block 112, and the other end of the first spring 113 is fixedly connected to one side of the inner wall of the movable groove 110. Multiple sets of heat dissipation fins 102 are provided on the bottom surface of the heat-conducting plate 101. The heat dissipation fins 102, the heat-conducting plate 101 and the heat-conducting pillar 103 are made of ceramic.

[0028] It should be noted that, in this utility model, by pulling the pulling rod 121, the locking block 124 is retracted into the locking groove 120, and the locking block 124 no longer obstructs the stop block 201, thereby allowing the protective frame 2 to flip. Then, by pulling the pulling rod 111 in the fixing block 11, the limiting block 112 at one end is retracted into the movable groove 110, thereby allowing the bottom copper thick circuit board 104, the middle copper thick circuit board 105, and the top copper thick circuit board 106 to be disassembled from the mounting frame 1, so that the circuit board can be repaired or inspected. During installation, simply insert the circuit board into the mounting frame 1, and the circuit board will squeeze the limiting block 112, causing the limiting block 112 to retract into the movable groove 110. When the circuit board is completely placed into the movable groove 110, the limiting block 112 will be ejected by the first spring 113 to limit and fix the circuit board, thus speeding up the maintenance efficiency of the staff.

[0029] Meanwhile, the protective frame 2 protects the circuit board body, which not only resists pressure but also does not affect the heat dissipation of the circuit board; while the installation frame 1 has a heat-conducting plate 101, heat-conducting pillar 103 and heat dissipation fins 102 at the bottom, which can accelerate the heat dissipation of the circuit board. Among them, the heat-conducting pillar 103 can vertically conduct the heat in the thick copper circuit board.

[0030] In the description of this specification, references to terms such as "an embodiment," "example," and "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0031] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A thick copper circuit board with a stacked structure, comprising a mounting frame (1) and a bottom copper thick circuit board (104), characterized in that: A heat-conducting plate (101) is provided inside the mounting frame (1). Multiple sets of heat-conducting columns (103) are provided on the upper surface of the heat-conducting plate (101). A middle layer copper thick circuit board (105) is provided on the upper surface of the bottom copper thick circuit board (104). A top layer copper thick circuit board (106) is provided on the upper surface of the middle layer copper thick circuit board (105). Fixing blocks (11) are symmetrically arranged on the upper surface of the mounting frame (1). A movable groove (110) is opened on one side of the fixing block (11). A pull rod (111) is inserted through one side of the inner wall of the movable groove (110). A first spring (113) is sleeved on the periphery of the pull rod (111). A limit block (112) is provided at one end of the pull rod (111).

2. The thick copper circuit board with a multilayer structure according to claim 1, characterized in that, A protective frame (2) is hinged to the upper surface of the mounting frame (1). A stop block (201) is provided on one side of the protective frame (2) located on the right side of the mounting frame (1). A mounting block (12) is provided on the right side of the upper surface of the mounting frame (1). A slot (120) is provided in the mounting block (12). A pull rod (121) is inserted through one side of the inner wall of the slot (120). A locking block (124) is provided at one end of the pull rod (121). A second spring (123) is sleeved on the periphery of the pull rod (121).

3. A thick copper circuit board with a stacked structure according to claim 2, characterized in that, The bottom surface of the protective frame (2) is provided with multiple sets of hollow tubes (21), and a sleeve (210) is slidably connected inside the hollow tube (21). A third spring (212) is provided on the upper surface inside the hollow tube (21), and a locking block (213) is provided on the bottom surface of the sleeve (210).

4. A thick copper circuit board with a multilayer structure according to claim 1, characterized in that, Through holes (107) are provided in the bottom copper thick circuit board (104), the middle copper thick circuit board (105) and the top copper thick circuit board (106). The shape and size of the heat-conducting pillar (103) are adapted to the through hole (107). One end of the heat-conducting pillar (103) is inserted into the through hole (107) and fits against the inner wall of the through hole (107).

5. A thick copper circuit board with a stacked structure according to claim 4, characterized in that, One end of the first spring (113) is fixedly connected to one side of the limiting block (112), and the other end of the first spring (113) is fixedly connected to one side of the inner wall of the movable groove (110). The bottom surface of the heat-conducting plate (101) is provided with multiple sets of heat dissipation fins (102). The heat dissipation fins (102), the heat-conducting plate (101) and the heat-conducting column (103) are made of ceramic.

6. A thick copper circuit board with a stacked structure according to claim 3, characterized in that, One end of the second spring (123) is fixedly connected to one side of the card block (124), and the other end of the second spring (123) is fixedly connected to one side of the inner wall of the card slot (120). The bottom end of the third spring (212) is fixedly connected to the bottom surface of the inner wall of the sleeve (210).