Foldable heat dissipation device

Abstract

A foldable heat dissipation device comprises a top cover layer and a bottom cover layer which are attached to each other, and a cavity for heat dissipation fluid to flow therein is defined between the top cover layer and the bottom cover layer. The foldable heat dissipation device is divided into at least two non-folding sections and at least one foldable section connected between the at least two non-folding sections along the surface of the top covering layer and the surface of the bottom covering layer, a distance between the top cover layer and the bottom cover layer in the at least one foldable section is less than a distance between the top cover layer and the bottom cover layer in the at least two non-foldable sections. By utilizing the foldable heat dissipation device provided by the utility model, the heat dissipation efficiency is improved, and the lightness, thinness and portability of a foldable electronic product equipped with the foldable heat dissipation device are improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation devices. Specifically, it relates to a foldable heat dissipation device. Background Technology

[0002] With the development of flexible displays, foldable electronic products can provide larger screens without sacrificing portability. For foldable electronic products, such as foldable phones, tablets, and laptops, the heat dissipation system is conventionally made of rigid materials, such as copper and stainless steel, which cannot be folded along with the flexible display. Therefore, the heat dissipation system can only be placed in a limited space, such as the SoC area of ​​the foldable electronic product, which poses new challenges to thermal management solutions.

[0003] Compared to conventional electronic products, foldable electronic products offer limited space for a heat dissipation system, resulting in more constrained heat dissipation capabilities and higher overall requirements for thermal design. To meet the heat dissipation needs of foldable electronic products, conventional solutions in existing technologies involve increasing the space for the heat dissipation system, such as increasing its thickness (leading to increased product thickness) and reducing battery size to improve heat dissipation. However, this affects the product's thinness, portability, and performance, thus impacting the user experience.

[0004] Therefore, there is a need for a foldable heat dissipation device that overcomes the aforementioned problems in the prior art. Utility Model Content

[0005] This invention proposes a foldable heat dissipation device, comprising a top cover layer and a bottom cover layer, the top cover layer and the bottom cover layer being attached to each other and enclosing a chamber therebetween for the flow of heat dissipation fluid, wherein the foldable heat dissipation device is divided along the surfaces of the top cover layer and the bottom cover layer into at least two non-foldable sections and at least one foldable section connecting the at least two non-foldable sections, wherein the distance between the top cover layer and the bottom cover layer in the at least one foldable section is less than the distance between the top cover layer and the bottom cover layer in the at least two non-foldable sections.

[0006] In the non-folded section, a plurality of first support members are arranged between the top cover layer and the bottom cover layer. Each of the plurality of first support members may include a first flexible material layer and a rigid thermally conductive material layer surrounding the first flexible material layer and attached to the first flexible material layer by an adhesive, the rigid thermally conductive material layer being attached to the top cover layer and the bottom cover layer by an adhesive.

[0007] In the foldable section, a plurality of second support members are arranged between the top cover layer and the bottom cover layer. Each of the plurality of second support members may include a second flexible material layer, and the second flexible material layer is attached to the top cover layer and the bottom cover layer by an adhesive.

[0008] Optionally, the top cover layer includes at least two first top cover layer segments in the at least two non-foldable segments and at least one second top cover layer segment in the at least one foldable segment, the at least two first top cover layer segments and the at least one second top cover layer segment being connected to each other by an adhesive.

[0009] Optionally, the bottom cover layer includes at least two first bottom cover layer segments in the at least two non-foldable segments and at least one second bottom cover layer segment in the at least one foldable segment, the at least two first bottom cover layer segments and the at least one second bottom cover layer segment being connected to each other by an adhesive.

[0010] Alternatively, the top cover layer and the bottom cover layer are each formed as a single structure.

[0011] Optionally, the thickness of the top cover layer and the bottom cover layer in the at least one foldable section is less than the thickness of the top cover layer and the bottom cover layer in the at least two non-foldable sections, respectively.

[0012] Optionally, the at least one foldable section is arranged to align with the foldable area of ​​a foldable electronic product equipped with the foldable heat dissipation device of the present invention. Attached Figure Description

[0013] The foldable heat dissipation device according to the present invention will now be described in detail with reference to the accompanying drawings, in which:

[0014] Figure 1 A schematic perspective view of a foldable heat dissipation device according to the present invention is shown.

[0015] Figure 2A Show Figure 1 A top view of the foldable heat dissipation device in the design;

[0016] Figure 2B Show Figure 1 Front view of the foldable heat dissipation device;

[0017] Figure 3A Show along Figure 2A The cross-sectional view shown is a portion of the cross-section AA shown.

[0018] Figure 3B Show along Figure 2A The cross-sectional view shown is a portion of the cross-section BB.

[0019] Figure 3C Show along Figure 2B The cross-sectional view shown is a cross-sectional view taken by cross-section CC; and

[0020] Figure 3D The following is shown according to an alternative embodiment. Figure 2B The cross-sectional view shown is a cross-sectional view taken by cross-section CC. Detailed Implementation

[0021] Figure 1 A schematic perspective view of a foldable heat dissipation device according to the present invention is shown. Figure 2A Show Figure 1 A top view of the foldable heat dissipation device. Figure 2B Show Figure 1 Front view of the foldable heat dissipation device. Figures 3A to 3D Cross-sectional views of different sections of the foldable heat dissipation device are shown. It should be noted that the figures are simplified and schematic only, intended to illustrate the construction of the foldable heat dissipation device according to the present invention, and that the figures are not necessarily drawn to scale but may be enlarged to show more detail.

[0022] Referring to the figures, the foldable heat dissipation device 10 according to this invention generally includes a top cover layer 20 and a bottom cover layer 30, which are attached to each other and enclose a chamber 40 for the flow of heat dissipation fluid. Furthermore, the foldable heat dissipation device 10 is divided along the surfaces of the top cover layer 20 and the bottom cover layer 30 into at least two non-foldable sections 100 and at least one foldable section 200 connecting the at least two non-foldable sections 100. The distance between the top cover layer 20 and the bottom cover layer 30 in the at least one foldable section 200 is less than the distance between the top cover layer 20 and the bottom cover layer 30 in the at least two non-foldable sections 100.

[0023] In the use of the foldable heat dissipation device 10, the top cover layer 20 can be arranged adjacent to the outer surface of the foldable electronic product, such as adjacent to the screen of a foldable mobile phone, while the bottom cover layer 30 can be arranged adjacent to heat-generating components inside the foldable electronic product, such as the CPU, capacitors, and inductors of the foldable mobile phone. Depending on the heat dissipation requirements and the internal space design requirements of the foldable electronic product, the shape and size of the top cover layer 20 and the bottom cover layer 30 can be appropriately adjusted, and are not limited to... Figure 1 The generally rectangular surface shape is shown. For example, the top cover layer 20 and the bottom cover layer 30 may have a shape and size that generally overlaps with the entire screen of the foldable electronic product, or generally corresponds to half of the screen of the foldable electronic product, etc.

[0024] The top cover layer 20 and the bottom cover layer 30 should be made of materials with sufficient thermal conductivity and mechanical strength, so that the heat generated by the heat-generating device inside the foldable electronic product can be transferred through the bottom cover layer 30 to the heat dissipation fluid, such as water and water vapor, in the cavity 40. After absorbing heat, the heat dissipation fluid can partially vaporize within the cavity 40. That is, the heat dissipation fluid in the cavity 40 can simultaneously contain both liquid and gas states. Specifically, the heat dissipation fluid in the cavity 40 absorbs heat and vaporizes in the heat-generating area corresponding to the location of the heat-generating device, carrying the heat as it flows in the cavity 40 to a location away from the heat-generating area, where it condenses and liquefies upon cooling, and then flows back to the heat-generating area through the cavity 40. In this way, the heat generated from the heat-generating device can be dispersed and transferred to different locations, thereby achieving heat conduction and diffusion.

[0025] The top cover layer 20 and the bottom cover layer 30 may be made of copper, but they may also be made of other metallic materials or even non-metallic thermally conductive materials. The top cover layer 20 and the bottom cover layer 30 may be made of the same material, such as copper, in at least one foldable section 200 and in at least two non-foldable sections 100. However, the distance between the top cover layer 20 and the bottom cover layer 30 in at least one foldable section 200 is less than the distance between the top cover layer 20 and the bottom cover layer 30 in at least two non-foldable sections 100, such that the foldable heat dissipation device 10 is made thin enough in at least one foldable section 200 that the top cover layer 20 and the bottom cover layer 30 are foldable in at least one foldable section 200, i.e., the foldable heat dissipation device 10 is foldable in at least one foldable section 200. Specifically, at least one foldable section 200 is arranged to align with the foldable area of ​​the foldable electronic product equipped with the heat dissipation device 10, such that the foldable heat dissipation device 10 can be folded along with the foldable electronic product.

[0026] It should be noted that Figure 1 and Figures 2A to 2B Two non-folding sections 100 and one foldable section 200 are shown, but the present invention is not limited thereto. Depending on the construction of the foldable electronic product to which the foldable heat dissipation device 10 is to be applied, the foldable heat dissipation device can be constructed to have more than two non-folding sections and more than one foldable section, for example, arranging one foldable section between every two adjacent non-folding sections, wherein each foldable section is arranged to be aligned with the foldable area of ​​the foldable electronic product equipped with the heat dissipation device 10, so that the foldable heat dissipation device 10 can be folded along with the foldable electronic product.

[0027] The following will combine Figure 3A and Figure 3B The specific structures of the non-foldable section 100 and the foldable section 200 are described in detail respectively. Figure 3A Show along Figure 2A The cross-sectional view shown in section AA reveals that, in the non-folding section 100, a plurality of first support members 110 are arranged between the top cover layer 20 and the bottom cover layer 30. The arrangement of the plurality of first support members 110 is to meet the mechanical strength requirements of the foldable heat dissipation device 10 in the non-folding section 100, ensuring that the foldable heat dissipation device 10 does not deform, such as break, collapse, or twist, during its operation in the non-folding section 100.

[0028] Reference Figure 3A Each first support member 110 is formed as a layered structure. Specifically, each first support member 110 may include a first flexible material layer 111 and a rigid thermally conductive material layer 113 surrounding the first flexible material layer 111 and attached to the first flexible material layer 111 by an adhesive 112, and the rigid thermally conductive material layer 113 is attached to the top cover layer 20 and the bottom cover layer 30 by the adhesive 112. Thus, each first support member 110 forms a solid support member between the top cover layer 20 and the bottom cover layer 30. Therefore, the presence of multiple first support members 110 can meet the mechanical strength requirements of the foldable heat dissipation device 10 in the non-folding section 100.

[0029] In the non-folded section 100, flow channels for heat dissipation fluids, including liquids and gases, are formed between a plurality of first support members 110 in the supply chamber 40.

[0030] Multiple first support members 110 may be formed as walls or columns. Specifically, the first support members 110 located at the edges of the non-folding section 100 may be formed as walls, while the first support members 110 located in the middle of the non-folding section 100, i.e., in the chamber 40, may be formed as columns, such as cylinders or columns with square or other suitable cross-sections. However, the present invention is not limited thereto. The cross-sectional shape and size of the first support members 110, the number of the first support members 110, and their arrangement may be adjusted depending on the strength and heat dissipation requirements of the foldable heat dissipation device 10 in the non-folding section 100. That is, in the non-folding section 100, the multiple first support members 110 need not be constructed to have the same shape and size as each other, and need not be evenly distributed. For example, in locations with high heat dissipation requirements, i.e., adjacent to the heat-generating devices inside the foldable electronic product, the first support members 110 may be constructed to have relatively small cross-sectional dimensions, and the spacing between adjacent first support members 110 may be constructed to be relatively large, i.e., forming larger flow channels, thereby enhancing the heat dissipation effect. In locations where high mechanical strength is required, the first support member 110 can be configured to have a relatively large cross-sectional dimension, and the spacing between adjacent first support members 110 can be configured to be relatively small, i.e., arranged relatively densely. The arrangement of the multiple first support members 110, such as their orientation, can also be adjusted to form a flow channel with a specific direction, thereby allowing liquids and gases to flow in the chamber 40 along a desired orientation.

[0031] The first flexible material layer 111 is, for example, a flexible plastic layer, such as a layer formed of polyimide or polyester. The first flexible material layer 111 functions similarly to the flexible substrate in an FPC (flexible printed circuit board), and other layers can be sequentially formed on two opposite sides of the first flexible material layer 111.

[0032] The rigid thermally conductive material layer 113 can be made of the same material as the top cover layer 20 and the bottom cover layer 30, such as copper, to provide support and thermal conductivity. Furthermore, the rigid thermally conductive material layer 113 can be formed using the same process as the top cover layer 20 and the bottom cover layer 30, such as a chemical etching process. Depending on the strength requirements of the first support member 110, the rigid thermally conductive material layer 113 can have the same or different thickness as the top cover layer 20 and the bottom cover layer 30. For example, the rigid thermally conductive material layer 113, the top cover layer 20, and the bottom cover layer 30 can each have a thickness of less than 0.1 mm, for example, 0.05 mm, and each first support member 110 can have a thickness between 0.2 mm and 0.5 mm.

[0033] The rigid thermally conductive material layer 113 is attached to the first flexible material layer 111, to the top cover layer 20, and to the bottom cover layer 30 by an adhesive 112, thereby forming an integral first support member 110. The adhesive 112 can be an adhesive commonly used in the manufacture of FPC.

[0034] In summary, the plurality of first support members 110 can be manufactured using the same process as FPC, i.e., a first flexible material layer 111 as the substrate, and then other layers sequentially formed on two opposite sides of the first flexible material layer 111, wherein the rigid thermally conductive material layer 113, the top cover layer 20, and the bottom cover layer 30 are formed by chemical etching, such as etching, processes commonly used in FPC. In this way, the plurality of first support members 110, the top cover layer 20, and the bottom cover layer 30 can all be made of conventional materials (the substrate for FPC, as well as copper and adhesive) and conventional processes used in foldable electronic products, wherein the same layer of each of the plurality of first support members 110 can be formed simultaneously from the same material using the same process, thereby simplifying the manufacturing process. On the other hand, by employing a process similar to that of FPC, each layer of the plurality of first support members 110 can be made thin enough to reduce the thickness of the foldable heat dissipation device 10, and thus reduce the overall thickness of the foldable electronic product, thereby meeting the requirements for thinness and portability of foldable electronic products.

[0035] Reference Figure 3B In the foldable section 200, multiple second support members 210 are arranged between the top cover layer 20 and the bottom cover layer 30. The arrangement of multiple second support members 210 is to satisfy both the foldability of the foldable section 200 and the strength requirements of the foldable heat dissipation device 10 within the foldable section 200, ensuring that the foldable heat dissipation device 10 can be folded within the foldable section 200 during operation without collapsing, twisting, or undergoing other deformations. In other words, even if the foldable section 200 is folded multiple times, it can still return to its original state.

[0036] like Figure 3B As shown, each second support member 210 may include a second flexible material layer 211, which is attached to the top cover layer 20 and the bottom cover layer 30 by an adhesive 212. Thus, each second support member 210 forms a solid support member between the top cover layer 20 and the bottom cover layer 30. Therefore, the presence of multiple second support members 210 satisfies the mechanical strength requirements of the foldable heat dissipation device 10 in the foldable section 200.

[0037] In the foldable section 200, flow channels for liquids and gases in the supply chamber 40 are formed between a plurality of second support members 210.

[0038] Multiple second support members 210 may be formed as walls or columns. Specifically, the second support members 210 located at the edges of the foldable section 200 may be formed as walls, while the second support members 210 located in the middle of the foldable section 200, i.e., in the chamber 40, may be formed as columns, such as cylinders or columns with square or other suitable cross-sections. However, the present invention is not limited thereto. Similar to the first support member 110, the cross-sectional shape and size of the second support members 210, the number of the second support members 210, and their arrangement may be adjusted depending on the strength and heat dissipation requirements of the foldable heat dissipation device 10 in the foldable section 200.

[0039] The second flexible material layer 211 can be made of the same material as the first flexible material layer 111, such as a flexible plastic layer, like a layer formed of polyimide or polyester. Similar to the first flexible material layer 111, the second flexible material layer 211 functions similarly to the flexible substrate in an FPC.

[0040] Adhesive 212 may be made of the same adhesive material as adhesive 112, such as adhesives commonly used in the manufacture of FPC.

[0041] Generally, the second flexible material layer 211 and adhesive 212 of each second support member 210 may be the same as the first flexible material layer 111 and adhesive 112 of each first support member 110, respectively. The difference between the second support member 210 and the first support member 110 is that each first support member 110 additionally includes a rigid thermally conductive material layer 113 and adhesive 112 between the rigid thermally conductive material layer 113 and the top cover layer 20 and the bottom cover layer 30. Therefore, the thickness of each of the plurality of second support members 210 is less than the thickness of each of the plurality of first support members 110. The foldable heat dissipation device 10 may have a thickness of, for example, 0.05 mm to 0.2 mm in the foldable section 200, which is small enough that the foldable heat dissipation device 10 can be folded in the foldable section 200.

[0042] Figure 3C Show along Figure 2BThe cross-sectional view shown is a cross-sectional view taken by cross section CC. The communicating chamber 40 can be seen. Furthermore, it can be seen that the top cover layer 20 includes at least two first top cover layer segments 21 in at least two non-foldable segments 100 and at least one second top cover layer segment 22 in at least one foldable segment 200, wherein the at least two first top cover layer segments 21 and the at least one second top cover layer segment 22 are connected to each other by adhesive 23. Similarly, the bottom cover layer 30 includes at least two first bottom cover layer segments 31 in at least two non-foldable segments 100 and at least one second bottom cover layer segment 32 in at least one foldable segment 200, wherein the at least two first bottom cover layer segments 31 and the at least one second bottom cover layer segment 32 are connected to each other by adhesive 33. Furthermore, the second top cover layer section 22 and the second bottom cover layer section 32 may have different thicknesses than the first top cover layer section 21 and the first bottom cover layer section 31, respectively. That is, the thicknesses of the second top cover layer section 22 and the second bottom cover layer section 32 may be less than the thicknesses of the first top cover layer section 21 and the first bottom cover layer section 31, respectively, to reduce the thickness of the foldable section 200. The adhesives 23 and 33 may be the same adhesives used in the aforementioned plurality of first support members 110 and plurality of second support members 210.

[0043] In other words, Figure 3C In the illustrated embodiment, the top cover layer 20 and the bottom cover layer 30 are each formed into multiple segments, with adjacent segments connected to each other by an adhesive. In this case, each segment of the top cover layer 20 and the bottom cover layer 30 can be formed by a process similar to that of FPC, thereby simplifying the manufacturing process.

[0044] Figure 3D The following is shown according to an alternative embodiment. Figure 2B The cross-sectional view shown is a cross-sectional view taken by cross section CC. In this alternative embodiment, the top cover layer 20 and the bottom cover layer 30 are each formed as an integral structure. That is, the top cover layer 20 and the bottom cover layer 30 are integrally formed in at least two non-foldable sections 100 and at least one foldable section 200, thereby simplifying the structure of the top cover layer 20 and the bottom cover layer 30. Since the thickness of the foldable heat dissipation device 10 in the at least two non-foldable sections 100 is greater than its thickness in the at least one foldable section 200, the top cover layer 20 and the bottom cover layer 30 can each form a transition section similar to a "ramp" at the transition between the at least two non-foldable sections 100 and the at least one foldable section 200.

[0045] It should be noted that the thickness of the top cover layer 20 and the bottom cover layer 30 in at least two non-foldable sections 100 may be the same as or different from their thickness in at least one foldable section 200. For example, the thickness of the top cover layer 20 and the bottom cover layer 30 in at least one foldable section 200 may be less than their thickness in at least two non-foldable sections 100, that is, the top cover layer 20 and the bottom cover layer 30 may be made thin enough in at least one foldable section 200 to enhance the foldability of the foldable heat dissipation device 10 in at least one foldable section 200.

[0046] It should also be noted that although the surfaces of the top cover layer 20 and the bottom cover layer 30 are shown as planar surfaces in at least two non-folding sections 100 and in at least one foldable section 200, the present invention is not limited thereto. The surfaces of the top cover layer 20 and the bottom cover layer 30 can be adapted to the shape of the foldable electronic product, such as the shape of the screen, for example, they can be formed as non-planar surfaces, such as curved surfaces, in at least two non-folding sections 100 and / or in at least one foldable section 200. Furthermore, the construction of the plurality of first support members 110 and the plurality of second support members 210 between the top cover layer 20 and the bottom cover layer 30 can be adjusted according to the surface construction of the top cover layer 20 and the bottom cover layer 30.

[0047] In summary, the foldable heat dissipation device 10 of this invention can be applied to various foldable electronic products, including electronic products with foldable screens and flip-type electronic products, to achieve heat dissipation. Compared with conventional non-foldable heat dissipation devices with limited installation space, the foldable heat dissipation device 10 of this invention can be folded along with the product, thus allowing it to be made with a larger surface area to cover more heat-generating components, which improves heat dissipation efficiency. In addition, the foldable heat dissipation device 10 of this invention adopts a manufacturing process similar to FPC, which simplifies manufacturing and allows the overall thickness of the heat dissipation device 10 to be made thinner, thereby improving the lightness and portability of foldable products equipped with this heat dissipation device 10.

[0048] The foregoing detailed description of feasible, but non-limiting, embodiments of the foldable heat dissipation device according to the present invention, with reference to the accompanying drawings, is intended to be perceptible to those skilled in the art. Modifications and additions to the technology and structure, as well as recombinations of features in the various embodiments, should be considered within the scope of the present invention without departing from the scope and spirit of the disclosure as set forth in the following claims. Therefore, such modifications and additions conceivable under the teachings of the present invention should be considered part of this disclosure. The scope of this disclosure is defined by the following appended claims and includes equivalent technologies known at the filing date of this disclosure and equivalent technologies not yet foreseen.

Claims

1. A foldable heat dissipation device (10), comprising a top cover layer (20) and a bottom cover layer (30), said top cover layer (20) and said bottom cover layer (30) being attached to each other and enclosing a chamber (40) therebetween for the flow of heat dissipation fluid, characterized in that, The foldable heat dissipation device (10) is divided along the surface of the top cover layer (20) and the surface of the bottom cover layer (30) into at least two non-foldable sections (100) and at least one foldable section (200) connecting the at least two non-foldable sections (100), wherein the distance between the top cover layer (20) and the bottom cover layer (30) in the at least one foldable section (200) is less than the distance between the top cover layer (20) and the bottom cover layer (30) in the at least two non-foldable sections (100).

2. The foldable heat dissipation device (10) according to claim 1, characterized in that, In the non-folded section (100), a plurality of first support members (110) are arranged between the top cover layer (20) and the bottom cover layer (30).

3. The foldable heat dissipation device (10) according to claim 2, characterized in that, Each of the plurality of first support members (110) includes a first flexible material layer (111) and a rigid thermally conductive material layer (113) surrounding the first flexible material layer (111) and attached to the first flexible material layer (111) by an adhesive, the rigid thermally conductive material layer (113) being attached to the top cover layer (20) and the bottom cover layer (30) by an adhesive.

4. The foldable heat dissipation device (10) according to claim 1, characterized in that, In the foldable section (200), a plurality of second support members (210) are arranged between the top cover layer (20) and the bottom cover layer (30).

5. The foldable heat dissipation device (10) according to claim 4, characterized in that, Each of the plurality of second support members (210) includes a second flexible material layer (211), and the second flexible material layer (211) is attached to the top cover layer (20) and the bottom cover layer (30) by an adhesive.

6. The foldable heat dissipation device (10) according to any one of claims 1 to 5, characterized in that, The top cover layer (20) includes at least two first top cover layer segments (21) in the at least two non-foldable segments (100) and at least one second top cover layer segment (22) in the at least one foldable segment (200), the at least two first top cover layer segments (21) and the at least one second top cover layer segment (22) being connected to each other by an adhesive.

7. The foldable heat dissipation device (10) according to any one of claims 1 to 5, characterized in that, The bottom cover layer (30) includes at least two first bottom cover layer segments (31) in the at least two non-foldable segments (100) and at least one second bottom cover layer segment (32) in the at least one foldable segment (200), the at least two first bottom cover layer segments (31) and the at least one second bottom cover layer segment (32) being connected to each other by an adhesive.

8. The foldable heat dissipation device (10) according to any one of claims 1 to 5, characterized in that, The top cover layer (20) and the bottom cover layer (30) are each formed as an integral structure.

9. The foldable heat dissipation device (10) according to any one of claims 1 to 5, characterized in that, The thickness of the top cover layer (20) and the bottom cover layer (30) in the at least one foldable section (200) is less than the thickness of the top cover layer (20) and the bottom cover layer (30) in the at least two non-foldable sections (100).

10. The foldable heat dissipation device (10) according to any one of claims 1 to 5, characterized in that, The at least one foldable section (200) is arranged to align with the foldable area of ​​the foldable electronic product equipped with the foldable heat dissipation device (10).

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