Selective wave crest automatic soldering machine

Abstract

The utility model provides a selective wave crest automatic soldering machine which comprises a platform, and a bearing mechanism used for bearing products, a soldering aid mechanism used for containing soldering flux and a selective wave crest tin furnace are sequentially arranged on the platform. The bearing mechanism comprises a supporting frame arranged on the platform and a bearing plate arranged on the supporting frame, the bearing plate is detachably installed on the supporting frame, a jig used for bearing a product is arranged on the bearing plate, the jig is detachably installed on the bearing plate, a plurality of installation holes used for installing the jig are formed in the bearing plate, and the jig is arranged in the installation holes. The platform is provided with a grabbing moving mechanism used for driving the bearing plate to move. The selective wave crest automatic soldering machine can be suitable for magnet ring type common mode inductor tinning, has the advantages of being good in applicability and easy and convenient to operate, and can improve the soldering efficiency of batch products and prevent tin particles from polluting the products while guaranteeing the machining precision and the machining quality.

Description

TECHNICAL FIELD

[0001] The utility model belongs to soldering machine technical field, especially is involved in a selective wave crest automatic soldering machine. BACKGROUND

[0002] In the field of electronic product processing, various processing equipment is often used, and the soldering machine is one of the more important equipment. The soldering machine mainly has the immersion soldering machine and the wave crest soldering machine. The existing application number as 201410022812.6 Chinese invention patent discloses a kind of linear soldering machine, including machine table, machine table is equipped with the feeding unit that can be transported to the jig of waiting clamping station, soldering flux unit and soldering mechanism in sequence, feeding unit and soldering flux mechanism are also equipped with the conveying belt combination structure that can be transported to the soldering machine outside the jig equipped with soldered component;Machine table is also fixed with a long strip-shaped support profile, feeding unit, conveying belt combination structure, soldering flux unit and soldering unit are sequentially distributed on the same side of support profile along the length direction of support profile, support profile is slidably provided with the mechanical arm mechanism that can clamp the jig at feeding unit and be transported to soldering flux unit, soldering mechanism and conveying belt combination structure along the length direction of itself. The soldering machine described above has the advantages of high degree of automation, high soldering efficiency, but since magnetic ring type common mode inductance tin pressing position is close to magnetic ring, tin particle is easy to splash to the surface of magnetic ring when using the tin pressing mode of the soldering machine described above, cause the cleanliness of product to be bad, need to be cleaned in subsequent process, increase processing cost, not conducive to improving the processing efficiency of magnetic ring type common mode inductance. CONTENT OF UTILITY MODEL

[0003] Therefore, the utility model aims at providing a selective wave crest automatic soldering machine to solve the problem that tin particle is easy to splash to the surface of magnetic ring when the existing soldering machine is applied to magnetic ring type common mode inductance tin pressing.

[0004] To achieve the above-mentioned purpose, the technical scheme of the utility model is as follows:

[0005] A selective wave crest automatic soldering machine, comprising a platform, the platform is equipped with a carrying mechanism for carrying products, a soldering flux mechanism for containing soldering flux and a selective wave crest soldering furnace in sequence;The carrying mechanism comprises a support frame provided on the platform and a carrying plate provided on the support frame, the carrying plate is detachably mounted on the support frame, the jig for carrying products is provided on the carrying plate, the jig is detachably mounted on the carrying plate, a plurality of mounting holes for mounting the jig are provided on the carrying plate, and a grabbing moving mechanism for moving the carrying plate is provided on the platform.

[0006] Further, the jig is provided with a detachable isolation plate, a positioning groove matched with the product is arranged above the isolation plate, and the isolation plate penetrates the jig below; a through hole for facilitating the product pin to penetrate is arranged on the isolation plate at a position corresponding to the positioning groove, and the through hole is communicated with the positioning groove, and the diameter of the through hole is greater than the diameter of the product pin.

[0007] Further, a chamfer is arranged at a position corresponding to the through hole orifice below the isolation plate.

[0008] Further, a drainage groove is further arranged below the isolation plate, the drainage groove is arranged corresponding to the chamfer, and the drainage groove is communicated with the through hole through the chamfer.

[0009] Further, the grabbing moving mechanism comprises a three-axis gantry platform, a clamping jaw assembly and a pressing assembly arranged on the three-axis gantry platform; the clamping jaw assembly is arranged at least in two groups along the length direction of the bearing plate, and the pressing assembly is arranged one by one corresponding to the jig; the edge of the jig is provided with a positioning edge capable of cooperating with the pressing assembly.

[0010] Further, the pressing assembly comprises a device mounting frame, a pressing plate for pressing and positioning the jig is arranged on the device mounting frame, the pressing plate is connected with the device mounting frame through a first spring telescopic rod, a pressing piece for pressing and positioning the product is arranged on the pressing plate, and the pressing piece is connected with the pressing plate through a second spring telescopic rod.

[0011] Further, a positioning pin is arranged below the pressing plate, at least two positioning pins are arranged corresponding to the left and right sides of the jig, a positioning hole capable of cooperating with the positioning pin is arranged on the positioning edge of the jig, and a positioning column capable of cooperating with the positioning hole is arranged on the bearing plate at a position corresponding to the left and right sides of the jig.

[0012] Further, a sensing mark is further arranged on the positioning edge, and a detection assembly for detecting the sensing mark is arranged on the pressing plate.

[0013] Further, a limiting slot matched with the bearing plate is arranged on the support frame, a limiting column is arranged on the support frame at a position corresponding to the limiting slot, at least two limiting columns are arranged corresponding to the left and right ends of the bearing plate, and a limiting hole matched with the limiting column is arranged on the bearing plate.

[0014] Further, a stationary tin furnace and a slag scraping mechanism are further arranged on the platform at a position corresponding to the soldering assisting mechanism and the selective wave peak tin furnace, the slag scraping mechanism comprises a slag scraping plate arranged obliquely above the stationary tin furnace, and a driving assembly for driving the slag scraping plate to act is arranged on the platform; one end of the slag scraping plate obliquely downward extends into the stationary tin furnace, the other end is connected with the driving assembly, and the one end of the slag scraping plate extending into the stationary tin furnace is provided with an arc-shaped bending part.

[0015] Compared with the prior art, the selective wave peak automatic soldering machine has the following advantages:

[0016] The selective wave peak automatic soldering machine can be suitable for tin soldering of magnetic ring type common mode inductors, has the advantages of good applicability and simple operation, can improve soldering efficiency of batch products and prevent tin particles from polluting products while ensuring machining precision and machining quality. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings that form a part of this application provide further understanding of the present application, the illustrative embodiments of the present application and its description serve to explain the present application, and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 The structure schematic view of the selective wave peak automatic soldering machine is described in the embodiments of the present application;

[0019] Figure 2 The structure schematic view of the bearing plate in the selective wave peak automatic soldering machine is described in the embodiments of the present application;

[0020] Figure 3 The structure schematic view of the support frame in the selective wave peak automatic soldering machine is described in the embodiments of the present application;

[0021] Figure 4 The structure schematic view of the jig in the selective wave peak automatic soldering machine is described in the embodiments of the present application;

[0022] Figure 5 The structure schematic view of the isolation plate in the selective wave peak automatic soldering machine is described in the embodiments of the present application;

[0023] Figure 6 The structure schematic view of the grabbing and moving mechanism in the selective wave peak automatic soldering machine is described in the embodiments of the present application;

[0024] Figure 7 The structure schematic view of the stationary tin furnace in the selective wave peak automatic soldering machine is described in the embodiments of the present application.

[0025] BRIEF DESCRIPTION OF DRAWINGS

[0026] 1, platform; 2, bearing mechanism; 3, soldering mechanism; 4, selective wave soldering furnace; 5, grabbing moving mechanism; 6, bearing plate; 7, mounting hole; 8, jig; 9, isolation plate; 10, product; 11, positioning hole; 12, induction mark; 13, support frame; 14, limiting groove; 15, limiting column; 16, positioning groove; 17, through hole; 18, chamfer; 19, drainage groove; 20, clamping jaw assembly; 21, pressing plate; 22, equipment mounting frame; 23, first spring telescopic rod; 24, pressing piece; 25, second spring telescopic rod; 26, detection assembly; 27, static soldering furnace; 28, slag scraping plate; 29, bending part; 30, linear module; 31, lifting cylinder; 32, three-axis gantry platform; 33, positioning pin; 34, positioning column. DETAILED DESCRIPTION

[0027] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" and the like are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0029] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0030] The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0031] A selective wave automatic soldering machine, such as Figures 1 to 7As shown, including the platform 1, the platform 1 is provided with a carrying mechanism 2 for carrying products 10, a flux mechanism 3 for containing flux and a selective wave soldering furnace 4 in sequence; the carrying mechanism 2 comprises a support frame 13 provided on the platform 1 and a carrying plate 6 provided on the support frame 13, the carrying plate 6 is detachably mounted on the support frame 13, the carrying plate 6 is provided with a jig 8 for carrying products 10, the jig 8 is detachably mounted on the carrying plate 6, the carrying plate 6 is provided with a plurality of mounting holes 7 for mounting the jig 8, and the platform 1 is provided with a grabbing moving mechanism 5 for moving the carrying plate 6. Wherein, the flux mechanism 3 can adopt the existing flux dipping machine used on the existing soldering machine, and the installation and working mode are both prior art, which will not be repeated here.

[0032] In actual application, the carrying plate 6 can also be fixed with a handle to facilitate the operator to take and place the carrying plate 6, the operator can use the jig 8 to carry the product 10, and the carrying plate 6 can carry a plurality of jigs 8, the selective wave soldering furnace 4 can be provided one by one with the jig 8, each selective wave soldering furnace 4 can be installed on the platform 1 by screw and other conventional methods, and by providing a plurality of selective wave soldering furnaces 4, it is beneficial to improve the soldering efficiency of batch products 10 while ensuring the processing precision and quality.

[0033] Specifically, the product 10 can be soldered according to the following steps: the product 10 can be placed in the positioning groove 16 of the jig 8, and the pin of the product 10 can pass through the through hole 17, then the jig 8 with the product 10 can be installed on the carrying plate 6, and finally the carrying plate 6 can be moved by the grabbing moving mechanism 5, first to the flux mechanism 3 to dip flux, and then to the selective wave soldering furnace 4 for pin soldering, and after soldering, the carrying plate 6 can be placed on the support frame 13, which is very simple to operate.

[0034] Preferably, the support frame 13 is provided with a limiting groove 14 matched with the carrying plate 6, the support frame 13 is provided with a limiting column 15 at a position corresponding to the limiting groove 14, the limiting column 15 is provided with at least two corresponding to the left and right ends of the carrying plate 6, and the carrying plate 6 is provided with a limiting hole matched with the limiting column 15. Exemplarily, the support frame 13 can be provided with two, each support frame 13 can be fixed on the platform 1 by screw, and the limiting column 15 can also be provided with two, each limiting column 15 is fixed on the support frame 13. By providing two support frames 13, it is convenient for the subsequent grabbing moving mechanism to grab the carrying plate 6, and by providing the limiting groove 14 and the limiting column 15 on each support frame 13 to limit the carrying plate 6, it is beneficial to improve the stability of the carrying plate 6 on the support frame 13, and facilitate the grabbing moving mechanism 5 to accurately grab and move the carrying plate 6.

[0035] Preferably, the jig 8 is provided with a detachable isolation plate 9, and the isolation plate 9 is provided with a positioning groove 16 above and a through hole 17 below. The through hole 17 is in communication with the positioning groove 16 and has a diameter greater than that of the pin of the product 10.

[0036] Preferably, the isolation plate 9 is made of a high-temperature-resistant material such as synthetic stone, and the diameter of the through hole 17 is 0.5 mm greater than that of the pin of the product 10. Those skilled in the art can also make adjustments according to actual needs, which will not be described here. In actual use, the positioning groove 16 on the isolation plate 9 can play a good positioning role for the product 10, ensuring that the product 10 can move stably with the jig 8. By setting the diameter of the through hole 17 to be greater than that of the pin of the product 10, the tin can be soldered to the root of the pin, and the tin particles can also be prevented from splashing onto the magnetic ring through the through hole 17.

[0037] Preferably, the isolation plate 9 is provided with four protruding portions uniformly arranged at the edges, and the jig 8 is provided with an assembly hole corresponding to the isolation plate 9. The jig 8 is provided with a positioning portion corresponding to the assembly hole. The isolation plate 9 can be stably positioned on the jig 8 by using the protruding portion and the positioning portion, and limiting the isolation plate 9 by using the assembly hole, so as to ensure that the jig 8 can support and limit the isolation plate 9.

[0038] In actual application, the isolation plate 9 can be installed on the bearing plate 6 by using the jig 8. The operator can replace the appropriate isolation plate 9 as needed without replacing the jig 8. The cooperation between the jig 8 and the mounting hole 7 of the bearing plate 6 can also ensure stability, and there will be no cooperation error due to the replacement of the isolation plate 9, which is beneficial to improve the moving accuracy of the subsequent isolation plate 9.

[0039] Preferably, the isolation plate 9 is provided with a chamfer 18 corresponding to the opening of the through hole 17. The chamfer 18 can form a tapered recess at the end of the through hole 17, so that the chamfer 18 can play a good guiding role for the soldering, guide the soldering to enter the through hole 17 stably and quickly, and flow to the pin root that needs to be soldered, which is beneficial to improve the soldering effect of the pin.

[0040] Preferably, the isolation plate 9 is also provided with a drainage groove 19 corresponding to the chamfer 18, and the drainage groove 19 is in communication with the through hole 17 through the chamfer 18. Specifically, the drainage groove 19 can be arranged corresponding to the edge of the isolation plate 9, and the opening faces the outside of the isolation plate 9. By setting the drainage groove 19, when the isolation plate 9 is in contact with the soldering, the soldering can quickly enter the chamfer 18 through the drainage groove 19, ensuring that the soldering can enter the through hole 17 more uniformly and finally uniformly contact with the pin, which is beneficial to improve the uniformity of the pin soldering.

[0041] Preferably, the grabbing moving mechanism 5 comprises a three-axis gantry platform 32, and a clamping jaw assembly 20 and a pressing assembly arranged on the three-axis gantry platform 32; the clamping jaw assembly 20 is arranged at least in two groups along the length direction of the bearing plate 6, the pressing assembly is arranged in one-to-one correspondence with the jig 8, the isolation plate 9 is installed on the bearing plate 6 through the jig 8, the isolation plate 9 and the jig 8 are detachably connected, and the edge of the jig 8 is provided with a positioning edge capable of cooperating with the pressing assembly.

[0042] Specifically, the three-axis gantry platform 32 can adopt an existing three-axis platform, the fixed end of the three-axis gantry platform 32 can be installed on the platform 1 through a conventional screw or the like, and the clamping jaw assembly 20 and the pressing assembly can be installed on the movable end of the three-axis gantry platform 32 in a conventional manner, so as to drive the clamping jaw assembly 20 and the pressing assembly to move and lift. The power supply and control mode both belong to the prior art, and thus will not be described here. The clamping jaw assembly 20 can also adopt an existing pneumatic clamping jaw, and the installation and control mode also belong to the prior art. Those skilled in the art can also select a suitable clamping jaw assembly 20 according to actual needs to achieve the grabbing of the bearing plate 6, and thus will not be described here.

[0043] Preferably, the pressing assembly comprises a device mounting rack 22, the device mounting rack 22 is provided with a pressing plate 21 for pressing and positioning the jig 8, the pressing plate 21 is connected with the device mounting rack 22 through a first spring telescopic rod 23, the pressing plate 21 is provided with a pressing piece 24 for pressing and positioning the product 10, and the pressing piece 24 is connected with the pressing plate 21 through a second spring telescopic rod 25. Exemplarily, the device mounting rack 22 can be fixedly installed on the movable end of the three-axis gantry platform 32 through a screw. The first spring telescopic rod 23 and the second spring telescopic rod 25 can both adopt an existing spring rod, and the installation and working mode of the spring rod both belong to the prior art, and thus will not be described here.

[0044] In actual application, the left and right sides of the pressing plate 21 can be connected with the device mounting rack 22 through the first spring telescopic rod 23, so as to ensure the stability of the pressing plate 21 when moving up and down. By arranging the first spring telescopic rod 23, when the clamping jaw assembly 20 is needed to grab the bearing plate 6, the pressing assembly can be first driven to press down and fix the bearing plate 6, so as to improve the stability of the bearing plate 6 after being grabbed by the clamping jaw assembly 20. When the pressing plate 21 presses down the jig 8 and the positioning edge thereof, the two first spring telescopic rods 23 can play a good buffering and guiding role, and the reset elastic force of the first spring telescopic rod 23 can also ensure that the pressing plate more stably presses the bearing plate 6.

[0045] In addition, by arranging the liftable pressing member 24 on the pressing plate 21 and connecting the pressing member 24 and the pressing plate 21 by the second spring telescopic rod 25, the pressing member 24 can also press the product 10 on the jig 8, ensuring that the product 10 and the jig 8 are stable when the clamping jaw assembly 20 grabs the carrier plate 6, which is beneficial to improve the stability of the product 10 during subsequent movement and soldering, and ensure the soldering quality.

[0046] Preferably, a positioning pin 33 is arranged below the pressing plate 21, and at least two positioning pins 33 are arranged on the left and right sides of the jig 8, and a positioning hole 11 capable of cooperating with the positioning pin 33 is arranged on the positioning edge of the jig 8, and a positioning column 34 capable of cooperating with the positioning hole 11 is arranged on the carrier plate 6 corresponding to the positions of the left and right sides of the jig 8. Exemplarily, two positioning pins 33 are arranged correspondingly, and each positioning pin 33 is fixed at one end on the pressing plate 21 and has a tapered end portion at the other end for being inserted into the positioning hole 11. Correspondingly, the positioning hole 11 and the positioning column 34 are also arranged correspondingly, and the positioning column 34 is fixed on the carrier plate 6, and the stable positioning of the jig 8 can be realized by cooperation of the two positioning columns 34 and the positioning pin 33 with the positioning hole 11. Those skilled in the art can also select to arrange multiple ones according to actual needs, which will not be described here.

[0047] In actual application, by arranging the positioning column 34 on the carrier plate 6 and cooperating the positioning column 34 with the positioning hole 11 on the jig 8, the jig 8 can be further limited, ensuring that the jig 8 is stably arranged on the carrier plate 6 and moves stably with the carrier plate 6. Meanwhile, by arranging the positioning pin 33 below the pressing plate 21 and the positioning hole 11 on the positioning edge of the jig 8 which cooperates with the positioning pin 33, when the jig 8 and the product 10 are positioned by the pressing plate 21, the positioning pin 33 can pass through the positioning hole 11 on the positioning edge of the jig 8 and press the jig 8 so that the positioning column 34 and the positioning hole 11 cooperate stably, thereby realizing the stable connection between the jig 8 and the carrier plate 6, which is beneficial to further improve the stability of the product 10 during the soldering process and prevent the soldering quality of the pins of the product 10 from being affected by the accidental movement of the jig 8.

[0048] Preferably, an inductive mark 12 is arranged on the positioning edge, and a detection assembly 26 for detecting the inductive mark 12 is arranged on the pressing plate 21. Exemplarily, the detection assembly 26 includes a sensor installed on the pressing plate 21, and the sensor can be installed by a conventional method such as screwing, and the inductive mark 12 can be installed on the positioning edge by a conventional method such as adhesive bonding. Those skilled in the art can select a sensor capable of identifying the inductive mark 12 according to the model of the inductive mark 12, and therefore the description will not be repeated here.

[0049] In actual application, the inductive mark 12 is arranged at different positions on the positioning edge, and the sensor capable of identifying different inductive marks 12 is arranged at the corresponding position on the pressing plate 21, so that the identification of the jig 8 can be realized, so that the operator can use different jigs 8 to carry the jig 8 with different products 10, and select the appropriate soldering program according to the needs to solder, which is beneficial to further improve the soldering efficiency of batch products 10, and the person skilled in the art can also set according to the actual needs, which will not be repeated here.

[0050] Preferably, a stationary soldering furnace 27 and a slag scraping mechanism are arranged on the platform 1 at a position corresponding to the soldering mechanism 3 and the selective wave soldering furnace 4. The slag scraping mechanism comprises a slag scraping plate 28 arranged obliquely above the stationary soldering furnace 27, and the platform 1 is provided with a driving assembly for driving the slag scraping plate 28 to act. One end of the slag scraping plate 28 obliquely downward extends into the stationary soldering furnace 27, and the other end is connected with the driving assembly. The end of the slag scraping plate 28 extending into the stationary soldering furnace 27 is provided with an arc-shaped bending part 29. By arranging the slag scraping plate 28, the soldering effect of the stationary soldering furnace 27 can be ensured. At the same time, by arranging the bending part 29 on the slag scraping plate 28, the slag scraping effect of the slag scraping plate 28 on the stationary soldering furnace 27 can be improved.

[0051] In actual application, the driving assembly can adopt a combination of a linear module 30 and a lifting cylinder 31. The fixed end of the lifting cylinder 31 can be installed on the sliding table of the linear module 30 by a conventional installation method such as screw. The slag scraping plate 28 can be fixed on the telescopic end of the lifting cylinder 31 by a conventional installation method such as screw. The fixed end of the linear module 30 and the stationary soldering furnace 27 can be installed on the platform 1 by a conventional installation method such as screw. Illustratively, the stationary soldering furnace 27 can adopt a square or long strip-shaped soldering furnace. The operator can select the stationary soldering furnace 27 or the selective wave soldering furnace 4 for soldering according to the soldering needs of different products 10, so as to improve the efficiency.

[0052] In addition, the inductive mark 12 and the detection assembly 26 can be used to carry the product 10 requiring soldering by the selective wave soldering furnace 4 by using the jig 8 with the first inductive mark 12 and the jig 8, and the product 10 requiring the use of the stationary soldering furnace 27 by using the jig 8 with the second inductive mark 12. The sensors capable of identifying the first inductive mark 12 and the second inductive mark 12 are arranged on the pressing plate 21. In the process of grabbing the carrying plate 6 by the grabbing and moving mechanism 5, the inductive mark 12 can be identified by the sensor on the pressing plate 21. When the first inductive mark 12 is identified, the carrying plate 6 can be finally moved to the selective wave soldering furnace 4 for soldering. When the second inductive mark 12 is identified, the carrying plate 6 can be finally moved to the stationary soldering furnace 27 for soldering, so as to realize the switching of soldering operation for different products 10.

[0053] The selective wave peak automatic soldering machine can be suitable for tin soldering of the magnetic ring type common mode inductor, has the advantages of good applicability and simple operation, and can improve soldering efficiency of batch products while ensuring machining precision and machining quality. By using the jig to carry the product, the stability of the product in the grabbing and moving process is improved, and by setting the diameter of the through hole to be greater than the diameter of the product pin, setting the chamfer and the drainage groove, the tin soldering can be ensured to be connected to the root of the pin, and the tin particles can be prevented from splashing onto the magnetic ring through the through hole.

[0054] The above merely describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A selective wave soldering machine, characterized in that: The platform (1) is provided with a supporting mechanism (2) for carrying products (10), a flux mechanism (3) for containing flux, and a selective wave crest tin furnace (4) in sequence; the supporting mechanism (2) comprises a support frame (13) provided on the platform (1) and a carrying plate (6) provided on the support frame (13), the carrying plate (6) is detachably mounted on the support frame (13), the carrying plate (6) is provided with a jig (8) for carrying products (10), the jig (8) is detachably mounted on the carrying plate (6), the carrying plate (6) is provided with a plurality of mounting holes (7) for mounting the jig (8), and the platform (1) is provided with a grabbing moving mechanism (5) for moving the carrying plate (6).

2. A selective wave-soldering machine according to claim 1, characterized in that: The jig (8) is provided with a detachable isolation plate (9), the isolation plate (9) is provided with a positioning groove (16) matched with the product (10) above, and the isolation plate (9) passes through the jig (8) below; the isolation plate (9) is provided with a through hole (17) corresponding to the position of the positioning groove (16) for facilitating the pin of the product (10) to pass through, the through hole (17) is communicated with the positioning groove (16), and the diameter of the through hole (17) is greater than the diameter of the pin of the product (10).

3. A selective wave-soldering machine according to claim 2, characterized in that: The isolation plate (9) is provided with a chamfer (18) below the position corresponding to the aperture of the through hole (17).

4. A selective wave-soldering machine according to claim 3, characterized in that: The isolation plate (9) is further provided with a drainage groove (19) below, the drainage groove (19) is arranged corresponding to the chamfer (18), and the drainage groove (19) is communicated with the through hole (17) through the chamfer (18).

5. A selective wave soldering machine according to any one of claims 1 to 4, characterized in that: The grabbing moving mechanism (5) comprises a three-axis gantry platform (32), a clamping jaw assembly (20) and a pressing assembly provided on the three-axis gantry platform (32); the clamping jaw assembly (20) is arranged at least in two groups along the length direction of the carrying plate (6), and the pressing assembly is arranged one-to-one corresponding to the jig (8); the edge of the jig (8) is provided with a positioning edge capable of cooperating with the pressing assembly.

6. A selective wave-soldering machine according to claim 5, characterized in that: The pressing assembly comprises a device mounting frame (22), the device mounting frame (22) is provided with a pressing plate (21) for pressing and positioning the jig (8), the pressing plate (21) is connected with the device mounting frame (22) through a first spring telescopic rod (23), the pressing plate (21) is provided with a pressing piece (24) for pressing and positioning the product (10), and the pressing piece (24) is connected with the pressing plate (21) through a second spring telescopic rod (25).

7. A selective wave-soldering machine according to claim 6, characterized in that: The pressing plate (21) is provided with a positioning pin (33) below, the positioning pin (33) is arranged at least two on the left and right sides of the jig (8), the positioning edge of the jig (8) is provided with a positioning hole (11) capable of cooperating with the positioning pin (33), and the carrying plate (6) is provided with a positioning column (34) capable of cooperating with the positioning hole (11) at positions corresponding to the left and right sides of the jig (8).

8. The selective wave-soldering machine according to claim 6, characterized in that: The positioning edge is further provided with an induction mark (12), and the pressing plate (21) is provided with a detection assembly (26) for detecting the induction mark (12).

9. The selective wave-soldering machine according to claim 1, characterized in that: The support frame (13) is provided with a limiting groove (14) matched with the bearing plate (6), and the support frame (13) is provided with a limiting post (15) at a position corresponding to the limiting groove (14); the limiting post (15) is provided with at least two limiting posts corresponding to the left and right ends of the bearing plate (6); and the bearing plate (6) is provided with a limiting hole matched with the limiting post (15).

10. The selective wave-soldering machine according to claim 1, characterized in that: The platform (1) is further provided with a static tin furnace (27) and a slag scraping mechanism at a position between the soldering mechanism (3) and the selective peak tin furnace (4); the slag scraping mechanism comprises a slag scraping plate (28) obliquely arranged above the static tin furnace (27); the platform (1) is provided with a driving assembly for driving the slag scraping plate (28) to act; one end of the slag scraping plate (28) obliquely downward extends into the static tin furnace (27), and the other end is connected with the driving assembly; and the one end of the slag scraping plate (28) extending into the static tin furnace (27) is provided with an arc-shaped bending part (29).

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