Double-station quartz crystal laser cutting machine

Abstract

The utility model discloses a double-station quartz crystal laser cutting machine which comprises a rack, a first motion platform and a first laser cutter and further comprises a transfer device, a second motion platform and a second laser cutter. A first material frame and a second material frame are arranged on the two sides of the rack correspondingly. The transfer device is arranged on the rack and located between the first material frame and the second material frame. The first laser cutter is opposite to the first motion platform, and the second laser cutter is opposite to the second motion platform; the transfer device can alternately transfer the quartz crystal plates in the first material frame to the first motion platform and transfer the quartz crystal plates in the second material frame to the second motion platform; the two stations can conduct laser cutting operation at the same time, it is not needed to wait for a single station to complete the complete process of feeding, cutting and discharging and then start the next round of operation, the waiting time between procedures is effectively eliminated, the unit time machining amount of equipment is remarkably increased, and the continuous machining requirement of large-batch quartz crystal plates is met.

Description

TECHNICAL FIELD

[0001] The utility model relates to quartz crystal processing equipment field, especially in kind of double -station quartz crystal laser cutting machine. BACKGROUND

[0002] In the field of quartz crystal processing, laser cutting has become the mainstream technical means of quartz crystal plate cutting processing because of the advantages of high precision, small heat-affected zone, etc. The quartz crystal laser cutting machine on the market is mostly single-station structure, and its core working process is usually: first, the quartz crystal plate to be cut is sent to a single moving platform by manual or a single transfer mechanism, then the cutting operation is completed by the corresponding laser cutter, and after the cutting is completed, the finished product is removed from the moving platform, and then the next batch of plate materials to be cut is fed and cut.

[0003] This single-station operation mode has significant limitations: on the one hand, the feeding, cutting and discharging processes need to be performed in sequence, and there is obvious waiting time between the links, resulting in low overall operation efficiency of the equipment, which is difficult to meet the continuous processing needs of large quantities of quartz crystal plates; on the other hand, the single-station equipment has poor flexibility when dealing with fluctuating processing tasks, and if a single moving platform or laser cutter fails, the entire production line will be stalled, seriously affecting the production progress. With the increasing demand for quartz crystal components in the electronic information industry, higher requirements are put forward for the efficiency, continuity and stability of laser cutting equipment, and the traditional single-station laser cutting machine has been difficult to meet the needs of modern production. SUMMARY

[0004] The utility model aims at least to solve one of the technical problems existing in the prior art. To this end, the utility model provides a double-station quartz crystal laser cutting machine.

[0005] The technical scheme adopted by an embodiment of the utility model to solve its technical problem is: a double-station quartz crystal laser cutting machine, comprising a rack, a first moving platform and a first laser cutter, further comprising a transfer device, a second moving platform and a second laser cutter;

[0006] The first material frame and the second material frame are arranged on both sides of the rack, and the first material frame and the second material frame are used for storing quartz crystal plates;

[0007] The transfer device is arranged on the rack and located between the first material frame and the second material frame;

[0008] The first moving platform and the second moving platform are arranged on the rack with a spacing, and are used for carrying quartz crystal plates;

[0009] The first laser cutter is opposite to the first moving platform, and the second laser cutter is opposite to the second moving platform;

[0010] The transfer device can alternately transfer the quartz crystal plate in the first material frame to the first moving platform and transfer the quartz crystal plate in the second material frame to the second moving platform, so that the first laser cutter and the second laser cutter simultaneously perform laser cutting on the quartz crystal plate on the first moving platform and the quartz crystal plate on the second moving platform.

[0011] As one of the preferred embodiments of the utility model, the first material frame and the second material frame have a first storage space and a second storage space, the first storage space is used for storing the quartz crystal plate to be cut, and the second storage space is used for storing the cut quartz crystal plate.

[0012] As one of the preferred embodiments of the utility model, a plurality of plate grooves are arranged in the vertical direction in the first storage space and the second storage space, and the quartz crystal plate is inserted into the plate groove.

[0013] As one of the preferred embodiments of the utility model, the first material frame and the second material frame are both provided as two.

[0014] As one of the preferred embodiments of the utility model, the transfer device includes a mechanical hand, a lifting assembly, a first suction cup assembly, and a second suction cup assembly, the lifting assembly is installed at the end of the mechanical hand, the first suction cup assembly and the second suction cup assembly are installed at the output end of the lifting assembly and are arranged on both sides thereof, the first suction cup assembly is used for adsorbing the quartz crystal plate to be cut, and the second suction cup assembly is used for adsorbing the cut quartz crystal plate.

[0015] As one of the preferred embodiments of the utility model, the first moving platform includes a first X-axis moving mechanism, a first Y-axis moving mechanism, and a first stage, the first stage is installed on the first X-axis moving mechanism, the first X-axis moving mechanism is installed on the first Y-axis moving mechanism, and the first stage is used for carrying the quartz crystal plate.

[0016] The second moving platform includes a second X-axis moving mechanism, a second Y-axis moving mechanism, and a second stage, the second stage is installed on the second X-axis moving mechanism, the second X-axis moving mechanism is installed on the second Y-axis moving mechanism, and the second stage is used for carrying the quartz crystal plate.

[0017] The first laser cutter is used for laser cutting the quartz crystal plate on the first stage, and the second laser cutter is used for laser cutting the quartz crystal plate on the second stage.

[0018] As one of the preferred embodiments of the utility model, the first stage and the second stage are provided with a vacuum adsorption assembly for adsorbing and fixing the quartz crystal plate.

[0019] As one of the preferred embodiments of the utility model, a fixing seat is arranged on the rack for fixing the first material frame and the second material frame.

[0020] The utility model discloses an advantage: a kind of double-station quartz crystal laser cutting machine, including rack, first motion platform and first laser cutting device, further including transfer device, second motion platform and second laser cutting device;The two sides of rack are provided with first material frame and second material frame respectively, and first material frame and second material frame are used to store quartz crystal plate;Transfer device is arranged on rack and is located between first material frame and second material frame;First motion platform and second motion platform are spaced apart and arranged on rack, for carrying quartz crystal plate;First laser cutting device is opposite to first motion platform, and second laser cutting device is opposite to second motion platform;Transfer device can alternately transport quartz crystal plate in first material frame to first motion platform and transport quartz crystal plate in second material frame to second motion platform, so that first laser cutting device and second laser cutting device simultaneously carry out laser cutting on quartz crystal plate on first motion platform and quartz crystal plate on second motion platform;Through above-mentioned structure, two stations can simultaneously carry out laser cutting operation, without waiting single station complete feeding-cutting-discharging complete process to start next round operation again, effectively eliminate waiting time between process, significantly improve the processing capacity of equipment per unit time, meet the continuous processing demand of large quantities of quartz crystal plate. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and / or additional aspects and advantages of the utility model will become apparent and more readily appreciated from the following description of the embodiments, with reference to the following drawings, in which:

[0022] Figure 1 It is a structure schematic diagram of a double-station quartz crystal laser cutting machine;

[0023] Figure 2 It is Figure 1 It is the local enlarged view of A area in

[0024] Figure 3 It is the structure schematic diagram of first motion platform and second motion platform. DETAILED DESCRIPTION

[0025] This part will describe the specific embodiment of the utility model in detail, and the preferred embodiment of the utility model is shown in the drawings, and the effect of the drawings is to supplement the description of the text part with graphics, so that people can intuitively and visually understand each technical feature and overall technical scheme of the utility model, but it cannot be understood as the limitation of the protection scope of the utility model.

[0026] In the description of the utility model, the meaning of multiple is two or more than, less than, more than, etc. Understand as not including the number, above, below, within, etc. Understand as including the number. If there is a description to the first, second, it is only used for distinguishing the purpose of technical features, and can not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0027] In the description of the utility model, it is understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. It is based on the orientation or position relationship shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and is not indicative or suggestive of the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, therefore, it can not be understood as a limitation on the utility model.

[0028] In the utility model, unless otherwise explicitly limited, the words such as "arrangement", "installation", "connection" should be broadly understood, for example, it can be directly connected, also can be indirectly connected through intermediate medium;It can be fixedly connected, can also be detachably connected, can also be integrally formed;It can be mechanical connection;It can be the internal communication of two elements or the interaction relationship of two elements. The skilled in the art can determine the specific meaning of the above words in the utility model in combination with the specific content of the technical scheme.

[0029] Reference Figures 1-3 A double-station quartz crystal laser cutting machine, comprising a rack 10, a first motion platform 30 and a first laser cutting device 51, further comprising a transfer device 20, a second motion platform 40 and a second laser cutting device 52;

[0030] The two sides of the rack 10 are respectively provided with a first material frame 60a and a second material frame 60b, and the first material frame 60a and the second material frame 60b are used for storing quartz crystal plates;

[0031] The transfer device 20 is arranged on the rack 10 and located between the first material frame 60a and the second material frame 60b;

[0032] The first motion platform 30 and the second motion platform 40 are arranged on the rack 10 with a spacing, and are used for carrying quartz crystal plates;

[0033] The first laser cutting device 51 is opposite to the first motion platform 30, and the second laser cutting device 52 is opposite to the second motion platform 40;

[0034] The transport device 20 can alternately transport the quartz crystal plate in the first material frame 60a to the first moving platform 30 and transport the quartz crystal plate in the second material frame 60b to the second moving platform 40, so that the first laser cutter 51 and the second laser cutter 52 simultaneously perform laser cutting on the quartz crystal plate on the first moving platform 30 and the quartz crystal plate on the second moving platform 40.

[0035] In the utility model, the working principle of the laser cutting machine is as follows:

[0036] 1) Place the first material frame 60a and the second material frame 60b storing the to-be-cut quartz crystal plates on the rack 10, after starting the laser cutting machine, the transport device 20 first transports the first to-be-cut quartz crystal plate on the first material frame 60a to the first moving platform 30, the first moving platform 30 drives the to-be-cut quartz crystal plate to move along the X-axis and the Y-axis, and the first laser cutter 51 performs laser cutting on the to-be-cut quartz crystal plate on the first moving platform 30; at the same time, the transport device 20 transports the first to-be-cut quartz crystal plate on the second material frame 60b to the second moving platform 40, the second moving platform 40 drives the to-be-cut quartz crystal plate to move along the X-axis and the Y-axis, and the second laser cutter 52 performs laser cutting on the to-be-cut quartz crystal plate on the second moving platform 40.

[0037] 2) When the first laser cutter 51 completes cutting on the to-be-cut quartz crystal plate on the first moving platform 30, the transport device 20 transports the second to-be-cut quartz crystal plate on the first material frame 60a to be close to the first moving platform 30, after taking off the cut quartz crystal plate on the first moving platform 30, the second to-be-cut quartz crystal plate is placed on the first moving platform 30, the first moving platform 30 drives the second to-be-cut quartz crystal plate to move along the X-axis and the Y-axis, and the first laser cutter 51 performs laser cutting on the second to-be-cut quartz crystal plate on the first moving platform 30; at the same time, when the second laser cutter 52 completes cutting on the to-be-cut quartz crystal plate on the second moving platform 40, the transport device 20 transports the second to-be-cut quartz crystal plate on the second material frame 60b to be close to the second moving platform 40, after taking off the cut quartz crystal plate on the second moving platform 40, the second to-be-cut quartz crystal plate is placed on the second moving platform 40, the second moving platform 40 drives the second to-be-cut quartz crystal plate to move along the X-axis and the Y-axis, and the second laser cutter 52 performs laser cutting on the second to-be-cut quartz crystal plate on the second moving platform 40.

[0038] 3) Recycle according to the above 1) -2), until the to-be-cut quartz crystal plates on the first material frame 60a and the second material frame 60b are all cut.

[0039] Refer to Figures 1-2In some embodiments, the first material frame 60a and the second material frame 60b are both provided in two, one of which is in a working state and the other is in a standby state. When the first material frame 60a and the second material frame 60b in the working state are completed, the transfer device 20 transfers the quartz crystal plate to be cut in the other first material frame 60a and the second material frame 60b, so as to be in a working state. At this time, the staff member removes the first material frame 60a and the second material frame 60b completed cutting and replaces the first material frame 60a and the second material frame 60b to be cut in the standby state, so as to realize uninterrupted work and greatly improve the production efficiency.

[0040] With reference to Figures 1-2 In some embodiments, the first material frame 60a and the second material frame 60b have a first storage space 61 and a second storage space 62. The first storage space 61 is used for storing the quartz crystal plate to be cut, and the second storage space 62 is used for storing the quartz crystal plate completed cutting. Further, the first storage space 61 and the second storage space 62 are provided with a plurality of plate grooves 63 arranged in the vertical direction. The quartz crystal plate is inserted into the plate groove 63.

[0041] With reference to Figures 1-2 In some embodiments, the transfer device 20 includes a mechanical hand 21, a lifting assembly 22, a first suction disc assembly 23, and a second suction disc assembly 24. The lifting assembly 22 is installed at the end of the mechanical hand 21. The first suction disc assembly 23 and the second suction disc assembly 24 are installed at the output end of the lifting assembly 22 and are arranged on both sides thereof. The first suction disc assembly 23 is used for adsorbing the quartz crystal plate to be cut, and the second suction disc assembly 24 is used for adsorbing the quartz crystal plate completed cutting.

[0042] Specifically, when the manipulator 21 drives the lifting assembly 22, the first suction cup assembly 23 and the second suction cup assembly 24 to approach the first material frame 60a or the second material frame 60b, first, the first suction cup assembly 23 and the second suction cup assembly 24 are controlled to reach a specified height by the lifting assembly 22, and then the whole is driven by the manipulator 21 to move towards the first material frame 60a or the second material frame 60b until the first suction cup assembly 23 is attached to the upper end face of the target quartz crystal plate to be cut, and the first suction cup assembly 23 is started to perform adsorption, the whole is driven by the manipulator 21 to approach the first movement platform 30 or the second movement platform 40, and the second suction cup assembly 24 is attached to the upper end face of the cut quartz crystal plate by cooperation of the manipulator 21 and the lifting assembly 22, and the second suction cup assembly 24 is started to perform adsorption, after being grabbed and lifted, the first suction cup assembly 23 and the second suction cup assembly 24 are reversely rotated by 180°, so that the quartz crystal plate to be cut adsorbed by the first suction cup assembly 23 is placed on the first movement platform 30 or the second movement platform 40, and finally the cut quartz crystal plate grabbed by the second suction cup assembly 24 is accommodated in the first material frame 60a or the second material frame 60b by cooperation of the manipulator 21 and the lifting assembly 22, and the cycle is repeated; it should be noted that the manipulator 21 can adopt any manipulator meeting the movement requirement, the lifting assembly 22 can adopt a lead screw module, and of course, the transfer device 20 can also adopt a high-precision manipulator with more degrees of freedom to complete, which will not be described here again and should not be considered as a limitation of the utility model.

[0043] With reference to Figures 1-3 In some embodiments, the first movement platform 30 comprises a first X-axis movement mechanism 31, a first Y-axis movement mechanism 32 and a first carrier 33, the first carrier 33 is arranged on the first X-axis movement mechanism 31, the first X-axis movement mechanism 31 is arranged on the first Y-axis movement mechanism 32, and the first carrier 33 is used to carry the quartz crystal plate; the second movement platform 40 comprises a second X-axis movement mechanism 41, a second Y-axis movement mechanism 42 and a second carrier 43, the second carrier 43 is arranged on the second X-axis movement mechanism 41, the second X-axis movement mechanism 41 is arranged on the second Y-axis movement mechanism 42, and the second carrier 43 is used to carry the quartz crystal plate; the first laser cutter 51 is used to perform laser cutting on the quartz crystal plate on the first carrier 33, and the second laser cutter 52 is used to perform laser cutting on the quartz crystal plate on the second carrier 43; in further embodiments, the first Y-axis movement mechanism 32 and the second Y-axis movement mechanism 42 can be completed by using the same linear motion module, that is, the first X-axis movement mechanism 31 and the second X-axis movement mechanism 41 are arranged on the same linear motion module, and only the movement stroke needs to be extended, which can reduce the complexity of the structure.

[0044] With reference to Figures 1-3In some embodiments, the first carrier 33 and the second carrier 43 are provided with vacuum adsorption assemblies 70 for adsorbing and fixing the quartz crystal plate.

[0045] With reference to Figures 1-2 In some embodiments, the rack 10 is provided with fixing seats 80 for fixing the first material frame 60a and the second material frame 60b, and the first material frame 60a and the second material frame 60b are locked with the fixing seats 80 in a quick disassembly and assembly structure, which not only improves the convenience of disassembly and assembly, but also ensures the accuracy of the positions of the first material frame 60a and the second material frame 60b, facilitating the taking and placing of the transfer device 20.

[0046] The utility model discloses the advantage lies in: through above -mentioned structure makes two stations can carry out laser cutting operation simultaneously, need not wait for single station to complete the complete flow of feeding - cutting - unloading after starting the next round operation again, effectively eliminated the waiting time between processes, significantly improved the equipment's unit time processing capacity, met the continuous processing demand of large -batch quartz crystal plate.

[0047] Of course, the utility model is not limited to the above-mentioned embodiment, and those skilled in the art can make equivalent transformation or replacement without departing from the spirit of the utility model, and these equivalent transformations and replacements are all included in the range defined by the claims of the present application.

Claims

1. A double-station quartz crystal laser cutting machine comprising a rack (10), a first moving platform (30) and a first laser cutting device (51), characterized in that: Further comprising a transfer device (20), a second movement platform (40) and a second laser cutter (52); The machine frame (10) is provided with a first material frame (60a) and a second material frame (60b) on both sides, and the first material frame (60a) and the second material frame (60b) are used for storing quartz crystal plates. The transfer device (20) is arranged on the machine frame (10) and located between the first material frame (60a) and the second material frame (60b); The first movement platform (30) and the second movement platform (40) are arranged on the machine frame (10) in a spaced manner and are used for carrying quartz crystal plates; The first laser cutter (51) is opposite to the first movement platform (30), and the second laser cutter (52) is opposite to the second movement platform (40); The transfer device (20) can alternately transfer the quartz crystal plates in the first material frame (60a) to the first movement platform (30) and transfer the quartz crystal plates in the second material frame (60b) to the second movement platform (40), so that the first laser cutter (51) and the second laser cutter (52) simultaneously perform laser cutting on the quartz crystal plates on the first movement platform (30) and the second movement platform (40).

2. A dual station quartz crystal laser cutting machine as claimed in claim 1 wherein: The first material frame (60a) and the second material frame (60b) have a first storage space (61) and a second storage space (62), the first storage space (61) is used for storing to-be-cut quartz crystal plates, and the second storage space (62) is used for storing cut quartz crystal plates.

3. A dual station quartz crystal laser cutting machine as claimed in claim 2 wherein: The first storage space (61) and the second storage space (62) are provided with a plurality of plate grooves (63) arranged in a spaced manner in the vertical direction, and the quartz crystal plates are inserted into the plate grooves (63).

4. The dual station quartz crystal laser cutting machine of claim 1, wherein: The first material frame (60a) and the second material frame (60b) are both provided with two.

5. The dual station quartz crystal laser cutting machine of claim 1 wherein: The transfer device (20) comprises a mechanical hand (21), a lifting assembly (22), a first suction disc assembly (23) and a second suction disc assembly (24), the lifting assembly (22) is arranged at the tail end of the mechanical hand (21), the first suction disc assembly (23) and the second suction disc assembly (24) are arranged on the output end of the lifting assembly (22) and are arranged on both sides of the lifting assembly (22), the first suction disc assembly (23) is used for adsorbing to-be-cut quartz crystal plates, and the second suction disc assembly (24) is used for adsorbing cut quartz crystal plates.

6. The double-station quartz crystal laser cutting machine according to claim 1, wherein: The first movement platform (30) comprises a first X-axis movement mechanism (31), a first Y-axis movement mechanism (32) and a first carrier (33), the first carrier (33) is arranged on the first X-axis movement mechanism (31), the first X-axis movement mechanism (31) is arranged on the first Y-axis movement mechanism (32), and the first carrier (33) is used for carrying quartz crystal plates. The second motion platform (40) comprises a second X-axis motion mechanism (41), a second Y-axis motion mechanism (42) and a second carrier (43), the second carrier (43) is arranged on the second X-axis motion mechanism (41), the second X-axis motion mechanism (41) is arranged on the second Y-axis motion mechanism (42), and the second carrier (43) is used for carrying the quartz crystal plate; The first laser cutter (51) is used for laser cutting the quartz crystal plate on the first carrier (33), and the second laser cutter (52) is used for laser cutting the quartz crystal plate on the second carrier (43).

7. A dual station quartz crystal laser cutting machine as claimed in claim 6 wherein: The first carrier (33) and the second carrier (43) are provided with vacuum adsorption assemblies (70) for adsorbing and fixing the quartz crystal plate.

8. The dual station quartz crystal laser cutting machine of claim 1 wherein: The rack (10) is provided with a fixing seat (80) for fixing the first material frame (60a) and the second material frame (60b).

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