Heat insulation device for welding head of integrated circuit (IC) wire welding machine

Abstract

The utility model discloses a heat insulation device for a welding head of an IC (integrated circuit) wire bonder, which comprises a welding head main body, a heat insulation component arranged below the welding head main body, a transducer arranged at the head of the welding head main body, a wire clamp arranged on the welding head main body, an air inlet component arranged on the heat insulation component, an air flow channel arranged inside the heat insulation component, and an air outlet component arranged inside the air flow channel. A plurality of air outlet assemblies are arranged on the two sides of the bottom of the heat insulation assembly. The heat insulation device has the advantages that by means of the heat insulation assembly, a hollow air channel and a cold air circulation mode, the problem that the welding precision is reduced due to the fact that the welding head body is affected by the temperature of a welding area below the welding head body and thermal expansion occurs is effectively solved; the IC wire bonder has the advantages of being simple in structure, good in heat insulation effect, easy to install and maintain and the like, welding quality and production efficiency of the IC wire bonder can be remarkably improved, and wide application prospects are achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to IC wire bonding machine technical field especially a heat insulating device for IC wire bonding machine welding head. BACKGROUND

[0002] In the existing IC wire bonding machine production process, there is a more prominent problem. The workbench below the welding head will produce high temperature when welding operation, and the welding head will inevitably be affected by the heat due to being close to the high temperature area. Due to the thermal expansion and contraction principle, the welding head will swell after absorbing the heat from the workbench below. This swelling will cause the physical size of the welding head to change, thereby making the welding precision worse, seriously affecting the quality and reliability of the welding product, increasing the scrap rate, increasing the production cost, and being not conducive to the continuous operation of efficient and high-precision automated production. Therefore, a heat insulating device is needed to effectively solve the problem of welding precision decline caused by the welding head affected by the temperature below. SUMMARY

[0003] The utility model discloses a heat insulating device for IC wire bonding machine welding head.

[0004] To achieve the above purpose, the technical scheme of the utility model is a heat insulating device for IC wire bonding machine welding head, which comprises a welding head main body, a heat insulating assembly is arranged below the welding head main body, a transducer is arranged at the head of the welding head main body, a wire clamp is arranged on the welding head main body, an air inlet assembly is arranged on the heat insulating assembly, an air flow channel is arranged in the heat insulating assembly, and a plurality of air outlet assemblies are arranged at the bottom of the heat insulating assembly.

[0005] As a further description of the technical scheme, the heat insulating assembly comprises a heat insulating 3D plastic printing piece arranged below the welding head main body.

[0006] As a further description of the technical scheme, the air flow channel is distributed in a meandering and zigzag shape.

[0007] As a further description of the technical scheme, the air inlet assembly comprises an air inlet connector arranged on the heat insulating assembly.

[0008] As a further description of the technical scheme, the air outlet assembly comprises a plurality of air outlet grooves arranged at the bottom of the heat insulating assembly.

[0009] As a further description of the technical scheme, the air inlet connector is connected with a cold air supply device, and a sealing assembly is arranged at the connecting part of the air inlet connector and the cold air supply device.

[0010] The beneficial effect is that the heat insulation assembly utilizes the hollow air duct and the cold air circulation to effectively solve the problem that the welding head main body is affected by the temperature of the lower welding area and expands to cause the welding precision to decrease. BRIEF DESCRIPTION OF DRAWINGS

[0011] Fig. 1 is the explosion drawing of the utility model;

[0012] Fig. 2 is the structural schematic view of the airflow channel.

[0013] In the drawing, 1, welding head main body; 2, heat insulation assembly; 3, transducer; 4, wire clamp; 5, air inlet assembly; 6, airflow channel; 7, air outlet assembly; 8, heat insulation 3D plastic printing piece; 9, air inlet joint; 10, air outlet groove. DETAILED DESCRIPTION

[0014] The utility model will be specifically described below in combination with the drawings, such as Figs. 1-2 As shown in the drawing, a kind of heat insulation device for IC wire bonding machine welding head, including welding head main body 1.

[0015] In order to facilitate heat insulation, heat insulation assembly 2 is arranged below the welding head main body 1, and heat insulation assembly 2 will be described in detail below, and the heat insulation assembly 2 includes heat insulation 3D plastic printing piece 8 arranged below the welding head main body 1.

[0016] Transducer 3 is arranged at the head of the welding head main body 1, and wire clamp 4 is arranged on the welding head main body 1 to facilitate wire clamping.

[0017] In order to facilitate air inlet, air inlet assembly 5 is arranged on the heat insulation assembly 2, and air inlet assembly 5 will be described in detail below, and the air inlet assembly 5 includes air inlet joint 9 arranged on the heat insulation assembly 2.

[0018] Airflow channel 6 is arranged in the heat insulation assembly 2, and the airflow channel 6 is distributed in meandering shape.

[0019] In order to facilitate air outlet, a plurality of air outlet assemblies 7 are arranged on the bottom of the heat insulation assembly 2, and air outlet assembly 7 will be described in detail below, and the air outlet assembly 7 includes a plurality of air outlet grooves 10 arranged on the bottom of the heat insulation assembly 2.

[0020] The air inlet joint 9 is connected with the cold air supply device, and the connecting part of the air inlet joint 9 and the cold air supply device is provided with sealing assembly.

[0021] The specific structure of the utility model is explained in detail above, and the working principle of the utility model will be explained below.

[0022] First, the heat insulation assembly 2 is installed below the welding head body 1, ensuring that the heat insulation assembly 2 is closely attached to the welding head body 1 to form a good heat insulation interface, then the air inlet joint 9 is connected with the cold air supply device, and the sealing property of the connection is ensured, when the IC wire bonding machine starts to work, the external cold air supply device sends cold air to the air inlet joint 9, after the cold air enters the hollow airflow channel 6, it flows in the airflow channel 6 in a roundabout way, and fully exchanges heat with the heat insulation assembly 2 and the welding head body 1, and takes away heat, so that the welding head body 1 is always in a relatively stable low-temperature environment, is not affected by the high temperature of the lower welding area, and the stability and reliability of the welding precision are ensured.

[0023] The technical scheme solves the problem that the welding precision is reduced due to thermal expansion of the welding head body 1 caused by the influence of the temperature of the lower welding area, the heat insulation device has the advantages of simple structure, good heat insulation effect, easy installation and maintenance, and the like, can significantly improve the welding quality and production efficiency of the IC wire bonding machine, and has a wide application prospect.

[0024] The above technical scheme only reflects the preferred technical scheme of the utility model, and some changes made by the person skilled in the art to some parts of the utility model all reflect the principle of the utility model and are within the protection scope of the utility model.

Claims

1. A heat shield for a bonding head of an IC bonding machine, characterized by comprising: The utility model provides a welding head, including welding head body (1), the heat insulation subassembly (2) is arranged below welding head body (1), the transducer (3) is arranged at the head of welding head body (1), the wire clamp (4) is arranged on welding head body (1), the air inlet subassembly (5) is arranged on the heat insulation subassembly (2), the airflow channel (6) is arranged inside the heat insulation subassembly (2), the bottom both sides of heat insulation subassembly (2) are provided with a plurality of air outlet subassembly (7).

2. A heat shield for a bonding head of an IC bonding machine according to claim 1, wherein The heat insulation subassembly (2) includes a heat insulation 3D plastic printed part (8) arranged below the welding head body (1).

3. The heat shield for a bonding tool of an IC bonding machine according to claim 1, wherein The airflow channel (6) is distributed in a meandering manner.

4. The heat shield for a bonding tool of an IC bonding machine according to claim 1, wherein The air inlet subassembly (5) includes an air inlet connector (9) arranged on the heat insulation subassembly (2).

5. The heat shield for a bonding tool of an IC bonding machine according to claim 1, wherein The air outlet subassembly (7) includes a plurality of air outlet grooves (10) arranged on both sides of the bottom of the heat insulation subassembly (2).

6. A heat shield for a bonding tool of an IC bonding machine according to claim 4, wherein The air inlet connector (9) is connected to a cold air supply device, and a sealing assembly is arranged at the connection part of the air inlet connector (9) and the cold air supply device.

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