Labeling device for semiconductor manufacturing process
By introducing correction and positioning components into the labeling device for semiconductor manufacturing, and using photoelectric through-beam sensors and motor systems to adjust the position and angle of the semiconductor, the problems of label offset and stacking are solved, thereby improving labeling accuracy and production efficiency.
Patent Information
- Application Number
- CN202520254552.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-18
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2035-02-18
AI Technical Summary
Existing labeling equipment for semiconductor manufacturing processes struggles to achieve precise position and angle adjustments, leading to label misalignment or skewness. Furthermore, semiconductors tend to stack on the conveyor belt, reducing production efficiency.
It employs a correction component and a limiting component. The semiconductor position is detected by a photoelectric through-beam sensor, and precise adjustment is made using a motor and drive board. Combined with a limiting rod and a push plate, the semiconductor position and angle are corrected to ensure accurate label application. At the same time, the limiting component prevents stacking.
This improves the accuracy and production efficiency of semiconductor labeling, ensuring that labels are accurately placed in the designated position, avoiding stacking, and thus increasing production efficiency.
Smart Images
Figure CN223631993U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor technical field especially relates to a kind of labelling device for semiconductor process. BACKGROUND
[0002] Semiconductor is a kind of conductive material between conductor and insulator. In semiconductor process, the primary role of labelling device is to paste the label containing various key information on semiconductor product. These information usually includes product model, batch number, production date, production serial number, etc., and different models of semiconductor product can be distinguished clearly by labelling. The existing labelling device for semiconductor process cannot accurately adjust the position and angle of semiconductor, so it is difficult to ensure the accuracy of labelling position, and label offset or skew will lead to the decline of labelling precision. Moreover, the semiconductor will be stacked on the conveyor belt, which increases the time waste caused by arranging semiconductor and reduces the production efficiency. SUMMARY
[0003] The utility model aims at solving the shortcomings in prior art, and provides a kind of labelling device for semiconductor process.
[0004] In order to achieve the above purpose, the utility model adopts the following technical scheme: a kind of labelling device for semiconductor process, including mounting bracket and auxiliary frame, the side close to mounting bracket and auxiliary frame is fixedly connected with connecting plate, the top of connecting plate is connected to limit component, the bottom of connecting plate is connected to correct component;
[0005] The correct component includes mounting plate, the both ends of mounting plate are fixedly connected to the inner side of connecting plate, the top of mounting plate is fixedly connected with motor, the output shaft of motor is fixedly connected with driving plate through mounting plate, the both ends of driving plate are rotatably connected with driving plate, the one end of driving plate is rotatably connected with driven plate, the one end of driven plate is fixedly connected with fixed plate at top, the one end of fixed plate is fixedly connected with limit rod in inner side, the top of connecting plate is fixedly connected with support frame, the inner wall of support frame is provided with limit hole, the one end of limit rod is fixedly connected with push plate through limit hole.
[0006] As a further description of the above technical scheme:
[0007] The limit component includes fixed frame, the both ends of fixed frame are fixedly connected to the top of connecting plate, the inner top of fixed frame is fixedly connected with electric telescopic rod, the one end of electric telescopic rod is fixedly connected with limit plate.
[0008] As a further description of the above technical scheme:
[0009] The inner top of support frame is connected with photoelectric opposite radiation sensor, and the outer side of support frame is connected with controller.
[0010] As a further description of the above technical solutions:
[0011] The motor, the photoelectric opposite -shooting sensor and the controller are electrically connected.
[0012] As a further description of the above technical solutions:
[0013] The motor is fixedly connected outside the mounting frame, and the output shaft of the motor is fixedly connected with a transmission shaft penetrating through the mounting frame.
[0014] As a further description of the above technical solutions:
[0015] The transmission shaft is provided with two groups, one group of the transmission shaft is rotatably connected inside the mounting frame, and the other group of the transmission shaft is rotatably connected inside the auxiliary frame.
[0016] As a further description of the above technical solutions:
[0017] The transmission shaft is provided with two groups, one group of the transmission shaft is rotatably connected inside the mounting frame, and the other group of the transmission shaft is rotatably connected inside the auxiliary frame.
[0018] The utility model has the advantages of the following beneficial effects:
[0019] 1、The utility model discloses a rectification assembly can accurately adjust the position and angle of the semiconductor, ensure the accuracy of the labeling position, make the label just stick in the specified position, avoid label deviation or skew, improve the labeling precision of the labeling device for semiconductor process.
[0020] 2、The utility model discloses a limiting assembly can arrange the semiconductor in order, avoid stacking, facilitate the labeling device to quickly grab and label, reduce the time waste caused by arranging the semiconductor, improve the production efficiency of the labeling device for semiconductor process. DRAWINGS
[0021] Figure 1 The utility model provides a kind of overall structure schematic of labeling device for semiconductor process Figure One ;
[0022] Figure 2 The utility model provides a kind of overall structure schematic of labeling device for semiconductor process Figure Two ;
[0023] Figure 3 A side view of the labeling device for semiconductor process is provided by the utility model.
[0024] Figure 4 A front view of the labeling device for semiconductor process is provided by the utility model.
[0025] Legend:
[0026] 1, mounting frame; 2, auxiliary frame; 3, connecting plate; 4, correction assembly; 5, mounting plate; 6, motor; 7, drive plate; 8, driving plate; 9, driven plate; 10, fixed plate; 11, support frame; 12, limiting hole; 13, limiting rod; 14, push plate; 15, photoelectric sensor; 16, controller; 17, limiting assembly; 18, fixed frame; 19, electric telescopic rod; 20, limiting plate; 21, motor; 22, transmission shaft; 23, conveyor belt. DETAILED DESCRIPTION
[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0028] Referring to Figures 1-4 , the present application provides an embodiment: a labeling device for semiconductor process, comprising a mounting frame 1 and an auxiliary frame 2, the mounting frame 1 and the auxiliary frame 2 are fixedly connected with a connecting plate 3 on the side close to each other, the top of the connecting plate 3 is connected with a limiting assembly 17, and the bottom of the connecting plate 3 is connected with a correction assembly 4.
[0029] The correction assembly 4 comprises a mounting plate 5, both ends of the mounting plate 5 are fixedly connected to the inner side of the connecting plate 3, the top of the mounting plate 5 is fixedly connected with a motor 6, the output shaft of the motor 6 is fixedly connected with a drive plate 7 through the mounting plate 5, both ends of the drive plate 7 are rotatably connected with a driving plate 8, one end of the driving plate 8 is rotatably connected with a driven plate 9, the top of one end of the driven plate 9 is fixedly connected with a fixed plate 10, the inner side of one end of the fixed plate 10 is fixedly connected with a limiting rod 13, the top of the connecting plate 3 is fixedly connected with a support frame 11, the inner wall of the support frame 11 is provided with a limiting hole 12, and one end of the limiting rod 13 is fixedly connected with a push plate 14 through the limiting hole 12.
[0030] The limiting assembly 17 comprises a fixed frame 18 fixedly connected at the top of the connecting plate 3 at both ends, a electric telescopic rod 19 fixedly connected at the top end in the fixed frame 18, a limiting plate 20 fixedly connected at one end of the electric telescopic rod 19, a photoelectric opposite-acting sensor 15 connected at the top end in the supporting frame 11, capable of detecting the position of the semiconductor in time, a controller 16 connected at the outer side of the supporting frame 11, the motor 6, the photoelectric opposite-acting sensor 15 and the controller 16 being electrically connected, an electric motor 21 fixedly connected at the outer side of the mounting frame 1, a transmission shaft 22 fixedly connected at the output shaft of the electric motor 21 through the mounting frame 1, two groups of the transmission shaft 22, one group of the transmission shaft 22 being rotatably connected at the inner side of the mounting frame 1, the other group of the transmission shaft 22 being rotatably connected at the inner side of the auxiliary frame 2, and a conveyor belt 23 mounted at the outer side of the two groups of the transmission shaft 22, capable of conveying the semiconductor and improving the continuity.
[0031] Working principle: first, start the electric telescopic rod 19, the electric telescopic rod 19 drives the limiting plate 20 to move downward, adjust to the appropriate height, so that the distance between the limiting plate 20 and the conveyor belt 23 can just pass a semiconductor, avoid the semiconductor stacking, improve the production efficiency; the position of the semiconductor is detected by the photoelectric opposite-acting sensor 15, when the semiconductor approaches, the photoelectric opposite-acting sensor 15 transmits the signal to the controller 16, the controller 16 drives the motor 6, the motor 6 drives the driving plate 7 to rotate, the driving plate 7 drives the driven plate 9 to move through the driving plate 8, the driven plate 9 drives the fixed plate 10 to move, the fixed plate 10 drives the limiting rod 13 to slide in the limiting hole 12, so that the limiting rod 13 drives the push plate 14 to move and approach the semiconductor, correct the position and angle of the semiconductor, improve the labeling accuracy.
[0032] The electrical components appearing in the text are all electrically connected with the main controller and 220V mains, and the main controller can be a conventional known device such as a computer, and the detailed description of the known functions and known components is omitted in the specific embodiment of the disclosure. In order to ensure the compatibility of the device, the operation means adopted is consistent with the parameters of the market appliances.
[0033] Finally, it should be noted that: the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacements to some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A labeling device for semiconductor processing, comprising a mounting frame (1) and an auxiliary frame (2), characterized in that: The mounting frame (1) and the auxiliary frame (2) are fixedly connected with a connecting plate (3) on one side close to each other, the top of the connecting plate (3) is connected with a limiting assembly (17), and the bottom of the connecting plate (3) is connected with a correcting assembly (4); The correcting assembly (4) comprises an installation plate (5), both ends of the installation plate (5) are fixedly connected to the inner side of the connecting plate (3), the top of the installation plate (5) is fixedly connected with a motor (6), the output shaft of the motor (6) is fixedly connected with a driving plate (7) penetrating through the installation plate (5), both ends of the driving plate (7) are rotatably connected with a driving plate (8), one end of the driving plate (8) is rotatably connected with a driven plate (9), one end of the driven plate (9) is fixedly connected with a fixed plate (10) at the top, one end of the fixed plate (10) is fixedly connected with a limiting rod (13) at the inner side, the top of the connecting plate (3) is fixedly connected with a supporting frame (11), the inner wall of the supporting frame (11) is provided with a limiting hole (12), and one end of the limiting rod (13) is fixedly connected with a push plate (14) penetrating through the limiting hole (12).
2. The labeling apparatus for semiconductor processing according to claim 1, wherein: The limiting assembly (17) comprises a fixed frame (18), both ends of the fixed frame (18) are fixedly connected to the top of the connecting plate (3), the inner top end of the fixed frame (18) is fixedly connected with an electric telescopic rod (19), and one end of the electric telescopic rod (19) is fixedly connected with a limiting plate (20).
3. The labeling apparatus for semiconductor processing according to claim 1, wherein: The inner top end of the supporting frame (11) is connected with a photoelectric opposite radiation sensor (15), and the outer side of the supporting frame (11) is connected with a controller (16).
4. The labeling apparatus for semiconductor processing according to claim 3, wherein: The motor (6), the photoelectric opposite radiation sensor (15) and the controller (16) are electrically connected.
5. The labeling apparatus for semiconductor manufacturing processes according to claim 1, wherein: The outer side of the mounting frame (1) is fixedly connected with a motor (21), and the output shaft of the motor (21) is fixedly connected with a conveying shaft (22) penetrating through the mounting frame (1).
6. The labeling apparatus for semiconductor processing according to claim 5, wherein: The conveying shaft (22) is provided with two groups, one group of the conveying shaft (22) is rotatably connected to the inner side of the mounting frame (1), and the other group of the conveying shaft (22) is rotatably connected to the inner side of the auxiliary frame (2).
7. The labeling apparatus for semiconductor processing according to claim 5, wherein: Both groups of the conveying shaft (22) are externally provided with a conveying belt (23).