Adhesive IC chip carrier tape

Abstract

The utility model belongs to the technical field of carrier tapes, and particularly relates to an adhesive IC (integrated circuit) chip carrier tape, which comprises a carrier strip for packaging and carrying a chip and a cover tape for covering the chip on the carrier strip. The diaphragm is pasted on the carrier strip, the cover tape is also pasted and connected with the diaphragm, and the diaphragm and the cover tape can be torn from the side surface to take out the chip from the carrier strip; it can be understood that the chip is sealed through pasting among the carrier strip, the diaphragm and the cover tape, pasting and packaging reliability can be achieved, meanwhile, glue remaining on the chip can be avoided, the diaphragm and the cover tape can be torn from the side face, the chip is taken out of the carrier strip, small-batch manual operation is facilitated, and the production efficiency is improved. The adjacent chips are prevented from being taken out at the same time while the taking-out convenience is ensured, and the reliability is higher.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of carrier tape, especially relates to a pasting type IC chip carrier tape. BACKGROUND

[0002] The pasting type IC chip carrier tape is a transmission device for fixing electronic components, especially IC chips, in a carrier tape groove. Generally, the IC chips are firmly attached to the carrier tape through electrostatic adsorption, adhesive or other pasting technology to ensure that no damage or displacement occurs during transportation and mounting, and the IC chips usually need to be transported through the carrier tape to realize batch automatic production during the electronic component manufacturing process. The carrier tape ensures that the chips can be sent to devices such as automatic mounting machines in a predetermined order;

[0003] Firstly, the adhesive directly contacts the chips, which may cause residual glue and is not convenient for the chip removal. Secondly, not all manufacturers and models need mass production in actual production, and components may not be processed through complete automatic production lines in small-batch production, customized production or sample production, which requires manual intervention. At this time, the operation of manually removing the components from the carrier tape is more common, especially when the samples are processed, calibrated, inspected or assembled in small batches.

[0004] To solve the above problems, the pasting type IC chip carrier tape is provided in the application. CONTENT OF THE UTILITY MODEL

[0005] The utility model aims at providing a pasting type IC chip carrier tape, which solves the problems in the background technology.

[0006] To solve the above technical problems, the utility model is implemented through the following technical scheme:

[0007] The utility model is a pasting type IC chip carrier tape, which includes a carrier strip for packaging and carrying chips and a cover tape for covering the chips on the carrier strip. The utility model further includes a diaphragm pasted on the carrier strip. The cover tape is also pasted and connected with the diaphragm. The diaphragm and the cover tape can be torn from the side to remove the chips from the carrier strip.

[0008] Further, the carrier strip includes a groove for accommodating the chips and a boss for separating adjacent chips.

[0009] Further, the diaphragm includes a sunken part in contact with the groove and a first pasting part connected with the sunken part and in contact with the boss.

[0010] Further, the first break point groove is arranged between the sinking part and the first adhesive part, the first hand tearing piece is arranged on one side of the sinking part, the first break point groove is torn by upward pulling of the first hand tearing piece, the sinking part is separated from the first adhesive part, and the chip on the sinking part is taken out from the groove at the same time.

[0011] Further, the cover tape comprises a closing part above the groove and a second adhesive part connected with the closing part and adhered with the first adhesive part, a second break point groove is arranged between the closing part and the second adhesive part, and the second break point groove is coincided with the first break point groove.

[0012] Further, the closing part is provided with a second hand tearing piece coincided with the first hand tearing piece, the second hand tearing piece is arranged on the upper surface of the first hand tearing piece, and the first hand tearing piece is larger than the second hand tearing piece.

[0013] Further, the diaphragm is adhered and connected with the boss on the carrier strip through the first glue area at the bottom of the first adhesive part, and the cover tape is adhered and connected with the first adhesive part on the diaphragm through the second glue area at the bottom of the second adhesive part.

[0014] The utility model has the following beneficial effects:

[0015] The utility model discloses a diaphragm and a cover tape are arranged, then a chip is sealed in the groove by using a first glue area and a second glue area, no glue contact type packaging can be realized, glue on the surface of the chip is avoided, and the chip is convenient to take out.

[0016] The diaphragm and the cover tape are arranged into structures that can be separately torn from the side, which is particularly suitable for small-batch manual operation, ensures the convenience of taking out the chip, avoids taking out adjacent chips, and the cooperation of the diaphragm and the cover tape can take out the chip from the groove directly, so that the operation convenience and reliability are remarkably improved.

[0017] Of course, any product implementing the utility model does not necessarily need to achieve all the advantages mentioned above. DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating creative labor.

[0019] Figure 1 It is the whole appearance structure schematic diagram of the utility model;

[0020] Figure 2 It is the split structure schematic diagram;

[0021] Figure 3 For Figure 2 Structure schematic diagram of bottom view;

[0022] Figure 4 For Figure 3 Structure schematic diagram of A part of middle enlarged;

[0023] The components represented by the reference numbers in the drawings are listed as follows:

[0024] In the drawings: 1, carrier strip; 11, groove; 12, boss; 2, diaphragm; 21, sunken part; 211, first hand tearing piece; 22, first pasting part; 23, first breakpoint groove; 3, cover tape; 31, closed part; 311, second hand tearing piece; 32, second pasting part; 33, second breakpoint groove; 4, first glue area; 5, second glue area. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] In the description of the present application, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "periphery" and the like indicate the orientation or positional relationship, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the present application.

[0027] Please refer to Figures 1-4 The utility model discloses, a kind of pasting IC chip carrier tape, carrier strip 1 of packaging bearing chip and cover tape 3 covering chip on carrier strip 1, further include;Diaphragm 2 is pasted on carrier strip 1, cover tape 3 is also pasted with diaphragm 2 and connects, diaphragm 2 and cover tape 3 can be taken out from carrier strip 1 in the way of tearing from side, diaphragm 2 and cover tape 3 can be torn separately from side, suitable for small batch manual operation, guarantee that chip is conveniently taken out, and adjacent chip cannot be taken out, improve the convenience and reliability of operation.

[0028] Among them, carrier strip 1 includes built-in chip groove 11 and boss 12 that separates adjacent chips, and the boss 12 in the embodiment is provided with a certain width to ensure that the diaphragm 2 and the cover tape 3 are firmly pasted.

[0029] The diaphragm 2 includes a sunken part 21 in contact with the groove 11 and a first adhesive part 22 connected with the sunken part 21 and in contact with the boss 12, and the chip can be placed in the sunken part 21, and the first adhesive part 22 can connect the sunken part 21 and form a downward pulling force when being torn, which facilitates the production of the diaphragm 2, the cooperation with the carrier strip 1, and the tearing of the first breakpoint slot 23.

[0030] The first breakpoint slot 23 is arranged between the sunken part 21 and the first adhesive part 22, and the sunken part 21 is provided with a first hand tearing piece 211 on one side, the first breakpoint slot 23 is torn and the sunken part 21 is separated from the first adhesive part 22 by pulling the first hand tearing piece 211 upward, and the chip on the sunken part 21 is taken out of the groove 11 at the same time, and in the embodiment, the first breakpoint slot 23 is gradually torn when the sunken part 21 is lifted upward, and at this time, the sunken part 21 drives the chip to be in an inclined state at the same time, and the upper part of the inclined chip protrudes out of the groove 11, thereby achieving the purpose of convenient taking out.

[0031] The cover tape 3 includes a closed part 31 located directly above the groove 11 and a second adhesive part 32 connected with the closed part 31 and in contact with the first adhesive part 22, a second breakpoint slot 33 is arranged between the closed part 31 and the second adhesive part 32, and the second breakpoint slot 33 coincides with the first breakpoint slot 23, and in the embodiment, the cover tape 3 can cover the chip during packaging, and the second breakpoint slot 33 cooperates with the first breakpoint slot 23 to facilitate the quick taking out of the chip, and the reliability and convenience are improved.

[0032] The closed part 31 is provided with a second hand tearing piece 311 coinciding with the first hand tearing piece 211 on one side, the second hand tearing piece 311 is located on the upper surface of the first hand tearing piece 211, and the first hand tearing piece 211 is larger than the second hand tearing piece 311, and in the embodiment, the second hand tearing piece 311 is smaller than the first hand tearing piece 211, so that the worker can pinch both of them and take out the chip at the same time when tearing, and the chip cannot be taken out after the second hand tearing piece 311 is torn.

[0033] The diaphragm 2 is connected with the boss 12 on the carrier strip 1 through the first adhesive part 22 and the first glue area 4 at the bottom of the first adhesive part 22, and the cover tape 3 is connected with the diaphragm 2 through the second adhesive part 32 and the second glue area 5 at the bottom of the second adhesive part 32, and in the embodiment, the first glue area 4 and the second glue area 5 have similar sizes, and when the first breakpoint slot 23 and the second breakpoint slot 33 are torn, the first adhesive part 22 and the second adhesive part 32 can be tightly attached to the boss 12 without falling off, thereby achieving the purpose of easy tearing.

[0034] It can be understood that the chip is sealed by the adhesion between the carrier strip, the diaphragm and the cover tape, which can achieve reliable adhesion and packaging, and also avoid leaving glue on the chip, and the diaphragm and the cover tape can be torn from the side and take the chip out of the carrier strip, which is convenient for small-batch processing manual operation, ensures convenient taking out, avoids taking out adjacent chips at the same time, and has higher reliability.

[0035] One specific application of the embodiment is that the diaphragm 2 is attached to the upper part of the carrier strip 1 through the first adhesive area 4, the chip is placed on the sunken part 21 inside the groove 11, and then the cover tape 3 is attached to the diaphragm 2 through the second adhesive area 5, so as to realize packaging of the chip through the carrier strip 1, the diaphragm 2 and the cover tape 3.

[0036] When in use, the first hand tearing piece 211 and the second hand tearing piece 311 are pinched and pulled upward, the first breakpoint groove 23 and the second breakpoint groove 33 are torn at the same time, the first adhesive part 22 and the second adhesive part 32 are left on the boss 12, the first hand tearing piece 211 drives the sunken part 21 and the internal chip upward, and the chip is taken out from the groove 11, and the chip is taken out from the side of the torn sunken part 21.

[0037] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0038] The preferred embodiments of the above disclosed application are only used to help explain the application. The preferred embodiments do not describe all the details, nor limit the application to the specific embodiments described. Obviously, according to the content of the specification, many modifications and changes can be made. The specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the application, so that those skilled in the art can well understand and utilize the application. The application is limited by the claims and their entire scope and equivalents.

Claims

1. An IC chip carrier tape for die attach, comprising a carrier tape (1) for carrying a die and a cover tape (3) for covering the die on the carrier tape (1), characterized in that, Also include; The cover tape (3) is also attached to the membrane (2) by adhesive, and the membrane (2) and the cover tape (3) can be torn from the side to take out the chip from the carrier strip (1).

2. The tape IC chip carrier of claim 1, wherein: The carrier strip (1) includes a groove (11) for embedding the chip and a boss (12) for separating adjacent chips.

3. The tape IC chip carrier of claim 1, wherein: The membrane (2) includes a sunken part (21) in contact with the groove (11) and a first adhesive part (22) connected with the sunken part (21) and in contact with the boss (12).

4. The tape IC chip carrier of claim 3, wherein: A first breakpoint slot (23) is provided between the sunken part (21) and the first adhesive part (22), and a first hand tearing piece (211) is provided on one side of the sunken part (21). By pulling the first hand tearing piece (211) upward, the first breakpoint slot (23) is torn and the sunken part (21) is separated from the first adhesive part (22), and the chip on the sunken part (21) is taken out of the groove (11) at the same time.

5. The tape IC chip carrier of claim 4, wherein: The cover tape (3) includes a closed part (31) above the groove (11) and a second adhesive part (32) connected with the closed part (31) and in contact with the first adhesive part (22). A second breakpoint slot (33) is provided between the closed part (31) and the second adhesive part (32), and the second breakpoint slot (33) coincides with the first breakpoint slot (23).

6. The tape IC chip carrier of claim 5, wherein: The closed part (31) is provided with a second hand tearing piece (311) coinciding with the first hand tearing piece (211), and the second hand tearing piece (311) is located on the upper surface of the first hand tearing piece (211), and the first hand tearing piece (211) is larger than the second hand tearing piece (311).

7. The tape IC chip carrier of claim 5, wherein: The membrane (2) is attached to the boss (12) on the carrier strip (1) by a first adhesive area (4) at the bottom of the first adhesive part (22), and the cover tape (3) is attached to the first adhesive part (22) on the membrane (2) by a second adhesive area (5) at the bottom of the second adhesive part (32).

Images