Anti-aging packaging adhesive film and flexible circuit board

Abstract

In order to solve the problem that the existing flexible circuit board is difficult to be suitable for the outdoor environment, the utility model provides an anti-aging packaging adhesive film which comprises an adhesive film layer, a first fiber layer, a second fiber layer, a first functional layer, a second functional layer, a first binder layer and a second binder layer, the first fiber layer and the second fiber layer are located on the surfaces of the two sides of the adhesive film layer respectively, the first functional layer is located on the surface, away from the adhesive film layer, of the first fiber layer, and the second functional layer is located on the surface, away from the adhesive film layer, of the second fiber layer. The first functional layer and the second functional layer are black silica gel coatings, the first binder layer is located on the surface, deviating from the first fiber layer, of the first functional layer, and the second binder layer is located on the surface, deviating from the second fiber layer, of the second functional layer.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of flexible circuit board, concretely relates to an anti-aging encapsulation adhesive film and flexible circuit board. BACKGROUND

[0002] With the continuous development of electronic products, there is an increasing demand for lightweight, small-sized and multi-functional flexible circuit boards (FPC boards). However, flexible circuit boards have been difficult to be applied to some open-air environments, the main reason of which is that long-term exposure to ultraviolet light will cause aging of FPC materials, especially polymer matrix and adhesives. Ultraviolet light can destroy the molecular structure of the materials, resulting in a decrease in their physical and mechanical properties, causing the materials to become brittle, reducing their toughness and increasing the risk of breakage, thereby affecting the flexibility and overall life of the FPC. Oxygen in the air and certain chemical gases can cause oxidation reaction with the FPC materials, especially in a humid environment, which will gradually consume the materials and weaken their performance, ultimately affecting the flexibility and reliability of the FPC. Therefore, how to improve the anti-aging performance of the flexible circuit board is a technical problem that needs to be solved to determine whether it is suitable for outdoor environments. SUMMARY

[0003] In view of the problem that the existing flexible circuit board is difficult to be applied to outdoor environments, the utility model provides an anti-aging encapsulation adhesive film and a flexible circuit board.

[0004] The utility model adopts the following technical solutions to solve the above technical problems:

[0005] On the one hand, the utility model provides an anti-aging encapsulation adhesive film, which comprises an adhesive film layer, a first fiber layer, a second fiber layer, a first functional layer, a second functional layer, a first adhesive layer and a second adhesive layer. The first fiber layer and the second fiber layer are respectively located on the two side surfaces of the adhesive film layer. The first functional layer is located on the surface of the first fiber layer away from the adhesive film layer. The second functional layer is located on the surface of the second fiber layer away from the adhesive film layer. The first functional layer and the second functional layer are black silicone coating. The first adhesive layer is located on the surface of the first functional layer away from the first fiber layer. The second adhesive layer is located on the surface of the second functional layer away from the second fiber layer.

[0006] Optionally, the first fiber layer and the second fiber layer are both grid-shaped fiber structures, which comprise a plurality of first fibers and a plurality of second fibers. The plurality of first fibers are parallel to each other, the plurality of second fibers are parallel to each other, and the plurality of first fibers and the plurality of second fibers are interwoven to form a grid-shaped fiber structure.

[0007] Optionally, the first fiber and the second fiber are glass fibers.

[0008] Optionally, the first adhesive layer and the second adhesive layer are epoxy resin layers.

[0009] Optionally, the adhesive film layer is a polyimide layer.

[0010] Optionally, the thickness of the adhesive film layer is 20-200 μm, the thickness of the first fiber layer and the second fiber layer is 2-60 μm, the thickness of the first functional layer and the second functional layer is 5-20 μm, and the thickness of the first adhesive layer and the second adhesive layer is 10-40 μm.

[0011] Optionally, the anti-aging packaging adhesive film further comprises a first release layer and a second release layer, the first release layer is located on the surface of the first adhesive layer away from the first functional layer, and the second release layer is located on the surface of the second adhesive layer away from the second functional layer.

[0012] Optionally, the first release layer and the second release layer are polyethylene terephthalate layers.

[0013] Optionally, the thickness of the first release layer and the second release layer is 100-300 μm.

[0014] In still another aspect, the present application provides a flexible circuit board, comprising at least one flexible circuit layer, the flexible circuit layer comprising a conductive circuit layer and an anti-aging packaging adhesive film as described above.

[0015] According to the anti-aging packaging adhesive film, the black silicone coating layers are respectively arranged on both sides of the adhesive film layer as the first functional layer and the second functional layer, the silicone material itself has excellent anti-aging performance and water vapor barrier performance, can effectively block water and oxygen from entering the anti-aging packaging adhesive film to affect the performance of the anti-aging packaging adhesive film, and can effectively block the aging effect of ultraviolet rays on other materials in the anti-aging packaging adhesive film. Furthermore, the first fiber layer and the second fiber layer are arranged between the first functional layer, the second functional layer and the adhesive film layer, the combination strength between the first functional layer, the adhesive film layer and the second functional layer can be improved through the first fiber layer and the second fiber layer, layering in the bending process is avoided, the bending performance of the anti-aging packaging adhesive film is improved, and the bending performance under long-term outdoor use is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural schematic view of the packaging adhesive film provided by an embodiment of the present application;

[0017] The reference signs in the drawings of the specification are as follows:

[0018] 1, adhesive film layer; 2, first fiber layer; 3, second fiber layer; 4, first functional layer; 5, second functional layer; 6, first adhesive layer; 7, second adhesive layer; 8, first release layer; 9, second release layer. DETAILED DESCRIPTION

[0019] In order to make the technical problems, technical schemes and beneficial effects solved by the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model and not used to limit the utility model.

[0020] In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "thickness", "upper", "lower" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as limiting the utility model.

[0021] Referring to Figure 1 As shown in the figure, an embodiment of the utility model provides an anti-aging packaging adhesive film, which comprises an adhesive film layer, a first fiber layer, a second fiber layer, a first functional layer, a second functional layer, a first adhesive layer and a second adhesive layer, the first fiber layer and the second fiber layer are respectively located on the two side surfaces of the adhesive film layer, the first functional layer is located on the surface of the first fiber layer away from the adhesive film layer, the second functional layer is located on the surface of the second fiber layer away from the adhesive film layer, the first functional layer and the second functional layer are black silicone coating, the first adhesive layer is located on the surface of the first functional layer away from the first fiber layer, and the second adhesive layer is located on the surface of the second functional layer away from the second fiber layer.

[0022] Black silicone coating is arranged on the two sides of the adhesive film layer as the first functional layer and the second functional layer, the silicone material itself has excellent anti-aging performance and water vapor barrier performance, can effectively block water and oxygen from entering the anti-aging packaging adhesive film and affecting the performance of the anti-aging packaging adhesive film; at the same time, it is arranged as black, which can effectively block the aging effect of ultraviolet rays on other materials inside; in addition, the first fiber layer and the second fiber layer are arranged between the first functional layer, the second functional layer and the adhesive film layer, the combination strength between the first functional layer, the adhesive film layer and the second functional layer can be improved through the first fiber layer and the second fiber layer, the delamination in the bending process is avoided, the bending performance of the anti-aging packaging adhesive film is improved, especially the bending performance under long-term outdoor use.

[0023] In some embodiments, the first fiber layer and the second fiber layer are both grid-shaped fiber structures, and the grid-shaped fiber structure comprises a plurality of first fibers and a plurality of second fibers, the plurality of first fibers are parallel to each other, the plurality of second fibers are parallel to each other, and the plurality of first fibers and the plurality of second fibers are interwoven to form the grid-shaped fiber structure.

[0024] By interweaving the plurality of first fibers and the plurality of second fibers to form the grid-shaped fiber structure, the stress uniformity of the first fiber layer and the second fiber layer in each direction and the overall tear resistance effect can be effectively improved, which is conducive to improving the connection stability between the first functional layer, the adhesive film layer and the second functional layer.

[0025] In some embodiments, the first fiber and the second fiber are glass fibers.

[0026] The glass fiber is a material composed of slender glass filaments, which are usually several microns to twenty microns in diameter, have good electrical insulation properties, and show excellent resistance to many chemicals (such as acids and bases) and are not easily corroded.

[0027] In some embodiments, the first adhesive layer and the second adhesive layer are epoxy resin layers.

[0028] The epoxy resin layer has good weather resistance and can maintain good bonding effect under high temperature and high humidity conditions, is suitable for use in some application scenarios with many environmental factors, ensures its bonding ability, and avoids delamination.

[0029] In some embodiments, the adhesive film layer is a polyimide layer.

[0030] Polyimide has extremely high heat resistance and can maintain its mechanical and electrical properties in high temperature environments. This property makes it very suitable for use in flexible circuit boards that need to withstand soldering temperatures or work in high temperature environments. At the same time, it can provide good flexibility while maintaining high strength, which allows the flexible circuit board to be bent, folded or even rolled without damage, suitable for complex shape design and application. Polyimide has excellent electrical insulation properties, which can effectively isolate the circuit to prevent short circuits and other electrical faults, improving the reliability of the product.

[0031] In some embodiments, the thickness of the adhesive film layer is 20-200 μm, the thickness of the first fiber layer and the second fiber layer is 2-60 μm, the thickness of the first functional layer and the second functional layer is 5-20 μm, and the thickness of the first adhesive layer and the second adhesive layer is 10-40 μm.

[0032] In some embodiments, the anti-aging encapsulation adhesive film further comprises a first release layer and a second release layer, the first release layer is located on the surface of the first adhesive layer away from the first functional layer, and the second release layer is located on the surface of the second adhesive layer away from the second functional layer.

[0033] The first release layer and the second release layer are used to temporarily protect the encapsulation adhesive film, so as to facilitate the storage and transfer of the encapsulation adhesive film, avoid the first adhesive layer and the second adhesive layer from adhering external dust or other impurities, and remove the first release layer and the second release layer according to needs when performing the lamination of the multilayer flexible circuit layer, to expose the first adhesive layer and the second adhesive layer, so as to facilitate the bonding with other flexible circuit layers.

[0034] In some embodiments, the first release layer and the second release layer are polyethylene terephthalate layers.

[0035] In some embodiments, the thickness of the first release layer and the second release layer is 100-300 μm.

[0036] Another embodiment of the present application provides a flexible circuit board, comprising at least one flexible circuit layer, the flexible circuit layer comprises a conductive circuit layer and an anti-aging encapsulation adhesive film as described above which are laminated with each other.

[0037] By using the anti-aging encapsulation adhesive film as described above, the flexible circuit board has good anti-aging properties and bending resistance, is suitable for application in some environments with ultraviolet rays or high temperature and high humidity, and in particular, can be applied in outdoor environments, and compared with conventional flexible circuit boards, has a more excellent service life in indoor environments and electronic products with relatively stable environments.

[0038] The above only describes preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An anti-aging encapsulation film, characterized by, The anti-aging packaging adhesive film comprises a glue film layer, a first fiber layer, a second fiber layer, a first functional layer, a second functional layer, a first adhesive layer and a second adhesive layer, the first fiber layer and the second fiber layer are respectively located on two side surfaces of the glue film layer, the first functional layer is located on a surface of the first fiber layer away from the glue film layer, the second functional layer is located on a surface of the second fiber layer away from the glue film layer, the first functional layer and the second functional layer are black silica gel coating layers, the first adhesive layer is located on a surface of the first functional layer away from the first fiber layer, and the second adhesive layer is located on a surface of the second functional layer away from the second fiber layer.

2. The anti-aging encapsulation adhesive film according to claim 1, wherein, The first fiber layer and the second fiber layer are both grid-shaped fiber structures, the grid-shaped fiber structure comprises a plurality of first fibers and a plurality of second fibers, the plurality of first fibers are parallel to each other, the plurality of second fibers are parallel to each other, and the plurality of first fibers and the plurality of second fibers are interwoven to form the grid-shaped fiber structure.

3. The anti-aging encapsulation adhesive film according to claim 1, wherein, The first fiber and the second fiber are glass fibers.

4. The anti-aging encapsulation adhesive film according to claim 1, wherein, The first adhesive layer and the second adhesive layer are epoxy resin layers.

5. The anti-aging encapsulation adhesive film according to claim 1, wherein, The glue film layer is a polyimide layer.

6. The anti-aging encapsulation adhesive film according to claim 1, wherein, The thickness of the glue film layer is 20-200 μm, the thickness of the first fiber layer and the second fiber layer is 2-60 μm, the thickness of the first functional layer and the second functional layer is 5-20 μm, and the thickness of the first adhesive layer and the second adhesive layer is 10-40 μm.

7. The anti-aging encapsulation adhesive film according to claim 1, wherein, The anti-aging packaging adhesive film further comprises a first release layer and a second release layer, the first release layer is located on a surface of the first adhesive layer away from the first functional layer, and the second release layer is located on a surface of the second adhesive layer away from the second functional layer.

8. The anti-aging encapsulation adhesive film according to claim 7, wherein, The first release layer and the second release layer are polyethylene terephthalate layers.

9. The anti-aging encapsulation adhesive film according to claim 7, wherein, The thickness of the first release layer and the second release layer is 100-300 μm.

10. A flexible circuit board, characterized by, The anti-aging packaging adhesive film comprises at least one flexible circuit layer, the flexible circuit layer comprises a conductive circuit layer and the anti-aging packaging adhesive film according to any one of claims 1-6.

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