High-heat-dissipation type laser quenching device

Abstract

The utility model belongs to the technical field of quenching devices, and particularly relates to a high-heat-dissipation type laser quenching device which comprises a machining machine table, a support is mounted at the top of the machining machine table, a three-axis linear module is mounted at the top of the support, a mounting seat is mounted at the bottom of a sliding table of the three-axis linear module, and a laser quenching head is mounted at the bottom of the mounting seat. A laser quenching head is installed on the top of the machining machine table, a quenching device cooling heat dissipation device is arranged on the outer side of the laser quenching head in a sleeving mode, a workpiece containing table support is installed on the top of the machining machine table, a workpiece containing table is installed on the top of the workpiece containing table support, and a lifting workpiece cooling auxiliary device is further arranged on the top of the machining machine table. And meanwhile, through the arrangement of the water cooling machine, the heat dissipation requirement of the laser quenching head is met, the cooling efficiency of the workpiece is improved, and the possibility that the workpiece is deformed and the hardness is reduced due to overheating is reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to quenching device technical field, concretely relates to a high heat dissipation type laser quenching device. BACKGROUND

[0002] Laser quenching, also known as laser phase transformation hardening and laser heat treatment, is an advanced surface hardening technology, which uses a laser beam to heat the material surface above the phase transition point, and the austenite is transformed into martensite with the cooling of the material itself, thereby hardening the material surface.

[0003] The laser quenching device generally drives the laser quenching head to feed according to the programmed route by a mechanical arm or a three-axis linear drive module to quench the workpiece surface. The current laser quenching head generally integrates the laser and optical components in a housing. When laser quenching, the laser quenching head emits a large amount of heat, so it is necessary to effectively cool the laser quenching head to avoid overheating and damage.

[0004] In the prior art, the cooling of the laser quenching head is generally achieved by water cooling. The internal cooling liquid is cooled by a water chiller, and the cooling liquid is pumped into the water cooling pipeline outside the laser quenching head by a pump, reflows into the water chiller after absorbing the heat of the laser quenching head, and is cooled. However, the current laser quenching device has the following problems in terms of heat dissipation. First, the contact area between the water cooling liquid and the heat-conducting part of the laser quenching head is insufficient, and the heat dissipation efficiency can be improved. Second, during the quenching process of the current workpiece, the cooling of the workpiece basically relies on natural cooling. However, when quenching some larger workpieces, the workpiece will have more heat accumulation due to the long quenching time. At this time, natural cooling cannot meet the cooling demand. At the same time, in some high-power quenching and quenching work with high surface hardness requirement and deep hardening layer requirement, natural cooling also cannot meet the cooling demand, which easily leads to workpiece deformation and hardness reduction. There is a lack of a laser quenching device that can use the cooling function of the water chiller on the workpiece when needed. SUMMARY

[0005] To solve the above problems, the utility model aims to provide a high heat dissipation type laser quenching device, which can effectively improve the cooling effect of the laser quenching head and ensure the normal operation of the laser quenching head. At the same time, through the setting of a water chiller, the cooling demand of the laser quenching head is met, and the cooling efficiency of the workpiece is improved, reducing the possibility of workpiece deformation and hardness reduction caused by overheating.

[0006] To achieve the above object, the utility model provides the following technical scheme: A high heat dissipation type laser quenching device, including processing machine table, the top of processing machine table is equipped with support, the top of support is equipped with three axle linear module, the slide base bottom of three axle linear module is equipped with mounting seat, the bottom of mounting seat is equipped with laser quenching head, the outside of laser quenching head is equipped with quenching device cooling heat dissipation device, quenching device cooling heat dissipation device includes the inner heat conduction cover of laser quenching head contact, the outside of inner heat conduction cover is equipped with first water cooling cover, the outside of first water cooling cover is equipped with outer heat dissipation cover, the inside and outside of outer heat dissipation cover is equipped with through groove, the inside of through groove is fixedly equipped with the screw joint plate, one side of screw joint plate is equipped with semiconductor refrigeration device, the top of processing machine table is equipped with workpiece placement table support, the top of workpiece placement table support is equipped with workpiece placement table, the top of processing machine table is equipped with lift workpiece cooling auxiliary device, the top of processing machine table is equipped with water cooling machine, the side of water cooling machine is connected with two groups of output connector and two groups of backflow connector, one end of output connector is connected with output pump.

[0007] The utility model discloses the beneficial effect is: in quenching process, the refrigeration of cooling liquid in water cooling machine is carried out, and the inside of first water cooling cover is inputted cooling liquid through output pump, output connection flexible pipe to the flow channel from water inlet interface to backflow interface is formed by the inside of first water cooling cover through shunt baffle separation, after cooling liquid enters the inside of first water cooling cover through water inlet interface, after going around laser quenching head one round along the inside of first water cooling cover, backflow into the inside of water cooling machine through backflow connection flexible pipe through backflow interface, the heat generated by laser quenching head is conducted to the inner heat conduction cover in its shell, because the outside of inner heat conduction cover is equipped with contact area increase fin, and the inside of first water cooling cover is equipped with contact area increase cooperation cavity convex, and cooling liquid fills up first water cooling cover, contact area increase cooperation cavity convex inside, through the cooperation of contact area increase fin, contact area increase cooperation cavity convex, the heat exchange area between inner heat conduction cover and first water cooling cover is greatly increased, so that cooling liquid can greatly absorb the heat on inner heat conduction cover, contact area increase fin, and the cooling effect of laser quenching head is improved, and semiconductor refrigeration piece, heat dissipation fan can be opened simultaneously, the surface of first water cooling cover is directly refrigerated by semiconductor refrigeration piece, so that the temperature of cooling liquid in first water cooling cover is reduced, and the cooling effect of cooling liquid on laser quenching head is further improved, and the heat on first water cooling cover can also be absorbed by outer heat dissipation cover, and the heat is effectively dissipated to air through auxiliary heat dissipation fin for increasing the contact area with air, and the cooling effect of laser quenching head can be effectively improved through the cooperation of the above structure, and the normal operation of laser quenching head is ensured.

[0008] When the natural cooling method cannot meet the cooling demand of the workpiece after quenching, the second water cooling jacket can be used for auxiliary cooling of the workpiece. When the second water cooling jacket is needed for auxiliary cooling of the workpiece, the output pump on the side of the water chiller is controlled to run to pump the cooling liquid into the second water cooling jacket through the output connection hose. The motor is controlled to run to drive the transmission screw to rotate. The second water cooling jacket is driven to move upward by the transmission belt between the transmission screw and the transmission seat, so that the second water cooling jacket contacts the bottom of the workpiece placing table while increasing the contact area. The contact area of the cavity block inserted into the slot in the bottom of the workpiece placing table is increased, the heat exchange area between the workpiece placing table and the cooling liquid in the second water cooling jacket is increased, and the heat generated on the workpiece due to quenching is conducted to the workpiece placing table and can be absorbed and taken away by the cooling liquid acting on the workpiece placing table in a large area. Through the setting of a set of water chiller, the heat dissipation demand of the laser quenching head is met, the cooling efficiency of the workpiece is improved, and the possibility of deformation caused by overheating of the workpiece is reduced.

[0009] In order to control the device:

[0010] As a further improvement of the above technical solution: the side of the machining table is provided with a control device, and the front of the control device is provided with a touch display screen.

[0011] The beneficial effects of the improvement are: the control device is used for controlling the device, and in the control, the touch display screen is operated.

[0012] In order to enable the cooling liquid to greatly absorb the heat on the inner heat conduction sleeve and the contact area increasing fin:

[0013] As a further improvement of the above technical solution: the side of the inner heat conduction sleeve is welded with a contact area increasing fin, and the inner side of the first water cooling jacket is provided with a contact area increasing matching cavity protrusion.

[0014] The beneficial effects of the improvement are: since the outer side of the inner heat conduction sleeve is provided with the contact area increasing fin, and the inner side of the first water cooling jacket is provided with the contact area increasing matching cavity protrusion, the cooling liquid fills the first water cooling jacket and the contact area increasing matching cavity protrusion, and through the cooperation of the contact area increasing fin and the contact area increasing matching cavity protrusion, the heat exchange area between the inner heat conduction sleeve and the first water cooling jacket is greatly increased, so that the cooling liquid can greatly absorb the heat on the inner heat conduction sleeve and the contact area increasing fin, and the cooling effect of the laser quenching head is improved.

[0015] In order to directly cool the first water cooling jacket:

[0016] As a further improvement of the above technical solution: the inner side of the semiconductor refrigeration device is provided with a semiconductor refrigeration sheet, one side surface of the semiconductor refrigeration sheet penetrates through a screw plate and is in contact with the first water cooling jacket, the other side surface of the semiconductor refrigeration sheet is connected with a heat conduction plate, the side surface of the semiconductor refrigeration device is provided with an air inlet groove, the inner side of the air inlet groove is provided with a heat conduction sheet, the heat conduction sheet is in contact with the heat conduction plate, the inner side of the semiconductor refrigeration device is provided with a cooling fan, one end of the semiconductor refrigeration device is provided with an air outlet, and the semiconductor refrigeration device and the screw plate are connected through bolts.

[0017] The improved beneficial effect is that when the device is running, the semiconductor refrigeration sheet and the cooling fan can be opened, the semiconductor refrigeration sheet directly cools the surface of the first water cooling jacket, thereby reducing the temperature of the cooling liquid inside the first water cooling jacket, keeping the cooling liquid entering the first water cooling jacket at a lower temperature as much as possible, and further improving the cooling effect of the cooling liquid on the laser quenching head. At the same time, the heat at the back of the semiconductor refrigeration sheet is conducted to the heat conduction plate and the heat conduction sheet, and the cooling fan draws air outside the semiconductor refrigeration device into the inside of the semiconductor refrigeration device through the air inlet groove, so that the airflow carries away the heat on the heat conduction plate and the heat conduction sheet, and the hot air flow is discharged through the air outlet.

[0018] In order to improve the heat dissipation efficiency of the outer heat dissipation sleeve:

[0019] As a further improvement of the above technical solution: the outer side of the outer heat dissipation sleeve is welded with an auxiliary heat dissipation fin.

[0020] The improved beneficial effect is that the auxiliary heat dissipation fin is used to increase the contact area of the outer heat dissipation sleeve with the outside air, thereby improving the heat dissipation efficiency of the outer heat dissipation sleeve.

[0021] In order to move the second water cooling jacket:

[0022] As a further improvement of the above technical solution: the lifting workpiece cooling auxiliary device comprises a support table, a motor is installed on the side surface of the support table, the output end of the motor is connected with a transmission screw rod, a second water cooling jacket is arranged on the top of the support table, a transmission seat is installed on the side surface of the second water cooling jacket, and the transmission seat is threadedly connected with the transmission screw rod.

[0023] The improved beneficial effect is that the control of the motor driving the transmission screw rod to rotate drives the second water cooling jacket to move upward through the transmission between the transmission screw rod and the transmission seat, so that the second water cooling jacket can be in contact with the bottom of the workpiece placing table.

[0024] In order to improve the heat exchange area of the workpiece placing table and the cooling liquid inside the second water cooling jacket:

[0025] As a further improvement of the above technical solution: the bottom of the workpiece placing table is provided with a contact area increasing slot, and the top of the second water cooling jacket is provided with an integrally formed contact area increasing fitting cavity plug.

[0026] The beneficial effect of the improvement is that the second water cooling jacket contacts the bottom of the workpiece placing table, and at the same time, the contact area increasing fitting cavity plug is inserted into the contact area increasing slot in the bottom of the workpiece placing table, thereby increasing the heat exchange area of the workpiece placing table and the cooling liquid in the second water cooling jacket.

[0027] In order to flow of the cooling liquid between the water inlet and the return flow interface:

[0028] As a further improvement of the above technical solution: the inner side of the first water cooling jacket and the second water cooling jacket is provided with a shunt partition plate.

[0029] The beneficial effect of the improvement is that the shunt partition plate is used to separate the interiors of the first water cooling jacket and the second water cooling jacket, and form a flow path from the water inlet to the return flow interface.

[0030] In order to output and return flow of the cooling liquid in the water cooling machine:

[0031] As a further improvement of the above technical solution: one side of the first water cooling jacket and the second water cooling jacket is provided with a water inlet and a return flow interface, the output pump and the water inlet are connected by an output connecting hose, and the return flow connector and the return flow interface are connected by a return flow connecting hose.

[0032] The beneficial effect of the improvement is that the output pump delivers the cooling liquid to the interiors of the first water cooling jacket and the second water cooling jacket through the output connecting hose, and the cooling liquid in the first water cooling jacket and the second water cooling jacket returns to the interior of the water cooling machine through the return flow connecting hose.

[0033] In order to avoid that the pipeline moves above the workpiece to affect quenching:

[0034] As a further improvement of the above technical solution: the top of the machining machine table is provided with a pipeline limiting rod.

[0035] The beneficial effect of the improvement is that the pipeline limiting rod is used to limit and support the output connecting hose and the return flow connecting hose connected to the first water cooling jacket, thereby avoiding that the pipeline moves above the workpiece to affect quenching.

[0036] The parts not involved in the device are the same as or can be realized by the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 It is a front left axis measurement structure schematic diagram of the utility model;

[0038] Figure 2The left rear structure schematic view of the utility model;

[0039] Figure 3 The pipeline connection schematic view of the utility model;

[0040] Figure 4 The shaft measurement schematic view of the quenching device cooling and heat radiation device in the utility model;

[0041] Figure 5 The section view schematic view of the quenching device cooling and heat radiation device in the utility model;

[0042] Figure 6 The section view schematic view of the quenching device cooling and heat radiation device in the utility model;

[0043] Figure 7 The shaft measurement structure schematic view of the semiconductor refrigeration device in the utility model;

[0044] Figure 8 The section view structure schematic view of the semiconductor refrigeration device in the utility model;

[0045] Figure 9 The section view schematic view of the workpiece placing table and the second water cooling jacket in the utility model;

[0046] Figure 10 The section view structure schematic view of the workpiece placing table and the second water cooling jacket in the utility model;

[0047] In the drawing: 1, processing machine table; 2, control device; 3, support; 4, three-axis linear module; 5, output connection hose; 6, backflow connection hose; 7, mounting seat; 8, laser quenching head; 9, quenching device cooling and heat radiation device; 10, inner heat conduction sleeve; 11, contact area increasing fin; 12, first water cooling jacket; 13, contact area increasing matching cavity protrusion; 14, outer heat radiation sleeve; 15, auxiliary heat radiation fin; 16, pipeline limiting rod; 17, screwing plate; 18, semiconductor refrigeration device; 19, semiconductor refrigeration sheet; 20, heat conduction plate; 21, air inlet groove; 22, heat conduction fin; 23, heat dissipation fan; 24, air outlet; 25, bolt; 26, workpiece placing table support; 27, workpiece placing table; 28, contact area increasing slot; 29, support table; 30, motor; 31, transmission screw; 32, transmission seat; 33, second water cooling jacket; 34, contact area increasing matching cavity plug; 35, shunt partition; 36, water inlet interface; 37, backflow interface; 38, water cooler; 39, output connector; 40, backflow connector; 41, output pump. DETAILED DESCRIPTION

[0048] In order to make the technical solution of the present application better understood by those skilled in the art, the present application will be described in detail below in conjunction with the drawings. The description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present application.

[0049] As shown in Figures 1-10 A high heat dissipation type laser quenching device, comprising a machining platform 1, a support 3 is installed on the top of the machining platform 1, a three-axis linear module 4 is installed on the top of the support 3, a mounting seat 7 is installed on the bottom of the slide table of the three-axis linear module 4, a laser quenching head 8 is installed on the bottom of the mounting seat 7, a quenching device cooling and heat dissipation device 9 is sleeved on the outer side of the laser quenching head 8, the quenching device cooling and heat dissipation device 9 comprises an inner heat conduction sleeve 10 in contact with the laser quenching head 8, a first water cooling sleeve 12 is sleeved on the outer side of the inner heat conduction sleeve 10, an outer heat dissipation sleeve 14 is sleeved on the outer side of the first water cooling sleeve 12, a through groove is provided between the inner and outer sides of the outer heat dissipation sleeve 14, a screw plate 17 is fixedly provided on the inner side of the through groove, a semiconductor refrigeration device 18 is provided on one side of the screw plate 17, a workpiece placing table support 26 is installed on the top of the machining platform 1, a workpiece placing table 27 is installed on the top of the workpiece placing table support 26, a lifting workpiece cooling auxiliary device is further provided on the top of the machining platform 1, a water cooler 38 is installed on the top of the machining platform 1, two groups of output connectors 39 and two groups of return connectors 40 are connected to the side of the water cooler 38, one end of the output connector 39 is connected with an output pump 41.

[0050] In the quenching process, the water cooling machine 38 cools the internal coolant, and at the same time, the internal coolant is input to the inside of the first water cooling jacket 12 through the output pump 41 and the output connection hose 5. The inside of the first water cooling jacket 12 is divided by the shunt partition 35 to form a flow channel from the water inlet interface 36 to the return interface 37. After the coolant enters the inside of the first water cooling jacket 12 through the water inlet interface 36, it circulates around the laser quenching head 8 along the inside of the first water cooling jacket 12, and then returns to the inside of the water cooling machine 38 through the return interface 37 and the return connection hose 6. The heat generated by the laser quenching head 8 is conducted to the inner heat conduction jacket 10 through its shell. Since the outer side of the inner heat conduction jacket 10 is provided with the contact area increasing fin 11, and the inner side of the first water cooling jacket 12 is provided with the contact area increasing matching cavity protrusion 13, the coolant fills the inside of the first water cooling jacket 12 and the contact area increasing matching cavity protrusion 13, and through the cooperation of the contact area increasing fin 11 and the contact area increasing matching cavity protrusion 13, the heat exchange area between the inner heat conduction jacket 10 and the first water cooling jacket 12 is greatly increased, so that the coolant can greatly absorb the heat on the inner heat conduction jacket 10 and the contact area increasing fin 11, and the cooling effect of the laser quenching head 8 is improved. At the same time, the semiconductor refrigeration piece 19 and the cooling fan 23 can be opened, the semiconductor refrigeration piece 19 directly cools the surface of the first water cooling jacket 12, thereby reducing the temperature of the coolant in the inside of the first water cooling jacket 12, so that the coolant entering the first water cooling jacket 12 can maintain a lower temperature as much as possible, and the cooling effect of the coolant on the laser quenching head 8 is further improved. The outer heat dissipation jacket 14 can also absorb the heat conducted to the first water cooling jacket 12, and cooperate with the auxiliary heat dissipation fin 15 for increasing the contact area with the air to effectively dissipate the heat to the air. Through the cooperation of the above structure, the cooling effect of the laser quenching head 8 can be effectively improved, and the normal operation of the laser quenching head 8 is ensured.

[0051] When the natural cooling method cannot meet the cooling requirement of the workpiece after quenching, the second water cooling jacket 33 can be used for auxiliary cooling of the workpiece. When the second water cooling jacket 33 is needed for auxiliary cooling of the workpiece, the output pump 41 on the side of the water chiller 38 is controlled to run to pump the cooling liquid into the second water cooling jacket 33 through the output connection hose 5. The motor 30 is controlled to run to drive the transmission screw 31 to rotate. The second water cooling jacket 33 is driven to move upward by the transmission belt between the transmission screw 31 and the transmission seat 32, so that the second water cooling jacket 33 contacts the bottom of the workpiece placing table 27, and the contact area is increased. The cavity block 34 is inserted into the contact area increased slot 28 in the bottom of the workpiece placing table 27. The heat exchange area between the workpiece placing table 27 and the cooling liquid in the second water cooling jacket 33 is increased. The heat generated on the workpiece due to quenching is conducted to the workpiece placing table 27, and then absorbed and taken away by the cooling liquid which acts on the workpiece placing table 27 in a large area. Through the setting of a set of water chiller 38, the heat dissipation requirement of the laser quenching head 8 is met, and the cooling efficiency of the workpiece is improved, and the possibility of deformation caused by overheating of the workpiece is reduced.

[0052] The control device 2 is installed on the side of the processing machine table 1, and the front surface of the control device 2 is provided with a touch display screen.

[0053] The control device 2 is used for the control of the device, and the touch display screen is used for operation during the control.

[0054] The side of the inner heat conduction jacket 10 is welded with the contact area increasing fin 11, and the inner side of the first water cooling jacket 12 is provided with the contact area increasing matching cavity protrusion 13.

[0055] Because the outer side of the inner heat conduction jacket 10 is provided with the contact area increasing fin 11, and the inner side of the first water cooling jacket 12 is provided with the contact area increasing matching cavity protrusion 13, the cooling liquid fills the first water cooling jacket 12 and the contact area increasing matching cavity protrusion 13. Through the cooperation of the contact area increasing fin 11 and the contact area increasing matching cavity protrusion 13, the heat exchange area between the inner heat conduction jacket 10 and the first water cooling jacket 12 is greatly increased, so that the cooling liquid can greatly absorb the heat on the inner heat conduction jacket 10 and the contact area increasing fin 11, and the cooling effect of the laser quenching head 8 is improved.

[0056] The semiconductor refrigeration device 18 is internally provided with a semiconductor refrigeration sheet 19, one side surface of the semiconductor refrigeration sheet 19 penetrates the screw plate 17 and is in contact with the first water cooling jacket 12, and the other side surface of the semiconductor refrigeration sheet 19 is connected with the heat conduction plate 20, the side surface of the semiconductor refrigeration device 18 is provided with an air inlet groove 21, the inner side of the air inlet groove 21 is provided with a heat conduction sheet 22, the heat conduction sheet 22 is in contact with the heat conduction plate 20, the inner side of the semiconductor refrigeration device 18 is provided with a heat dissipation fan 23, one end of the semiconductor refrigeration device 18 is provided with an air outlet 24, and the semiconductor refrigeration device 18 and the screw plate 17 are screwed by a bolt 25.

[0057] When the device is in operation, the semiconductor refrigeration sheet 19 and the heat dissipation fan 23 can be turned on, the semiconductor refrigeration sheet 19 directly cools the surface of the first water cooling jacket 12, thereby reducing the temperature of the cooling liquid in the first water cooling jacket 12, keeping the cooling liquid entering the first water cooling jacket 12 at a lower temperature as much as possible, and further improving the cooling effect of the cooling liquid on the laser quenching head 8, at the same time, the heat on the back surface of the semiconductor refrigeration sheet 19 is conducted to the heat conduction plate 20 and the heat conduction sheet 22, the heat dissipation fan 23 draws air outside the semiconductor refrigeration device 18 into the inside of the semiconductor refrigeration device 18 through the air inlet groove 21, so that the airflow carries away the heat on the heat conduction plate 20 and the heat conduction sheet 22, and the hot air flow is discharged through the air outlet 24.

[0058] The outer side of the outer heat dissipation sleeve 14 is welded with an auxiliary heat dissipation fin 15.

[0059] The auxiliary heat dissipation fin 15 is used to increase the contact area of the outer heat dissipation sleeve 14 with the outside air, and improve the heat dissipation efficiency of the outer heat dissipation sleeve 14.

[0060] The lifting workpiece cooling auxiliary device comprises a support table 29, a motor 30 is installed on the side surface of the support table 29, the output end of the motor 30 is connected with a transmission screw 31, a second water cooling jacket 33 is arranged on the top of the support table 29, and a transmission seat 32 is installed on the side surface of the second water cooling jacket 33 and is in threaded connection with the transmission screw 31.

[0061] The motor 30 is controlled to drive the transmission screw 31 to rotate, and the second water cooling jacket 33 is driven to move upwards through the transmission between the transmission screw 31 and the transmission seat 32, so that the second water cooling jacket 33 is in contact with the bottom of the workpiece placing table 27.

[0062] The bottom of the workpiece placing table 27 is provided with a contact area increasing slot 28, and the top of the second water cooling jacket 33 is provided with an integrally formed contact area increasing matching cavity plug 34.

[0063] The second water cooling jacket 33 is in contact with the bottom of the workpiece placing table 27, and meanwhile, the contact area is increased, the cavity plug-in block 34 is inserted into the contact area increased slot 28 in the bottom of the workpiece placing table 27, and the heat exchange area of the workpiece placing table 27 and the cooling liquid in the second water cooling jacket 33 is increased.

[0064] The inner side of the first water cooling jacket 12 and the second water cooling jacket 33 is provided with a shunt partition plate 35.

[0065] The shunt partition plate 35 is used for separating the interiors of the first water cooling jacket 12 and the second water cooling jacket 33, and forming a flow passage from the water inlet interface 36 to the backflow interface 37.

[0066] The first water cooling jacket 12 and the second water cooling jacket 33 are provided with the water inlet interface 36 and the backflow interface 37 on one side surface, the output pump 41 and the water inlet interface 36 are connected through the output connection hose 5, and the backflow joint 40 and the backflow interface 37 are connected through the backflow connection hose 6.

[0067] The output pump 41 delivers the cooling liquid to the interiors of the first water cooling jacket 12 and the second water cooling jacket 33 through the output connection hose 5, and the cooling liquid in the first water cooling jacket 12 and the second water cooling jacket 33 is backflowed into the interior of the water cooling machine 38 through the backflow connection hose 6.

[0068] The pipeline limiting rod 16 is installed on the top of the processing machine table 1.

[0069] The pipeline limiting rod 16 is used for limiting and supporting the output connection hose 5 and the backflow connection hose 6 connected with the first water cooling jacket 12, so as to avoid that the pipeline moves above the workpiece and affects the quenching.

[0070] The utility model discloses a working principle and use flow: the device uses, the workpiece of quenching is placed on the top of workpiece placing table 27, can start to carry out laser quenching, controls three -dimensional linear module 4 according to setting program operation through controlling device 2, drives laser quenching head 8 to travel along program route, carries out quenching to workpiece, in the quenching process, water -cooled machine 38 carries out refrigeration to the cooling liquid in the inside, simultaneously through output pump 41, output connection hose 5 to the inside of first water cooling jacket 12 input cooling liquid, the inside of first water cooling jacket 12 is separated to form the flow channel from water inlet 36 to backflow interface 37 through the shunt baffle 35, after cooling liquid enters the inside of first water cooling jacket 12 through water inlet 36, after going around laser quenching head 8 a round along the inside of first water cooling jacket 12, backflow into the inside of water -cooled machine 38 through backflow connection hose 6 through backflow interface 37, the heat generated by laser quenching head 8 is conducted to the inner heat conduction sleeve 10 through its shell, because the outside of inner heat conduction sleeve 10 is equipped with contact area increase fin 11, and the inside of first water cooling jacket 12 is equipped with contact area increase cooperation cavity convex 13, and cooling liquid fills up first water cooling jacket 12, contact area increase cooperation cavity convex 13 inside, through the cooperation of contact area increase fin 11, contact area increase cooperation cavity convex 13, the heat exchange area between inner heat conduction sleeve 10 and first water cooling jacket 12 is greatly increased, so that cooling liquid can greatly absorb the heat on inner heat conduction sleeve 10, contact area increase fin 11, improve the cooling effect of laser quenching head 8, after cooling liquid takes away the heat and backflows into water -cooled machine 38, through water -cooled machine 38, cooling liquid is refrigerated again, after reducing the temperature of cooling liquid, enters first water cooling jacket 12 again, can open simultaneously semiconductor refrigerating piece 19, cooling fan 23, and semiconductor refrigerating piece 19 carries out direct refrigeration to the surface of first water cooling jacket 12, thereby reducing the temperature of cooling liquid in the inside of first water cooling jacket 12, makes the cooling liquid in first water cooling jacket 12 as possible to keep lower temperature, further improve the cooling effect of laser quenching head 8, and the heat on the back of semiconductor refrigerating piece 19 is conducted to heat conduction plate 20, heat conduction fin 22, and cooling fan 23 draws the air located on the outside of semiconductor refrigerating device 18 into the inside of semiconductor refrigerating device 18 through air inlet groove 21, so that the airflow carries away the heat on heat conduction plate 20, heat conduction fin 22, and is discharged through air outlet 24, and the outer heat sink 14 can also play the function of absorbing the heat conducted to first water cooling jacket 12, cooperates with the auxiliary heat dissipation fin 15 for increasing the contact area with the air, effectively dissipates the heat to the air, through the cooperation of the above structure, the cooling effect of laser quenching head 8 can be effectively improved, and the normal operation of laser quenching head 8 is guaranteed, and when the natural cooling method cannot satisfy the cooling demand of workpiece after quenching, the second water cooling jacket 33 can be used to assist cooling workpiece, when needing to use second water cooling jacket 33 to assist cooling workpiece, the output pump 41 on the side of water -cooled machine 38 runs and pumps cooling liquid into second water cooling jacket 33 through output connection hose 5,The second water cooling jacket 33 is also provided with a flow separation baffle 35 and is separated by the flow separation baffle 35 to form a flow channel from the water inlet interface 36 to the return flow interface 37, so that the cooling liquid enters the inside of the second water cooling jacket 33 through the water inlet interface 36, bypasses the flow separation baffle 35, and then flows to the return flow interface 37, and is returned to the inside of the water cooler 38 through the return flow connecting hose 6 and the return flow connector 40 to be cooled again. The control motor 30 drives the transmission screw 31 to rotate, and the second water cooling jacket 33 is driven to move upward through the transmission belt between the transmission screw 31 and the transmission seat 32, so that the second water cooling jacket 33 contacts the bottom of the workpiece placing table 27, and the contact area is increased, the cavity plug-in block 34 is inserted into the contact area of the contact slot 28 in the bottom of the workpiece placing table 27, the heat transfer area of the workpiece placing table 27 and the cooling liquid in the second water cooling jacket 33 is increased, and the heat generated by quenching on the workpiece is conducted to the workpiece placing table 27 and is absorbed and taken away by the cooling liquid which acts on the workpiece placing table 27 in a large area. Through the setting of the water cooler 38, the heat dissipation demand of the laser quenching head 8 is met, the cooling efficiency of the workpiece is improved, and the possibility of deformation caused by overheating of the workpiece is reduced.

[0071] It should be noted that in this document, the terms "comprising", "containing", or any other variant thereof are intended to cover non-exclusive inclusion, so that processes, methods, articles, or devices that include a series of elements not only include those elements, but also include other elements not explicitly listed, or inherent to such processes, methods, articles, or devices.

[0072] The principle and implementation mode of the present application are described by using specific examples in this document, and the above examples are only used to help understand the method and core idea of the present application. The above description is only the preferred implementation mode of the present application. It should be pointed out that due to the limitation of language expression, there are infinite specific structures objectively, and for ordinary skilled persons in the technical field, some improvements, decorations or changes can be made without departing from the principle of the present application, or the technical features described above can be combined in a proper way, or the present application can be directly applied to other occasions without improvement. The scope of protection of the present application should be regarded as the scope of protection of the present application.

Claims

1. A high heat dissipation type laser quenching device, characterized by: The utility model provides a laser quenching head cooling device, including processing machine platform (1), the top of processing machine platform (1) is equipped with support (3), the top of support (3) is equipped with three -axis linear module (4), the slide platform bottom of three -axis linear module (4) is equipped with mounting seat (7), the bottom of mounting seat (7) is equipped with laser quenching head (8), the outside of laser quenching head (8) is equipped with quenching device cooling heat dissipation device (9), and quenching device cooling heat dissipation device (9) includes the inner heat conduction sleeve (10) of contact with laser quenching head (8), the outside of inner heat conduction sleeve (10) is equipped with first water cooling jacket (12), the outside of first water cooling jacket (12) is equipped with outer heat dissipation sleeve (14), the inner and outer sides of outer heat dissipation sleeve (14) are equipped with through groove, the inner side of through groove is fixedly equipped with the screwing plate (17), one side of screwing plate (17) is equipped with semiconductor refrigeration device (18), the top of processing machine platform (1) is equipped with workpiece placement platform support (26), the top of workpiece placement platform support (26) is equipped with workpiece placement platform (27), the top of processing machine platform (1) is also equipped with lifting workpiece cooling auxiliary device, the top of processing machine platform (1) is equipped with water cooling machine (38), and the side of water cooling machine (38) is connected with two groups of output connector (39) and two groups of backflow connector (40), and one end of output connector (39) is connected with output pump (41).

2. The high heat dissipation type laser quenching device according to claim 1, characterized in that: The side of the processing machine platform (1) is provided with a control device (2), and the front of the control device (2) is provided with a touch display screen.

3. The high heat dissipation type laser quenching device according to claim 1, characterized in that: The side of the inner heat conduction sleeve (10) is welded with a contact area increasing fin (11), and the inner side of the first water cooling jacket (12) is provided with a contact area increasing matching cavity protrusion (13).

4. The high heat dissipation type laser quenching device according to claim 1, characterized in that: The inner side of the semiconductor refrigeration device (18) is provided with a semiconductor refrigeration sheet (19), one side of the semiconductor refrigeration sheet (19) penetrates the screwing plate (17) and is in contact with the first water cooling jacket (12), the other side of the semiconductor refrigeration sheet (19) is connected with a heat conduction plate (20), the side of the semiconductor refrigeration device (18) is provided with an air inlet groove (21), the inner side of the air inlet groove (21) is provided with a heat conduction sheet (22), the heat conduction sheet (22) is in contact with the heat conduction plate (20), the inner side of the semiconductor refrigeration device (18) is provided with a heat dissipation fan (23), one end of the semiconductor refrigeration device (18) is provided with an air outlet (24), and the semiconductor refrigeration device (18) and the screwing plate (17) are screwed by a bolt (25).

5. The high heat dissipation type laser quenching device according to claim 1, characterized in that: The outer side of the outer heat dissipation sleeve (14) is welded with an auxiliary heat dissipation fin (15).

6. The high heat dissipation type laser quenching device according to claim 1, characterized in that: The lifting workpiece cooling auxiliary device comprises a support table (29), a motor (30) is installed on the side of the support table (29), the output end of the motor (30) is connected with a transmission screw (31), a second water cooling jacket (33) is arranged on the top of the support table (29), a transmission seat (32) is installed on the side of the second water cooling jacket (33), and the transmission seat (32) is threadedly connected with the transmission screw (31).

7. The high heat dissipation type laser quenching device according to claim 6, characterized in that: The bottom of the workpiece placing table (27) is provided with a contact area increasing slot (28), and the top of the second water cooling jacket (33) is provided with an integrally formed contact area increasing matching cavity plug (34).

8. The high heat dissipation type laser quenching device according to claim 7, characterized in that: The inner sides of the first water cooling jacket (12) and the second water cooling jacket (33) are both provided with a shunt partition plate (35).

9. The high heat dissipation type laser quenching device according to claim 8, characterized in that: One side of the first water cooling jacket (12) and the second water cooling jacket (33) is both provided with a water inlet interface (36) and a backflow interface (37), the output pump (41) and the water inlet interface (36) are connected through an output connecting hose (5), and the backflow joint (40) and the backflow interface (37) are connected through a backflow connecting hose (6).

10. The high heat dissipation type laser quenching device according to claim 1, characterized in that: The top of the processing machine table (1) is provided with a pipeline limiting rod (16).

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