Radiator and lamp

Abstract

The radiator comprises a heat dissipation substrate, a plurality of lamp beads and a heat dissipation component, the heat dissipation component comprises a plurality of heat dissipation units, the heat dissipation units are arranged in the heat dissipation substrate, the lamp beads are arranged on a mounting part, and the heat dissipation units and the lamp beads are arranged in a one-to-one correspondence mode. The projection parts of the lamp beads and the heat dissipation units in the first direction are overlapped, heat generated by the lamp beads can be guided to the heat dissipation substrate, and the situation that the bottoms of the lamp beads are damaged due to local high temperature is avoided; the interval areas are arranged between the lamp beads, the heat dissipation unit is partially arranged in the projection of the interval areas in the first direction, the heat dissipation unit can conduct a large amount of local heat to other positions, where the lamp beads are not arranged, of the heat dissipation substrate, the heat is conducted to the interval areas between the lamp beads in the heat dissipation substrate from the bottoms of the lamp beads, and uniform heat dissipation is achieved; the heat dissipation efficiency and the temperature uniformity of the heat dissipation substrate can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of lamps, in particular to a heat sink and a lamp. BACKGROUND

[0002] In the field of stage lighting, high-power stage lamps have higher brightness, and a large part of the electric energy of the lamp will be converted into heat energy during use. If the heat inside the stage lamp cannot be dissipated in time, it will seriously affect the service life of the stage lamp, and even the lamp may be damaged due to high temperature. The power of stage lamps is getting larger and larger, and more and more lightweight and miniaturization is pursued, and the space inside the lamp is limited, and the existing heat dissipation structure cannot meet the heat dissipation needs of high-power stage lamps. CONTENT OF THE INVENTION

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application proposes a heat sink, which can improve the heat dissipation efficiency and temperature uniformity of the heat dissipation substrate, and avoid local high temperature at the bottom of the lamp beads from damaging the lamp beads.

[0004] The present application also proposes a lamp with the above heat sink.

[0005] According to the first aspect of the embodiment of the present application, the heat sink comprises

[0006] a heat dissipation substrate, the substrate comprising a mounting portion;

[0007] a plurality of lamp beads, the lamp beads being arranged on the mounting portion, and a spacing region being arranged between the lamp beads;

[0008] a heat dissipation component, the heat dissipation component comprising a plurality of heat dissipation units, the plurality of heat dissipation units being arranged in the heat dissipation substrate, and the heat dissipation units being arranged one-to-one corresponding to the lamp beads;

[0009] wherein the lamp beads and the heat dissipation units partially overlap in the projection in the first direction, and the heat dissipation units are partially arranged in the projection of the spacing region in the first direction.

[0010] According to the heat dissipation device provided in the embodiments of the first aspect of the present application, the heat dissipation device comprises a heat dissipation substrate, a plurality of lamp beads and a heat dissipation component, the heat dissipation component comprises a plurality of heat dissipation units, the plurality of heat dissipation units are arranged in the heat dissipation substrate, the plurality of lamp beads are arranged on the mounting portion, the heat dissipation units are arranged one-to-one corresponding to the lamp beads, the lamp beads and the heat dissipation units are partially overlapped in the projection in the first direction, the heat generated by the lamp beads can be guided to the heat dissipation substrate, and local high temperature at the bottom of the lamp beads is avoided to prevent damage; the spacing regions are arranged between the lamp beads, the heat dissipation units are partially arranged in the projection of the spacing regions in the first direction, the heat dissipation units can conduct a large amount of heat to other positions of the heat dissipation substrate where the lamp beads are not arranged, the heat is conducted from the bottom of the lamp beads to the spacing regions between the lamp beads in the heat dissipation substrate, uniform heat dissipation is achieved, and the heat dissipation efficiency and temperature uniformity of the heat dissipation substrate can be improved.

[0011] According to some embodiments of the present application, the projection of the lamp bead in the first direction overlaps with the middle part of the heat dissipation unit, and the two ends of the heat dissipation unit are arranged in the projection of the spacing region in the first direction.

[0012] According to some embodiments of the present application, the projection of the lamp bead in the first direction overlaps with one end of the heat dissipation unit, and the other end of the heat dissipation unit is arranged in the projection of the spacing region in the first direction.

[0013] According to some embodiments of the present application, the heat dissipation unit is arranged as a heat pipe, and the heat pipe is arranged linearly in the heat dissipation substrate.

[0014] According to some embodiments of the present application, the heat dissipation unit is arranged as a heat pipe, and the heat pipe is arranged linearly in the heat dissipation substrate.

[0015] According to some embodiments of the present application, the heat dissipation component further comprises a plurality of heat dissipation fins, and the heat dissipation fins are arranged on the side of the heat dissipation substrate opposite to the mounting portion.

[0016] According to some embodiments of the present application, the heat dissipation component further comprises a fan, and the fan is arranged towards the heat dissipation fins to blow air to the heat dissipation fins for heat dissipation.

[0017] According to some embodiments of the present application, a cavity is arranged in the heat dissipation substrate, and the heat dissipation unit is arranged in the cavity.

[0018] According to some embodiments of the present application, a heat-conducting filler is arranged between the heat dissipation substrate and the heat dissipation unit.

[0019] The lamp provided in the embodiments of the second aspect of the present application comprises the heat dissipation device provided in the embodiments of the first aspect of the present application.

[0020] According to the lamp provided by the embodiment of the present application, the following beneficial effects are achieved: the lamp provided by the present application uses a heat sink, the heat sink comprises a heat dissipation base plate, a plurality of lamp beads and a heat dissipation component, the heat generated by the lamp beads is guided to the heat dissipation base plate through a plurality of heat dissipation units, the local high temperature at the bottom of the lamp beads is avoided, and the service life of the lamp beads and the lamp is improved; the spacing area is arranged between the mounting portions, the heat dissipation unit is arranged in the projection of the spacing area in the first direction, the heat dissipation unit can conduct a large amount of heat to other positions of the heat dissipation base plate where no lamp beads are arranged, the heat is conducted from the bottom of the lamp beads to the spacing area between the lamp beads in the heat dissipation base plate, the heat dissipation efficiency and the temperature uniformity of the heat dissipation base plate are improved, the light weight and miniaturization requirement of the lamp is met, and the heat dissipation requirement of high power is also met.

[0021] Additional aspects and advantages of the present application will be made apparent from the following description of embodiments that proceeds with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the accompanying drawings, wherein:

[0023] Figure 1 is a structural schematic diagram of a heat sink in an embodiment of the present application;

[0024] Figure 2 is a structural schematic diagram of the heat sink from another angle as shown in Figure 1

[0025] Figure 3 is a structural schematic diagram of the lamp bead and the mounting portion as shown in Figure 1

[0026] Figure 4 is a structural schematic diagram of a heat dissipation unit in an embodiment of the present application;

[0027] Figure 5 is a structural schematic diagram of a heat dissipation unit in another embodiment of the present application;

[0028] Figure 6 is a sectional view of the heat sink as shown in Figure 1 DETAILED DESCRIPTION

[0029] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, in which the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0030] ​​​In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, inner, outer and the like, is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0031] In the description of the present application, one or more is understood as one or more, more than two is understood as more than two, greater than, less than, more than and the like are understood as not including the number, above, below, within and the like are understood as including the number. If the first, second is described, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of technical features indicated.

[0032] In the description of the present application, unless otherwise explicitly limited, the words such as setting, mounting, connecting, assembling, fitting and the like should be broadly understood, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0033] The following refers to Figures 1 to 6 The heat sink of the embodiment of the present application is described.

[0034] The heat sink of the embodiment of the present application, as Figures 1 to 6 shown, includes a heat dissipation base plate 100, lamp beads 200 and a heat dissipation component, the lamp beads 200 are used to provide light sources, the heat dissipation base plate 100 includes a mounting portion 110, the lamp beads 200 are provided in plurality, and the plurality of lamp beads 200 are mounted on the mounting portion 110 to complete the mounting and fixation of the lamp beads 200.

[0035] The heat dissipation component includes a plurality of heat dissipation units 300, the plurality of heat dissipation units 300 are arranged in the heat dissipation base plate 100, the heat dissipation units 300 are arranged one by one corresponding to the lamp beads 200, the lamp beads 200 and the heat dissipation units 300 overlap in the projection part in the first direction, and the heat generated by the lamp beads 200 can be guided to the heat dissipation base plate 100, avoiding local high temperature at the bottom of the lamp beads 200 and damage.

[0036] The lamp beads 200 are provided with a spacing area, and the heat dissipation units 300 are partially arranged in the projection of the spacing area in the first direction, the high temperature generated by the lamp beads 200 is conducted to the heat dissipation units 300 through the overlapping part, the heat dissipation units 300 can conduct a large amount of local heat to other positions of the heat dissipation base plate 100 where the lamp beads 200 are not arranged, realizing uniform heat dissipation, and improving the heat dissipation efficiency and temperature uniformity of the heat dissipation base plate 100.

[0037] In some embodiments, the first direction is a vertical downward direction Figure 1In the direction indicated by the middle X axis, the vertical downward projection of the lamp bead 200 partially overlaps the heat dissipation unit 300 in the heat dissipation substrate 100, the high temperature generated by the lamp bead 200 accumulates below, the high temperature vertically downward conducts to the part of the heat dissipation unit 300 that overlaps, the other part of the heat dissipation unit 300 is arranged in the projection of the interval area in the first direction, the heat dissipation unit 300 conducts the high temperature to the other part, can conduct the local large amount of heat to the other position of the heat dissipation substrate 100 where the lamp bead 200 is not arranged, realize uniform heat dissipation, improve the heat dissipation efficiency.

[0038] In some embodiments, the plurality of lamp beads 200 are uniformly distributed on the heat dissipation substrate 100, and specifically, the plurality of lamp beads 200 are arranged to form concentric circles, and the positions of the plurality of mounting portions 110 and the plurality of heat dissipation units 300 correspond to the positions of the lamp beads 200. In other embodiments, the plurality of lamp beads 200 are arranged in a rectangular array on the heat dissipation substrate 100. It can be understood that the number and arrangement of the lamp beads 200 can be adaptively adjusted according to actual needs, and the heat dissipation units 300 are arranged one-to-one corresponding to the lamp beads 200 without affecting the heat dissipation effect.

[0039] In some embodiments, the mounting portion 110 is arranged as a mounting plate, the mounting plate is provided with a plurality of mounting holes for mounting the lamp beads 200, and the lamp beads 200 are mounted one-to-one in the mounting holes to complete the fixed mounting of the plurality of lamp beads 200.

[0040] It should be noted that the thermal conductivity coefficient of the heat dissipation unit 300 is greater than that of the heat dissipation substrate 100, the high temperature generated by the lamp bead 200 accumulates on the heat dissipation substrate 100, and the heat dissipation unit 300 corresponding to the lamp bead 200 can take away the local large amount of heat of the heat dissipation substrate 100, the heat dissipation unit 300 conducts the heat to the part arranged in the projection of the interval area in the first direction, thereby conducting the local large amount of heat to the position of the heat dissipation substrate 100 where the lamp bead 200 is not arranged, fully utilizing the heat dissipation substrate 100, and improving the heat dissipation efficiency.

[0041] It can be understood that the cost of the heat dissipation unit 300 is higher than that of the heat dissipation substrate 100, and using the heat dissipation unit 300 to dissipate heat for the lamp bead 200 will increase the cost by several times. In the present application, the heat dissipation unit 300 corresponds to the lamp bead 200 one-to-one, and the heat dissipation unit 300 is arranged in the heat dissipation substrate 100, which saves cost and greatly improves the heat dissipation efficiency.

[0042] According to some embodiments of the present application, the projection of the lamp beads 200 in the first direction overlaps with the middle part of the heat dissipation unit 300, and the two ends of the heat dissipation unit 300 are arranged in the projection of the spacing area in the first direction. The lamp beads 200 are arranged in multiple numbers, and the number and position of the heat dissipation unit 300 correspond to the number and position of the lamp beads 200. The projection of the lamp beads 200 in the first direction overlaps with the middle part of the heat dissipation unit 300, and the high temperature generated by the lamp beads 200 accumulates on the heat dissipation substrate 100. Since the position of the heat dissipation unit 300 corresponds to the position of the lamp beads 200, the high temperature on the heat dissipation substrate 100 is conducted to the middle part of the heat dissipation unit 300 which overlaps with the projection of the lamp beads 200, and the heat dissipation unit 300 conducts the high temperature from the middle part to the two ends. The two ends of the heat dissipation unit 300 are arranged in the projection of the spacing area in the first direction, so that the local large amount of heat accumulated under the lamp beads 200 can be distributed to other positions of the heat dissipation substrate 100. Not only can the local high temperature at the bottom of the lamp beads 200 be avoided to damage, but also uniform heat dissipation can be achieved, and the heat dissipation efficiency is improved.

[0043] According to some embodiments of the present application, the projection of the lamp beads 200 in the first direction overlaps with one end of the heat dissipation unit 300, and the other end of the heat dissipation unit 300 is arranged in the projection of the spacing area in the first direction. One end of the heat dissipation unit 300 is arranged towards the lamp beads 200, and overlaps with the projection of the lamp beads 200 in the first direction. The other end of the heat dissipation unit 300 is arranged in the projection of the spacing area in the first direction. The high temperature generated by the lamp beads 200 accumulates on the heat dissipation substrate 100, and the high temperature on the heat dissipation substrate 100 is conducted to one end of the heat dissipation unit 300 which overlaps with the projection of the lamp beads 200. The heat dissipation unit 300 conducts the high temperature from one end to the other end, and conducts the high temperature from the heat dissipation unit 300 to the position where the other end is located. The local large amount of heat accumulated under the lamp beads 200 is distributed to other positions of the heat dissipation substrate 100. Not only can the local high temperature at the bottom of the lamp beads 200 be avoided to damage, but also uniform heat dissipation can be achieved, and the heat dissipation efficiency is improved.

[0044] According to some embodiments of the present application, the heat dissipation unit 300 is arranged as a heat pipe, and the heat pipe is arranged linearly in the heat dissipation substrate 100. The heat pipe is arranged linearly in the heat dissipation substrate 100. Specifically, in some embodiments, the middle part of the linearly arranged heat pipe overlaps with the projection of the lamp beads 200 in the first direction, and the two ends of the heat pipe are arranged in the projection of the spacing area in the first direction. The heat can be linearly transported from the middle part of the heat pipe to the two ends of the heat pipe, and then conducted from the two ends to the projection of the spacing area in the first direction. The heat is uniformly distributed in the heat dissipation substrate 100, and uniform heat dissipation is achieved. In other embodiments, one end of the linearly arranged heat pipe overlaps with the projection of the lamp beads 200 in the first direction, and the other end of the heat pipe is linearly arranged in the projection of the spacing area in the first direction. The heat can be linearly transported from one end of the heat pipe to the other end of the heat pipe, and uniform heat dissipation can also be achieved to ensure the heat dissipation efficiency.

[0045] According to some embodiments of the present application, the heat dissipation unit 300 is arranged as a heat pipe, and the heat pipe is arranged in a bent manner in the heat dissipation substrate 100. The heat pipe arranged in a bent manner can be in full contact with the heat dissipation substrate 100, and can conduct heat to various positions of the heat dissipation substrate 100, thereby improving the heat dissipation efficiency. Specifically, in some embodiments, the middle part of the heat pipe arranged in a bent manner coincides with the projection of the lamp bead 200 in the first direction, and the two ends of the heat pipe are arranged in the projection of the spacing area in the first direction, so that heat can be transported from the middle part of the heat pipe to the two ends of the heat pipe, and then conducted from the two ends to the projection of the spacing area in the first direction, thereby uniformly distributing heat in the heat dissipation substrate 100 and achieving uniform heat dissipation. In other embodiments, one end of the heat pipe arranged in a bent manner coincides with the projection of the lamp bead 200 in the first direction, and the other end of the heat pipe is arranged in a bent manner in the projection of the spacing area in the first direction, so that heat can be transported from one end of the heat pipe to the other end of the heat pipe in a bent manner, thereby achieving uniform heat dissipation and ensuring the heat dissipation efficiency.

[0046] It should be noted that in other embodiments, each heat pipe does not interfere with each other, the shape of the heat pipe is not unique, and the heat dissipation unit 300 is provided with a plurality of heat dissipation units 300, which include heat pipes arranged in a straight line and heat pipes arranged in a bent manner, and can conduct heat to the projection of the spacing area in the first direction, thereby achieving uniform heat dissipation.

[0047] According to some embodiments of the present application, the heat dissipation component further comprises a plurality of heat dissipation fins 410 arranged on the side of the heat dissipation substrate 100 opposite to the mounting portion 110. The heat dissipation component further comprises heat dissipation fins 410 arranged on both sides of the heat dissipation substrate 100 with the mounting portion 110, specifically, the mounting portion 110 is arranged on one side of the heat dissipation substrate 100, and the heat dissipation fins 410 are arranged on the other side of the heat dissipation substrate 100. The lamp bead 200 is arranged on the mounting portion 110, and the heat of the lamp bead 200 is conducted to the heat dissipation substrate 100. The heat dissipation unit 300 in the heat dissipation substrate 100 uniformly distributes heat to the entire heat dissipation substrate 100, and the arrangement of the heat dissipation fins 410 can increase the heat dissipation area and improve the heat dissipation effect. It can be understood that in some embodiments, the heat dissipation fins 410 are provided in multiple pieces, and the multiple heat dissipation fins 410 are arranged side by side on one side of the heat dissipation substrate 100, and the heat dissipation fins 410 are arranged with gaps therebetween. The gaps between the heat dissipation fins 410 can be used for ventilation while increasing the heat dissipation area, thereby improving the heat dissipation effect.

[0048] According to some embodiments of the present application, the heat dissipation component further comprises a fan 420 arranged towards the heat dissipation fins 410 to blow air to the heat dissipation fins 410 for heat dissipation. Specifically, the fan 420 is arranged below the heat dissipation fins 410 and towards the heat dissipation fins 410, and blows air to the heat dissipation fins 410, which can further improve the heat dissipation efficiency.

[0049] According to some embodiments of the present application, a cavity is arranged in the heat dissipation substrate 100, and the heat dissipation unit 300 is arranged in the cavity. The mounting portion 110 is arranged on the surface of the heat dissipation substrate 100, and the lamp beads 200 are mounted on the surface of the heat dissipation substrate 100 through the mounting portion 110. The heat dissipation substrate 100 is internally provided with a cavity, and the heat dissipation unit 300 is arranged in the cavity. The position of the heat dissipation unit 300 in the cavity corresponds to the position of the lamp beads 200 on the surface of the heat dissipation substrate 100. The heat of the lamp beads 200 is conducted to the heat dissipation substrate 100, and the heat dissipation substrate 100 conducts the heat to the heat dissipation unit 300 in the cavity. The heat dissipation unit 300 can conduct a large amount of heat in a local area to the interval area of the heat dissipation substrate 100 where no lamp beads 200 are arranged. The heat is conducted from the bottom of the lamp beads 200 to the lamp beads 200 and between the lamp beads 200, achieving uniform heat dissipation and improving the heat dissipation efficiency and temperature uniformity of the heat dissipation substrate 100. It should be noted that in some embodiments, the heat dissipation unit 300 is tightly attached to the heat dissipation substrate 100 in the cavity to ensure good heat conduction effect between the heat dissipation unit 300 and the heat dissipation substrate 100.

[0050] According to some embodiments of the present application, a heat-conducting filler is arranged between the heat dissipation substrate 100 and the heat dissipation unit 300. The heat dissipation unit 300 is arranged in the heat dissipation substrate 100, and the heat-conducting filler is used to fill between the heat dissipation substrate 100 and the heat dissipation unit 300, which can ensure that the heat dissipation substrate 100 and the heat dissipation unit 300 are in full contact, and is conducive to uniform heat conduction. Specifically, in some embodiments, the heat-conducting filler is solder, which is used to fill between the heat dissipation substrate 100 and the heat dissipation unit 300. This not only facilitates uniform heat conduction, but also fixes the heat dissipation unit 300 in the heat dissipation substrate 100, ensuring the stability of the heat dissipation unit 300 in the heat dissipation substrate 100.

[0051] The lamp of the embodiment of the present application comprises a heat sink. By using the heat sink, the heat sink comprises a heat dissipation substrate 100, a plurality of lamp beads 200 and a heat dissipation component, the heat generated by the lamp beads 200 is guided to the heat dissipation substrate 100 through a plurality of heat dissipation units 300, local high temperature at the bottom of the lamp beads 200 is avoided to damage, the service life of the lamp beads 200 and the lamp is improved; a spacing area is arranged between the mounting parts 110, the heat dissipation units 300 are partially arranged in the projection of the spacing area in the first direction, the heat dissipation units 300 can conduct a large amount of local heat to other positions of the heat dissipation substrate 100 which are not arranged with the lamp beads 200, the heat is conducted from the bottom of the lamp beads 200 to the projection of the spacing area between the lamp beads 200 in the first direction, the heat dissipation efficiency and the temperature uniformity of the heat dissipation substrate 100 can be improved, the light weight and miniaturization demand of the lamp is met, and the heat dissipation demand of high power can also be met.

[0052] The embodiment of the present application is described in detail above in combination with the drawings, but the present application is not limited to the above-mentioned embodiment, and various changes can be made within the knowledge range possessed by those skilled in the art without departing from the purpose of the present application.

Claims

1. A heat sink, characterized by The application relates to a heat dissipation device. The heat dissipation device comprises: a heat dissipation substrate, the substrate comprising a mounting portion; a plurality of lamp beads arranged on the mounting portion, and a spacing area arranged between the lamp beads; a heat dissipation component, the heat dissipation component comprising a plurality of heat dissipation units, the plurality of heat dissipation units being arranged in the heat dissipation substrate, and the heat dissipation units being arranged one by one corresponding to the lamp beads; 2. The heat spreader of claim 1, wherein, wherein the lamp beads and the heat dissipation units are partially overlapped in the projection of the lamp beads and the heat dissipation units in a first direction, and the heat dissipation units are partially arranged in the projection of the spacing area in the first direction.

3. The heat spreader of claim 1, wherein, The projection of the lamp beads in the first direction is overlapped with the middle part of the heat dissipation units, and the two ends of the heat dissipation units are arranged in the projection of the spacing area in the first direction.

4. The heat sink of claim 2 or 3, wherein, The projection of the lamp beads in the first direction is overlapped with one end of the heat dissipation units, and the other end of the heat dissipation units is arranged in the projection of the spacing area in the first direction.

5. The heat sink of claim 2 or 3, wherein, The heat dissipation units are arranged as heat pipes, and the heat pipes are arranged linearly in the heat dissipation substrate.

6. The heat spreader of claim 1, wherein, The heat dissipation units are arranged as heat pipes, and the heat pipes are arranged in the heat dissipation substrate in a curved manner.

7. The heat sink of claim 6, wherein, The heat dissipation component further comprises a plurality of heat dissipation fins arranged on the side of the heat dissipation substrate opposite to the mounting portion.

8. The heat spreader of claim 1, wherein, The heat dissipation component further comprises a fan arranged towards the heat dissipation fins to send air to the heat dissipation fins for heat dissipation.

9. The heat spreader of claim 1, wherein, The heat dissipation substrate is provided with a cavity, and the heat dissipation units are arranged in the cavity.

10. A luminaire characterized by, The heat dissipation substrate and the heat dissipation units are provided with a heat-conducting filler. The heat dissipation device comprises any one of claims 1 to 9. The heat dissipation device comprises any one of claims 1 to 9.

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