Detection device of light emitting diode chip
By using alternating detection electrodes to contact the LED chip electrodes, efficient detection of micro LED chips is achieved, solving the problem of probe detection damage, improving detection reliability, and simplifying the process.
Patent Information
- Application Number
- CN202422844139.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-11-21
AI Technical Summary
In existing technologies, miniaturized LED chips are difficult to detect effectively with probes, and probe connections may damage the electrodes.
Multiple first and second detection electrodes are arranged at alternating intervals. The first electrode is connected to the positive terminal of the power supply, and the second electrode is connected to the negative terminal of the power supply. They are in contact with the electrodes of the LED chip respectively, so as to realize the simultaneous detection of multiple chips and reduce post-detection damage through the adhesive layer.
This technology enables simultaneous detection of multiple LED chips, reduces electrode damage, improves detection reliability, and simplifies process steps.
Smart Images
Figure CN223637652U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of semiconductor technology, and in particular, to a detection device of a light emitting diode chip. BACKGROUND
[0002] Light emitting diodes (LEDs) have been widely used in various light source fields such as backlight, lighting, and landscape, due to their small size, long service life, rich color, and low energy consumption.
[0003] In the related art, a detection device of an LED chip includes a probe. The probe is used to connect the electrodes of the LED chip, and an electrical signal is provided to the LED chip through the probe to detect the LED chip.
[0004] However, as the size of the LED chip is gradually miniaturized, it is difficult to detect each LED chip using the probe, and the electrodes of the LED chip may be damaged when the electrodes of the LED chip are connected using the probe to detect the LED chip. UTILITY MODEL CONTENT
[0005] Embodiments of the present disclosure provide a detection device of a light emitting diode chip, which can simultaneously complete the detection of multiple LED chips and improve the reliability of LED chip detection. The technical solution is as follows:
[0006] In one aspect, a detection device of a light emitting diode chip is provided, which includes a carrier and a detection electrode layer located on a surface of the carrier. The detection electrode layer includes a plurality of first detection electrodes and a plurality of second detection electrodes arranged alternately and spaced apart in a first direction. The length direction of the first detection electrodes and the second detection electrodes is a second direction, and the first direction and the second direction intersect. The plurality of first detection electrodes and the plurality of second detection electrodes are arranged in pairs. In any pair of the first detection electrode and the second detection electrode, the first detection electrode is used to be electrically connected to a positive electrode of a power supply and to contact a first electrode of at least one light emitting diode chip, and the second detection electrode is used to be electrically connected to a negative electrode of the power supply and to contact a second electrode of the at least one light emitting diode chip.
[0007] Optionally, the first detection electrode includes a first wire, and the length direction of the first wire is the second direction. The second detection electrode includes a second wire, and the length direction of the second wire is the second direction.
[0008] Optionally, the first detection electrode further comprises a plurality of first pads, the plurality of first pads are located on the surface of the first conductive wire away from the carrier and are arranged at intervals along the second direction; the second detection electrode further comprises a plurality of second pads, the plurality of second pads are located on the surface of the second conductive wire away from the carrier and are arranged at intervals along the second direction; the first pads are used to contact the first electrode of the light-emitting diode chip, and the second pads are used to contact the second electrode of the light-emitting diode chip.
[0009] Optionally, the detection electrode layer further comprises a third conductive wire and a fourth conductive wire, the third conductive wire and the fourth conductive wire are arranged at intervals along the second direction, the same end of the plurality of first detection electrodes is connected to the third conductive wire, and the same end of the plurality of second detection electrodes is connected to the fourth conductive wire.
[0010] Optionally, the third conductive wire comprises a first sub-part and a second sub-part connected in sequence, the length direction of the first sub-part is the first direction, the length direction of the second sub-part is the second direction, and the same end of the plurality of first detection electrodes is connected to the first sub-part; the fourth conductive wire comprises a third sub-part and a fourth sub-part connected in sequence, the length direction of the third sub-part is the first direction, the length direction of the fourth sub-part is the second direction, and the same end of the plurality of second detection electrodes is connected to the third sub-part.
[0011] Optionally, the detection electrode layer further comprises a third pad and a fourth pad, the third pad is located on the surface of the third conductive wire away from the carrier, and the fourth pad is located on the surface of the fourth conductive wire away from the carrier; the third pad is used to be connected to the positive electrode of a power supply, and the fourth pad is used to be connected to the negative electrode of the power supply.
[0012] Optionally, in the first direction, the orthographic projection of the third pad on the carrier and the orthographic projection of the fourth pad on the carrier are located on the same side of the orthographic projection of the plurality of first detection electrodes on the carrier and on the same side of the orthographic projection of the plurality of second detection electrodes on the carrier.
[0013] Optionally, the carrier is a carrier substrate; or the carrier comprises a plurality of first carriers and a plurality of second carriers arranged at intervals along the first direction alternately and with adjustable intervals, the first detection electrodes are located on the surface of the first carriers, and the second detection electrodes are located on the surface of the second carriers.
[0014] Optionally, the surface of the detection electrode layer away from the carrier is flush with the surface of the adhesive layer away from the carrier.
[0015] Optionally, the adhesive layer is a polydimethylsiloxane (PDMS) layer, an epoxy resin layer, or a polyurethane layer.
[0016] The technical scheme provided by the embodiments of the present disclosure has the following beneficial effects:
[0017] In the embodiments of the present disclosure, the detection electrode layer includes a plurality of first detection electrodes and a plurality of second detection electrodes arranged alternately and spaced apart in a first direction, the length direction of the first detection electrode and the second detection electrode is a second direction, and the first direction and the second direction intersect. The plurality of first detection electrodes and the plurality of second detection electrodes are arranged in pairs, in any pair of first detection electrode and second detection electrode, the first detection electrode is used to be electrically connected with the positive electrode of the power supply and to contact the first electrode of the at least one LED chip, and the second detection electrode is used to be electrically connected with the negative electrode of the power supply and to contact the second electrode of the at least one LED chip. In this way, the current can be conducted to the electrode of the LED chip through the first detection electrode and the second detection electrode to detect the LED chip. The detection of a plurality of LED chips can be completed at the same time through the plurality of first detection electrodes and the plurality of second detection electrodes arranged alternately and spaced apart in pairs, and the separation of the detection device from the LED chip after the detection is completed can reduce the probability of damage to the electrode of the LED chip caused by the detection, thereby improving the reliability of the LED chip detection. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical scheme in the embodiments of the present disclosure, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.
[0019] Figure 1 is a top view of a detection device for an LED chip provided by an embodiment of the present disclosure;
[0020] Figure 2 is Figure 1 is a schematic view of the cross-sectional structure at AA line in
[0021] Figure 3 is a top view of another detection device for an LED chip provided by an embodiment of the present disclosure;
[0022] Figure 4 is Figure 3 is a schematic view of the cross-sectional structure at BB line in
[0023] Figure 5 is a schematic view of a detection process for an LED chip provided by an embodiment of the present disclosure;
[0024] Figure 6 is a top view of another LED chip detection device provided by an embodiment of the present disclosure;
[0025] Figure 7 is Figure 6 is a schematic view of a cross-sectional structure at a CC line in the embodiment of the present disclosure;
[0026] Figure 8 is a flow chart of a preparation method of an LED chip detection device provided by an embodiment of the present disclosure.
[0027] Reference signs:
[0028] x: first direction; y: second direction; 10: carrier; 11: first carrier; 12: second carrier; 20: detection electrode layer; 21: first detection electrode; 211: first wire; 212: first pad; 22: second detection electrode; 221: second wire; 222: second pad; 23: third wire; 231: first sub-part; 232: second sub-part; 24: fourth wire; 241: third sub-part; 242: fourth sub-part; 25: third pad; 26: fourth pad; 30: adhesive layer; 40: light-emitting structure; 41: first electrode; 42: second electrode. DETAILED DESCRIPTION
[0029] In order to make the objectives, technical solutions and advantages of the present disclosure clearer, the following will further describe the embodiments of the present disclosure in detail with reference to the accompanying drawings.
[0030] Unless otherwise defined, technical or scientific terms used herein should have the same meaning as commonly understood by one of ordinary skill in the art to which this present disclosure belongs. The terms "first", "second", "third", and similar terms used herein do not imply any order, quantity, or importance, but are used to distinguish different components. Similarly, the terms "one", "another", and similar terms do not mean a quantity restriction, but mean that there is at least one. The terms "include", "comprise", and similar terms mean that the elements or objects before the "include" or "comprise" cover the elements or objects listed after the "include" or "comprise" and their equivalents, and do not exclude other elements or objects. The terms "connect" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "up", "down", "left", "right", "top", "bottom", and the like are only used to indicate relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships may also change accordingly.
[0031] This disclosure provides an LED chip testing device applicable to various sizes and types of LED chips, including Mini-LED and Micro-LED chips. The LED chip testing device is described below with reference to the accompanying drawings.
[0032] Figure 1 This is a top view of an LED chip detection device provided in an embodiment of this disclosure. Figure 1 As shown, the detection device includes a carrier 10 and a detection electrode layer 20 located on the surface of the carrier 10. The detection electrode layer 20 includes a plurality of first detection electrodes 21 and a plurality of second detection electrodes 22 arranged alternately in a first direction x. The length direction of both the first detection electrodes 21 and the second detection electrodes 22 is the second direction y, and the first direction x and the second direction y intersect. The plurality of first detection electrodes 21 and the plurality of second detection electrodes 22 are arranged in pairs. In any pair of first detection electrodes 21 and second detection electrodes 22, the first detection electrode 21 is electrically connected to the positive terminal of the power supply and contacts the first electrode of at least one LED chip, and the second detection electrode 22 is electrically connected to the negative terminal of the power supply and contacts the second electrode of at least one LED chip.
[0033] In this embodiment, current can be conducted to the electrodes of the LED chip through the first detection electrode 21 and the second detection electrode 22 to detect the LED chip. Multiple LED chips can be detected simultaneously by using alternating and paired first detection electrodes 21 and second detection electrodes 22. After detection, separating the detection device from the LED chip reduces the probability of damage to the LED chip electrodes, thereby improving the reliability of LED chip detection.
[0034] Furthermore, the carrier 10 in this testing device can provide some support, acting as a temporary substrate to support the LED chip during testing. Therefore, the original substrate of the LED chip can be removed, and non-emitting abnormal LED chips can be removed after testing. Qualified, normally emitting LED chips can then be directly transferred from the testing device for subsequent steps, simplifying the process.
[0035] Figure 1 In the embodiment shown, the first direction x is perpendicular to the second direction y.
[0036] Figure 1 In the illustrated embodiment, the first direction x can be a row direction, and the second direction y can be a column direction. In other embodiments, the first direction x can be a column direction, and the second direction y can be a row direction.
[0037] In other embodiments, the included angle between the first direction x and the second direction y is less than 90°, or the included angle between the first direction x and the second direction y is greater than 90°, which is not limited in the present disclosure.
[0038] Figure 2 is Figure 1 a cross-sectional structure schematic view at AA line. As Figure 1 and Figure 2 shown, the first detection electrode 21 includes a first wire 211, and the length direction of the first wire 211 is the second direction y. The second electrode 22 includes a second wire 221, and the length direction of the second wire 221 is the second direction y. In this way, the first wire 211 and the second wire 221 are simple in structure, which is conducive to simplifying the manufacturing process of the detection device. Moreover, the LED chip can be directly detected by aligning and contacting the first wire 211 with the first electrode of the LED chip and aligning and contacting the second wire 221 with the second electrode of the LED chip. The alignment accuracy requirement of the first wire 211 and the second wire 221 is low, which is conducive to improving the convenience of detection.
[0039] Optionally, the first wire 211 and the second wire 221 are straight lines.
[0040] Optionally, the detection electrode layer 20 further includes a third wire 23 and a fourth wire 24, and the third wire 23 and the fourth wire 24 are arranged at intervals in the second direction y. The same end of each of the plurality of first detection electrodes 21 is connected to the third wire 23, and the same end of each of the plurality of second detection electrodes 22 is connected to the fourth wire 24. In this way, when the LED chip is detected, the third wire 23 can be used to electrically connect all the first detection electrodes 21 to the positive electrode of the same power supply, and the fourth wire 24 can be used to electrically connect all the second detection electrodes 22 to the negative electrode of the same power supply, so that the detection of the LED chip can be simplified, and the detection of a plurality of LED chips can be efficiently completed.
[0041] As Figure 1 shown, the third wire 23 is located at the upper side edge of the detection device, and the upper end of each first detection electrode 21 is connected to the third wire 23. The fourth wire 24 is located at the lower side edge of the detection device, and the lower end of each second detection electrode 22 is connected to the fourth wire 24.
[0042] In other embodiments, the third wire 23 can be located at the lower side edge of the detection device, and the fourth wire 24 can be located at the upper side edge of the detection device, which is not limited in the present disclosure.
[0043] As Figure 1As shown, the third wire 23 comprises a first sub-portion 231 and a second sub-portion 232 connected in sequence, the length direction of the first sub-portion 231 is the first direction x, the length direction of the second sub-portion 232 is the second direction y, and the same end of the plurality of first detection electrodes 21 is connected to the first sub-portion 231. The fourth wire 24 comprises a third sub-portion 241 and a fourth sub-portion 242 connected in sequence, the length direction of the third sub-portion 241 is the first direction x, the length direction of the fourth sub-portion 242 is the second direction y, and the same end of the plurality of second detection electrodes 22 is connected to the third sub-portion 241. Among them, the first sub-portion 231 and the third sub-portion 241 are arranged in the second direction y, and the second sub-portion 232 and the fourth sub-portion 242 are arranged in the second direction y. In this way, it is convenient to connect all the first detection electrodes 21 through the first sub-portion 231, connect all the second detection electrodes 22 through the third sub-portion 241, and electrically connect the second sub-portion 232 and the fourth sub-portion 242 to the external power supply.
[0044] Optionally, in the first direction x, the orthographic projection of the second sub-portion 232 on the carrier 10 and the orthographic projection of the fourth sub-portion 242 on the carrier 10 are located on the same side of the orthographic projection of the plurality of first detection electrodes 21 on the carrier 10, and on the same side of the orthographic projection of the plurality of second detection electrodes 22 on the carrier 10. In this way, the second sub-portion 232 and the fourth sub-portion 242 can be made closer, which is beneficial to reduce the size of the LED chip detection device.
[0045] Exemplarily, the orthographic projection of the second sub-portion 232 on the carrier 10 and the orthographic projection of the fourth sub-portion 242 on the carrier 10 are located on the right side of the orthographic projection of the plurality of first detection electrodes 21 on the carrier 10, and on the right side of the orthographic projection of the plurality of second detection electrodes 22 on the carrier 10. That is, the second sub-portion 232 and the fourth sub-portion 242 are both located at the right side edge of the detection device.
[0046] In other embodiments, the second sub-portion 232 and the fourth sub-portion 242 can also be both located at the left side edge of the detection device, etc.
[0047] Exemplarily, the first sub-portion 231, the second sub-portion 232, the third sub-portion 241 and the fourth sub-portion 242 can all be straight lines.
[0048] Figure 3 is another top view of the LED chip detection device provided by the embodiments of the present disclosure. Figure 4 is Figure 3 is a schematic view of the cross-sectional structure at the BB line in FIG. 8. Figure 3 and Figure 4As shown, the first detection electrode 21 further comprises a plurality of first pads 212 which are located on the surface of the first conducting wire 211 away from the carrier 10 and are arranged at intervals along the second direction y. The second detection electrode 22 further comprises a plurality of second pads 222 which are located on the surface of the second conducting wire 221 away from the carrier 10 and are arranged at intervals along the second direction y. The first pads 212 are used to contact the first electrode of the LED chip, and the second pads 222 are used to contact the second electrode of the LED chip. In this way, the current can be conducted through the first conducting wire 211 and the second conducting wire 221, and the first pads 212 and the second pads 222 can be reliably and in position contacted with the LED chip, which is conducive to improving the reliability of the detection of the LED chip.
[0049] Exemplarily, the orthographic projection of the first pad 212 on the carrier 10 and the orthographic projection of the second pad 222 on the carrier 10 are both rectangular.
[0050] Optionally, the detection electrode layer 20 further comprises a third pad 25 and a fourth pad 26, the third pad 25 is located on the surface of the third conducting wire 23 away from the carrier 10, and the fourth pad 26 is located on the surface of the fourth conducting wire 24 away from the carrier 10. The third pad 25 is used to connect with the positive electrode of the power supply, and the fourth pad 26 is used to connect with the negative electrode of the power supply. In this way, the third pad 25 and the fourth pad 26 can be reliably and in position electrically connected with the external power supply.
[0051] Optionally, in the first direction x, the orthographic projection of the third pad 25 on the carrier 10 and the orthographic projection of the fourth pad 26 on the carrier 10 are located on the same side of the orthographic projections of the plurality of first detection electrodes 21 on the carrier 10 and on the same side of the orthographic projections of the plurality of second detection electrodes 22 on the carrier 10. In this way, the third pad 25 and the fourth pad 26 can be made to be relatively close, which is conducive to the electrical connection of the external power supply with the third pad 25 and the fourth pad 26, and is also conducive to reducing the size of the detection device of the LED chip.
[0052] Exemplarily, the orthographic projection of the third pad 25 on the carrier 10 and the orthographic projection of the fourth pad 26 on the carrier 10 are located on the right side of the orthographic projections of the plurality of first pads 212 on the carrier 10 and on the right side of the orthographic projections of the plurality of second pads 222 on the carrier 10. That is, the third pad 25 and the fourth pad 26 are both located at the right side edge of the detection device.
[0053] In other embodiments, the third pad 25 and the fourth pad 26 can also be both located at the left side edge of the detection device, etc.
[0054] Exemplarily, the third pad 25 is located on the surface of the second sub-portion 232 away from the carrier 10, and the fourth pad 26 is located on the surface of the fourth sub-portion 242 away from the carrier 10.
[0055] Exemplarily, the orthographic projection of the third pad 25 on the carrier 10 and the orthographic projection of the fourth pad 26 on the carrier 10 are both rectangular.
[0056] Optionally, the first conductive line 211, the second conductive line 221, the third conductive line 23 and the fourth conductive line 24 are in the same layer. The first pad 212, the second pad 222, the third pad 25 and the fourth pad 26 are in the same layer. Here, the same layer means being formed by the same patterning process, or being in contact with the same surface of the same film layer. In this way, the first conductive line 211, the second conductive line 221, the third conductive line 23 and the fourth conductive line 24 can be fabricated synchronously by the patterning process, and the first pad 212, the second pad 222, the third pad 25 and the fourth pad 26 can be fabricated synchronously, so as to simplify the process flow and improve the production efficiency of the detection device.
[0057] As shown in Figure 4 The detection device further comprises an adhesive layer 30, the adhesive layer 30 is located on the surface of the carrier 10, and at least part of the detection electrode layer 20 is exposed on the surface of the adhesive layer 30. The adhesive layer 30 has adhesion, and the connection between the adhesive layer 30 and the LED chip can reduce the probability of falling off of the detection device and the LED chip, thereby improving the reliability of the detection of the LED chip.
[0058] Optionally, the surface of the detection electrode layer 20 away from the carrier 10 is flush with the surface of the adhesive layer 30 away from the carrier 10, so as to reduce the probability of damage to the electrode of the LED chip by the detection electrode layer 20 during the detection process.
[0059] Exemplarily, the surface of the first pad 212, the surface of the second pad 222, the surface of the third pad 25 and the surface of the fourth pad 26 are all flush with the surface of the adhesive layer 30 away from the carrier 10.
[0060] In other embodiments, the first pad 212, the second pad 222, the third pad 25 and the fourth pad 26 can also protrude above the surface of the adhesive layer 30 away from the carrier 10, and the present disclosure does not limit this.
[0061] Figure 5 is a schematic diagram of a detection process of an LED chip provided by an embodiment of the present disclosure. As Figure 5As shown, the LED chip includes a light emitting structure 40, a first electrode 41 and a second electrode 42. The first electrode 41 and the second electrode 42 are respectively connected with semiconductor layers of different conductive types in the light emitting structure 40. When the LED chip is detected, the first electrode 41 can be connected with the first pad 212 and the second electrode 42 can be connected with the second pad 222 by means of alignment bonding, so that the first electrode 41 is in contact with the first pad 212 and the second electrode 42 is in contact with the second pad 222. Here, contact refers to physical contact between the separated electrodes and the pads, and connection can refer to fixing the separated electrodes and the pads as an integral structure or making the separated electrodes and the pads form physical contact.
[0062] Optionally, the adhesive layer 30 can be a PDMS layer, an epoxy resin layer or a polyurethane layer. The PDMS layer, the epoxy resin layer and the polyurethane layer all have good adhesion and will not damage the electrodes of the LED chip, and have a certain elasticity. When the LED chip is detected, pressure can be applied to the LED chip to reliably electrically connect the LED chip with the first pad 212 and the second pad 222 of the detection device, thereby reducing the probability of missed detection.
[0063] Figures 3 to 5 The detection device shown in Figure 1 and Figure 2 The difference between Figures 3 to 5 is that a pad and an adhesive layer 30 are arranged in Figure 1 and Figure 2 The detection device shown in the embodiment of the present disclosure can be provided with an adhesive layer on the basis of the detection device shown in
[0064] In the detection device shown in Figures 1 to 5 The carrier 10 is an integral carrier substrate.
[0065] Exemplarily, the carrier substrate can be an insulating substrate.
[0066] Exemplarily, the carrier substrate can be a rectangular substrate.
[0067] Figure 6 is another detection device for an LED chip provided by the embodiment of the present disclosure. Figure 7 is a cross-sectional structure schematic view at the CC line in Figure 6 Figure 6 and Figure 7 As shown, the carrier 10 comprises a plurality of first carriers 11 and a plurality of second carriers 12 which are alternately and intervally arranged along the first direction x, the first detection electrodes 21 are located on the surface of the first carriers 11, and the second detection electrodes 22 are located on the surface of the second carriers 12. In this way, according to the different sizes of the LED chips, the first carriers 11 and the second carriers 12 can be moved along the first direction x, so as to adjust the interval of the first detection electrodes 21 and the second detection electrodes 22, thereby making the detection device of the LED chip applicable to LED chips of different sizes, and improving the application range of the detection device.
[0068] Exemplarily, the first carrier 11 and the second carrier 12 are both conductive carriers. In this way, the first detection electrodes 21 on the first carrier 11 and the second detection electrodes 22 on the second carrier 12 can be electrically connected with the power supply through the first carrier 11 and the second carrier 12.
[0069] In other embodiments, the first carrier 11 and the second carrier 12 can also be both insulating carriers, and the first detection electrodes 21 and the second detection electrodes 22 are electrically connected with the external power supply by themselves, which is not limited in the present disclosure.
[0070] Exemplarily, the first carrier 11 and the second carrier 12 can both be cuboids.
[0071] In other embodiments, the first carrier 11 and the second carrier 12 can also be other irregular shapes. For example, the first carrier 11 and the second carrier 12 can be ring-shaped clamps, the clamps are connected with the movable instrument, the first detection electrodes 21 are clamped on the inner side of the ring-shaped first carrier 11, and the second detection electrodes 22 are clamped on the inner side of the ring-shaped second carrier 12.
[0072] Optionally, the first detection electrodes 21 comprise first wires 211, and the second detection electrodes 22 comprise second wires 221, and the specific structure can refer to Figure 1 and Figure 2 embodiments, the detailed description is omitted here.
[0073] Figure 6 and Figure 7 The detection device shown is different from Figure 1 and Figure 2 in that the carrier 10 is different, and Figure 6 and Figure 7 do not set the third wire and the fourth wire.
[0074] In other embodiments, the structure of the first detection electrodes 21 and the second detection electrodes 22 can also be set to be the same as Figure 6 and Figure 7 on the basis of the detection device shown. Figures 3 to 5The embodiment is the same structure. That is, the first detection electrode 21 further comprises a plurality of first pads, and the second detection electrode 22 further comprises a plurality of second pads. For details, please refer to Figures 3 to 5 In related embodiments, detailed descriptions are omitted here. Alternatively, the detailed descriptions can also be provided in Figure 6 and Figure 7 The detection device shown in the figure is based on the bonding layer. The bonding layer is located on the surface of the plurality of first carriers 11 and the surface of the plurality of second carriers 12. At least part of the detection electrode layer 20 is exposed to the surface of the bonding layer. The present disclosure does not limit this.
[0075] Figure 8 The present disclosure provides a preparation method flowchart of an LED chip detection device. As shown in the figure Figure 8 The preparation method comprises the following steps:
[0076] In step S1001, a carrier is provided.
[0077] In step S1002, a detection electrode layer is formed on the carrier.
[0078] The detection electrode layer comprises a plurality of first detection electrodes and a plurality of second detection electrodes arranged alternately and spaced apart in a first direction. The length direction of the first detection electrode and the second detection electrode is a second direction. The first direction and the second direction intersect. The plurality of first detection electrodes and the plurality of second detection electrodes are arranged in pairs. In any pair of first detection electrode and second detection electrode, the first detection electrode is used to be electrically connected with the positive electrode of the power supply and to contact the first electrode of at least one LED chip, and the second detection electrode is used to be electrically connected with the negative electrode of the power supply and to contact the second electrode of at least one LED chip.
[0079] Optionally, the step S1002 can comprise the following steps:
[0080] Firstly, first, second, third and fourth conductive lines are formed on the carrier.
[0081] Exemplarily, a photoresist structure can be obtained on the carrier substrate by photoresist coating, exposure, development and other processes. The first, second, third and fourth conductive lines are formed by physical vapor deposition (PVD) process and stripping process with the photoresist structure as a mask.
[0082] Secondly, first, second, third and fourth pads are respectively formed on the first, second, third and fourth conductive lines.
[0083] Exemplarily, the photoresist structure can be obtained on the first wire, the second wire, the third wire and the fourth wire through photoresist coating, exposure, development and the like processes, and the first pad, the second pad, the third pad and the fourth pad are respectively formed through PVD process and stripping process with the photoresist structure as a mask.
[0084] Through the above first step and the second step, the detection electrode layer can be formed on the carrier.
[0085] Optionally, after the step S1002 is completed, the preparation method can further include:
[0086] In step S1003, the adhesive layer is formed on the carrier.
[0087] Exemplarily, a layer of PDMS material can be formed on the carrier through spin coating or blade coating, a photoresist structure is obtained through photoresist coating, exposure, development and the like processes, and the adhesive layer is formed through ICP etching and the like methods on the PDMS material with the photoresist structure as a mask, and at least part of the detection electrode layer is exposed to the surface of the adhesive layer.
[0088] Optionally, the structure, shape, material and position of each layer are described in detail in the above embodiment. Figures 3 to 4 The related embodiments are omitted here.
[0089] The above description is not intended to limit the present disclosure in any form, although the present disclosure has been disclosed as above through the embodiments. However, any skilled person in the art can make some changes or modifications to the above disclosed technical content to form equivalent embodiments with equivalent changes without departing from the technical solution of the present disclosure. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present disclosure shall still fall within the scope of the technical solution of the present disclosure.
Claims
1. A detection device for a light-emitting diode chip, characterized in that, The detection electrode layer (20) comprises a plurality of first detection electrodes (21) and a plurality of second detection electrodes (22) arranged alternately and spaced apart in a first direction, the length direction of the first detection electrodes (21) and the second detection electrodes (22) is a second direction, and the first direction and the second direction intersect; The plurality of first detection electrodes (21) and the plurality of second detection electrodes (22) are arranged in pairs, in any pair of the first detection electrodes (21) and the second detection electrodes (22), the first detection electrode (21) is used for electrically connected with the positive electrode of the power supply and in contact with the first electrode of the at least one light-emitting diode chip, and the second detection electrode (22) is used for electrically connected with the negative electrode of the power supply and in contact with the second electrode of the at least one light-emitting diode chip. The first detection electrode (21) comprises a first wire (211), and the length direction of the first wire (211) is the second direction; 2. The detection device of claim 1, wherein, The second detection electrode (22) comprises a second wire (221), and the length direction of the second wire (221) is the second direction. The first detection electrode (21) further comprises a plurality of first pads (212), and the plurality of first pads (212) are arranged spaced apart along the second direction and away from the surface of the carrier (10); 3. The detection device of claim 2, wherein, The second detection electrode (22) further comprises a plurality of second pads (222), and the plurality of second pads (222) are arranged spaced apart along the second direction and away from the surface of the carrier (10); The first pad (212) is used for being in contact with the first electrode of the light-emitting diode chip, and the second pad (222) is used for being in contact with the second electrode of the light-emitting diode chip. The detection electrode layer (20) further comprises a third wire (23) and a fourth wire (24), 4. The detection device according to any one of claims 1 to 3, characterized in that The third wire (23) and the fourth wire (24) are arranged spaced apart in the second direction, the same end of the plurality of first detection electrodes (21) is connected with the third wire (23), and the same end of the plurality of second detection electrodes (22) is connected with the fourth wire (24). The third wire (23) comprises a first sub-portion (231) and a second sub-portion (232) connected with each other, the length direction of the first sub-portion (231) is the first direction, the length direction of the second sub-portion (232) is the second direction, and the same end of the plurality of first detection electrodes (21) is connected with the first sub-portion (231); 5. The detection device of claim 4, wherein, The fourth wire (24) comprises a third sub-portion (241) and a fourth sub-portion (242) connected with each other, the length direction of the third sub-portion (241) is the first direction, the length direction of the fourth sub-portion (242) is the second direction, and the same end of the plurality of second detection electrodes (22) is connected with the third sub-portion (241). 6. The detection device of claim 4, wherein, The detection electrode layer (20) further comprises a third pad (25) and a fourth pad (26), The third pad (25) is located on the surface of the third lead (23) away from the carrier (10), and the fourth pad (26) is located on the surface of the fourth lead (24) away from the carrier (10); The third pad (25) is used for being connected with the positive pole of a power supply, and the fourth pad (26) is used for being connected with the negative pole of the power supply.
7. The detection device of claim 6, wherein, In the first direction, the orthographic projection of the third pad (25) on the carrier (10) and the orthographic projection of the fourth pad (26) on the carrier (10) are located on the same side of the orthographic projection of the plurality of first detection electrodes (21) on the carrier (10) and on the same side of the orthographic projection of the plurality of second detection electrodes (22) on the carrier (10).
8. The detection device according to any one of claims 1 to 3, characterized in that The carrier (10) is a carrier substrate; or The carrier (10) comprises a plurality of first carriers (11) and a plurality of second carriers (12) which are alternately and spacedly arranged along the first direction and have adjustable intervals, the first detection electrodes (21) are located on the surface of the first carriers (11), and the second detection electrodes (22) are located on the surface of the second carriers (12).
9. The detection device according to any one of claims 1 to 3 and 5 to 7, characterized in that, The detection device further comprises an adhesive layer (30) located on the surface of the carrier (10), and at least part of the detection electrode layer (20) is exposed on the surface of the adhesive layer (30).
10. The detection device of claim 9, wherein, The adhesive layer (30) is a polydimethylsiloxane layer, an epoxy resin layer or a polyurethane layer.