Testing device for sensor chip

Abstract

The utility model discloses a testing device of a sensor chip, which comprises a plurality of single photoelectric sensing chip testing daughter boards, a HAST testing mother board, a HTOL testing mother board and a control board, the single photoelectric sensing chip testing daughter boards are detachably connected with the HAST testing mother board and the HTOL testing mother board, the HAST testing mother board and the HTOL testing mother board are detachably connected with the control board, and when the HAST testing is needed, the HAST testing mother board and the HTOL testing mother board are detachably connected with the control board. When an HTOL test needs to be carried out, only the corresponding single photoelectric sensing chip test daughter board and the HAST test mother board need to be assembled according to the model of the photoelectric sensing chip to be tested, and the HAST test mother board and the control board need to be assembled, and when the HTOL test needs to be carried out, only the corresponding single photoelectric sensing chip test daughter board and the HTOL test mother board need to be assembled according to the model of the photoelectric sensing chip to be tested, and then the HTOL test is carried out. The HTOL test mother board and the control board are assembled, when different chips are tested, only the single photoelectric sensing chip test daughter board needs to be replaced, so that the cost of the test device is greatly reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip test technical field, especially a kind of sensor chip's testing device. BACKGROUND

[0002] Sensor chip needs to be tested before leaving factory reliability, to improve test efficiency, testing device generally adopts integrated test mode, and sensor chip is tested from many aspects.Testing device of existing laser ranging chip, such as integrated test device for HAST (Highly Accelerated Stress Test, high acceleration stress test) test and HTOL (High Temperature Operating Life test, high temperature operating life test) test, needs to be customized for different chip models, and the cost is high.

[0003] There are two installation modes of welding and pin socket connection between the measured chip on the HAST test plate of the existing integrated test device and the chip test seat.Welding mode chip IO foot is pulled up and down according to HAST, and the on-board test chip monomer function and performance cannot be carried out, resulting in that the reliability test chip monomer failure can only be disassembled and then analyzed, and the disassembly process has the risk of damaging the chip on-site state;In pin socket mode, the sensor chip is physically pressed by pin and cover, and the pressing force has the risk of damaging the chip in long-time oven environment.

[0004] In addition, the existing test device needs to be connected to test machine for testing, and cannot run offline, therefore, the prior art still needs to be improved. UTILITY MODEL CONTENTS

[0005] In view of the above deficiencies of prior art, the purpose of the utility model is to provide sensor chip's testing device, to solve the problem of high cost of prior art sensor chip testing device.

[0006] To solve the above technical problems, the utility model adopts the following technical scheme:

[0007] A kind of sensor chip's testing device, it includes several single photoelectric sensor chip test sub-plate, HAST test mother plate, HTOL test mother plate, and the control board for controlling and monitoring the test state of HAST test mother plate and HTOL test mother plate, the single photoelectric sensor chip test sub-plate is detachably connected with HAST test mother plate and HTOL test mother plate, and the HAST test mother plate and HTOL test mother plate are detachably connected with control board.

[0008] The sensor chip testing device, the single photoelectric sensor chip testing sub-board is provided with a pin connector, the HAST test mother board and the HTOL test mother board are provided with a number of pin connectors greater than or equal to the number of single photoelectric sensor chip testing sub-boards, and the pin connector is plug-connected with the pin connector.

[0009] The sensor chip testing device, the control board is provided with a mother board connector, a power supply module, an MCU module, a current test module and a state indication module, the mother board connector is connected with the HAST test mother board and / or the HTOL test mother board through a wire, the power supply module supplies power to the HAST test mother board and / or the HTOL test mother board, the current test module is controlled by the MCU module to test the sensor chip on the single photoelectric sensor chip testing sub-board, the test state of the HAST test mother board and / or the HTOL test mother board is monitored, and the state indication module is controlled to indicate the test state.

[0010] The sensor chip testing device, the control board is further provided with an encoding module for encoding the single photoelectric sensor chip testing sub-board, and the encoding module is connected with the MCU module.

[0011] The sensor chip testing device, the state indication module includes a buzzer and a plurality of indicator lights, when the test state of the single photoelectric sensor chip testing sub-board is abnormal, the MCU module controls the state indication module to light the corresponding indicator light in a binary coding mode.

[0012] The sensor chip testing device, the HTOL test mother board is provided with a plurality of one-in-eight clock signal buffers, and each one-in-eight clock signal buffer is connected with eight single photoelectric sensor chip testing sub-boards; the control board is further provided with a clock module, and the clock module communicates with the one-in-eight clock signal buffer through the mother board connector.

[0013] The sensor chip testing device, the control board is further provided with a USB communication module for communicating with a testing machine, and the USB communication module is connected with the MCU module.

[0014] The sensor chip testing device, the pin of the pin connector is located on both sides of the single photoelectric sensor chip testing sub-board; a plurality of conductive parts electrically connected with the pins on both sides of the sensor chip are arranged on the single photoelectric sensor chip testing sub-board, and each conductive part is electrically connected with the pin of the pin connector.

[0015] The test device of the sensor chip, wherein the pins of the pin connector on one side are connected in series with resistors, the pins of the pin connector on the other side are left hanging; the connection terminals on one side of the pin connector of the HAST test motherboard are connected in series with pull-up resistors, the connection terminals on the other side of the pin connector of the HAST test motherboard are connected in series with pull-down resistors; and the connection terminals on the same row of the pin connector of the HAST test motherboard are short-circuited.

[0016] The test device of the sensor chip further comprises a temperature box, wherein a plurality of mounting positions for placing the single photoelectric sensor chip test sub-boards, the HAST test motherboards and the HTOL test motherboards are arranged on the temperature box, and the sidewall of the temperature box is provided with through holes for the passage of the wires.

[0017] Compared with the prior art, the test device of the sensor chip provided by the utility model, comprising a plurality of single photoelectric sensor chip test sub-boards, HAST test motherboards, HTOL test motherboards and a control board for controlling and monitoring the test states of the HAST test motherboards and the HTOL test motherboards, through detachable connection of the single photoelectric sensor chip test sub-boards with the HAST test motherboards and the HTOL test motherboards and detachable connection of the HAST test motherboards and the HTOL test motherboards with the control board, when HAST test is needed, only the corresponding single photoelectric sensor chip test sub-board and the HAST test motherboard need to be assembled according to the model of the photoelectric sensor chip to be tested, and the HAST test motherboard and the control board are assembled, when HTOL test is needed, only the corresponding single photoelectric sensor chip test sub-board and the HTOL test motherboard need to be assembled according to the model of the photoelectric sensor chip to be tested, and the HTOL test motherboard and the control board are assembled, the utility model only needs to replace the single photoelectric sensor chip test sub-board during test of different chips, without customizing the HAST test motherboard, the HTOL test motherboard and the control board according to different photoelectric sensor chips to be tested, so that the cost of the test device is greatly reduced. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 The block diagram of the test device of the sensor chip provided by the utility model.

[0019] Figure 2 The circuit diagram of the pin connector of the single photoelectric sensor chip test sub-board in the test device of the sensor chip provided by the utility model.

[0020] Figure 3 The circuit diagram of the pin connector of the HAST test motherboard in the test device of the sensor chip provided by the utility model.

[0021] Figure 4 The circuit diagram of the pin connector of the HTOL test motherboard in the test device of the sensor chip provided by the utility model.

[0022] Figure 5 The block diagram of the control board in the sensor chip testing device.

[0023] Figure 6 The communication schematic diagram of the HTOL test mother board and the control main board in the sensor chip testing device provided by the utility model.

[0024] Figure 7 The circuit diagram of the current test module in the sensor chip testing device provided by the utility model.

[0025] Explanation of reference signs

[0026] Single photoelectric sensor chip test subboard 1, HAST test mother board 2, HTOL test mother board 3, control board 4, test device 100, row pin connector J1, row female connector J2, J3, female board connector J4, power supply module 41, MCU module 42, current test module 43, state indication module 44, coding module 45, USB communication module 46, buzzer 47, indicator lamp LED, one-to-eight buffer 31, clock module 48, pull-up resistor RH, pull-down resistor RL, oven 50, current monitoring chip U1, first resistor R1, second resistor R2, third resistor R3, fourth resistor R4, capacitor C1 DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the utility model more clearly and clearly, the utility model is further described in detail below by combining with the drawings and examples. It should be understood that the specific examples described here are only used to explain the utility model, and are not used to limit the utility model.

[0028] The packaging structure of the photoelectric chip provided by the utility model can be used on a laser radar detection module, the light receiving / emitting module of the chip is separated by setting the light shielding body between different modules, so that the effect of resisting light crosstalk is realized, the process flow is greatly simplified, and the process difficulty and production cost are also relatively reduced.

[0029] The test device of the sensor chip provided by the utility model is mainly used for HAST test and TOL test of photoelectric sensors, please refer to Figure 1 The test device 100 provided by the utility model comprises a plurality of single photoelectric sensor chip test subboards 1, a HAST test mother board 2, an HTOL test mother board 3 and a control board 4 used for controlling and monitoring the test state of the HAST test mother board 2 and the HTOL test mother board 3.

[0030] The single photoelectric sensing chip test subboard 1 is detachably connected with the HAST test motherboard 2 and the HTOL test motherboard 3, the HAST test motherboard 2 and the HTOL test motherboard 3 are detachably connected with the control board 4, when the HAST test is carried out, the single photoelectric sensing chip test subboard 1 is only connected with the HAST test motherboard 2, and then the HAST test motherboard 2 is connected with the control board 4, when the HTOL test is carried out, the single photoelectric sensing chip test subboard 1 is only connected with the HTOL test motherboard 3, and then the HTOL test motherboard 3 is connected with the control board 4, so that the HAST test and the HTOL test can be respectively completed.

[0031] Of course, in other embodiments, the HAST test and the HTOL test of the to-be-tested photoelectric sensing chip can be simultaneously carried out, after the first connection of the subboards and the motherboards, the HAST test and the HTOL test of part of the to-be-tested photoelectric sensing chip can be carried out, then the single photoelectric sensing chip test subboard 1 on the HAST test motherboard 2 and the HTOL test motherboard 3 is adjusted and tested, so that the HAST test and the HTOL test of all to-be-tested photoelectric sensing chips can be completed by only operating twice, and the operation is simple and the test efficiency is high.

[0032] The single photoelectric sensing chip test subboard 1 is detachably connected with the HAST test motherboard 2 and the HTOL test motherboard 3, the HAST test motherboard 2 and the HTOL test motherboard 3 are detachably connected with the control board 4, when the HAST test is carried out, the single photoelectric sensing chip test subboard 1 is only connected with the HAST test motherboard 2, and then the HAST test motherboard 2 is connected with the control board 4, when the HTOL test is carried out, the single photoelectric sensing chip test subboard 1 is only connected with the HTOL test motherboard 3, and then the HTOL test motherboard 3 is connected with the control board 4, so that the HAST test and the HTOL test can be respectively completed.

[0033] Please refer to Figures 2 to 4In an optional embodiment, taking the single optoelectronic sensor chip as an example, the single optoelectronic sensor chip test subboard 1 is provided with a pin connector J1, the HAST test motherboard 2 and the HTOL test motherboard 3 are provided with a number of female connector J2, J3 which is greater than or equal to the number of the single optoelectronic sensor chip test subboard 1 (it is assumed that the female connector on the HAST test motherboard 2 is J2 and the female connector on the HTOL test motherboard 3 is J3), and the pin connector J1 is plug-connected with the female connector J2, J3, which is reliable in connection mode, and compared with the existing welding and socket mode, the installation and dismounting mode of the utility model is more convenient, solves the problem that the existing tested chip needs to be disassembled to retest the function and performance of the chip, and the utility model will not damage the tested sensor chip.

[0034] In an optional embodiment, the pins of the pin connector J1 are located on both sides of the single optoelectronic sensor chip test subboard 1, so as to facilitate the plug connection with the female connector J2, J3. The single optoelectronic sensor chip test subboard 1 is provided with a plurality of conductive parts (such as copper exposed areas, not shown in the figure) which are electrically connected with the pins of the sensor chip on both sides. Each conductive part is electrically connected with the pin of the pin connector J1. The pins of the tested optoelectronic sensor chip only need to be placed at the conductive part to realize the electrical connection between the tested optoelectronic sensor chip and the corresponding pin of the pin connector J1, and the installation and dismounting mode is simple.

[0035] The pins on one side of the pin connector J1 are connected in series with resistors, and the pins on the other side of the pin connector J1 are suspended (such as Figure 2 In this embodiment, resistors can be selected and attached on one side of the pin connector J1 according to needs, and the other side is not attached, so that the single optoelectronic sensor chip test subboard 1 can pull out the signal pins of the tested optoelectronic sensor chip to the terminals of the pin connector J1, and connect the pin connector J1 with the female connector J2 or J3 of the HAST test motherboard 2 or the HTOL test motherboard through the pin connector J1. When retesting the function of the tested optoelectronic sensor chip, only need to pull the pin connector J1 of the single optoelectronic sensor chip test subboard 1 from the female connector J2 or J3, and then connect an external test board to test the performance.

[0036] As shown in the figure, when the IO pins of the tested optoelectronic sensor chip are tested by HAST, the IO port is pulled up or pulled down according to the IO characteristics and ordering of the tested optoelectronic sensor chip. If the IO pins of the pin connector J1 need to be pulled down, the resistors on the L side of the pin connector J1 are welded and the resistors on the H side are not attached. Figure 2 If the IO pins of the tested optoelectronic sensor chip need to be pulled up when doing HAST test, the resistors on the H side of the pin connector J1 are welded and the resistors on the L side are not attached. Figure 2 Figure 2 Figure 2 Figure 2 ​​​The resistance on the L side. During HTOL testing, because the L-side and H-side networks on the same row of the HTOL motherboard are connected together (e.g., Figure 4 (as shown), Figure 2 The IO pins of the J1 center row connector automatically select the L-side or H-side path.

[0037] A pull-up resistor RH is connected in series to the connection terminal on one side of the female connector J2 of the HAST test motherboard 2. The pull-up resistor RH is connected to the VCC power supply terminal to pull up the terminal on the right side of the female connector J2. A pull-down resistor RL is connected in series to the connection terminal on the other side of the female connector J2 of the HAST test motherboard 2 and is grounded through the pull-down resistor RL to pull down the terminal on the left side of the female connector J2.

[0038] When performing HAST testing, if it is necessary to pull the IO pin of pin header connector J1 low, select the resistor on the L side of pin header connector J1 for soldering, leave the resistor on the right side unused, and make... Figure 2 Pin header connector J1 and Figure 3 When the female connector J2 is inserted, the pull-down resistor RL of the female connector J4 pulls down the IO pin of the pin header connector J1. When it is necessary to pull up the IO pin of the pin header connector J1, the soldered resistor on the right side of the pin header connector J1 is left unattached, and the resistor on the left side is left unattached. Figure 2 Pin header connector J1 and Figure 3 When the female connector J2 is inserted, the pull-up resistor RH of the female connector J4 pulls up the IO pin of the pin header connector J1.

[0039] In one embodiment, the pin header connector J3 of the HTOL test motherboard 3 is short-circuited at the same row of connection terminals before being connected to the control board 4, as shown below. Figure 4 As shown, pins 1 and 2 of the female connector J3 on the HTOL test motherboard 3 are shorted together, pins 3 and 4 are shorted together, pins 5 and 6 are shorted together…

[0040] When performing HTOL testing, Figure 2 The pin header connector J1 shown is connected to Figure 4 After the HTOL female connector J3 is installed, all I / O networks in the same row will be connected together through the HTOL test motherboard 3 and then externally connected to the control board 4. Therefore, regardless of whether the high-level side 0-ohm resistor or the low-level side 0-ohm resistor is selected on the single photoelectric sensor chip test daughterboard 1, after plugging it into the HTOL test motherboard 3, the lines will converge and short-circuit on the HTOL test motherboard 3. Thus, the single photoelectric sensor chip test daughterboard 1 can be used in both the HAST test and the HTOL test, solving the problem that the test daughterboards for the same sensor chip cannot be used in different test items of HAST and HTOL.

[0041] Please continue reading.Figure 1 The testing device 100 further comprises a temperature box 50, wherein a plurality of mounting positions (not shown in the figure) for placing the single photoelectric sensor chip testing sub-plate 1, the HAST testing mother plate 2 and the HTOL testing mother plate 3 are arranged on the temperature box 50, so that the single photoelectric sensor chip testing sub-plate 1, the HAST testing mother plate 2 and the HTOL testing mother plate 3 can be placed at the designated positions of the temperature box 50, and the single photoelectric sensor chip testing sub-plate 1 with problems can be found out when the testing fails, and a through hole (not shown in the figure) for passing the wire is arranged on the side wall of the temperature box 50.

[0042] Optionally, the temperature of the temperature box 50 is -45℃-125℃, and the HAST testing and the HTOL testing of the photoelectric sensor chip to be tested are simulated under the extreme environmental temperature condition by the temperature box 50. Further, the temperature box 50 is further provided with a heat preservation layer on the outside, so that the temperature is constant when the HAST testing and the HTOL testing are performed, the temperature requirement is ensured, and the electric energy is saved.

[0043] Please refer to Figure 5 The control board 4 is provided with a mother plate connector J4, a power supply module 41, an MCU module 42, a current testing module 43 and a state indicating module 44, the mother plate connector J4 is connected with the HAST testing mother plate 2 and / or the HTOL testing mother plate 3 through the wire, the power supply module 41 supplies power to the HAST testing mother plate 2 and / or the HTOL testing mother plate 3 through the wire, the MCU module 42 comprises an MCU chip, the type of the MCU chip can be selected according to the type of the sensor chip to be tested and the testing item, which is the prior art and is not the protection point of the utility model, and will not be described in detail here.

[0044] The HAST testing mother plate 2 and the HTOL testing mother plate 3 are also provided with mother plate connectors J41' and J42', the mother plate connectors J41' and J42' on the testing mother plate are connected with the mother plate connector J4 on the control board 4 through the wire, and the testing mother plate is powered and controlled by the control board 4. During the testing, the MCU module 42 controls the current testing module 43 to perform the current testing on the photoelectric sensor chip on the single photoelectric sensor chip testing sub-plate 1, simultaneously monitors the testing state of the HAST testing mother plate 2 and / or the HTOL testing mother plate 3, and controls the state indicating module 44 to indicate the testing state, and the state indicating module 44 can also output an alarm signal when the testing is abnormal.

[0045] In an optional embodiment, the control board 4 is further provided with an encoding module 45 for encoding the single photoelectric sensor chip testing sub-plate 1, the encoding module 45 is connected with the MCU module 42, and is used for encoding and distinguishing when a plurality of single photoelectric sensor chip testing sub-plates 1 are connected with the control board 4, so as to facilitate the corresponding indication of the state indicating module 44.

[0046] The control board 4 is further provided with a USB communication module 46 for communication with a test machine, which is connected with the MCU module 42 and connected with an external PC test machine through a USB data line for feeding back test data to the PC test machine and receiving test instructions sent by the PC test machine to realize network test, and when the PC test machine is not connected, the control board 4 is used for offline test.

[0047] The state indication module 44 includes a buzzer 47 and a plurality of indicator lights LED, when the single photoelectric sensor chip test sub-board 1 is abnormal in test state, the MCU module 42 controls the state indication module 44 to make the corresponding indicator light LED light up in binary coding mode.

[0048] Optionally, the single photoelectric sensor chip test sub-board 1 can be 40 pieces, when the HAST test mother board 2 is tested, 40 sensor chips can be tested at a time, the indicator light LED can be 7 pieces, through 2^7 coding, the position of 40 chips is realized, for example, when the current of the 5th chip is too large, the 7 indicator lights LED light up in the form of 0000101 (i.e. the right side 1st, 3rd light up, and the other LED does not light up), and the buzzer 47 is controlled to sound to remind the tester.

[0049] Of course, the HAST test mother board 2 and the HTOL test mother board 3 can share one control board 4, or each can be connected with one control board 4. When sharing one control board 4, the mother board connector J4, the power supply module 41, the MCU module 42, the current test module 43 and the state indication module 44 can be provided with two groups, which can realize simultaneous test and state indication of the HAST test mother board 2 and the HTOL test mother board 3, and solve the problem that the existing HTOL reliability test cannot run offline and needs to be connected with the PC test machine without interruption.

[0050] Please refer to Figure 6 , the HTOL test mother board 3 is provided with a plurality of one-in-eight buffer 31, each one-in-eight buffer 31 is connected with eight single photoelectric sensor chip test sub-boards 1; the control board 4 is further provided with a clock module 48, which communicates with the one-in-eight buffer 31 through the mother board connector J4. Taking 40 single photoelectric sensor chip test sub-boards 1 as an example, the HTOL test mother board 3 is provided with 40 HTOL test mother boards 3, and the one-in-eight buffer 31 is 5, so that the clock signal output by the clock module 48 on the control board 4 is divided by eight to the corresponding measured sensor chip on the HTOL test mother board 3.

[0051] Please refer to Figure 7In the testing device 100 of the sensor chip, the current test module 43 comprises: a current monitoring chip U1, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, and a capacitor C1, the IN+ pin of the current monitoring chip U1 is connected with the first pin of the motherboard connector J4 and one end of the capacitor C1, and also connected with the other end of the capacitor C1 through the first resistor R1 and the other end of the second resistor R2, the other end of the second resistor R2 is connected with the fifth pin of the motherboard connector J4, the SDA pin and the SCL pin of the current monitoring chip U1 are connected with the MCU module 42, and also connected with the VCC_3.6V power supply end through the third resistor R3 and the fourth resistor R4 respectively, for communicating with the MCU chip through the I2C bus, and ensuring that the I2C bus is at a high level when idle.

[0052] The current monitoring chip U1 can adopt an integrated chip with the model INA226, which is a high-precision current / power monitor, the first resistor R1 is used for current monitoring, which can convert the current into voltage for the current monitoring chip U1 to read, and the voltage and the resistance value of the first resistor R1 can be used to judge whether the current of the measured sensor is abnormal. The capacitor C1 is a power decoupling capacitor, which reduces the influence of power noise on the current monitoring chip U1, thereby realizing the monitoring of the test current of the single photoelectric sensor chip.

[0053] In conclusion, the testing device provided by the utility model needs to replace only the single photoelectric sensing chip test subboard when testing different sensor chips, without the need to customize the HAST test motherboard, the HTOL test motherboard and the control panel according to different photoelectric sensing chips to be tested, so that the cost of the testing device is greatly reduced. Meanwhile, the control panel independently controls and intelligently judges the running state of the sensor chip reliability test, can also monitor the sensor chip current and running state offline in real time, and improves the intelligent degree of the testing device.

[0054] Moreover, the single photoelectric sensing chip test subboard required by the HAST test and the HTOL test can be shared, further saving the cost of the testing device.

[0055] In addition, the testing device of the utility model adopts modular design, flexible disassembly and assembly, different test items are selected according to needs, cost is reduced and efficiency is improved, and the reduced modules reduce the storage space of the testing device in the sensor chip test project.

[0056] It can be understood that, for ordinary skilled persons in the art, equivalent replacement or change can be made according to the technical scheme and the utility model concept of the utility model, and all these changes or replacements shall belong to the protection scope of the claims attached to the utility model.

Claims

1. A testing apparatus for a sensor chip, characterized by, The application relates to a single photoelectric sensor chip test subboard, a HAST test motherboard, an HTOL test motherboard and a control board for controlling and monitoring the test states of the HAST test motherboard and the HTOL test motherboard.

2. The test apparatus for a sensor chip according to claim 1, wherein The single photoelectric sensor chip test subboard is detachably connected with the HAST test motherboard and the HTOL test motherboard, and the HAST test motherboard and the HTOL test motherboard are detachably connected with the control board.

3. The test apparatus for a sensor chip according to claim 1 or 2, wherein The control board is provided with a motherboard connector, a power supply module, an MCU module, a current test module and a state indication module, the motherboard connector is connected with the HAST test motherboard and / or the HTOL test motherboard through a cable, the power supply module supplies power for the HAST test motherboard and / or the HTOL test motherboard, the current test module is controlled by the MCU module to test the sensor chip on the single photoelectric sensor chip test subboard, the test state of the HAST test motherboard and / or the HTOL test motherboard is monitored, and the state indication module is controlled to indicate the test state.

4. The test apparatus for a sensor chip according to claim 3, wherein The control board is also provided with an encoding module for encoding the single photoelectric sensor chip test subboard, and the encoding module is connected with the MCU module.

5. The test apparatus for a sensor chip according to claim 3, wherein The state indication module comprises a buzzer and a plurality of indicator lamps, when the test state of the single photoelectric sensor chip test subboard is abnormal, the MCU module controls the state indication module to light the corresponding indicator lamp in a binary coding mode.

6. The test apparatus for a sensor chip according to claim 3, wherein The HTOL test motherboard is provided with a plurality of one-in-eight clock signal buffers, and each one-in-eight clock signal buffer is connected with eight single photoelectric sensor chip test subboards; the control board is also provided with a clock module, and the clock module communicates with the one-in-eight clock signal buffer through the motherboard connector.

7. The test apparatus for the sensor chip according to claim 3, wherein The control board is also provided with a USB communication module for communicating with a test machine, and the USB communication module is connected with the MCU module.

8. The test apparatus for the sensor chip according to claim 2, wherein The pins of the pin connector are located on both sides of the single photoelectric sensor chip test subboard; the single photoelectric sensor chip test subboard is provided with a plurality of conductive parts which are electrically connected with the pins on both sides of the sensor chip, and the conductive parts are electrically connected with the pins of the pin connector.

9. The test apparatus for a sensor chip according to claim 8, wherein The pins on one side of the pin connector are connected in series with resistors, and the pins on the other side of the pin connector are suspended; the connection terminals on one side of the female connector of the HAST test motherboard are connected in series with pull-up resistors, the connection terminals on the other side of the female connector of the HAST test motherboard are connected in series with pull-down resistors, and the connection terminals in the same row of the female connector of the HAST test motherboard are short-circuited.

10. The test apparatus for the sensor chip according to claim 3, wherein The application also relates to a temperature box, and the temperature box is provided with a plurality of mounting positions for placing the single photoelectric sensor chip test subboard, the HAST test motherboard and the HTOL test motherboard; the side wall of the temperature box is provided with through holes for the cable to pass through.

Images