Chip cooling radiator for microcomputer mainboard

Abstract

The utility model provides a chip cooling radiator for a microcomputer mainboard. The chip cooling radiator comprises a radiating bottom plate and a water pump assembly, the water pump assembly comprises a water pump shell, the lower end face of the water pump shell is connected with the heat dissipation bottom plate in a sealed mode, a cooling liquid cavity connected with the heat dissipation bottom plate is formed in the water pump shell, and a first water inlet connector communicated with the cooling liquid cavity is arranged on one side of the water pump shell. A second water inlet connector and a water outlet connector which are communicated with the cooling liquid cavity are arranged on the other side of the water pump shell, the second water inlet connector is provided with an electromagnetic valve, and a circulating water pump core is arranged in the cooling liquid cavity. The water pump assembly and the water cooling head are integrally designed, complex pipeline connection in a traditional water cooling heat dissipation system is reduced, and therefore the risk of liquid leakage is reduced. In addition, a second water inlet connector in the water pump assembly is provided with an electromagnetic valve, the flow of the cooling liquid is automatically adjusted according to the heat dissipation requirement, and the heat dissipation efficiency and the energy-saving effect are further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radiator, concretely relates to a chip cooling radiator for microcomputer mainboard. BACKGROUND

[0002] Microcomputer works will produce a large amount of heat, in order to effectively dissipate heat, usually need to adopt radiator to transfer working heat. Compared with air-cooled heat dissipation, water-cooled heat dissipation has the advantages of high heat dissipation efficiency, low noise etc. However, the traditional water-cooled heat dissipation system structure is complex, inconvenient to install, and the cost is higher, which limits its wide application in the field of microcomputer. The original microcomputer water-cooled structure of our company contains water pump and water-cooled head, the two mechanisms are separated, and the water pump and water-cooled head are connected through the radiator pipeline in the middle, too many connecting pipelines will increase the risk of liquid leakage, and the pipe joint and connecting pipe should be reduced as much as possible. SUMMARY

[0003] The utility model provides a kind of chip cooling radiator for microcomputer mainboard, microcomputer contains mainboard, chip is installed on mainboard, and radiator mounting interface located in the periphery of chip is reserved on mainboard, chip cooling radiator contains heat dissipation bottom plate and the water pump assembly sealedly connected with heat dissipation bottom plate;

[0004] The material of heat dissipation bottom plate is metal and can be detachably connected with the mainboard.

[0005] The water pump assembly comprises an integrally formed water pump housing, the lower end surface of the water pump housing is sealedly connected with the heat dissipation bottom plate, a cooling liquid cavity connected with the heat dissipation bottom plate is arranged in the water pump housing, a first water inlet connector in communication with the cooling liquid cavity is arranged on one side of the water pump housing, and a second water inlet connector and a water outlet connector in communication with the cooling liquid cavity are arranged on the other side of the water pump housing, the second water inlet connector is provided with an electromagnetic valve, and a circulating water pump core is arranged in the cooling liquid cavity.

[0006] Further, the water pump assembly further comprises an upper cover, and the upper cover is arranged outside the water pump housing through a buckle cover.

[0007] Further, the lower end surface of the water pump housing is provided with a rubber sealing ring arranged around the cooling liquid cavity.

[0008] Further, a water separation plate is arranged in the cooling liquid cavity, and the water separation plate is located between the circulating water pump core and the lower end surface of the water pump housing.

[0009] Further, the water storage device is connected with the first water inlet connector, the second water inlet connector and the water outlet connector through plug-in connectors, a limiting step is arranged in the first water inlet connector, the second water inlet connector and the water outlet connector, and the end of the plug-in connector is in contact with the limiting step.

[0010] Further, the first water inlet joint, the second water inlet joint and the water outlet joint are internally provided with a second sealing ring groove, and an O-ring is installed in the second sealing ring groove.

[0011] Further, the first water inlet joint, the second water inlet joint and the water outlet joint are internally provided with a second sealing ring groove, and an O-ring is installed in the second sealing ring groove.

[0012] A plurality of counterbores are arranged on the lower end surface of the water pump housing and penetrate into the clamp groove, and the fastening screw is threadedly connected with the clamp and the insertion pipe joint, so as to fixedly connect the insertion pipe joint with the water pump housing.

[0013] The water pump assembly and the water cooling head are designed in an integrated manner, the complex pipeline connection in the traditional water cooling heat dissipation system is reduced, the liquid leakage risk is reduced, and the reliability of the system is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor under the premise of the drawings.

[0015] Figure 1 It is an exploded view of the chip cooling radiator for the microcomputer mainboard of the present application;

[0016] Figure 2 It is an outline drawing of the chip cooling radiator of the present application;

[0017] Figure 3 It is an outline drawing of the chip cooling radiator of the present application;

[0018] Figure 4 It is a schematic diagram of the integrally formed water pump housing;

[0019] Figure 5 It is a lower end surface view of the water pump housing;

[0020] Figure 6 It is a schematic diagram of the water pump housing. DETAILED DESCRIPTION

[0021] In the following description, a large number of specific details are given to provide a more thorough understanding of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced without one or more of these specific details. In other instances, well-known features have not been described in detail to avoid obscuring the present application.

[0022] In order to thoroughly understand the present application, detailed steps and detailed structures will be proposed in the following description in order to explain the technical scheme of the present application. The preferred embodiments of the present application are described in detail as follows, however, in addition to these detailed descriptions, the present application can also have other implementation manners.

[0023] The present application provides a chip cooling radiator for a microcomputer mainboard, the microcomputer comprising a mainboard, the mainboard being provided with a chip, the mainboard being provided with a radiator mounting interface located at the periphery of the chip, the chip cooling radiator comprising a heat dissipation bottom plate 100 and a water pump assembly 200 in sealing connection with the heat dissipation bottom plate 100.

[0024] The heat dissipation bottom plate 100 is made of metal and is detachably connected with the mainboard.

[0025] The water pump assembly 200 comprises an integrally formed water pump housing 210, the lower end surface of the water pump housing 210 being in sealing connection with the heat dissipation bottom plate 100, the water pump housing 210 being provided with a cooling liquid cavity 211 connected with the heat dissipation bottom plate 100, one side of the water pump housing 210 being provided with a first water inlet connector 212 in communication with the cooling liquid cavity 211, and the other side of the water pump housing 210 being provided with a second water inlet connector 213 and a water outlet connector 214 in communication with the cooling liquid cavity 211, the second water inlet connector 213 being provided with an electromagnetic valve, and a circulating water pump core 220 being arranged in the cooling liquid cavity 211.

[0026] The chip cooling radiator provided by the present application combines the water pump and the water cooling head into one whole, compared with the separate design of the water pump and the water cooling head in the prior art, the present application can omit the pipeline connected between the water pump and the water cooling head. In addition, the radiator has two water inlets and one water outlet, one end has a first water inlet and a water outlet, and the other end has a second water inlet, the first water inlet on the same side as the water outlet is provided with an electromagnetic valve, the opening and closing of the first water inlet can be controlled through the electromagnetic valve, when the heat of the chip is too high, the electromagnetic valve can be opened, two-way delivery of the cooling liquid is realized, and the water pump speed is simultaneously increased, and then the heat dissipation effect is improved.

[0027] In an optional embodiment, the water pump assembly 200 further comprises an upper cover 230, the upper cover 230 being arranged outside the water pump housing 210 through a buckle cover.

[0028] In an optional embodiment, the lower end surface of the water pump housing 210 is provided with a rubber sealing ring 240 arranged around the periphery of the cooling liquid cavity 211, and a corresponding sealing ring groove 101 is arranged on the heat dissipation base plate 100 for accommodating the rubber sealing ring 240.

[0029] In an optional embodiment, a water baffle 217 is arranged in the cooling liquid cavity 211, between the circulating water pump core 220 and the lower end surface of the water pump housing 210.

[0030] In an optional embodiment, the water reservoir is connected to the first water inlet connector 212, the second water inlet connector 213 and the water outlet connector 214 through plug-in connectors (not shown in the figure). As shown in the figure, a limiting step 218 is arranged inside the first water inlet connector 212, the second water inlet connector 213 and the water outlet connector 214. When the plug-in connector of the water reservoir is inserted, the plug-in connector is inserted to the position where it is in contact with the limiting step 218, thereby achieving quick positioning. In addition, a second sealing ring groove 219 is arranged inside the first water inlet connector 212, the second water inlet connector 213 and the water outlet connector 214, and an O-ring is arranged in the second sealing ring groove 219, so as to ensure the sealing performance of the connection between the plug-in connector and the first water inlet connector 212, the second water inlet connector 213 and the water outlet connector 214. Figure 6

[0031] In an optional embodiment, as shown in the figure, the top of the first water inlet connector 212, the second water inlet connector 213 and the water outlet connector 214 is provided with a clamp groove 216, and a clamp with a threaded hole is arranged in the clamp groove 216. A plurality of counterbores 215 are arranged on the lower end surface of the water pump housing 210, and the counterbores 215 are respectively penetrated into the clamp grooves. A fastening screw is screwed through the counterbores 215 and the plug-in connector, and is screwed with the clamp, so as to fixedly connect the plug-in connector and the water pump housing 210 together. Figures 3-5

[0032] The utility model has the advantages of:

[0033] 1. Simplified structure: by integrating the water pump assembly and the water cooling head, the complex pipeline connection in the traditional water cooling heat dissipation system is reduced, thereby reducing the risk of liquid leakage and improving the reliability of the system.

[0034] 2. Convenient installation: the integrated water pump housing design makes the installation process of the radiator more convenient and fast.

[0035] 3. Solenoid valve control: the second water inlet connector in the water pump assembly is provided with a solenoid valve, so that the radiator can have one-way water inlet or two-way water inlet, and the flow of the cooling liquid can be automatically adjusted according to the heat dissipation requirement, thereby further improving the heat dissipation efficiency and energy saving effect.

[0036] ​​4. Good sealing performance: the sealing design between the water pump housing and the heat dissipation bottom plate, as well as the O-ring sealing at the joint of the water reservoir, ensures the sealing of the entire heat dissipation system, effectively preventing the leakage of cooling liquid.

[0037] 5. Quick positioning: the limiting step design of the cannula joint and the water inlet joint and the water outlet joint enables quick positioning of the cannula joint during insertion, ensuring the accuracy and convenience of connection.

[0038] In summary, the chip cooling radiator of the present application has significant advantages in terms of heat dissipation efficiency, structural design, installation convenience, cost control, electromagnetic valve control, sealing performance, and quick positioning, providing an efficient, reliable, and economical solution to the heat dissipation problem of microcomputers.

[0039] The preferred embodiments of the present application have been described above. It should be understood that the present application is not limited to the specific implementation described above, and that devices and structures not fully described should be understood as implemented in a conventional manner in the art; any person skilled in the art, without departing from the scope of the technical solutions of the present application, can make many possible changes and modifications to the technical solutions of the present application using the disclosed methods and technical content, or modify equivalent embodiments, which do not affect the essential content of the present application. Therefore, any simple modification, equivalent change and modification of the above embodiments made in accordance with the technical essence of the present application, without departing from the scope of the technical solutions of the present application, still belongs to the scope of protection of the technical solutions of the present application.

Claims

1. A chip cooling heat sink for a microcomputer mainboard, said microcomputer comprising a mainboard on which a chip is mounted, and a heat sink mounting interface being reserved on said mainboard at the periphery of said chip, characterized in that, The chip cooling radiator comprises a heat dissipation base plate (100) and a water pump assembly (200) sealingly connected with the heat dissipation base plate (100); The heat dissipation base plate (100) is made of metal and detachably connected with the main plate; The water pump assembly (200) comprises an integrally formed water pump housing (210), the lower end surface of the water pump housing (210) is sealingly connected with the heat dissipation base plate (100), the water pump housing (210) is provided with a cooling liquid cavity (211) connected with the heat dissipation base plate (100), one side of the water pump housing (210) is provided with a first water inlet connector (212) in communication with the cooling liquid cavity (211), and the other side of the water pump housing (210) is provided with a second water inlet connector (213) and a water outlet connector (214) in communication with the cooling liquid cavity (211), the second water inlet connector (213) is provided with an electromagnetic valve, and a circulating water pump core (220) is arranged in the cooling liquid cavity (211).

2. A chip cooling heat spreader for a microcomputer motherboard as defined in claim 1, wherein, The water pump assembly (200) further comprises an upper cover (230) arranged outside the water pump housing (210) through a buckle cover.

3. A chip cooling heat spreader for a microcomputer motherboard as defined in claim 1, wherein, The lower end surface of the water pump housing (210) is provided with a rubber sealing ring (240) arranged around the periphery of the cooling liquid cavity (211).

4. A chip cooling heat spreader for a microcomputer motherboard as defined in claim 1, wherein, A water baffle (217) is arranged in the cooling liquid cavity (211), and the water baffle (217) is located between the circulating water pump core (220) and the lower end surface of the water pump housing (210).

5. A chip cooling heat spreader for a microcomputer motherboard as defined in claim 1, wherein, A water storage device is connected with the first water inlet connector (212), the second water inlet connector (213) and the water outlet connector (214) through a pipe connector, and a limiting step (218) is arranged in the first water inlet connector (212), the second water inlet connector (213) and the water outlet connector (214).

6. A chip cooling heat spreader for a microcomputer motherboard as claimed in claim 5, wherein, Second sealing ring grooves (219) are arranged in the first water inlet connector (212), the second water inlet connector (213) and the water outlet connector (214), and O-rings are arranged in the second sealing ring grooves (219).

7. A chip cooling heat spreader for a microcomputer motherboard as defined in claim 6, wherein, The top of the first water inlet connector (212), the second water inlet connector (213) and the water outlet connector (214) is provided with a clamp groove (216) provided with a clamp with a threaded hole, A plurality of counterbores (215) penetrating the clamp grooves are arranged on the lower end surface of the water pump housing (210), and fastening screws penetrate the counterbores (215) and are threadedly connected with the pipe connector and the clamp to fixedly connect the pipe connector with the water pump housing (210).

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