Moisture-proof resistor

Abstract

The utility model provides a moisture-proof resistor. The moisture-proof resistor comprises a substrate, a pair of back electrodes, a pair of front electrodes, a resistive layer, a protective layer and side electrodes, through the first protection layer made of the glass material and the second protection layer made of the epoxy resin material, the resistor has a multi-layer protection structure, water vapor permeation is effectively prevented, the stability and reliability of the resistor in a humid environment are improved, the first protection layer made of the glass material is moisture-proof, excellent mechanical protection is provided, external impact and pressure can be resisted, and the service life of the resistor is prolonged. The resistor is kept complete and stable under severe conditions, the second protection layer made of epoxy resin has good electrical insulation performance, the risk that the resistor fails due to electric leakage or short circuit is avoided, the stability of electrical performance is ensured, the resistor can resist erosion of environmental factors for a long time due to the double-layer protection structure, and the service life of the resistor is prolonged. And performance degradation caused by external environment change is reduced, so that the service life of the product is greatly prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of resistor, specifically, relates to a moistureproof resistor. BACKGROUND

[0002] The ordinary resistor on the market, when working in high humidity environment, moisture penetration can cause internal material oxidation, conductivity change, insulation performance decline, life shortening or even failure, which seriously affects the electrical performance and service life of the device. Therefore, there is an urgent need to design a new type of resistor suitable for use in humid and other harsh environments. SUMMARY

[0003] Therefore, the utility model aims at providing a moistureproof resistor to solve the above problems.

[0004] The utility model adopts the following scheme:

[0005] The application provides a moistureproof resistor, which comprises a substrate, a pair of back electrodes, a pair of front electrodes, a resistance layer, a protective layer and side electrodes; the pair of back electrodes are formed on the lower surface of the substrate and are separated from each other; the pair of front electrodes are formed on the upper surface of the substrate and are separated from each other, and the pair of front electrodes comprises a left electrode arranged on the left side and a right electrode arranged on the right side; the resistance layer is covered between the left electrode and the right electrode; the protective layer is covered on the resistance layer, and the protective layer extends to the left electrode and the right electrode respectively; the side electrodes are arranged on the opposite sides of the substrate respectively, the side electrode on the left side is connected with the left electrode and the back electrode on the corresponding side, and the side electrode on the right side is connected with the right electrode and the back electrode on the corresponding side; the protective layer comprises a first protective layer and a second protective layer; the first protective layer is composed of at least two layers of glass material, and the second protective layer is composed of at least two layers of epoxy resin material.

[0006] As a further improvement, the second protective layer is covered on the first protective layer, the thickness of the two layers of glass material of the first protective layer is the same, and the thickness of the two layers of epoxy resin material of the second protective layer is different.

[0007] As a further improvement, the resistance layer and the protective layer extend and cover the left electrode and the right electrode in one part, and the covering area on the left electrode is larger than that on the right electrode.

[0008] As a further improvement, a third protective layer intersecting with the side electrode is formed on the left electrode and the right electrode in another part which is not covered; and the third protective layer is made of resin silver material.

[0009] As a further improvement, a nickel plating layer is further included; the nickel plating layer completely covers the back electrodes, side electrodes and front electrodes, and covers the third protective layer further lapping on the end surface of the second protective layer.

[0010] As a further improvement, a tin plating layer is further included; the tin plating layer covers the nickel plating layer and lapping on the end surface of the second protective layer.

[0011] As a further improvement, the resistance layer is provided with a plurality of laser cutting grooves which are relatively folded and inwardly retracted, so as to perform laser resistance adjustment.

[0012] As a further improvement, one of the laser cutting grooves is in a straight line, and the other is in an L shape, and at least one of the laser cutting grooves is covered by a first protective layer made of glass, and at least one of the laser cutting grooves is covered by a second protective layer made of epoxy resin.

[0013] As a further improvement, the first protective layer is printed by a 250 mesh screen printing, and the second protective layer is printed by a 325 mesh screen printing, so as to reduce the knot effect between them.

[0014] The application further provides a preparation method of a moisture-proof resistor, comprising the following steps:

[0015] S1: providing a substrate, forming back electrodes separated from each other on the lower surface of the substrate, and forming left and right electrodes separated from each other on the upper surface of the substrate;

[0016] S2: forming a resistance layer connected to the left and right electrodes;

[0017] S3: forming a first protective layer composed of at least two layers of glass material on the resistance layer, and a second protective layer composed of at least two layers of epoxy resin material;

[0018] S4: forming a third protective layer made of resin silver material on the left and right electrodes which are not covered;

[0019] S5: sputtering along the side surface to form side electrodes connected to the front electrodes and corresponding back electrodes;

[0020] S6: electroplating a layer of metal nickel to form a nickel plating layer completely covering the back electrodes, side electrodes, front electrodes and third protective layer;

[0021] S7: electroplating a layer of metal tin on the surface of the nickel plating layer to form a tin plating layer completely covering the nickel plating layer and lapping on the second protective layer.

[0022] As a further improvement, in step S1, further comprising:

[0023] First, print the back electrode material, dry at 180 DEG C; then print the front electrode material, dry at 180 DEG C; after sintering at 850 DEG C, the back electrode and the front electrode are formed.

[0024] As a further improvement, in step S3, also includes:

[0025] Using a laser laser on the same side of the resistance layer, the resistance layer is cut by multiple laser laser cutting, forming a first protective layer of laser cutting slot penetrating a layer of glass material, and a first protective layer of laser cutting slot penetrating two layers of glass material, corresponding to adjusting the resistance value of the resistance layer to the required resistance value.

[0026] As a further improvement, first, the first layer of glass material is formed into a first protective layer, and then cut into an L-shaped laser cutting slot occupying 90% of the total length, followed by forming a second layer of glass material into a first protective layer, and finally cutting into a linear laser cutting slot occupying 10% of the total length.

[0027] As a further improvement, in step S3, also includes:

[0028] Print two layers of glass material with the same thickness, dry and sinter at 600 DEG C to form a first protective layer; and print two layers of epoxy resin material with different thicknesses and one layer of resin silver material, dry and sinter at 220 DEG C to form a second protective layer and a third protective layer.

[0029] As a further improvement, the first protective layer is printed by using a 250 mesh screen, and the second protective layer is printed by using a 325 mesh screen.

[0030] As a further improvement, in step S5, also includes:

[0031] The side electrode is sputtered to a height that is flush with the third protective layer, and the side electrode and the third protective layer are in an intersecting state after sputtering.

[0032] By using the above technical scheme, the utility model can achieve the following technical effects:

[0033] The moisture-proof resistor of the present application has a multi-layer protection structure with the first protection layer of glass material and the second protection layer of epoxy resin material, effectively prevents water vapor penetration, improves the stability and reliability of the resistor in a humid environment, and the first protection layer of glass material not only prevents moisture, but also provides excellent mechanical protection, can resist external impact and pressure, so that the resistor remains intact and stable in harsh conditions, and the second protection layer of epoxy resin material has good electrical insulation, avoids the risk of resistor failure due to leakage or short circuit, ensures the stability of electrical performance, and the double-layer protection structure makes the resistor can resist environmental factors for a long time, reduces the performance degradation caused by changes in external environment, thereby greatly prolongs the service life of the product. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 is a structure schematic view of the moisture-proof resistor of the present application embodiment;

[0035] Figure 2 is Figure 1 the schematic diagram of preventing water vapor invasion in

[0036] Figure 3 is a cross-sectional view of the moisture-proof resistor of the present application embodiment at the section, and the right boundary is the fold line;

[0037] Figure 4 is a schematic view of the specification size of the moisture-proof resistor of the present application embodiment;

[0038] Figure 5 is a schematic view of the moisture-proof resistor of the present application embodiment before and after laser cutting line adjustment;

[0039] Figure 6 is a structure block diagram of the preparation method of the moisture-proof resistor of the present application embodiment;

[0040] Figure 7 is a flow chart of the preparation method of the moisture-proof resistor of the present application embodiment.

[0041] Icon:

[0042] 1-substrate; 2-back electrode; 3-resistor layer; 4-side electrode; 5-left electrode; 6-right electrode; 7-first protection layer; 8-second protection layer; 9-third protection layer; 10-nickel plating layer; 11-tin plating layer; 12-laser cutting groove. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings of the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application.

[0044] Embodiments

[0045] In a first aspect, in conjunction with Figures 1 to 5 The present embodiment provides a moisture-proof resistor, which comprises a substrate 1, a pair of back electrodes 2, a pair of front electrodes, a resistance layer 3, a protective layer and side electrodes 4.

[0046] The pair of back electrodes 2 are formed on the lower surface of the substrate 1 and separated from each other, and the pair of front electrodes are formed on the upper surface of the substrate 1 and separated from each other, which comprises a left electrode 5 arranged on the left side and a right electrode 6 arranged on the right side.

[0047] The resistance layer 3 is covered between the left electrode 5 and the right electrode 6. The protective layer is covered on the resistance layer 3, and the protective layer extends to the left electrode 5 and the right electrode 6 respectively. The side electrodes 4 are arranged on the opposite sides of the substrate 1 respectively, the left side electrode 4 is connected with the left electrode 5 and the corresponding back electrode 2, and the right side electrode 4 is connected with the right electrode 6 and the corresponding back electrode 2.

[0048] The protective layer comprises a first protective layer 7 and a second protective layer 8, the first protective layer 7 is composed of at least two layers of glass material, and the second protective layer 8 is composed of at least two layers of epoxy resin material.

[0049] The moisture-proof resistor described above has a multi-layer protection structure with the first protective layer 7 made of glass and the second protective layer 8 made of epoxy resin, effectively preventing moisture penetration and improving the stability and reliability of the resistor in a humid environment. The first protective layer 7 made of glass not only prevents moisture but also provides excellent mechanical protection, resisting external impact and pressure, so that the resistor remains intact and stable in harsh conditions. The second protective layer 8 made of epoxy resin has good electrical insulation, avoiding the risk of resistor failure due to leakage or short circuit, ensuring stable electrical performance. The double-layer protection structure enables the resistor to resist environmental factors for a long time, reducing performance degradation caused by changes in external environment, thereby greatly extending the service life of the product.

[0050] In addition, due to the high-temperature resistance of glass, the resistor can maintain its performance stability in high-temperature environments, making it suitable for a wider range of industrial applications. The coverage of multiple types of protective layers relative to the resistance layer 3 effectively prevents the resistance layer 3 from being disturbed by external factors, ensuring the stability and accuracy of the resistance value, thereby improving the performance consistency and reliability of the resistor.

[0051] In the present embodiment, the second protective layer 8 covers the first protective layer 7, and the thickness of the two layers of glass material of the first protective layer 7 is the same, and the thickness of the two layers of epoxy resin material of the second protective layer 8 is different. Preferably, the film thickness of the two layers of glass material protective layer is 15um, the film thickness of the first layer of epoxy resin material protective layer is less than 15um, and the film thickness of the second layer of epoxy resin material protective layer is greater than 15um.

[0052] In one aspect, the first protective layer 7 is composed of two layers of glass material with the same thickness, and the uniform thickness can ensure that the glass layer forms a consistent protective effect on the surface of the resistor, enhances the overall mechanical strength and high-temperature resistance, and provides a reliable moisture-proof barrier. On the other hand, the two layers of epoxy resin material of the second protective layer 8 have different thicknesses, which can provide a layered protection effect for the resistor. The thicker layer of epoxy resin material is mainly used to enhance the mechanical strength and wear resistance of the overall structure, while the thinner layer is used to provide additional moisture-proof performance and electrical insulation.

[0053] In this embodiment, the resistive layer 3 and the protective layer extend and cover a portion of the left electrode 5 and the right electrode 6, with the coverage area on the left electrode 5 being larger than that on the right electrode 6. Because the resistive layer 3 covers a larger area on the left electrode 5, the contact area between the left electrode 5 and the resistive layer 3 is correspondingly wider, thus influencing the current distribution. This asymmetrical distribution is used to adjust the current path within the resistor, enabling it to achieve more ideal electrical performance in specific application scenarios (e.g., in harsher environments where the left side of the component is more humid). For example, the larger coverage area makes the protective layer of the left electrode 5 more complete, effectively reducing the risk of environmental damage to the left electrode 5, which is especially important for electrode portions requiring additional protection.

[0054] Furthermore, a third protective layer 9 is formed on the left electrode 5 and right electrode 6 of another part of the uncovered area, intersecting with the side electrode 4. The third protective layer 9 is made of resin silver. The intersection of the third protective layer 9 with the side electrode 4 ensures a smooth transition between the electrode surface and the external electrical connection, reducing contact problems caused by height differences, thereby improving the electrical connection reliability of the resistor. Resin silver has excellent conductivity and protective properties; its application in the third protective layer 9 not only provides additional physical protection for the electrodes, further resisting moisture erosion from the external environment, but also maintains the conductivity of the electrodes, effectively preventing resistance changes or failures caused by corrosion.

[0055] In this embodiment, the moisture-proof resistor further includes a nickel plating layer 10. The nickel plating layer 10 completely covers the back electrode 2, the side electrode 4, and the front electrode, and overlaps the end face of the second protective layer 8 on top of the third protective layer 9. Furthermore, the moisture-proof resistor also includes a tin plating layer 11. The tin plating layer 11 covers the nickel plating layer 10 and overlaps the end face of the second protective layer 8. It should be noted that the tin plating layer 11 and the nickel plating layer 10 are existing structures and will not be described in detail here.

[0056] like Figure 3 As shown, in this embodiment, the resistor layer 3 has multiple laser-cut grooves 12 that are recessed relative to the folded lines for laser trimming. The folded lines of the resistor are a specific structure distributed on the surface of the substrate 1, forming a V-shaped groove structure to facilitate cutting operations and achieve folded and striped effects. Furthermore, a protective layer covers the folded lines. In the prior art, the control of the cutting point is not strict, allowing moisture to penetrate through the junction of the side folded grooves and the protective layer. Recessing the laser-cut grooves 12 relative to the folded lines not only reduces structural damage after cutting, but also, especially with the protective layer covering the folded lines, further enhances the protection of the cutting area and ensures that the laser-cut grooves 12 are not exposed above the folded lines.

[0057] Specifically, one of the laser tangent grooves 12 is in a straight line, one of the laser tangent grooves 12 is in an L shape, and at least one of the laser tangent grooves 12 is covered by a first protective layer 7 made of glass material, and at least one of the laser tangent grooves 12 is covered by a second protective layer 8 made of epoxy resin material. Thus, by at least two different laser tangent grooves 12, the resistance value of the resistor can be more flexibly adjusted. The L-shaped tangent groove is suitable for a larger range of resistance adjustment, while the straight-line tangent groove can be fine-tuned in a more fine range to meet the specific requirements of resistance value in different application scenarios.

[0058] Among them, the first laser tangent is longer (90% of the total length of the L-shaped tangent) to preliminarily correct the resistance value of the resistance layer 3, and then a second protective layer made of glass material is covered. The second laser tangent is shorter (10% of the total length of the straight-line tangent), which further reduces the resistance value range on the basis of the existing one, and then a protective layer made of epoxy resin material is covered. The double protection reduces the influence of water vapor on the resistance value to the minimum. As shown in Figure 5 After adjustment, two laser tangents are performed to solve the problem of parallel resistance caused by crack closure, which leads to resistance drift or drop.

[0059] In this embodiment, the first protective layer 7 is printed by a 250-mesh screen, and the second protective layer 8 is printed by a 325-mesh screen to reduce the mesh effect between them. By selecting different mesh screens to coat the first protective layer 7 and the second protective layer 8 respectively, the mesh effect between them can be effectively reduced. The mesh effect refers to the uneven coverage and adhesion caused by the grid structure in the multi-layer coating process. Selecting screens with different mesh sizes can ensure that the material of each protective layer is evenly distributed, reduce unevenness or bubbles between layers, and improve the overall coating quality.

[0060] As shown in Figure 4 In this embodiment, preferably, the shape of the resistance layer 3 is square, and the size of the moisture-proof resistor is specifically 3.20±0.20mm in length L, 1.60±0.20mm in width W, and 0.60±0.20mm in height T. The length A and B of the electroplated layer are both 0.40±0.20mm.

[0061] In combination Figures 6 to 7 In a second aspect, the embodiment further provides a preparation method of a moisture-proof resistor, including the following steps:

[0062] S1: providing a substrate 1, forming back electrodes 2 separated from each other on the lower surface of the substrate 1, and forming left electrodes 5 and right electrodes 6 separated from each other on the upper surface of the substrate 1;

[0063] S2: forming a resistance layer 3 connected to the left electrodes 5 and the right electrodes 6;

[0064] S3: Forming a first protective layer 7 composed of at least two layers of glass material and a second protective layer 8 composed of at least two layers of epoxy resin material on the resistance layer 3;

[0065] S4: Forming a third protective layer 9 of resin silver material on the uncovered left electrode 5 and right electrode 6;

[0066] S5: Sputtering along the side to form a side electrode 4 connecting the front electrode and the corresponding side back electrode 2;

[0067] S6: Electroplating a layer of metal nickel to form a nickel plating layer 10 completely covering the back electrode 2, side electrode 4, front electrode and third protective layer 9;

[0068] S7: Electroplating a layer of metal tin on the surface of the nickel plating layer 10 to form a tin plating layer 11 completely covering the nickel plating layer 10 and overlapping on the second protective layer 8.

[0069] In the above, by forming a first protective layer 7 composed of at least two layers of glass material and a second protective layer 8 composed of at least two layers of epoxy resin material, the resistance layer 3 is provided with multiple protection, and the multi-layer structure significantly enhances the moisture resistance of the resistor, prolonging its service life in a humid environment. The tin plating layer 11 covers the nickel plating layer 10 and overlaps on the second protective layer 8, further strengthening the protection ability of the resistor, avoiding the performance loss caused by defects between the plating layers. The combination of multi-layer protection structure and processing technology in the entire preparation method makes the resistor have excellent electrical performance, long-term stability and high reliability, which helps to enhance the moisture resistance and durability of the resistor, and is especially suitable for electronic devices in harsh environments.

[0070] In step S1, it also includes:

[0071] First, print the back electrode 2 material and dry at 180°C; then print the front electrode material and dry at 180°C; after sintering at 850°C, the back electrode 2 and front electrode are formed correspondingly.

[0072] In step S3, it also includes:

[0073] Using a laser to cut the resistance layer on the same side, respectively, forming a laser cutting slot 12 that penetrates through the first protective layer 7 composed of at least two layers of glass material, and a laser cutting slot 12 that penetrates through the first protective layer 7 composed of at least two layers of glass material, corresponding to adjust the resistance value of the resistance layer 3 to the required resistance value.

[0074] Specifically, first, a first protective layer 7 of glass material is formed, then a laser cutting groove 12 of L-shaped occupying 90% of the total length is cut, then a first protective layer 7 of glass material is formed, and finally a laser cutting groove 12 of straight line type occupying 10% of the total length is cut.

[0075] In step S3, it also includes:

[0076] Two layers of glass material of the same thickness are printed, dried and sintered at 600 DEG C respectively to form the first protective layer 7. Two layers of epoxy resin material of different thicknesses and one layer of resin silver material are printed, dried and sintered at 220 DEG C respectively to form the second protective layer 8 and the third protective layer 9.

[0077] Preferably, the first protective layer 7 is printed by silk screen printing with 250 mesh, and the second protective layer 8 is printed by silk screen printing with 325 mesh. Among them, the film thickness of the two layers of first protective layer 7 is the same, and the film thickness of the two layers of second protective layer 8 is different.

[0078] In step S5, it also includes:

[0079] The side electrode 4 is sputtered to the height of the third protective layer 9, and the side electrode 4 and the third protective layer 9 are in the state of intersection after sputtering. Specifically, by sputtering the side electrode 4 to the height of the third protective layer 9, the precise butt joint between the electrode and the protective layer can be ensured, which helps to improve the stability of electrical connection and avoids the contact failure or electrical performance problems caused by the height difference between the electrode and the protective layer.

[0080] The above is only the preferred embodiment of the present application, and the protection scope of the present application is not limited to the above-mentioned embodiments. Any technical solution belonging to the idea of the present application belongs to the protection scope of the present application.

Claims

1. A moisture resistant resistor characterized by, It comprises: a substrate; a pair of back electrodes formed on the lower surface of the substrate and separated from each other; a pair of front electrodes formed on the upper surface of the substrate and separated from each other, which includes a left electrode arranged on the left side and a right electrode arranged on the right side; a resistance layer covering between the left electrode and the right electrode; a protective layer covering the resistance layer, and the protective layer extends to the left electrode and the right electrode respectively; a side electrode arranged on the opposite sides of the substrate respectively, the left side electrode connects the left electrode and the corresponding back electrode, and the right side electrode connects the right electrode and the corresponding back electrode; wherein, the protective layer includes a first protective layer and a second protective layer; the first protective layer is composed of at least two layers of glass material, and the second protective layer is composed of at least two layers of epoxy resin material.

2. The moisture barrier resistor of claim 1, wherein The second protective layer covers the first protective layer, and the thickness of the two layers of glass material of the first protective layer is the same, and the thickness of the two layers of epoxy resin material of the second protective layer is different.

3. The moisture barrier resistor of claim 1, wherein The resistance layer and the protective layer extend to cover part of the left electrode and the right electrode, and the coverage area on the left electrode is larger than that on the right electrode.

4. The moisture barrier resistor of claim 3, wherein A third protective layer corresponding to the side electrode is formed on the other part of the left electrode and the right electrode which is not covered; and the third protective layer is a resin silver material.

5. The moisture barrier resistor of claim 4, wherein It also includes a nickel plating layer; the nickel plating layer completely covers the back electrode, side electrode and front electrode, and covers the third protective layer and further overlaps the end surface of the second protective layer.

6. The moisture barrier resistor of claim 5, wherein It also includes a tin plating layer; the tin plating layer covers the nickel plating layer and overlaps the end surface of the second protective layer.

7. The moisture barrier resistor of claim 1, wherein The resistance layer is provided with a plurality of laser cutting grooves which are relatively folded and shrunk, so as to perform laser resistance adjustment.

8. The moisture barrier resistor of claim 7, wherein, One of the laser cutting grooves is in a straight line type, and the other is in an L type, and at least one of the laser cutting grooves is covered by a first protective layer of glass material, and at least one of the laser cutting grooves is covered by a second protective layer of two layers of epoxy resin material.

9. The moisture barrier resistor of claim 1, wherein The first protective layer is printed by a 250 mesh screen, and the second protective layer is printed by a 325 mesh screen, so as to reduce the knot effect between them.

10. The moisture-resistant resistor of claim 1, wherein Print the back electrode material and dry at 180℃; then print the front electrode material and dry at 180℃; simultaneously sinter at 850℃ to form the back electrode and the front electrode; And print two layers of glass material with the same thickness to form the first protective layer after drying and sintering at 600℃ respectively; And print two layers of epoxy resin material with different thicknesses and a layer of resin silver material to form the second protective layer and the third protective layer after drying and sintering at 220℃ respectively. ​ ​

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