Chip packaging equipment

Abstract

The utility model provides a chip packaging device. The utility model provides chip packaging equipment. The chip packaging equipment comprises a first loading station, a second loading station, a third loading station, a hot pressing station, an alignment station, an automatic optical detection station, an unloading station and a control station, the first loading station, the second loading station and the third loading station are respectively used for accommodating the substrate assembly, the interface heat dissipation material preform and the heat dissipation cover; the sealant distribution station is used for distributing a sealant for the substrate to obtain a first middleware; the alignment station is used for placing the interface heat dissipation material preform on the chip to obtain a second middleware, and placing a heat dissipation cover on a substrate of the second middleware to form a third middleware; the hot pressing station is used for applying temperature and pressure to the third middleware so as to cure the sealant and form a fourth middleware; the unloading station is used for accommodating the fourth middleware; and the control station is used for transferring intermediate products in the packaging process among the stations. According to the chip packaging equipment provided by the invention, alignment errors can be avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, and in particular to a chip packaging device. BACKGROUND

[0002] In the modern electronic equipment manufacturing industry, with the wide application of high-performance chips, the leap-forward improvement of equipment operation capacity puts forward more stringent requirements for thermal management. As the core component of electronic equipment, the chip will generate a large amount of heat when running under high load, which will seriously affect the stability and service life of the equipment if it cannot be effectively dissipated in time. Therefore, the thermal management link in the chip packaging process is particularly important. In this process, the interface thermal material (referred to as TIM) as the bridge connecting the CPU chip and the heat sink plays an irreplaceable role in ensuring efficient heat transfer between the two.

[0003] The welding process of the traditional interface thermal material adopts the interface thermal material based on flux, which has been widely used in the chip assembly industry due to its excellent adhesion and processing convenience. The presence of flux enables the interface thermal material to adhere firmly to the chip surface, thereby ensuring the stability and reliability in the subsequent assembly steps. During the curing process of the interface thermal material, the flux is easily volatilized and leaves tiny cavities, which act as obstacles in the heat conduction path and significantly reduce the thermal conductivity of the interface thermal material, resulting in the inability of the heat generated by the chip to be quickly transferred to the heat sink, thereby affecting the heat dissipation efficiency.

[0004] In recent years, with the introduction of flux-free interface thermal material preforms, the situation has been significantly improved. Flux-free interface thermal material preforms can avoid the formation of cavities and significantly improve the thermal conductivity.

[0005] At this time, in the chip packaging process, how to avoid the displacement of the flux-free interface thermal material becomes a problem to be solved. INVENTION CONTENTS

[0006] Therefore, the present application provides a chip packaging device to avoid the displacement of the flux-free interface thermal material and avoid alignment errors.

[0007] Specifically, the present application is realized by the following technical solutions:

[0008] The first aspect of the present application provides a chip packaging device, which comprises a first loading station, a second loading station, a third loading station, a hot pressing station, an alignment station, an automatic optical detection station, a sealant dispensing station, an unloading station, and a control station configured with a plurality of pick-up arms; the interface thermal material preform is a flux-free interface thermal material preform;

[0009] The first loading station, the second loading station and the third loading station are respectively used for accommodating a substrate assembly, a solder flux-free interface thermal material preform and a heat dissipation cover;

[0010] The sealant dispensing station is used for dispensing sealant for the substrate in the substrate assembly to obtain a first intermediate product;

[0011] The alignment station is used for placing the interface thermal material preform on the chip of the first intermediate product to obtain a second intermediate product, and placing the heat dissipation cover on the substrate of the second intermediate product to form a third intermediate product;

[0012] The hot-pressing station is used for applying temperature and pressure to the third intermediate product to solidify the sealant to form a fourth intermediate product;

[0013] The unloading station is used for accommodating the fourth intermediate product;

[0014] The automatic optical inspection station is used for optically inspecting the substrate assembly, the interface thermal material preform and the heat dissipation cover to ensure no defects;

[0015] The control station is used for transferring the intermediate product in the packaging process between the stations by the plurality of pick-up arms.

[0016] The chip packaging device provided by the application has the following advantages. In the first aspect, the first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical inspection station, the unloading station and the control station with the plurality of pick-up arms are arranged. In the process of packaging the chip, the sealant dispensing station is used for dispensing sealant for the substrate in the substrate assembly to obtain a first intermediate product. Then, the alignment station is used for placing the interface thermal material preform on the chip of the first intermediate product to obtain a second intermediate product, and placing the heat dissipation cover on the substrate of the second intermediate product to form a third intermediate product. The hot-pressing station is used for applying temperature and pressure to the third intermediate product to solidify the sealant to form a fourth intermediate product. In this way, the placement of the interface thermal material preform and the heat dissipation cover is completed in the same station, which minimizes or eliminates the movement of the interface thermal material preform, avoids alignment errors, ensures correct alignment, and thus achieves better thermal contact and improves heat dissipation performance. In the second aspect, the stations are integrated in one device, which simplifies the assembly process, reduces the number of steps, reduces the transfer and waiting time of the intermediate product, and maximizes the reduction of potential errors, thereby improving the packaging efficiency. In the third aspect, the sealant dispensing station is integrated, which further improves the packaging efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 FIG. 1 shows a schematic diagram of a chip packaging apparatus according to an embodiment of the present application;

[0018] Figure 2 FIG. 2 shows a schematic diagram of a chip packaging apparatus according to another embodiment of the present application;

[0019] Figure 3 FIG. 3 shows a schematic diagram of a chip packaging apparatus according to another embodiment of the present application;

[0020] Figure 4 FIG. 4 shows a schematic diagram of a chip packaging apparatus according to another embodiment of the present application;

[0021] Figure 5 FIG. 5 shows a schematic diagram of a chip packaging apparatus according to another embodiment of the present application;

[0022] Figure 6 FIG. 6 shows a schematic diagram of a chip packaging apparatus according to another embodiment of the present application;

[0023] Figure 7 FIG. 7 shows a schematic diagram of a chip packaging apparatus according to another embodiment of the present application. DETAILED DESCRIPTION

[0024] The specific embodiments will now be described in detail hereinafter with reference to the accompanying drawings. The following description is only exemplary and is not intended to limit the present application. The same reference numerals in different drawings denote the same or similar elements throughout the present application.

[0025] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0026] It is to be understood that the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. It is to be understood that the term "and / or" as used herein encompasses all possible combinations of particular items listed apart from disjunctively worded limitations of various claims. It is further understood that the terms "comprise" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0027] The specific embodiments will now be described in detail hereinafter with reference to the accompanying drawings. The following description is only exemplary and is not intended to limit the present application. The same reference numerals in different drawings denote the same or similar elements throughout the present application.

[0028] Figure 1A schematic diagram of a chip packaging apparatus according to an embodiment of the present application is provided. Please refer to Figure 1 The chip packaging apparatus according to the embodiment of the present application comprises a first loading station, a second loading station, a third loading station, a hot-pressing station, an alignment station, an automatic optical inspection station, an unloading station, a sealant dispensing station, and a control station provided with a plurality of pick-up arms; the interface thermal material preform is a flux-free interface thermal material preform;

[0029] The first loading station, the second loading station, and the third loading station are respectively used for accommodating a substrate assembly, a flux-free interface thermal material preform, and a heat dissipation cover; the substrate assembly comprises a substrate and a chip disposed on the substrate;

[0030] The sealant dispensing station is used for dispensing a sealant for the substrate in the substrate assembly to obtain a first intermediate product;

[0031] The alignment station is used for placing the interface thermal material preform on the chip of the first intermediate product to obtain a second intermediate product, and placing the heat dissipation cover on the substrate of the second intermediate product to form a third intermediate product;

[0032] The hot-pressing station is used for applying temperature and pressure to the third intermediate product to solidify the sealant to form a fourth intermediate product;

[0033] The unloading station is used for accommodating the fourth intermediate product;

[0034] The automatic optical inspection station is used for optically inspecting the substrate assembly, the interface thermal material preform, and the heat dissipation cover to ensure no defects;

[0035] The control station is used for transferring the intermediate product in the packaging process between the stations by using the plurality of pick-up arms.

[0036] Specifically, the first loading station is used for accommodating the substrate assembly. It can be understood that a plurality of substrate assemblies can be accommodated in the first packaging station, and the substrate assembly is grasped and transferred to other stations for processing when needed.

[0037] Further, the substrate assembly can be used as the starting point of the packaging process, and the substrate assembly comprises a substrate and a chip mounted on the substrate. The combination mode of the chip and the substrate is set according to actual needs, which is not limited in the embodiment. For example, the chip can be welded on the substrate.

[0038] Further, the second loading station is used for accommodating the flux-free interface thermal material preform. It can be understood that a plurality of interface thermal material preforms can be accommodated in the second packaging station, and the interface thermal material preform is grasped and transferred to other stations for processing when needed.

[0039] Specifically, the interface thermal material preform is a material used to fill the gap between the chip and the heat dissipation cover, and the interface thermal material preform can improve the heat conduction efficiency. It should be noted that, unlike the traditional flux-based interface thermal material preform, the flux-free interface thermal material preform can avoid the problem of voids caused by flux residue, thereby improving the thermal management performance.

[0040] Further, the third loading station is used to accommodate the heat dissipation cover. It can be understood that the third loading station can accommodate a plurality of heat dissipation covers, and the heat dissipation cover can be grabbed and transferred to other stations for processing when needed.

[0041] Specifically, the heat dissipation cover is a cover made of metal or ceramic material used to cover the chip. Through the heat dissipation cover, the chip can help dissipate heat, ensure that the heat generated by the chip during operation can be effectively dissipated in time, thereby maintaining the normal working temperature of the chip and improving its stability and reliability.

[0042] Further, the control station contains a plurality of pick-up arms. It can be understood that the pick-up arm is a key tool used by the control station to transfer intermediate products.

[0043] In specific implementation, the pick-up arm can have multiple joints and can freely move, rotate, etc. in three-dimensional space, accurately grabbing and placing various components and intermediate products in the packaging process. In this way, the control station ensures that the pick-up arm transfers different products to the corresponding workstations at the right time and in the right order through accurate calculation and scheduling, which not only improves the automation level of the packaging process, but also significantly shortens the packaging cycle and improves production efficiency.

[0044] It should be noted that, since the control station not only completes the pick-up of the interface thermal material preform but also completes the pick-up of the heat dissipation cover, the heat dissipation cover can be placed on the interface thermal material immediately after the interface thermal material is placed on the chip, ensuring that the flux-free interface thermal material preform does not shift during the assembly process of the chip, and ensuring accurate alignment and avoiding alignment errors.

[0045] Specifically, the sealant dispensing station stores the sealant. In specific implementation, the sealant dispensing station dispenses the sealant onto the corresponding substrate assembly.

[0046] It should be noted that the sealant is a kind of adhesive with high viscosity, good flowability and curing performance. In the chip packaging process, the sealant is coated on the surface of the substrate, and after curing, it can tightly combine the substrate and the heat dissipation cover together. At the same time, integrating the sealant dispensing station with other workstations can dispense the sealant immediately after the pick-up arm picks up the heat dissipation cover, fix the heat dissipation cover on the substrate, prevent displacement and improve the efficiency of chip packaging.

[0047] Further, the automatic optical inspection station inspects the substrate assembly, the interface heat dissipation material preform and the heat dissipation cover through a high-resolution camera and an advanced image processing algorithm. Specifically, the article sent into the automatic optical inspection station is photographed, the image is analyzed and compared through the image processing algorithm, and the article is automatically judged to be defective or not through the preset quality standard and defect recognition algorithm, and the corresponding detection result is given.

[0048] It can be understood that when the automatic optical inspection station detects that the article has defects, it needs to be discarded and a same article is taken again for re-detection.

[0049] It should be noted that the chip packaging equipment provided in the embodiment and the specific process of chip packaging can generally include: dispensing the encapsulant on the substrate of the substrate assembly → moving to the alignment station to place the interface heat dissipation material preform → placing the heat dissipation cover on the interface heat dissipation material preform. In this way, the placing processes of the interface heat dissipation material preform and the heat dissipation cover are integrated in the same workstation, and by eliminating the need to move the unpackaged chip between different stations or different equipment, the risk of intermediate part displacement or misplacement can be reduced, better accuracy in the assembly process is ensured, and it is ensured that the interface heat dissipation material preform and the chip and the heat dissipation cover can be accurately aligned.

[0050] Specifically, the pick-up arm in the control station can first take the substrate assembly from the first loading station, move the substrate assembly to the automatic optical inspection station for detection, then transfer the substrate assembly to the encapsulant dispensing station, dispense the encapsulant for the substrate assembly in the encapsulant dispensing station to obtain a first intermediate part; then transfer the first intermediate part to the alignment station; further, the pick-up arm takes the interface heat dissipation material preform from the second loading station, moves the interface heat dissipation material preform to the automatic optical inspection station for detection, then places the non-defective interface heat dissipation material preform on the chip of the first intermediate part in the alignment station to form a second intermediate part; further, the pick-up arm takes the heat dissipation cover from the third loading station, moves the heat dissipation cover to the automatic optical inspection station for detection, then places the non-defective heat dissipation cover on the substrate of the second intermediate part in the alignment station to form a third intermediate part.

[0051] As described above, in the alignment station, the interface heat dissipation material preform is first accurately placed on the chip, and then the heat dissipation cover is immediately and accurately placed on the substrate. Since these two processes are performed in the same station and the heat dissipation cover is placed immediately after the interface heat dissipation material preform, the risk of displacement can be reduced, so that the heat dissipation cover can be accurately placed on the interface heat dissipation material preform, and the alignment between each part can be maximized.

[0052] It should be noted that in the process of forming the third intermediate, the heat dissipation cover is in contact with the sealing agent, so that the heat dissipation cover and the substrate are connected together through the sealing agent to obtain the third intermediate.

[0053] Further, the hot pressing station is responsible for completing the curing process of the sealing agent, thereby ensuring the stable connection between the components such as the chip, the interface heat dissipation material preform and the heat dissipation cover. In specific implementation, the hot pressing station is usually equipped with a heating device and a pressurizing equipment, which can quickly heat the working area to a preset temperature range. It should be noted that the specific temperature value of the preset temperature range is set according to actual needs, which is not limited in the embodiment. For example, the temperature range at which the sealing agent can be melted can be determined as the preset temperature range.

[0054] Further, while heating, the hot pressing station can also apply a certain pressure to the third intermediate, which helps the melted sealing agent to be more evenly distributed, so as to form a uniform and stable bonding layer between the substrate and the heat dissipation cover.

[0055] In specific implementation, the third intermediate is moved to the hot pressing station by the pick-up arm, and after the sealing agent is cured, the fourth intermediate is formed, and the fourth intermediate is moved to the unloading station by the pick-up arm.

[0056] The chip packaging equipment provided in the embodiment has the following advantages. First, by arranging the first loading station, the second loading station, the third loading station, the hot pressing station, the alignment station, the automatic optical detection station, the unloading station, and the control station provided with a plurality of pick-up arms, the sealing agent can be distributed to the substrate in the substrate assembly by the sealing station during the chip packaging process, to obtain the first intermediate. Then, the interface heat dissipation material preform is placed on the chip of the first intermediate by the alignment station, to obtain the second intermediate. The heat dissipation cover is placed on the substrate of the second intermediate, to form the third intermediate. The temperature and pressure are applied to the third intermediate by the hot pressing station, to cure the sealing agent, and form the fourth intermediate. In this way, the placement of the interface heat dissipation material preform and the placement of the heat dissipation cover can be completed in the same station, which can minimize or eliminate the movement of the interface heat dissipation material preform, avoid alignment errors, and ensure correct alignment, thereby achieving better thermal contact and improving heat dissipation performance. Second, by integrating all the stations in one device, the assembly process can be simplified, the number of steps can be reduced, the transfer and waiting time of intermediate products can be reduced, potential errors can be minimized, and the packaging efficiency can be improved. Third, by integrating the sealing agent distribution station, the packaging efficiency can be further improved.

[0057] It should be noted that the specific arrangement of each station is set according to actual needs, which is not limited in the embodiment.

[0058] Optionally, as shown in Figure 1 Figure 1 In the example shown, the first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical inspection station and the unloading station are arranged in a circle; and the control station is at the center of the circular arrangement.

[0059] It should be noted that the specific positions of the first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical inspection station and the unloading station in the circle are set according to actual needs, and are not limited in the embodiment. In specific implementation, the first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical inspection station and the unloading station can be placed within the pickup range of the pickup arm of the control station.

[0060] The chip packaging device provided in the embodiment can more effectively utilize space by arranging each station in a circle, so that the layout between each workstation is more compact, which can provide more workstation space in the same floor area, thereby improving the overall packaging efficiency of the device. Further, by arranging in a circle, the material flow paths between each workstation are relatively short and uniform, which helps to reduce the transmission time and energy consumption of materials inside the device. Further, placing the controller at the center of the circular arrangement can more conveniently centrally control and manage each workstation, thereby improving the reliability and maintainability of the device.

[0061] Further, Figure 2 FIG. 2 is a schematic view of the chip packaging device provided in the embodiment of the present application. Please refer to Figure 2 In another possible implementation, the first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical inspection station and the unloading station are linearly arranged opposite the control station.

[0062] Please refer to Figure 2 The first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical inspection station and the unloading station are linearly arranged to form a pipeline; and the control station is opposite the linear arrangement, in other words, the first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical inspection station and the unloading station are located on one side, and the control station is located on the opposite side of the other workstations.

[0063] ​It should be noted that the specific positions of the first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical detection station and the unloading station in the circle are set according to actual needs, and in this embodiment, no limitation is made thereto. In specific implementation, the first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical detection station and the unloading station can be arranged in sequence according to the flow of chip packaging.

[0064] The chip packaging equipment provided in this embodiment can make material transfer more smooth through linear arrangement of each work station, reduce waiting time and delay of material handling, and at the same time, can make each operation in the packaging process closely connected through linear arrangement of each work station, thereby improving overall production efficiency. Further, linear arrangement makes the operation flow more clear and intuitive, and the staff can more easily understand the task and flow sequence of each work station, which helps to reduce operation errors and confusion and improve packaging quality.

[0065] Figure 3 A schematic view of the third embodiment of the chip packaging equipment provided in this application is shown in Figure 3 At least one of the plurality of pickup arms comprises a joint arm, a telescopic mechanism, a weighing sensor and a pickup chuck;

[0066] One end of the telescopic mechanism is connected with the joint arm, and the other end is connected with the weighing sensor; the pickup arm realizes multi-angle and multi-direction movement through the joint arm, and adjusts the length through the telescopic mechanism;

[0067] The weighing sensor is also connected with the pickup chuck; the weighing sensor is used for real-time detection of the force applied by the pickup chuck;

[0068] The pickup chuck is used for picking up the interface heat dissipation material preform and placing the interface heat dissipation material preform on the chip of the first intermediate piece;

[0069] The pickup chuck is also used for applying a specified pressure to the chip under the cooperative control of the joint arm, the telescopic arm and the weighing sensor when placing the interface heat dissipation material preform on the chip of the first intermediate piece, so that the interface heat dissipation material preform adheres to the upper surface of the chip under the action of the pressure by natural adhesion, to avoid displacement.

[0070] Specifically, the structure of at least one of the plurality of pickup arms is as shown in Figure 3 For example, the structure of one of the pickup arms is as shown in Figure 3 Alternatively, the structures of all the pickup arms are as shown in Figure 3

[0071] Please refer to​Figure 3 The joint arm is the uppermost end of the pickup arm, which can be fixed to the ground through a base. Further, the upper end of the telescopic mechanism is connected to the joint arm, and the lower end of the telescopic mechanism is connected to the load cell. The upper end of the load cell is connected to the telescopic mechanism, and the lower end of the load cell is connected to the pickup chuck. The other end of the pickup chuck picks up the interface heat dissipation material preform during use.

[0072] Specifically, the joint arm is the main structural part of the pickup arm, which enables the pickup arm to realize multi-angle and multi-directional movement. It should be noted that during the chip packaging process, the positions and heights of various workstations may be different, and therefore a joint arm capable of flexible posture adjustment is needed to adapt to different operation requirements. The joint arm is usually composed of multiple rotating or swinging joints, which has high flexibility and can move in three-dimensional space, thereby ensuring that the pickup arm can accurately and stably reach the specified position to pick up and place different components.

[0073] Further, Figure 4 The fourth embodiment of the chip packaging device provided in the present application is shown in the schematic diagram. Among them, Figure 4 A diagram in FIG. is a schematic diagram when the telescopic mechanism is in a retracted state, Figure 4 B diagram in FIG. is a schematic diagram when the telescopic mechanism is in an extended state. Please refer to Figure 4 It can be understood that the telescopic mechanism can be extended to adjust the length of the pickup arm through the length of the extension, so that the pickup arm can approach or move away from the target position. One end of the telescopic mechanism is connected to the joint arm, and the other end is connected to the load cell, so that the pickup arm can flexibly control the distance of the pickup chuck to the target, improving the precision of the operation.

[0074] It should be noted that the specific structural form of the telescopic mechanism is set according to actual needs, and in the present embodiment, it is not limited. For example, in one possible implementation, the telescopic structure is a hydraulic cylinder.

[0075] Further, please continue to refer to Figure 3 and Figure 4 The load cell is installed between the telescopic mechanism and the pickup chuck, and is used to detect the force exerted by the pickup chuck on the target. When implemented, the load cell can monitor the force in real time and transmit information to ensure that the pressure exerted by the pickup chuck meets the set value.

[0076] Further, the pickup chuck is used to pick up the interface heat dissipation material preform and place the interface heat dissipation material preform on the chip of the first intermediate piece.

[0077] It can be understood that the pickup gripper is an end effector directly contacting and picking up the interface heat dissipation material preform. The specific shape of the pickup gripper can be set according to actual needs, and in this embodiment, no limitation is made.

[0078] In a specific implementation, the pickup gripper is usually designed with flexibility to adapt to interface heat dissipation material preforms of different sizes and shapes, so that the pickup gripper can be widely applied to different types of chip packaging processes, improving the versatility and flexibility of the equipment.

[0079] Optionally, in a possible implementation, the pickup gripper is a vacuum type pickup gripper or an electrostatic discharge type pickup gripper.

[0080] Specifically, the vacuum type pickup gripper picks up components by using vacuum suction. The vacuum type pickup gripper is usually equipped with a vacuum generating device (such as a vacuum pump or a vacuum generator) inside. When it is necessary to pick up components, the vacuum generating device works to form a negative pressure area inside the pickup gripper. In this way, when the pickup gripper contacts the interface heat dissipation material preform or other components, the components will be adsorbed on the pickup gripper, thereby realizing the pickup operation.

[0081] Further, the electrostatic discharge type pickup gripper picks up components by using electrostatic adsorption principle. This pickup gripper usually has an electrostatic generating device that can generate an electrostatic field. When the pickup gripper contacts the interface heat dissipation material preform or other components with static electricity, the components will be firmly adsorbed on the pickup gripper due to electrostatic adsorption.

[0082] It should be noted that the vacuum type pickup gripper is suitable for components of various shapes and materials, and the pickup force is stable and reliable. At the same time, since the vacuum suction force can uniformly act on the surface of the component, it is not easy to cause damage to the component. Further, the electrostatic discharge type pickup gripper has the advantages of fast response speed and simple operation. At the same time, since it picks up components by electrostatic adsorption, it does not need additional mechanical structure to generate pickup force, which can simplify the equipment structure. In a specific implementation, different types of grippers can be selected according to actual needs, and in this embodiment, no limitation is made.

[0083] Optionally, in a possible implementation, the pickup gripper has a non-stick surface that directly contacts the picked object.

[0084] Specifically, the non-stick surface can significantly reduce the stickiness of the pickup gripper, ensuring that the components can be smoothly detached from the pickup gripper during pickup and placement, and will not be accidentally taken away or damaged.

[0085] It should be noted that the specific material of the non-stick surface is determined according to actual needs, and in the embodiment, the non-stick surface is not limited. In actual implementation, since the fluxless interface thermal material preform depends on its natural adhesion to be bonded on the chip, when placing the preform, the fluxless interface thermal material preform may be stuck on the chuck instead of the chip, thereby damaging the assembly process. Therefore, a low-adhesion material can be selected to make the non-stick surface. For example, in an embodiment, Teflon can be selected to make the non-stick surface.

[0086] The chip packaging device provided in the embodiment can keep good separation from the element during picking and placing by using the non-stick surface material, avoid the possibility that the fluxless interface thermal material preform is stuck on the picking chuck, improve the overall placement accuracy, and avoid delays or defects that may be caused by misplacement of the chip or secondary processing, thereby ensuring smooth packaging process.

[0087] Further, the picking chuck is also used to apply a specified pressure to the chip under the joint arm, the telescopic arm and the weighing sensor to make the fluxless interface thermal material preform adhere to the upper surface of the chip under the action of the pressure by relying on the natural adhesion when placing the interface thermal material preform on the chip of the first intermediate piece.

[0088] In actual implementation, the weighing sensor can measure the pressure when the fluxless interface thermal material preform is placed on the chip, and based on the joint arm, the telescopic arm and the weighing sensor, the size of the pressure is controlled to apply a specified pressure.

[0089] The following will give a specific introduction to explain in detail that the fluxless interface thermal material preform can adhere to the upper surface of the chip under the action of the specified pressure by relying on the natural adhesion.

[0090] In actual implementation, the fluxless interface thermal material preform is pressed on the smooth chip with different forces of 5 Newton to 25 Newton, and then the chip is tilted to an angle of 45 degrees to simulate the potential movement in the assembly process, and the results are shown in Table 1.

[0091] Table 1

[0092]

[0093]

[0094] As can be seen from Table 1, when a force of 20 Newtons or more is applied, the fluxless interface material preform adheres to the die when the force is applied and remains adhered to the die when the die is tilted at a 45 degree angle without shifting or falling off. When the applied force is less than 20 Newtons, the fluxless interface material preform can shift or fall off the die when the die is tilted.

[0095] It can be appreciated that the pick-up head must apply a pressure of at least 20 Newtons to the fluxless interface material preform to ensure that it adheres to the die during assembly. Optionally, the specified pressure is greater than or equal to 20 N.

[0096] The chip packaging apparatus provided in this embodiment includes at least one pick-up arm among the plurality of pick-up arms, which includes a joint arm, a telescopic mechanism, a load sensor, and a pick-up head. One end of the telescopic mechanism is connected to the joint arm, and the other end is connected to the load sensor. The load sensor is also connected to the pick-up head. Thus, the pick-up arm can be used to pick up the interface material preform and place the interface material preform on the die of the first intermediate piece. Further, when the interface material preform is placed on the die, the load sensor can be used to detect the force applied by the pick-up head in real time. The joint arm, the telescopic mechanism, and the load sensor can be used to control the size of the applied force. Thus, the specified pressure can be applied to the die, and the specified force can be applied to the die. The interface material preform can adhere to the upper surface of the die under the action of the pressure by relying on the natural adhesion force, thereby further avoiding the shifting of the interface material preform.

[0097] Figure 5 Figure 5 is a schematic diagram of the chip packaging apparatus provided in this application. Please refer to Figure 5 Optionally, the plurality of pick-up arms can simultaneously perform different operations.

[0098] Specifically, when performing chip packaging, the plurality of pick-up arms allows the apparatus to simultaneously perform multiple packaging steps instead of performing them in series.

[0099] In a specific implementation, for example, the chip packaging apparatus can process three substrate assemblies. One pick-up arm can pick up a substrate assembly from a loading station, another pick-up arm can be placing an interface material preform on a die of another substrate assembly, and a third pick-up arm can be placing a heat dissipation cover on a third substrate assembly. Thus, multiple substrate assemblies can be processed in parallel, and this parallel processing capability can improve work efficiency.

[0100] It should be noted that the control station can intelligently assign and schedule the tasks of each pick-up arm. In particular, the control station dynamically arranges each pick-up arm to perform the most appropriate operation according to the current packaging progress, the state of each station, and the availability of the pick-up arms.

[0101] The chip packaging device provided in the embodiment can work with multiple pick-up arms at the same time, and the overall packaging speed of the device is significantly increased, so that the production cycle can be significantly shortened and the yield can be improved. Further, when a pick-up arm cannot be used temporarily due to failure or maintenance, other pick-up arms can continue to work, ensuring continuous operation of the production line and ensuring the reliability of the device. In addition, the simultaneous work of multiple pick-up arms can ensure close connection and efficient cooperation between different steps, and ensure the efficiency of chip packaging.

[0102] Optionally, in a possible implementation, the first loading station is configured to accommodate a batch of substrate assemblies, and the batch of substrate assemblies are placed on a designated carrier to be processed simultaneously by the chip packaging device at one time.

[0103] Figure 6 A schematic diagram of the seventh embodiment of the chip packaging device provided in the present application is shown in FIG. 7. Figure 6 The multiple substrate assemblies are placed on the designated carrier, and the pick-up arms can directly take the designated carrier to process the multiple substrate assemblies at one time during packaging.

[0104] It should be noted that the designated carrier provides stable support for the substrate assemblies and also ensures correct positioning and alignment of the substrate assemblies during packaging. It can be understood that by using the designated carrier, movement or misalignment of the substrate assemblies during transmission and processing can be avoided, thereby improving the accuracy and reliability of packaging.

[0105] Further, the specific number of substrate assemblies stored in the designated carrier is set according to actual needs, which is not limited in the embodiment. In particular, the specific number of substrate assemblies stored can be determined according to the capacity of the designated carrier.

[0106] When multiple substrate assemblies are placed on the designated carrier, multiple mechanical arms can be used to perform the same action on the multiple substrate assemblies at a certain step.

[0107] The chip packaging device provided in the embodiment can process a batch of substrate assemblies at one time through the designated carrier, and multiple packaged chips can be obtained at the same time, which can improve the efficiency of chip packaging and reduce the cost of chip packaging.

[0108] Optionally, Figure 7 A schematic diagram of the seventh embodiment of the chip packaging device provided in the present application is shown in FIG. 7. Figure 7The chip packaging device further comprises a reflow soldering station;

[0109] The reflow soldering station is configured to perform reflow soldering on the fourth intermediate product to melt the interface heat dissipation material preform and fix the chip and the heat dissipation cover together by the melted interface heat dissipation material.

[0110] Specifically, the reflow soldering station is mainly used to heat the fourth intermediate product to a specific temperature curve to melt and solidify the interface heat dissipation material.

[0111] In the implementation, the fourth intermediate product is sent to the reflow soldering station by the pick-up arm, and the reflow soldering station is used to heat the fourth intermediate product to melt the interface heat dissipation material preform without flux, flow and fill the small gap between the chip and the heat dissipation cover, and then fix the chip and the heat dissipation cover during the cooling process.

[0112] The chip packaging device provided in the embodiment can further improve the packaging efficiency by integrating the reflow soldering station.

[0113] The above merely provides the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A chip packaging apparatus, characterized by comprising: The chip packaging device comprises a first loading station, a second loading station, a third loading station, a hot-pressing station, an alignment station, a sealant dispensing station, an automatic optical detection station, an unloading station, and a control station provided with a plurality of pick-up arms; The interface heat dissipation material preform is a flux-free interface heat dissipation material preform; The first loading station, the second loading station and the third loading station are respectively used for accommodating a substrate assembly, a flux-free interface heat dissipation material preform and a heat dissipation cover; the substrate assembly comprises a substrate and a chip arranged on the substrate; The sealant dispensing station is used for dispensing a sealant for the substrate in the substrate assembly to obtain a first intermediate product; The alignment station is used for placing the interface heat dissipation material preform on the chip of the first intermediate product to obtain a second intermediate product, and placing the heat dissipation cover on the substrate of the second intermediate product to form a third intermediate product; The hot-pressing station is used for applying temperature and pressure to the third intermediate product to solidify the sealant and form a fourth intermediate product; The unloading station is used for accommodating the fourth intermediate product; The automatic optical detection station is used for optically detecting the substrate assembly, the interface heat dissipation material preform and the heat dissipation cover to ensure no defects; The control station is used for transferring intermediate products in the packaging process between the stations by using the plurality of pick-up arms.

2. The chip package apparatus of claim 1, wherein, At least one pick-up arm among the plurality of pick-up arms comprises a joint arm, an extension mechanism, a weighing sensor and a pick-up chuck; The extension mechanism is connected with the joint arm at one end and connected with the weighing sensor at the other end; the pick-up arm realizes multi-angle and multi-directional movement through the joint arm and adjusts length through the extension mechanism; The weighing sensor is also connected with the pick-up chuck; the weighing sensor is used for detecting force applied by the pick-up chuck in real time; The pick-up chuck is used for picking up the interface heat dissipation material preform and placing the interface heat dissipation material preform on the chip of the first intermediate product; The pick-up chuck is also used for placing the interface heat dissipation material preform on the chip of the first intermediate product, applying a specified pressure to the chip under the joint action of the joint arm, the extension arm and the weighing sensor to make the interface heat dissipation material preform adhere to the upper surface of the chip under the action of the pressure and rely on natural adhesion to avoid displacement.

3. The chip packaging apparatus of claim 2, wherein, The specified pressure is greater than or equal to 20 N.

4. The chip package device according to claim 2 or 3, characterized in that, The pick-up chuck is a vacuum type pick-up chuck or an electrostatic discharge type pick-up chuck.

5. The chip package apparatus of claim 4, wherein, The pick-up chuck has a non-stick surface which directly contacts the picked object.

6. The chip package apparatus of claim 1, wherein, The first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical detection station and the unloading station are linearly arranged opposite the control station.

7. The chip package apparatus of claim 1, wherein, The first loading station, the second loading station, the third loading station, the hot-pressing station, the alignment station, the automatic optical detection station and the unloading station are circularly arranged; The control station is at the center of the circular arrangement.

8. The chip package apparatus of claim 1, wherein, The plurality of pick-up arms can simultaneously perform a plurality of different operations.

9. The chip package apparatus of claim 1, wherein, The first loading station is used for accommodating a batch of substrate assemblies, which are placed on designated carriers to be processed simultaneously by the chip packaging device at one time.

10. The chip package apparatus of claim 1, wherein, The chip packaging device further comprises a reflow soldering station; The reflow soldering station is used for performing reflow soldering on the fourth intermediate piece to melt the interface heat dissipation material preform, and fix the chip and the heat dissipation cover together through the melted interface heat dissipation material.

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