Multi-size wafer loading disc and jacking material taking device
By using multi-size wafer loading trays and lifting and unloading devices, the applicability problem of wafers of different sizes in existing technologies has been solved, achieving automated unloading and cost reduction.
Patent Information
- Application Number
- CN202423158944.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-12-20
AI Technical Summary
Existing wafer handling robots and wafer loading boxes can only be used for wafers of a single size, and cannot be used for wafers of different sizes at the same time, resulting in high equipment costs and hindering mass production.
Design a multi-size wafer loading tray, including a central limiting groove and multiple annular stepped limiting grooves, to accommodate wafers of different sizes, and equipped with a lifting and unloading device, which automatically unloads the wafers from the loading cavity by lifting rods, avoiding contact with the polished surface of the wafers.
It enables automated loading and unloading of wafers of different sizes, reduces the overall cost of the equipment, simplifies the operation process, improves the degree of automation, and avoids damage to the polished surface of the wafers.
Smart Images
Figure CN223638341U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer processing technical field, concretely relates to a multi -size wafer loading tray and jacking material taking device. BACKGROUND
[0002] Wafer is the basic material of manufacturing semiconductor chip, before the accurate cutting operation of wafer, need to carry out laser polishing processing to wafer to improve the technology of wafer surface quality and flatness. At present, the automatic feeding and discharging system in the wafer manufacturing process on the market is mainly composed of wafer handling manipulator, wafer loading box and so on, or adopts complete EFFM (semiconductor equipment front end module) system equipment, but the existing wafer handling manipulator, wafer loading box and EFFM system equipment all belong to standard outsourcing parts, and its assembly to wafer processing equipment is more complicated, and these automatic feeding and discharging systems are also limited by the fixed specification size of wafer handling manipulator and wafer loading box, can only automatically feed and discharge single specification size wafer, cannot be applied to wafer feeding and discharging of different sizes simultaneously, and different size wafers need to be equipped with wafer handling manipulator and wafer loading system of different specifications, the price of wafer handling manipulator and wafer loading system itself is relatively expensive, which is not conducive to batch equipment cost control and batch production. UTILITARIAN CONTENT
[0003] In order to solve the problem of different size wafer loading system in the prior art, the utility model provides a multi -size wafer loading tray, which can be matched with different size specifications of wafer to carry and limit, and can conveniently and quickly eject the processed wafer from the corresponding annular step limiting groove to take out. In addition, the utility model also provides a jacking material taking device, which is used with the multi -size wafer loading tray, ejects different size wafers from the corresponding annular step limiting groove, conveniently takes out the processed wafer, avoids contacting the polishing surface of wafer during the process of taking out wafer, and has high automation degree.
[0004] In order to realize the above purpose, the utility model adopts the following technical scheme:
[0005] The utility model discloses a first aspect provides a kind of multi-size wafer loading tray, including the loading tray body of discoid, loading cavity is set on the loading tray body upper surface, the loading cavity includes center limiting groove and multiple annular step limiting grooves, the center limiting groove is set at the center position of the loading tray body upper surface, and with the minimum size wafer is adapted to carry limiting, the center limiting groove outside is provided with multiple annular step limiting grooves with gradually increasing diameter from inside to outside, the upper end surface height of multiple annular step limiting grooves gradually increases from inside to outside, multiple annular step limiting grooves are respectively adapted to install and carry limiting with different size wafers, upper and lower through top-up groove is set in the bottom of the loading cavity, top-up rod is passed out upwards from the top-up groove, and the top-up rod is lifted upwards from the loading cavity to the wafer.
[0006] Adopt the above technical scheme:
[0007] In the application, according to the conventional size specification (2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches) of the wafer, the center limiting groove and the multiple annular step limiting grooves with different heights are correspondingly arranged, so that the wafers with different size specifications can be correspondingly carried and limited. For example, when the wafer to be processed is 2 inches, it can be loaded and limited in the center limiting groove; when the wafer to be processed is 8 inches, it can be loaded and limited in the annular step limiting groove located at the outermost side. The annular step limiting groove has a certain width, and the outer edge portion of the lower end surface of the wafer is in contact with the annular step limiting groove located at the outermost side, so that the support and loading limiting effect of the 8-inch wafer are realized. The subsequent polishing processing of the upper end surface of the wafer is facilitated. Since the structure of the multi-size wafer loading tray is fixed, the structure of the wafer handling robot and the wafer loading box matched with the multi-size wafer loading tray is also fixed, and it is not necessary to frequently adjust the size specification of the wafer, so that the overall cost of the equipment is reduced. In addition, the upper and lower through top-up groove is set in the bottom of the loading cavity. By controlling the top-up rod to pass out upwards from the top-up groove, the top-up rod is in contact with the lower end surface of the wafer, and the wafer after polishing processing is lifted upwards from the loading cavity, so that the wafer is conveniently taken out, the automatic unloading operation of the wafer is realized, the operation is simple, and the polishing surface of the wafer is avoided from being contacted.
[0008] Further, one end of the top-up groove is located at the edge of the center limiting groove, and the other end of the top-up groove extends outward to the annular step limiting groove located at the outermost side.
[0009] In order to improve the efficiency of the jacking operation, the jacking groove is extended from the center limiting groove to the outermost annular step limiting groove, the size and shape of the jacking rod and the jacking groove are matched, the jacking rod is controlled to pass out of the jacking groove upward, it is ensured that the top of the jacking rod can contact the bottom surface of the wafers of various sizes loaded in the loading cavity, the wafers of various sizes can be smoothly jacked out of the loading cavity upward, it is not necessary to set multiple jacking operation sites according to the size specifications of the wafers, the specific structure and process of the jacking operation are simplified, and the operation efficiency of the jacking operation is improved.
[0010] Further, the jacking grooves are provided in plurality, and the bottom of the loading cavity is provided with a plurality of jacking grooves which are distributed in a radial manner and extend along the radial direction.
[0011] In order to facilitate subsequent material taking operation, preferably, a plurality of jacking grooves are uniformly provided, a plurality of corresponding jacking rods pass out of the jacking grooves, the plurality of jacking rods contact the lower end surface (non-machining surface) of the wafer and are uniformly distributed, the wafer is jacked upward horizontally, and subsequent material taking operation on the wafer is facilitated. In specific application, only one jacking groove can be provided to jack one side of the wafer upward for subsequent material taking operation.
[0012] Further, one jacking rod which is matched with the shape and size of each jacking groove is correspondingly provided below each jacking groove, the jacking rod is driven by a jacking drive assembly to move up and down reciprocatingly, and the jacking drive assembly drives the jacking rod to move out of the corresponding jacking groove.
[0013] In specific work, since the jacking drive assembly (such as a jacking cylinder) drives the jacking rod to move up and down reciprocatingly, when jacking operation is not needed, the jacking drive assembly drives the jacking rod to move downward, the jacking rod is separated from the jacking groove, and the loading of the wafers in the multi-size wafer loading disc or the transfer of the multi-size wafer loading disc is not affected, when jacking operation is needed, the jacking drive assembly drives the jacking rod to move upward out of the corresponding jacking groove, and the wafer is jacked upward.
[0014] Further, the first protruding structures which extend outward are formed on the opposite sides of the outer side surface of the loading disc body, and the first protruding structures are in contact with the limiting grooves on the inner wall of the wafer loading box to be limited and fixed.
[0015] The inner side wall of the wafer loading box is provided with a plurality of limiting grooves from top to bottom, the two first protruding structures on the outer side surface of the loading disc body are in contact with the limiting grooves on the inner side wall of the wafer loading box to be limited and guided, the plurality of multi-size wafer loading discs are stably accommodated in the wafer loading box, and in the subsequent feeding and discharging process, the guiding effect is achieved, and the multi-size wafer loading discs are smoothly fed and discharged from the wafer feeding loading box to the wafer discharging loading box.
[0016] In addition, during the process that the gripper assembly transfers the multi-size wafer loading tray, the two first protruding structures can be used as guiding structures, which are in sliding contact with the guide rail to guide and position.
[0017] Further, the other two sides of the outer side of the loading tray body are formed with second protruding structures extending outward, which are matched with the gripper assembly to clamp and grab the loading tray body to move the position.
[0018] The two second protruding structures are used as clamping sites matched with the gripper assembly, so as to facilitate the gripper assembly to grab the multi-size wafer loading tray.
[0019] Further, the first protruding structure and the second protruding structure are the same or different.
[0020] In specific applications, the first protruding structure and the second protruding structure can be designed to have the same structure or different structures.
[0021] In the second aspect of the utility model, a jacking material taking device is provided, which is used in cooperation with the multi-size wafer loading tray, and the jacking material taking device comprises a jacking rod, a lifting platform and a jacking cylinder, the shape and size of the jacking rod are matched with those of the jacking groove, the jacking rod is arranged one by one in one-to-one correspondence below the jacking groove, the jacking rod is installed on the lifting platform, the jacking cylinder is drivingly connected with the lifting platform, and the jacking cylinder drives the jacking rod to move upwards and pass through the corresponding jacking groove, so that the wafer is jacked upwards from the loading cavity.
[0022] Due to factors such as cost and convenient storage, the thickness of the multi-size wafer loading tray is relatively thin, and the jacking material taking device is relatively large in size, so it cannot be installed inside the multi-size wafer loading tray. Therefore, the jacking material taking device is arranged below the multi-size wafer loading tray, and when jacking operation is not needed, the jacking cylinder drives the plurality of jacking rods to move downwards synchronously, the jacking rod is separated from the corresponding jacking groove, and the wafer loading or wafer loading tray transferring operation in the multi-size wafer loading tray is not affected. When jacking operation is needed, the jacking cylinder drives the plurality of jacking rods to move upwards synchronously and extend out of the corresponding jacking groove, the jacking rod is in contact with the lower end surface (non-machining surface) of the wafer, and the wafer is jacked upwards horizontally, so that subsequent wafer taking operation is facilitated, the polishing surface (upper end surface) of the wafer is avoided during wafer taking, and the degree of automation is high.
[0023] Compared with the prior art, the utility model has the following beneficial effects:
[0024] In this invention, according to the conventional wafer sizes (2-inch, 3-inch, 4-inch, 5-inch, 6-inch, and 8-inch), a central limiting groove and multiple annular stepped limiting grooves of different heights are correspondingly set to support and limit wafers of different sizes. For example, when the wafer to be processed is 2-inch, it can be loaded and limited into the central limiting groove. When the wafer to be processed is 8-inch, it can be loaded and limited into the outermost annular stepped limiting groove. The annular stepped limiting groove has a certain width, and the outer edge of the lower end face of the wafer contacts the outermost annular stepped limiting groove, thus achieving the function of supporting and limiting the 8-inch wafer. This facilitates subsequent polishing and other operations on the upper end face of the wafer. Since the structure of this multi-size wafer loading tray is fixed, the structure of the wafer handling robot and wafer loading box used with it is also fixed, eliminating the need for frequent adjustments based on the wafer size, thereby reducing the overall cost of the equipment. In addition, a lifting groove that runs vertically through the bottom of the loading cavity is provided. By controlling the lifting rod to move upward through the lifting groove, the lifting rod contacts the lower end face (non-processed surface) of the wafer, lifting the polished wafer upward from the loading cavity, which facilitates the subsequent removal of the wafer. This realizes the automated wafer unloading operation, which is simple to operate and avoids contact with the polished surface (upper end face) of the wafer. Attached Figure Description
[0025] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.
[0026] Figure 1 This is a schematic diagram of the structure of the multi-size wafer loading disk in this utility model;
[0027] Figure 2 This is a front view of the multi-size wafer loading disk in this utility model;
[0028] Figure 3 This is a schematic diagram of the back structure of the multi-size wafer loading disk in this utility model;
[0029] Figure 4 This is a schematic diagram of the lifting and material handling device in this utility model;
[0030] Figure 5 This is a schematic diagram of the structure of the multi-size wafer loading tray and the lifting and unloading device in this utility model.
[0031] The specific reference numerals in the attached figures are as follows:
[0032] Multi-size wafer loading tray 1, loading tray body 2, loading cavity 3, central limiting groove 4, annular stepped limiting groove 5, lifting groove 6, first protruding structure 7, second protruding structure 8, lifting rod 9, lifting platform 10, lifting cylinder 11. Detailed Implementation
[0033] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.
[0034] Embodiment 1
[0035] The embodiment discloses a multi-size wafer loading disc, as shown in Figure 1 、 Figure 2 and Figure 5 , comprising a disc-shaped loading disc body 2, a loading cavity 3 is formed on the upper surface of the loading disc body 2, the loading cavity 3 comprises a center limiting groove 4 and a plurality of annular stepped limiting grooves 5, the center limiting groove 4 is formed at the center position of the upper surface of the loading disc body 2 and is adapted to bear and limit the smallest size wafer, a plurality of annular stepped limiting grooves 5 are arranged outside the center limiting groove 4 and have diameters gradually increasing from inside to outside, the upper end surfaces of the plurality of annular stepped limiting grooves 5 gradually increase from inside to outside, the plurality of annular stepped limiting grooves 5 are respectively adapted to bear and limit wafers of different sizes, and a jacking groove 6 penetrating upward and downward is formed in the inner bottom of the loading cavity 3, a jacking rod 9 is movably arranged in the jacking groove 6 and penetrates upward, and the jacking rod 9 jacks the wafer upward from the loading cavity 3.
[0036] In a specific application, according to the conventional size specifications (2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches) of the wafer, the center limiting groove 4 and the plurality of annular stepped limiting grooves 5 with different heights are correspondingly arranged, and wafers of different size specifications can be correspondingly borne and limited, for example, when the wafer to be processed is 2 inches, the wafer can be loaded and limited in the center limiting groove 4, and when the wafer to be processed is 8 inches, the wafer can be loaded and limited in the annular stepped limiting groove 5 located at the outermost side, the annular stepped limiting groove 5 has a certain width, the outer edge portion of the lower end surface of the wafer is in contact with the annular stepped limiting groove 5 located at the outermost side, the support and loading limiting effect of the 8-inch wafer is realized, subsequent polishing processing of the upper end surface of the wafer is facilitated, the structure of the multi-size wafer loading disc 1 is fixed, the structure of the wafer handling mechanical hand and the wafer loading box matched with the multi-size wafer loading disc 1 is also fixed, and it is not necessary to frequently adjust the size specifications of the wafer, so that the overall cost of the equipment is reduced. In addition, the jacking groove 6 penetrating upward and downward is formed in the inner bottom of the loading cavity 3, the jacking rod 9 is movably arranged in the jacking groove 6 and penetrates upward, the jacking rod 9 is in contact with the lower end surface of the wafer, the wafer after polishing processing is jacked upward from the loading cavity 3, the wafer is conveniently taken out, the automatic unloading operation of the wafer is realized, the operation is simple, and the polished surface of the wafer is avoided from being contacted.
[0037] In specific embodiments, one end of the jacking groove 6 is located at the edge of the center limiting groove 4, and the other end of the jacking groove 6 extends outward to the outermost annular step limiting groove 5. In order to improve the efficiency of the jacking operation, the jacking groove 6 extends outward from the center limiting groove 4 to the outermost annular step limiting groove 5, and the jacking rod 9 is matched in size and shape with the jacking groove 6. By controlling the jacking rod 9 to pass upwardly out of the jacking groove 6, it is ensured that the top of the jacking rod 9 can contact the bottom surface of the multiple different sizes of wafers loaded in the loading cavity 3, and the multiple different sizes of wafers can be smoothly jacked upwardly out of the loading cavity 3. It is not necessary to set multiple jacking operation sites according to the size specifications of the wafers, which simplifies the specific structure and process of the jacking operation and improves the operation efficiency of the jacking operation.
[0038] Preferably, the jacking groove 6 is provided with multiple jacking grooves 6, which are radially distributed and extend along the radial direction. In order to facilitate subsequent material taking operation, multiple jacking grooves 6 are uniformly provided, and multiple corresponding jacking rods 9 pass through the jacking grooves 6. The multiple jacking rods 9 contact the lower end surface (non-machining surface) of the wafer and are uniformly distributed, which facilitates the subsequent material taking operation of the wafer. In specific applications, only one jacking groove 6 can be provided to lift one side of the wafer for subsequent material taking operation.
[0039] In specific embodiments, a jacking rod 9 matched in shape and size is provided below each jacking groove 6, and the jacking rod 9 is driven by a jacking drive assembly to move up and down reciprocally. The jacking drive assembly drives the jacking rod 9 to move upwardly out of the corresponding jacking groove 6. In specific work, since the jacking drive assembly (such as a jacking cylinder 11) drives the jacking rod 9 to move up and down reciprocally, when jacking operation is not needed, the jacking drive assembly drives the jacking rod 9 to move downwardly, and the jacking rod 9 is separated from the jacking groove 6, which does not affect the loading of the wafer in the multi-size wafer loading disc 1 or the transfer of the multi-size wafer loading disc 1. When jacking operation is needed, the jacking drive assembly drives the jacking rod 9 to move upwardly out of the corresponding jacking groove 6, and the wafer is jacked upwardly.
[0040] In specific embodiments, the outer side of the loading disc body 2 is formed with first protruding structures 7 extending outward on opposite sides, and the first protruding structures 7 are in contact with the limiting grooves on the inner wall of the wafer loading box to limit and fix the position. The inner wall of the wafer loading box is provided with a plurality of limiting grooves from top to bottom, and the two first protruding structures 7 on the outer side of the loading disc body 2 are in contact with the limiting grooves on the inner wall of the wafer loading box to limit and guide the position. The plurality of multi-size wafer loading discs 1 are stably accommodated in the wafer loading box, and during the subsequent feeding and discharging process, the plurality of multi-size wafer loading discs 1 are guided to be smoothly fed and discharged from the wafer feeding loading box to the wafer discharging loading box. In addition, during the process of transferring the multi-size wafer loading disc 1 by the gripper assembly, the two first protruding structures 7 can be used as guide structures, which are in sliding contact with the guide rail to guide and position.
[0041] In the above embodiment, the outer side of the loading disc body 2 is formed with second protruding structures 8 extending outward on opposite sides, and the second protruding structures 8 are in contact with the gripper assembly to clamp and grasp the loading disc body 2 for position movement. The two second protruding structures 8 are clamping sites for cooperation with the gripper assembly, which facilitates the gripper assembly to grasp the multi-size wafer loading disc 1.
[0042] In the above embodiment, the first protruding structure 7 and the second protruding structure 8 are the same or different. As shown in Figure 3 In the above embodiment, the first protruding structure 7 and the second protruding structure 8 are the same or different. As shown in
[0043] Embodiment 2
[0044] The present embodiment discloses a jacking material taking device, which is used in cooperation with the above multi-size wafer loading disc 1, as shown in Figure 4 and Figure 5 The jacking material taking device includes a jacking rod 9, a lifting platform 10, and a jacking cylinder 11. The jacking rod 9 is matched in shape and size with the jacking groove 6. The jacking rod 9 is installed on the lifting platform 10. The jacking cylinder 11 is drivingly connected with the lifting platform 10, which drives the jacking rod 9 to move upward and pass through the corresponding jacking groove 6, and the wafer is jacked upward from the loading cavity 3.
[0045] Due to the factors of cost and convenient storage, the thickness of the multi-size wafer loading plate 1 is thin, the volume of the lifting material taking device is large, and it cannot be installed in the multi-size wafer loading plate 1. Therefore, the lifting material taking device is arranged below the multi-size wafer loading plate 1. When the lifting operation is not needed, the lifting cylinder 11 drives the plurality of lifting rods 9 to move downward synchronously, the lifting rods 9 are separated from the corresponding lifting grooves 6, and the loading of the wafer in the multi-size wafer loading plate 1 or the transfer of the multi-size wafer loading plate 1 is not affected. When the lifting operation is needed, the lifting cylinder 11 drives the plurality of lifting rods 9 to move upward synchronously from the corresponding lifting grooves 6, the lifting rods 9 are in contact with the lower end surface (non-processing surface) of the wafer, the wafer is lifted horizontally upward, the subsequent wafer taking operation is facilitated, the polishing surface (upper end surface) of the wafer is avoided to be contacted in the wafer taking process, and the automation degree is high.
[0046] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.
Claims
1. A multi-size wafer loading tray, comprising: The application discloses a multi-size wafer loading disc, which comprises a disc-shaped loading disc body, wherein an upper surface of the loading disc body is provided with a loading cavity, the loading cavity comprises a center limiting groove and a plurality of annular step limiting grooves, the center limiting groove is arranged at a center position of the upper surface of the loading disc body and is matched with a smallest-size wafer for bearing limiting, a plurality of annular step limiting grooves are arranged outside the center limiting groove and have a same center, and the diameters of the annular step limiting grooves gradually increase from inside to outside; upper end surfaces of the annular step limiting grooves gradually increase from inside to outside, the annular step limiting grooves are matched with wafers of different sizes for bearing limiting, respectively, and a jacking groove is arranged in the bottom of the loading cavity and penetrates the loading cavity upward and downward; a jacking rod is arranged to be movable upward and outward through the jacking groove.
2. The multi-size wafer boat of claim 1, wherein, One end of the jacking groove is located at an edge of the center limiting groove, and the other end of the jacking groove extends outward to the annular step limiting groove located at the outermost side.
3. The multi-size wafer boat of claim 2, wherein, A plurality of jacking grooves are arranged in the bottom of the loading cavity and are distributed in a radial direction.
4. The multi-size wafer boat of claim 3, wherein, A jacking rod matched with the shape and size of each jacking groove is arranged below the jacking groove, the jacking rod is driven by a jacking drive assembly to move upward and downward synchronously, and the jacking drive assembly drives the jacking rod to move upward and outward through the corresponding jacking groove.
5. The multi-size wafer boat of claim 1, wherein, First protruding structures extending outward are formed on opposite sides of the outer side surface of the loading disc body, and the first protruding structures are matched with limiting grooves in the inner wall of a wafer loading box to be limited and fixed.
6. The multi-size wafer boat of claim 5, wherein, Second protruding structures extending outward are formed on the other opposite sides of the outer side surface of the loading disc body, and the second protruding structures are matched with a gripper assembly to clamp and grab the loading disc body to move the loading disc body.
7. The multi-size wafer boat of claim 6, wherein, The first protruding structures and the second protruding structures are the same or different.
8. A lift takeoff apparatus characterized by, The jacking device is matched with the multi-size wafer loading disc, and the jacking device comprises a jacking rod, a lifting table and a jacking cylinder, the jacking rod is matched with the shape and size of the jacking groove, the jacking groove is arranged below the jacking groove, the jacking rod is installed on the lifting table, the jacking cylinder is drivingly connected with the lifting table, the jacking cylinder drives the jacking rod to move upward and outward through the corresponding jacking groove, and the jacking rod jacks up the wafer from the loading cavity.