Vacuum platform and mounting equipment
By introducing an isolation plate into the vacuum platform to change the gas flow path, the problem of substrate depression caused by excessive vacuum hole adsorption force was solved, resulting in a more uniform adsorption force distribution and higher mounting equipment efficiency.
Patent Information
- Application Number
- CN202520241097.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-14
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2035-02-14
AI Technical Summary
The vacuum holes of existing vacuum platforms have excessive suction force, which causes depressions on the substrate surface, affecting the reliability and efficiency of chip mounting.
In the design of the vacuum platform, an isolation plate is added to the gas guide hole to change the gas flow path, disperse the adsorption force, reduce the gas flow rate, and avoid excessive local adsorption force.
This achieves a more uniform distribution of vacuum adsorption force on the surface of objects such as chips, avoids substrate surface depression, and improves the operating efficiency and accuracy of mounting equipment.
Smart Images
Figure CN223638351U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a vacuum platform and mounting equipment. Background Technology
[0002] With the rapid development of the semiconductor industry, electronic products are moving towards miniaturization to meet user needs. Furthermore, as product performance and memory capacity increase, substrate thickness is becoming increasingly thinner, often employing core-less substrate designs. When mounting chips, a vacuum platform is typically used to hold the substrate in place. However, the excessive suction force of the vacuum holes on the platform can easily cause surface depressions after the substrate is held in place, leading to poor soldering of the chip and substrate pads during subsequent chip mounting. Utility Model Content
[0003] The purpose of this application is to provide a vacuum platform and mounting equipment that can solve the problem that the vacuum holes of the vacuum platform in the prior art are prone to causing the substrate surface to sink due to excessive adsorption force.
[0004] The embodiments of this application are implemented as follows:
[0005] A first aspect of this application provides a vacuum platform, including a platform body and a partition. The platform body has an air inlet at its bottom and an adsorption hole at its top. The partition is horizontally disposed within the platform body to separate the air inlet and the adsorption hole. The partition has a guide hole, through which gas introduced can flow to the adsorption hole under the guidance of the guide hole, thereby performing vacuum adsorption on a chip supported on the top of the platform body. This vacuum platform can solve the problem in existing vacuum platforms where excessive adsorption force in the vacuum holes easily causes the substrate surface to sink.
[0006] As one possible implementation, the number of partitions is at least one. When the number of partitions is multiple, the multiple partitions are arranged sequentially at intervals along the height direction of the platform body, and the air guide holes of the multiple partitions are arranged in a staggered manner.
[0007] As one possible implementation, the orthographic projections of the air vents of the plurality of partitions on the platform body may partially overlap or not overlap at all.
[0008] As one possible implementation, a column is provided at the bottom of the partition, and the partition near the bottom of the platform body is supported by the column between the bottom of the platform body and the bottom of the platform body, as well as between two adjacent partitions.
[0009] As an implementation, the number of the gas guide holes is at least one, and when the number of the gas guide holes is multiple, the multiple gas guide holes are arranged uniformly along the table surface direction of the platform body.
[0010] As an implementation, the bottom of the platform body is provided with a mounting column, the partition plate is provided with a mounting hole, and the mounting hole is sleeved on the mounting column to position and install the partition plate and the platform body.
[0011] As an implementation, the platform body includes a vacuum base and a vacuum cover lid covering the vacuum base, the air inlet hole and the mounting column are located at the bottom of the vacuum base, and the adsorption hole is located at the top of the vacuum cover lid.
[0012] As an implementation, the mounting column is provided with a connecting hole, the bottom of the vacuum cover lid is provided with a connecting column, the connecting column is arranged in the mounting hole and the connecting hole, and the vacuum cover lid is fixedly connected with the vacuum base.
[0013] As an implementation, the bottom of the platform body is provided with a positioning part for cooperating with a machine table of a mounting device.
[0014] In a second aspect, the application provides a mounting device including the above-mentioned vacuum platform. The vacuum platform can solve the problem that the vacuum holes of the vacuum platform in the prior art are prone to causing the surface of a substrate to be concave due to excessive adsorption force.
[0015] The application has the following beneficial effects:
[0016] The vacuum platform includes a platform body and a partition plate, the bottom of the platform body is provided with an air inlet hole, the top of the platform body is provided with an adsorption hole, the partition plate is arranged horizontally in the platform body to separate the air inlet hole and the adsorption hole, the partition plate is provided with a gas guide hole, and the gas introduced through the air inlet hole can flow to the adsorption hole under the guidance of the gas guide hole to perform vacuum adsorption on a chip loaded on the top of the platform body. The application adds the partition plate with the gas guide hole in the platform body, changes the flow path of the gas, disperses the relatively large adsorption force that may be concentrated on some vacuum holes, and thus the distribution of the vacuum adsorption force acting on the surface of an object is more uniform when the object such as a chip is adsorbed by the vacuum platform, and the situation that the local vacuum adsorption force is too large does not occur. At the same time, the actual flow of the gas can be reduced, the size of the vacuum adsorption force applied on the chip through the adsorption hole is reduced, and thus the situation that the surface of a substrate is concave due to excessive vacuum adsorption force is avoided. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those of ordinary skill in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.
[0018] Figure 1 The structural schematic diagram of the vacuum platform provided by the embodiments of the present application is shown in the figure.
[0019] Figure 2 The structural schematic diagram of the partition provided by the embodiments of the present application is shown in the figure.
[0020] Figure 3 The explosion schematic diagram of the vacuum platform provided by the embodiments of the present application is shown in the figure.
[0021] Figure legend: 100-vacuum platform; 10-platform body; 11-vacuum base; 111-air inlet hole; 112-mounting column; 1121-connection hole; 113-positioning part; 12-vacuum top cover; 121-suction hole; 122-connection column; 20-partition; 21-air guide hole; 22-stand column; 23-mounting hole. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0023] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.
[0024] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.
[0025] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0026] In addition, the terms "horizontal", "vertical" and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that it is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0027] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "set", "mount", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the connection between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0028] Please refer to Figures 1 to 3 The embodiment of the present application provides a vacuum platform 100, which comprises a platform body 10 and a partition plate 20. The bottom of the platform body 10 is provided with an air inlet hole 111, and the top of the platform body 10 is provided with an adsorption hole 121. The partition plate 20 is arranged horizontally in the platform body 10 to separate the air inlet hole 111 and the adsorption hole 121 through the partition plate 20. The partition plate 20 is provided with a gas guide hole 21. The gas introduced through the air inlet hole 111 can flow to the adsorption hole 121 under the guidance of the gas guide hole 21, so as to perform vacuum adsorption on the chip carried on the top of the platform body 10. The vacuum platform 100 can solve the problem that the vacuum hole of the vacuum platform 100 in the prior art is easy to cause the surface of the substrate to be concave due to excessive adsorption force.
[0029] It should be noted that, as Figures 1 to 3 shown, the vacuum platform 100 comprises a platform body 10 and a partition plate 20, wherein, as Figure 1 and Figure 3As shown, the platform body 10 serves as the main structure of the vacuum platform 100, which has oppositely arranged bottom and top parts. The gas inlet hole 111 is arranged at the bottom of the platform body 10 to serve as a passage for gas to enter the inside of the platform body 10. The adsorption hole 121 is arranged at the top of the platform body 10 to serve as a site for adsorbing objects such as chips. Figures 1 to 3 As shown, the partition plate 20 is horizontally arranged inside the platform body 10, which mainly separates the gas inlet hole 111 and the adsorption hole 121. The gas guide hole 21 is arranged on the partition plate 20. When gas is introduced into the inside of the platform body 10 from the gas inlet hole 111, the gas cannot directly reach the adsorption hole 121 due to the presence of the partition plate 20. At this time, the gas guide hole 21 arranged on the partition plate 20 plays a role in guiding the flow direction of the gas and reducing the flow rate of the gas. Thus, the gas will flow from the gas inlet hole 111 to the adsorption hole 121 under the guidance and reduction of the gas guide hole 21. The advantage of this design is that the path of the gas can be reasonably planned to avoid disordered flow of the gas in the platform body 10, and the flow rate of the gas can be appropriately reduced to reduce the size of the vacuum adsorption force applied to the chip through the adsorption hole 121.
[0030] Compared with the prior art in which gas directly flows from the gas inlet hole to the vacuum hole (i.e., the adsorption hole 121) of the vacuum platform, the present application can change the flow path of the gas by adding the partition plate 20 with the gas guide hole 21 in the platform body 10. The relatively large adsorption force that may have been concentrated at some vacuum holes is dispersed. Thus, when the object such as a chip is adsorbed by the vacuum platform 100, the distribution of the vacuum adsorption force acting on the surface of the object will be more uniform, and the situation of excessive local vacuum adsorption force will not occur. At the same time, the actual flow rate of the gas can be reduced to reduce the size of the vacuum adsorption force applied to the chip through the adsorption hole 121, thereby avoiding the concave surface of the substrate caused by excessive vacuum adsorption force.
[0031] As an implementable manner, as shown in Figures 1 to 3 The number of the partition plates 20 is at least one. When the number of the partition plates 20 is multiple, the multiple partition plates 20 are sequentially and spacedly arranged along the height direction of the platform body 10, and the gas guide holes 21 of the multiple partition plates 20 are staggered arranged.
[0032] For example, as shown in Figures 1 to 3As shown, in the embodiment, the number of the partitions 20 is two, and the two partitions 20 are sequentially and spacedly arranged along the height direction of the platform body 10 to ensure that the gas can flow through the gas guiding holes 21 of the two partitions 20 and the spacing space between the two partitions 20, and the gas guiding holes 21 of the plurality of partitions 20 are staggered arranged to further reduce the flow of the gas, thereby reducing the vacuum adsorption force applied on the chip by the adsorption holes 121.
[0033] As an implementable manner, as shown in Figures 1 to 3 As shown, the orthographic projections of the gas guiding holes 21 of the plurality of partitions 20 on the platform body 10 are partially overlapped or completely not overlapped. Those skilled in the art can reasonably select and design according to the actual required size of the vacuum adsorption force, which is not specifically limited here. For example, as shown in Figures 1 to 3 As shown, the orthographic projections of the gas guiding holes 21 of the plurality of partitions 20 on the platform body 10 are partially overlapped to further reduce the flow of the gas, thereby reducing the vacuum adsorption force applied on the chip by the adsorption holes 121.
[0034] As an implementable manner, as shown in Figures 1 to 3 and Figure 2 As shown in the embodiment, the bottom of the partition 20 is provided with a column 22, and the partition 20 located near the bottom of the platform body 10 and the bottom of the platform body 10 and the adjacent two partitions 20 are supported by the column 22 to ensure that there is a spacing space between the partition 20 located near the bottom of the platform body 10 and the bottom of the platform body 10 and the adjacent two partitions 20, thereby ensuring that the gas can flow through the above spacing space and finally flow into the adsorption holes 121.
[0035] It should be noted that when the number of the partitions 20 is multiple, the thickness of the plurality of partitions 20 and the size of the gas guiding holes 21 and the height of the column 22 can be the same or different. Those skilled in the art can reasonably select and design according to the actual situation, which is not specifically limited here.
[0036] As an implementable manner, as shown in Figure 3 As shown, the number of the gas guiding holes 21 is at least one, and when the number of the gas guiding holes 21 is multiple, the plurality of gas guiding holes 21 are uniformly arranged along the tabletop direction of the platform body 10 to further improve the uniformity of the vacuum adsorption force of the plurality of adsorption holes 121 distributed along the tabletop direction of the platform body 10 by reasonably guiding the flow direction of the gas.
[0037] As an implementable manner, as shown in Figures 1 to 3 and Figure 1As shown in the embodiment, the bottom of the platform body 10 is provided with a mounting column 112, and the partition plate 20 is provided with a mounting hole 23, which is sleeved on the mounting column 112, so that the partition plate 20 is positioned and installed with the platform body 10, and the air guiding hole 21 and the adsorption hole 121 positioned and installed on the partition plate 20 are ensured, so that the air guiding hole 21 can reasonably guide the gas to flow to the adsorption hole 121.
[0038] As an implementable manner, as shown in Figure 3 and Figure 1 As shown in the embodiment, the platform body 10 includes a vacuum base 11 and a vacuum top cover 12 covering the vacuum base 11, the air inlet hole 111 and the mounting column 112 are located at the bottom of the vacuum base 11, and the adsorption hole 121 is located at the top of the vacuum top cover 12.
[0039] It should be noted that, as shown in Figure 3 and Figure 1 The vacuum base 11 is provided with a containing groove, so that the partition plate 20 can be arranged in the containing groove in a direction parallel to the table surface of the platform body 10, and the vacuum top cover 12 covers the vacuum base 11 to close the slot of the containing groove through the vacuum top cover 12, the air inlet hole 111 and the mounting column 112 are located at the bottom of the vacuum base 11, and the adsorption hole 121 is located at the top of the vacuum top cover 12, so that the gas introduced into the containing groove through the air inlet hole 111 can flow to the adsorption hole 121 under the action of the air guiding hole 21, thereby vacuum adsorbing the chip and other objects carried on the vacuum top cover 12.
[0040] As an implementable manner, as shown in Figure 3 and Figure 1 As shown in the embodiment, the mounting column 112 is provided with a connecting hole 1121, and the bottom of the vacuum top cover 12 is provided with a connecting column 122, which is arranged in the mounting hole 23 and the connecting hole 1121, so that the vacuum top cover 12 is fixedly connected with the vacuum base 11. Through the cooperation of the connecting column 122, the mounting hole 23 and the connecting hole 1121, the vacuum top cover 12, the partition plate 20 and the vacuum base 11 can be fixedly connected and positioned and installed.
[0041] As an implementable manner, as shown in Figure 3 and Figure 1 Figure 3 As shown in the embodiment, the bottom of the platform body 10 (i.e. the vacuum base 11) is provided with a positioning part 113, which is used for positioning and installing with the machine table of the mounting device. For example, the positioning part 113 can be a clamping table to cooperate with a clamping groove on the machine table of the mounting device, or the positioning part 113 can be a clamping groove to cooperate with a clamping table on the machine table of the mounting device, so that the vacuum platform 100 and the machine table of the mounting device can be fixedly connected and positioned and installed, thereby improving the accuracy of chip mounting.
[0042] The embodiment of the present application also provides a mounting device, which comprises a machine table and the vacuum platform 100 described above, and the vacuum platform 100 is installed on the machine table. The vacuum platform 100 can realize double-track substrate simultaneous operation, and can be applied to operation of various track width sizes. Only the corresponding track width size needs to be installed on the machine table during operation, and the operation efficiency of the mounting device can be greatly improved. Since the structure and beneficial effects of the vacuum platform 100 have been described in detail in the foregoing embodiment, they will not be described here again.
[0043] The above merely describes optional embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
[0044] In addition, it should be noted that various specific technical features described in the foregoing specific embodiments can be combined in any appropriate manner without contradiction, and in order to avoid unnecessary repetition, various possible combinations will not be described again in the present application.
Claims
1. A vacuum platform, characterized in that, The platform body is provided with an air inlet hole at the bottom and an adsorption hole at the top, and the partition plate is arranged in the platform body to separate the air inlet hole and the adsorption hole, and the partition plate is provided with a gas guide hole, and the gas entering through the air inlet hole can flow to the adsorption hole under the guidance of the gas guide hole to vacuum adsorb the chip carried on the top of the platform body.
2. The vacuum platform of claim 1, wherein, The number of the partition plates is at least one, and when the number of the partition plates is multiple, the multiple partition plates are arranged in sequence and at intervals along the height direction of the platform body, and the gas guide holes of the multiple partition plates are arranged in a staggered manner.
3. The vacuum platform of claim 2, wherein, The gas guide holes of the multiple partition plates have a part of their projections on the platform body overlapping or completely not overlapping.
4. The vacuum platform of claim 2, wherein, The bottom of the partition plate is provided with a stand column, and the partition plate close to the bottom of the platform body and the bottom of the platform body and the adjacent two partition plates are supported by the stand column.
5. The vacuum platform of claim 1, wherein, The number of the gas guide holes is at least one, and when the number of the gas guide holes is multiple, the multiple gas guide holes are arranged uniformly along the tabletop direction of the platform body.
6. The vacuum platform of claim 1, wherein, The bottom of the platform body is provided with a mounting column, and the partition plate is provided with a mounting hole, and the mounting hole is sleeved on the mounting column to position and install the partition plate and the platform body.
7. The vacuum platform of claim 6, wherein, The platform body comprises a vacuum base and a vacuum top cover covering the vacuum base, the air inlet hole and the mounting column are located at the bottom of the vacuum base, and the adsorption hole is located at the top of the vacuum top cover.
8. The vacuum platform of claim 7, wherein, The mounting column is provided with a connecting hole, the bottom of the vacuum top cover is provided with a connecting column, and the connecting column is arranged in the mounting hole and the connecting hole to fixedly connect the vacuum top cover and the vacuum base.
9. The vacuum platform of claim 1, wherein, The bottom of the platform body is provided with a positioning part for cooperating with the machine table of the mounting equipment to be positioned and installed.
10. A mounting apparatus characterized by comprising: The vacuum platform comprises the vacuum platform according to any one of claims 1-9. The vacuum platform comprises the vacuum platform according to any one of claims 1-9.