Two-phase flow heat dissipation plate structure formed by stamping and forging

Abstract

The utility model provides a two-phase flow radiating plate structure formed by stamping and forging, which comprises a plate body formed by stamping a metal plate, a concave space is arranged on one side of the plate body, a heat source contact area is arranged at the central position of the concave space, and a heat source is arranged in the heat source contact area. The heat source contact area is provided with a plurality of convex or concave microstructures which are formed by forging and pressing and are arranged on one side of the plate body, the heat dissipation area is increased through the microstructures, further, more heat contact area which is in contact with a working fluid is provided, the heat exchange efficiency is effectively improved, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a two-phase flow heat dissipation plate structure, especially to a two-phase flow heat dissipation plate structure made by stamping and forging, which increases the thermal contact area by stamping and forging to effectively improve the heat dissipation efficiency. BACKGROUND

[0002] In electronic products, the conventional vapor chamber is combined with the surface of a heat generating element (such as a central processing unit or a graphics processing unit or a single chip), and the conventional vapor chamber has an upper plate body and a lower plate body. The upper plate body and the lower plate body have a chamber filled with working fluid, and a capillary structure is arranged in the chamber. The central position of the outer side of the lower plate body is attached to a heat generating element. When the lower plate body of the vapor chamber absorbs the heat of the heat generating element, the working fluid in the vapor chamber is heated and changes into gaseous working fluid. Then the gaseous working fluid flows to the upper plate body, releases heat and condenses, thereby taking away the heat of the heat generating element to achieve the purpose of heat dissipation.

[0003] The process of the upper plate body and the lower plate body of the conventional vapor chamber can be divided into stamping forming or forging forming. In the forging forming method, a relatively thick copper plate material such as 4 mm (millimeters) is used to forge and form the shape of the upper plate body and the lower plate body. However, in the forging forming process, a larger pressure is required to forge and form the copper plate material due to its excessive thickness. However, the upper and lower plate bodies formed by forging have different and uneven thicknesses in different parts, and the manufacturing cost is high. Based on the above problems of the forging forming method, manufacturers mostly only use a single stamping forming method for manufacturing. The stamping forming method can use a relatively thin copper sheet material such as 1 mm (millimeters) for manufacturing, and the thickness of each part of the upper plate body and the lower plate body formed by stamping is uniform and the manufacturing cost is low.

[0004] However, the vapor chamber made by stamping also has another problem. The inner and outer sides of the lower plate body of the vapor chamber are flat surfaces. When the outer surface of the lower plate body is attached to a high heat flux density chip or processor, and the heat generating element performs operation, a nucleation point appears in the heat generating element. The appearance of the nucleation point (hot spot) leads to excessively high temperature in the local part (such as the central position) of the heat generating element. However, due to the limited single area of the flat surface on the inner side of the lower plate body, the thermal contact area between the working fluid in the vapor chamber and the inner side of the lower plate body is limited and small, so that the working fluid is heated to evaporation and vaporization at a low efficiency and slowly. Therefore, the conventional vapor chamber cannot provide rapid and immediate heat dissipation and poor heat dissipation effect for the current high heat flux density chip or processor, which leads to the problems of reduced service life or damage of the heat generating element.

[0005] Therefore, how to solve the problem of the local nucleation point of the high heat flux density heating element cannot be quickly cooled and the lack thereof is a direction that the present inventor and relevant persons in the industry desire to research and improve. Content of the Utility Model

[0006] The utility model discloses a two-phase flow heat dissipation plate structure formed by stamping and forging, which can increase the thermal contact area with a working fluid by stamping and forging, thereby effectively improving the heat exchange efficiency.

[0007] Another object of the utility model is to provide a two-phase flow heat dissipation plate structure formed by stamping and forging, which can reduce the cost.

[0008] To achieve the above object, the utility model provides a two-phase flow heat dissipation plate structure formed by stamping and forging, which comprises a plate body formed by stamping a metal plate, characterized in that the plate body has an upper side and a lower side, the upper side is provided with a recessed space, the recessed space is recessed towards the lower side, at least one heat source contact area is arranged in the recessed space, and the heat source contact area is processed by forging to have a plurality of convex or concave microstructures arranged on the upper side or the lower side.

[0009] The two-phase flow heat dissipation plate structure formed by stamping and forging, wherein the surface of each microstructure is composed of a plurality of heat dissipation surfaces.

[0010] The two-phase flow heat dissipation plate structure formed by stamping and forging, wherein the shape of the microstructure is a polygonal body.

[0011] The two-phase flow heat dissipation plate structure formed by stamping and forging, wherein the shape of the microstructure is a rectangular body.

[0012] The two-phase flow heat dissipation plate structure formed by stamping and forging, wherein the shape of the microstructure is a long strip-shaped body.

[0013] The two-phase flow heat dissipation plate structure formed by stamping and forging, wherein the shape of the microstructure is a regular or irregular body.

[0014] The two-phase flow heat dissipation plate structure formed by stamping and forging, wherein the plate body can be combined with another plate body face to face to form a two-phase flow heat dissipation unit, the two-phase flow heat dissipation unit has a cavity filled with a working fluid, the inner wall of the cavity is provided with a capillary structure, and the lower side of the plate body is in contact with a heat source.

[0015] The heat source contact area of the plate body is additionally provided with a plurality of microstructures for increasing the heat dissipation area, thereby providing more heat contact area in contact with the working fluid, accelerating the evaporation vaporization efficiency of the working fluid, and effectively improving the heat exchange efficiency and reducing the cost. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The figure is a three-dimensional exploded schematic view of the preferred embodiment of the present application.

[0017] Figure 2 The figure is a three-dimensional exploded schematic view of the preferred embodiment of the present application.

[0018] Figure 3A The figure is a three-dimensional exploded schematic view of the preferred embodiment of the present application. Figure 1 The figure is a three-dimensional exploded schematic view of the preferred embodiment of the present application.

[0019] Figure 3B The figure is a three-dimensional exploded schematic view of the preferred embodiment of the present application.

[0020] Figure 3C The figure is a three-dimensional exploded schematic view of the preferred embodiment of the present application.

[0021] Figure 4 The figure is a three-dimensional exploded schematic view of the preferred embodiment of the present application.

[0022] BRIEF DESCRIPTION OF DRAWINGS: Two-phase flow heat dissipation plate structure 1; plate body 11; upper side of plate body 111; recessed space 112; lower side of plate body 113; heat source contact area 12; microstructure 13; heat dissipation surface 131; two-phase flow heat dissipation unit 2; chamber 21; capillary structure 22; evaporation surface 23; condensation surface 24; upper plate body 25; heat source 3. DETAILED DESCRIPTION

[0023] The above-mentioned objects, structure and functional characteristics of the present application will be described in accordance with the preferred embodiments of the accompanying drawings.

[0024] The present application provides a two-phase flow heat dissipation plate structure 1 made by stamping and forging, which is applied to a two-phase flow heat dissipation unit 2 (isothermal plate or flat plate type heat pipe or heat plate). Please refer to Figure 1 、 Figure 3A 、 Figure 4As shown, the two-phase flow heat spreader structure 1 includes a plate body 11 made of a metal plate (such as copper, commercial titanium, aluminum or other metal materials) by stamping, which can be the upper plate body and / or the lower plate body of the two-phase flow heat dissipation unit 2 (such as a vapor chamber). Specifically, the plate body 11 is made of a copper metal plate by stamping to form the entire outer contour and shape of the upper plate body (lower plate body) of the vapor chamber.

[0025] The stamped plate body 11 has a plate body upper side 111 and a plate body lower side 113, the plate body upper side 111 is provided with a recessed space 112 recessed towards the plate body lower side 113, and at least one heat source contact area 12 is provided at a predetermined position of the recessed space 112, which is used to be in contact with the surface of a corresponding heat source 3 (such as a high heat flux central processing unit or a graphics processing unit or a single chip). Specifically, the plate body 11 is attached to the surface of the heat source 3 at the plate body lower side 113 of the heat source contact area 12, to absorb the heat generated by the heat source 3.

[0026] Continuing to refer to Figure 1 , Figure 2 As shown, the heat source contact area 12 has a plurality of microstructures 13 in the form of protrusions or depressions made by forging and stamping, which are densely distributed on the plate body upper side 111 or the plate body lower side 113 of the heat source contact area 12. That is, the plurality of microstructures 13 are directly formed on the plate body upper side 111 or the plate body lower side 113 in the form of multi-faceted depressions (holes, cavities, pits; as shown in Figure 2 As shown) and / or multi-faceted protrusions (blocks, columns; as shown in Figure 1 The shape of the plurality of microstructures 13 can be selected as rectangular bodies (as shown in Figure 3A , polygonal bodies, long strip-shaped bodies (as shown in Figure 3B , grid-shaped bodies (as shown in Figure 3C , regular three-dimensional shapes or irregular three-dimensional shapes.

[0027] Specifically, in Figure 1 , Figure 3A , the shape of the plurality of microstructures 13 is in the form of rectangular bodies, which are densely formed in a plurality of rows and parallel spaced-apart manner on the plate body upper side 111 of the plate body 11, so that the plate body upper side 111 surface of the heat source contact area 12 protrudes in the form of multi-faceted protrusions (blocks, columns), and the surface of each microstructure 13 is composed of a plurality of heat dissipation surfaces 131. By densely adding hundreds or thousands of microstructures 13 with a plurality of heat dissipation surfaces 131 in the heat source contact area 12, the heat contact area between the heat source contact area 12 of the plate body 11 and the working fluid can be greatly increased in a single area, so as to accelerate the evaporation and vaporization of the working fluid, thereby improving the evaporation and vaporization efficiency.

[0028] Reference is made to Figure 1 、 Figure 4 The plate body 11 and another plate body made of metal material are mutually sealed to form the two-phase flow heat dissipation unit 2. The plate body 11 is the lower plate body of the two-phase flow heat dissipation unit 2, and the other plate body is the upper plate body 25 of the two-phase flow heat dissipation unit 2. The upper plate body 25 of the two-phase flow heat dissipation unit 2 is arranged on the recessed space 112 of the plate body 11 (i.e. the lower plate body) to form a chamber 21 between them. The chamber 21 is filled with a working fluid, and the inner wall of the chamber 21 is provided with a capillary structure 22. The capillary structure 22 can be a groove, a powder sintered body, a metal woven mesh (such as a copper mesh), or any combination of the above. The capillary structure 22 can be arranged on the inner side of the upper plate body and / or the lower plate body (i.e. the plate body 11) in the chamber 21. In this embodiment, the capillary structure 22 is formed on the inner side of the plate body 11 (i.e. the upper side 111 of the plate body) in the chamber 21 and the heat dissipation surfaces 131 of the plurality of microstructures 13 and the inner side of the upper plate body 25.

[0029] The outer side (i.e. the lower side 113 of the plate body) of the plate body 11 of the two-phase flow heat dissipation unit 2 is in contact with the heat source 3, and the inner side forms an evaporation surface 23 (i.e. the upper side 111 of the plate body in the heat source contact area 12). The inner side of the upper plate body 25 forms a condensation surface 24. When the evaporation surface 23 of the two-phase flow heat dissipation unit 2 absorbs heat from the heat source 3, such as a high heat flux central processing unit or a wafer, the heat exchange between the heat dissipation surfaces 131 of the plurality of microstructures 13 of the evaporation surface 23 and the working fluid is accelerated to increase the evaporation and vaporization of the working fluid, thereby increasing the rapid change of the two-phase flow of the working fluid in the two-phase flow heat dissipation unit 2. The working fluid is quickly heated and converted into a gaseous working fluid and flows towards the condensation surface 24. The gaseous working fluid is condensed in the upper plate body 25 and then returns to the evaporation surface 23 by gravity / capillary force, and the cycle of vapor-liquid circulation continues.

[0030] Therefore, the two-phase flow heat dissipation plate structure 1 is initially formed by stamping, and then the plurality of microstructures 13 are formed on the heat source contact area 12 of the two-phase flow heat dissipation plate structure 1 after stamping, which can provide more heat contact area with the working fluid, thereby accelerating the evaporation and vaporization of the working fluid, and effectively improving the heat exchange efficiency and reducing the cost. In addition, when the two-phase flow heat dissipation unit 2 formed by the two-phase flow heat dissipation plate structure 1 is used to dissipate heat from the high heat flux heat source 3, the two-phase flow change of the working fluid in the chamber 21 of the two-phase flow heat dissipation unit 2 is effectively accelerated, thereby effectively improving the heat transfer efficiency of the two-phase flow heat dissipation unit 2.

Claims

1. A two-phase heat spreader structure made by stamping and swaging, comprising a plate body made by stamping a metal plate, characterized in that: The plate body has a plate body upper side and a plate body lower side, the plate body upper side is provided with a recessed space, the recessed space is recessed towards the plate body lower side, at least one heat source contact area is arranged in the recessed space, the heat source contact area is subjected to forging processing to have a plurality of convex or concave microstructures, the microstructures are arranged on the plate body upper side or the plate body lower side.

2. The two-phase heat spreader structure formed by stamping and swaging of claim 1, wherein: The surface of each microstructure is composed of a plurality of heat dissipation surfaces.

3. The two-phase heat spreader structure formed by stamping and swaging of claim 1, wherein: The shape of the microstructure is a polygonal body.

4. The two-phase heat spreader structure fabricated by stamping and swaging of claim 1, wherein: The shape of the microstructure is a rectangular body.

5. The two-phase heat spreader structure fabricated by stamping and swaging of claim 1, wherein: The shape of the microstructure is a long strip-shaped body.

6. The two-phase heat spreader structure fabricated by stamping and swaging of claim 1, wherein: The shape of the microstructure is a regular or irregular body.

7. The two-phase heat spreader structure fabricated by stamping and swaging of claim 1, wherein: The plate body can be combined face to face with another plate body to form a two-phase flow heat dissipation unit, the two-phase flow heat dissipation unit has a chamber, the chamber is filled with a working fluid, the inner wall of the chamber is provided with a capillary structure, and the plate body lower side is in contact with a heat source.

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