Vacuum exhaust system for semiconductor vacuum coating equipment

Abstract

The utility model discloses a vacuum exhaust system for semiconductor vacuum coating equipment, which comprises a reaction cavity exhaust pipe, the reaction cavity exhaust pipe is communicated with one end of a pneumatic ball valve, the other end of the pneumatic ball valve is communicated with one end of a first pipeline, and the other end of the first pipeline is communicated with a circulating filtering device. The circulating filtering device is communicated with one end of a manual ball valve, the other end of the manual ball valve is communicated with one end of a second pipeline, the other end of the second pipeline is communicated with one end of an angle valve, and the other end of the angle valve is communicated with a vacuum pump. The vacuum exhaust system for the semiconductor vacuum coating equipment provided by the utility model effectively solves the problems that a vacuum pump of the existing semiconductor vacuum coating equipment needs to be in a working state all the time, so that more energy is consumed, wastes with high temperature cannot be cooled, subsequent pipelines and vacuum components are influenced, and the production cost is reduced. And the purification effect on waste gas impurities in vacuum exhaust is poor.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor vacuum coating equipment technical field, concretely is a kind of vacuum exhaust system for semiconductor vacuum coating equipment. BACKGROUND

[0002] Semiconductor vacuum coating equipment is important equipment in semiconductor manufacturing, for plating film on the surface of object. The following is a detailed overview of semiconductor vacuum coating equipment: Equipment type: including vacuum heating tube coating machine, plasma spraying equipment, magnetron sputtering vacuum coating machine, etc. It is widely used in aerospace, laboratory high-temperature heating tube, mobile phone cover gradual color coating, etc. The vacuum exhaust system of semiconductor vacuum coating equipment is an important component, mainly composed of vacuum mechanical pump or vacuum booster pump, etc. But the existing semiconductor vacuum coating equipment has the following problems.

[0003] The existing semiconductor vacuum coating equipment is a vacuum pump that needs to be in working condition all the time, which is more energy-consuming. It cannot cool the high-temperature waste, which affects the subsequent pipeline and vacuum components. The waste gas impurities in the vacuum exhaust cannot be purified effectively.

[0004] Therefore, a vacuum exhaust system for semiconductor vacuum coating equipment is needed to solve the above problems. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a vacuum exhaust system for semiconductor vacuum coating equipment to solve the problems raised in the background.

[0006] To achieve the above purpose, the utility model provides the following technical scheme: a vacuum exhaust system for semiconductor vacuum coating equipment, comprising a reaction cavity exhaust pipe, the reaction cavity exhaust pipe is communicated with one end of pneumatic ball valve, the other end of pneumatic ball valve is communicated with one end of first pipeline, the other end of first pipeline is communicated with circulating filter device, circulating filter device is communicated with one end of manual ball valve, the other end of manual ball valve is communicated with one end of second pipeline, the other end of second pipeline is communicated with one end of angle valve, the other end of angle valve is communicated with vacuum pump.

[0007] Further, the reaction cavity exhaust pipe is provided with a cavity, one end of the cavity is communicated with water supply pipeline, the other end of the cavity is communicated with drain pipeline.

[0008] Further, the circulating filtering device comprises a water storage cabin, the upper end of the water storage cabin is communicated with the first sleeve, the lower end of the water storage cabin is communicated with one end of a pressurized water pump, the other end of the pressurized water pump is communicated with a pressure cabin through a water pipe, the outer wall of the pressure cabin is connected with the inner wall of the first sleeve through connecting rods arranged in a ring shape at equal intervals, the lower end of the pressure cabin is communicated with a communication hole of a transmission conduit, the communication hole of the transmission conduit is communicated with spray heads arranged vertically and at equal intervals, and the lower end of the transmission conduit (75) is rotationally connected with the bottom of the inner wall of the first sleeve.

[0009] Further, the pressure cabin is internally provided with a pushing blade, the bottom of the pushing blade is fixedly connected with the transmission conduit, and helical blades are arranged on the outer ring of the transmission conduit.

[0010] Further, a plurality of drainage holes are arranged on the surface of the helical blade at equal intervals.

[0011] Further, the upper end of the first sleeve is communicated with a second sleeve, the second sleeve is rotationally connected with the top of a filtering layer, the top of the second sleeve is communicated with an exhaust pipe, and the exhaust pipe is provided with a valve.

[0012] Further, the bottom of the filtering layer is drivingly connected with one end of a differential gear set, the other end of the differential gear set is fixedly connected with the top of the pushing blade through the water storage cabin.

[0013] Compared with the prior art, the vacuum exhaust system for the semiconductor vacuum coating equipment is reasonable and has the following advantages.

[0014] (1) The waste gas with different reaction components can be directly discharged through the direct discharge pipeline in a harmless manner or discharged after being sprayed and purified through the circulating filtering device, and meanwhile, if vacuumization is needed, the angle valve can be opened, the vacuum pump can be opened to perform vacuumization and discharge the waste gas, and the waste gas can also be sprayed and purified through the circulating filtering device.

[0015] (2) The pressurized water pump sucks the water in the water storage cabin, the water enters the pressure cabin through the water pipe, then enters the communication hole of the transmission conduit from the pressure cabin, and finally is sprayed from the spray head, so that the waste is sprayed and dusted, and the purification effect is achieved.

[0016] (3) The water pipeline and the drain pipeline can cool the waste, thereby protecting the subsequent pipeline and vacuum components, reducing energy consumption and prolonging the service life.

[0017] (4) The water flow in the water pipe impacts the pushing blade to make the pushing blade rotate, thereby driving the helical blade to rotate, the rotating rotating blade rotates to make the water contact the surface thereof, thereby further driving the water to fully contact the waste gas for dust removal, and the waste gas dust removal effect is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the whole structure schematic view of the utility model;

[0019] Figure 2 It is the structure schematic view of the utility model reaction cavity exhaust pipe;

[0020] Figure 3 It is the cross section structure schematic view of the utility model reaction cavity exhaust pipe;

[0021] Figure 4 It is the cross section structure schematic view of the utility model circulating filter device;

[0022] Figure 5 It is Figure 4 The enlarged view of A in the utility model.

[0023] In the drawing: 1-reaction cavity exhaust pipe, 11-cavity, 2-water delivery pipeline, 4-drainage pipeline, 5-pneumatic ball valve, 7-circulating filter device, 71-water storage cabin, 72-pressurized water pump, 73-pressure cabin, 74-pushing blade, 75-transmission conduit, 751-communication hole, 76-sprinkler head, 77-spiral blade, 771-drainage hole, 78-differential gear set, 79-filter layer, 8-hand-operated ball valve, 9-angle valve. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0025] Please refer to Figures 1-5 The utility model provides a technical scheme: a vacuum exhaust system for semiconductor vacuum coating equipment, including reaction cavity exhaust pipe 1, its characterized in that: reaction cavity exhaust pipe 1 with pneumatic ball valve 5 one end communication, pneumatic ball valve 5 other end with first pipeline one end communication, first pipeline other end with circulating filter device 7 communication, circulating filter device 7 upper end through pipeline can with hand-operated ball valve 8 one end communication, hand-operated ball valve 8 other end with second pipeline one end communication, second pipeline other end with angle valve 9 one end communication, angle valve 9 other end with vacuum pump communication, second pipeline middle position with direct discharge pipeline communication, through different reaction component exhaust gas, exhaust gas harmless condition can through direct discharge pipeline direct discharge, or through circulating filter device 7 and then discharge after spraying purification, simultaneously if need to carry out the vacuum condition can through angle valve 9 and open, vacuum pump opens and carries out the vacuum exhaust gas, simultaneously also can through circulating filter device 7 and then discharge after spraying purification.

[0026] The reaction cavity exhaust pipe 1 is provided with a cavity 11, one end of the cavity 11 is communicated with the water conveying pipe 2, and the other end of the cavity 11 is communicated with the water draining pipe 4. The waste can be cooled through the water conveying pipe 2 and the water draining pipe 4, so as to protect the subsequent pipeline and vacuum components, reduce energy consumption, and prolong the service life.

[0027] The circulating filtering device 7 comprises a water storage cabin 71, a horizontally arranged filter screen is arranged at the middle position of the water storage cabin 71, the upper end of the water storage cabin 71 is communicated with the first sleeve, the lower end of the water storage cabin 71 is communicated with one end of a pressurized water pump 72, the other end of the pressurized water pump 72 is communicated with a pressure cabin 73 through a water pipe, the outer wall of the pressure cabin 73 is connected with the inner wall of the first sleeve through a plurality of connecting rods arranged in a ring shape and at equal intervals, the lower end of the pressure cabin 73 is communicated with a communication hole 751 formed in a transmission conduit 75, the communication hole 751 of the transmission conduit 75 is communicated with a plurality of spray heads 76 arranged vertically and at equal intervals and symmetrically, and the lower end of the transmission conduit 75 is rotationally connected with the bottom of the inner wall of the first sleeve. The water in the water storage cabin 71 is sucked into the water storage cabin 71 by the pressurized water pump 72, then the water enters the pressure cabin 73 through the water pipe, then the water enters the communication hole 751 formed in the transmission conduit 75 from the pressure cabin 73, and finally the water is sprayed from the spray heads 76, so as to spray and dust the waste, thereby achieving the purification effect.

[0028] A push blade 74 is arranged in the pressure cabin 73, the bottom of the push blade 74 is fixedly connected with the transmission conduit 75, a spiral blade 77 is arranged on the outer ring of the transmission conduit 75, the push blade 74 is rotated by the water flow in the water pipe, so as to drive the spiral blade 77 to rotate, and the rotation of the spiral blade 77 drives the water to contact the surface of the spiral blade 77, thereby further driving the water to contact the waste gas to achieve dust reduction.

[0029] A plurality of drainage holes 771 are formed in the surface of the spiral blade 77 at equal intervals, so that the waste gas can better rise through the drainage holes 771 and uniformly contact the filter layer 79.

[0030] The upper end of the first sleeve is communicated with a second sleeve, the second sleeve is rotationally connected with the top of the filter layer 79, the filter layer 79 is made of activated carbon adsorption material, a first perforation formed in the top of the second sleeve is communicated with a vacuum pump, and a second perforation formed in the top of the second sleeve is communicated with an exhaust pipe. The activated carbon adsorption force of the filter layer 79 can adsorb the waste gas molecules, thereby further evolving the waste.

[0031] The bottom of the filter layer 79 is transmissionally connected with one end of a differential gear set 78, the other end of the differential gear set 78 penetrates through the water storage cabin 71 and is fixedly connected with the top of the push blade 74. The differential gear set 78 can drive the filter layer 79 to rotate, and the differential gear set 78 forms a differential speed with the spiral blade 77 at the lower end, so as to avoid the waste gas from contacting the fixed filter layer 79, and further improve the utilization rate of the filter layer 79.

[0032] It will be apparent to those skilled in the art that the application is not limited to the details of the above-exemplified embodiments and that the application can be implemented in other particular forms without departing from the spirit or essential characteristics of the application. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. No feature of the application is considered critical unless it is expressly stated in the claims.

Claims

1. A vacuum exhaust system for a semiconductor vacuum coating apparatus, comprising a reaction chamber exhaust pipe (1), characterized in that: The exhaust pipe (1) of the reaction chamber is connected to one end of the pneumatic ball valve (5), the other end of the pneumatic ball valve (5) is connected to one end of the first pipe, the other end of the first pipe is connected to the circulating filter device (7), the circulating filter device (7) is connected to one end of the manual ball valve (8), the other end of the manual ball valve (8) is connected to one end of the second pipe, the other end of the second pipe is connected to one end of the angle valve (9), and the other end of the angle valve (9) is connected to the vacuum pump.

2. The vacuum exhaust system for a semiconductor vacuum coating equipment according to claim 1, characterized in that: The reaction chamber exhaust pipe (1) has a cavity (11), one end of which is connected to the water supply pipe (2), and the other end of which is connected to the drainage pipe (4).

3. The vacuum exhaust system for a semiconductor vacuum coating equipment according to claim 1, characterized in that: The circulating filtration device (7) includes a water storage tank (71), the upper end of which is connected to the first sleeve, the lower end of which is connected to one end of a pressurized water pump (72), the other end of which is connected to a pressure chamber (73) via a water pipe, the outer wall of the pressure chamber (73) is connected to the inner wall of the first sleeve via connecting rods arranged in annular equidistant arrangement, the lower end of the pressure chamber (73) is connected to a connecting hole (751) opened in a transmission conduit (75), the connecting hole (751) of the transmission conduit (75) is connected to spray heads (76) arranged vertically equidistantly and symmetrically, and the lower end of the transmission conduit (75) is rotatably connected to the bottom of the inner wall of the first sleeve.

4. A vacuum exhaust system for a semiconductor vacuum coating equipment according to claim 3, characterized in that: The pressure chamber (73) is equipped with a pusher blade (74), the bottom of which is connected and fixed to the transmission conduit (75), and the outer ring of the transmission conduit (75) is equipped with a helical blade (77).

5. A vacuum exhaust system for a semiconductor vacuum coating equipment according to claim 4, characterized in that: The surface of the spiral blade (77) has multiple drainage holes (771) at equal intervals.

6. A vacuum exhaust system for a semiconductor vacuum coating equipment according to claim 5, characterized in that: The upper end of the first sleeve is connected to the second sleeve, and the second sleeve is rotatably connected to the top of the filter layer (79).

7. A vacuum exhaust system for a semiconductor vacuum coating equipment according to claim 6, characterized in that: The bottom of the filter layer (79) is connected to one end of the differential gear set (78), and the other end of the differential gear set (78) passes through the water storage tank (71) and is connected and fixed to the top of the push blade (74).

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