Rapid dispensing and packaging device

Abstract

The utility model relates to the technical field of dispensing equipment, in particular to a quick dispensing and packaging device which comprises a roller conveying belt, a positioning and clamping mechanism used for positioning and clamping a large semiconductor is arranged in the middle of the roller conveying belt, a fixing frame is fixedly connected to the rear side of the roller conveying belt, a first hydraulic cylinder is fixedly connected to the top of the fixing frame, and a second hydraulic cylinder is fixedly connected to the bottom of the fixing frame. According to the utility model, a baffle plate in the positioning and clamping mechanism is used for blocking and positioning a large semiconductor, and the clamping assembly is used for clamping and fixing the large semiconductor, so that the rapid positioning and clamping of the large semiconductor are realized; the clamping block in the clamping assembly can slide along the sliding rail, large semiconductors of different sizes can be conveniently clamped, multi-point integrated dispensing of the large semiconductors is achieved through the dispensing mechanism, compared with a single-point dispensing mode, the working efficiency is high, and the fixing frame can be correspondingly replaced according to the sizes and shapes of the large semiconductors.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the point gum equipment technical field, concretely relates to a kind of quick dispensing encapsulation device. BACKGROUND

[0002] In the semiconductor packaging process, dispensing is a key step, to ensure the fixation of chip, the reliability of electrical connection and the overall performance of packaging, semiconductor is divided into different kinds according to the size, large semiconductor size reaches 120mmx120mm, and even reaches 700mmx700mm in panel type semiconductor chip, the edge of large semiconductor is usually sealed by sealing glue during packaging.

[0003] Due to the large size of large semiconductor, there are more positions needing dispensing when dispensing and sealing the edge, the existing dispensing device is usually single-point dispensing, so the dispensing head needs to move along the edge of large semiconductor for multiple dispensing, the dispensing time is long, the working efficiency is low, and the semiconductor needs to be clamped and fixed by clamp before dispensing, however, different clamps need to be replaced for different sizes of semiconductor during clamping, which is time-consuming and laborious. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of quick dispensing encapsulation device with simple structure and reasonable design to solve the above problems.

[0005] The utility model realizes the above-mentioned purposes by the following technical solutions:

[0006] A kind of quick dispensing encapsulation device, including roller conveyor belt, the middle part of roller conveyor belt is provided with positioning clamping mechanism for positioning and clamping large semiconductor, the rear side of roller conveyor belt is fixedly connected with fixed frame, the top of fixed frame is fixedly connected with No.1 hydraulic cylinder, the output end of No.1 hydraulic cylinder and fixed frame are jointly provided with dispensing mechanism.

[0007] The dispensing mechanism includes dispensing machine body fixedly connected to the top of fixed frame, the input end of dispensing machine body is fixedly connected with suction pipe, one end of suction pipe is located inside glue storage cylinder, the output end of dispensing machine body is fixedly connected with connector pipe, the end of connector pipe away from dispensing machine body is threadedly connected with corrugated expansion pipe, the bottom of corrugated expansion pipe is fixedly connected with annular shunt pipe, a plurality of conveying pipes are evenly installed on annular shunt pipe, the end of a plurality of conveying pipes away from annular shunt pipe is fixedly connected with fixed frame, fixed frame is hollow inside, and a plurality of dispensing heads are evenly installed on the bottom of fixed frame, cross fixed plate is fixedly connected inside fixed frame, and the top center of cross fixed plate is fixedly connected with the bottom of the output end of No.1 hydraulic cylinder by screw.

[0008] Preferably, the bottom of roller conveyor belt is fixedly connected with supporting leg at four corners respectively, and large semiconductor is conveyed along roller conveyor belt from left to right.

[0009] Preferably, the positioning and clamping mechanism comprises a driving assembly and a clamping assembly, the driving assembly comprises a No.

[0010] Preferably, a lead screw is rotatably penetrated in the middle of the roller conveying belt, and the lead screw is located between the adjacent two rollers, and a spur gear meshing with the rack is fixedly sleeved on the front end of the lead screw.

[0011] Preferably, the clamping assembly comprises two movable blocks movably sleeved on the lead screw in front and back symmetry, the movable blocks are connected with the lead screw through ball nut threads, a guide rod is slidably penetrated between the two movable blocks, the guide rod is fixedly installed on the roller conveying belt, and the top of each movable block is fixedly connected with a sliding rail, and the front and rear ends of the two sliding rails are fixedly connected with stop blocks.

[0012] Preferably, a sliding block is slidably connected on each of the two sliding rails, an L-shaped arm is fixedly connected on the side of the top of the sliding block close to the roller conveying belt, a clamping block is fixedly connected on the side of the top of the L-shaped arm close to the roller conveying belt, a nut block is fixedly installed on the side of the top of the sliding block away from the roller conveying belt, a locking screw is threadedly connected in the center of the nut block, and the bottom of the locking screw is attached to the top of the sliding rail.

[0013] The beneficial effects of the present application are as follows:

[0014] 1. The positioning and clamping mechanism blocks the large semiconductor, and the clamping assembly clamps and fixes the large semiconductor, realizes the rapid positioning and clamping of the large semiconductor, and the clamping block in the clamping assembly can slide along the sliding rail, so that different sizes of large semiconductors can be clamped.

[0015] 2. The dispensing mechanism realizes the multi-point integrated dispensing of the large semiconductor, and compared with the single-point dispensing mode, the working efficiency is high, and the fixed frame can be replaced according to the size and shape of the large semiconductor, thereby improving the practicability of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is the overall structure of the utility model stereogram;

[0017] Figure 2 is the roller conveying belt and the positioning and clamping mechanism of the utility model stereogram;

[0018] Figure 3 is the Figure 2 A region enlargement schematic view of the utility model

[0019] Figure 4 It is the point gum mechanism, the fixed frame and the one hydraulic cylinder perspective view of the utility model.

[0020] In the drawing: 1, roller conveyor belt; 2, support leg; 3, positioning clamping mechanism; 31, drive assembly; 311, baffle; 312, No. 2 hydraulic cylinder; 313, L-shaped mounting plate; 314, rack; 315, straight gear; 316, lead screw; 32, clamping assembly; 321, slide rail; 322, movable block; 323, guide rod; 324, clamping block; 325, L-shaped arm; 326, stop block; 327, nut block; 328, locking screw; 329, sliding block; 4, point gum mechanism; 41, suction pipe; 42, point gum machine body; 43, joint pipe; 44, fixed frame; 45, point gum head; 46, conveying pipe; 47, annular shunt pipe; 48, cross fixed plate; 49, corrugated expansion pipe; 5, fixed frame; 6, No. 1 hydraulic cylinder. DETAILED DESCRIPTION

[0021] The following detailed description of the application in conjunction with the drawings, it is necessary to point out here that the following detailed description is only used to further illustrate the application, can not be understood as limiting the scope of the application, the skilled person can make some non-essential improvements and adjustments to the application according to the above application.

[0022] EMBODIMENT

[0023] Please refer to Figure 1 and Figure 2 A kind of fast point gum packaging device, including roller conveyor belt 1, positioning clamping mechanism 3 for being positioned to the clamping of large semiconductor is arranged in the middle part of roller conveyor belt 1, roller conveyor belt 1 rear side is fixedly connected with fixed frame 5, fixed frame 5 top is fixedly connected with No. 1 hydraulic cylinder 6, No. 1 hydraulic cylinder 6 output end and fixed frame 5 are commonly provided with point gum mechanism 4;Roller conveyor belt 1 bottom four corners are fixedly connected with support leg 2 respectively, large semiconductor is transported from left to right along roller conveyor belt 1, when using, roller conveyor belt 1 transports large semiconductor from left to right, utilizes positioning clamping mechanism 3 to realize the quick positioning clamping of large semiconductor, point gum mechanism 4 realizes the integrated fast point gum of multiple points.

[0024] Please refer to Figure 1 、 Figure 2 and Figure 3, The positioning and clamping mechanism 3 comprises a driving assembly 31 and a clamping assembly 32, the driving assembly 31 comprises a No. 2 hydraulic cylinder 312, the output end top of the No. 2 hydraulic cylinder 312 is fixedly connected with a baffle 311, the baffle 311 is located between two adjacent rollers of the roller conveying belt 1, the upper part of the output end of the No. 2 hydraulic cylinder 312 is fixedly sleeved with an L-shaped mounting plate 313, the top front side of the L-shaped mounting plate 313 is fixedly connected with a rack 314, a lead screw 316 is rotatably penetrated in the middle part of the roller conveying belt 1, and the lead screw 316 is located between two adjacent rollers, and the front end of the lead screw 316 is rotatably penetrated through the front side of the roller conveying belt 1 and is fixedly sleeved with a spur gear 315 engaged with the rack 314.

[0025] Please refer to Figure 2 and Figure 3 , the clamping assembly 32 comprises two movable blocks 322 movably sleeved on the lead screw 316 and symmetrically arranged front and back, the movable blocks 322 and the lead screw 316 are connected through a ball nut thread, a guide rod 323 is slidably penetrated between the two movable blocks 322, the guide rod 323 is fixedly installed on the frame of the roller conveying belt 1, the top of each of the two movable blocks 322 is fixedly connected with a sliding rail 321, and the front and rear ends of the two sliding rails 321 are fixedly connected with a stop block 326, a sliding block 329 is slidably connected on each of the two sliding rails 321, the top of the sliding block 329 is fixedly connected with an L-shaped arm 325 on the side close to the roller conveying belt 1, the top of the L-shaped arm 325 is fixedly connected with a clamping block 324 on the side close to the roller conveying belt 1, a nut block 327 is fixedly installed on the top of the sliding block 329 away from the roller conveying belt 1, the nut block 327 is threadedly connected with a locking screw 328 in the center, and the bottom of the locking screw 328 is in close contact with the top of the sliding rail 321.

[0026] When the large semiconductor is conveyed from left to right along the roller conveyor 1, the No. 2 hydraulic cylinder 312 is started, the output end of the No. 2 hydraulic cylinder 312 is elongated, the baffle 311 and the L-shaped mounting plate 313 thereon are driven to move upward, at this time the baffle 311 protrudes from the top of the roller conveyor 1, the baffle 311 blocks and positions the large semiconductor, with the continuous elongation of the No. 2 hydraulic cylinder 312, the L-shaped mounting plate 313 and the rack 314 thereon are driven to move upward, the spur gear 315 and the lead screw 316 thereon are driven to rotate synchronously, in turn the movable block 322 and the sliding rail 321 thereon are driven to move centripetally, at the same time the sliding block 329 and the L-shaped arm 325 thereon are driven to move centripetally, thereby the clamping block 324 is driven to move centripetally, realizing stable clamping and fixing of the large semiconductor, realizing synchronous driving of the lifting of the baffle 311 and the clamping of the clamping block 324 by a single driving source, when different sizes of large semiconductors need to be clamped, the locking screw 328 is screwed, the locking of the sliding rail 321 by the locking screw 328 is loosened, the sliding block 329 is slid along the sliding rail 321, thereby the L-shaped arm 325 and the clamping block 324 thereon are slid along the sliding rail 321, after adjustment, the locking screw 328 is tightened, which is favorable for clamping large semiconductors of different sizes.

[0027] Please refer to Figure 1 and Figure 4 , the glue dispensing mechanism 4 comprises a glue dispensing machine body 42 fixedly connected to the top of the fixed frame 5, a suction pipe 41 is fixedly connected to the input end of the glue dispensing machine body 42, one end of the suction pipe 41 is located inside the glue storage cylinder, a connector pipe 43 is fixedly connected to the output end of the glue dispensing machine body 42, a corrugated expansion pipe 49 is threadedly connected to the end of the connector pipe 43 away from the glue dispensing machine body 42, an annular shunt pipe 47 is fixedly connected to the bottom of the corrugated expansion pipe 49, a plurality of delivery pipes 46 are uniformly installed on the annular shunt pipe 47, a plurality of delivery pipes 46 are fixedly connected to the end of the annular shunt pipe 47 away from the annular shunt pipe 47, a fixed frame 44 is fixedly connected to the end of the annular shunt pipe 47 away from the annular shunt pipe 47, the inside of the fixed frame 44 is hollow, a plurality of glue dispensing heads 45 are uniformly installed on the bottom of the fixed frame 44, a cross fixed plate 48 is fixedly connected inside the fixed frame 44, and the top center of the cross fixed plate 48 is fixedly connected to the bottom of the output end of the No. 1 hydraulic cylinder 6 through screws.

[0028] When the large semiconductor is clamped, the first hydraulic cylinder 6 is started, the cross fixed plate 48 at the output end of the first hydraulic cylinder 6 is lowered, the fixed frame 44 and the glue dispensing head 45 thereon are synchronously lowered, until the glue dispensing head 45 is lowered to 1-2 cm above the top of the large semiconductor, at this time the glue dispensing machine body 42 is started, the glue dispensing machine body 42 sucks the glue stored in the glue storage cylinder into the connector pipe 43 through the suction pipe 41, then enters the annular shunt pipe 47 through the corrugated expansion pipe 49, then enters the fixed frame 44 through the conveying pipe 46, and then flows out from the bottom of the glue dispensing head 45, realizing integrated and rapid glue dispensing on the top of the large semiconductor. The corrugated expansion pipe 49 is elongated along with the elongation of the output end of the first hydraulic cylinder 6, and the threaded connection between the connector pipe 43 and the corrugated expansion pipe 49 is loosened, the screw fixing between the bottom of the output end of the first hydraulic cylinder 6 and the cross fixed plate 48 is loosened, and different shapes and sizes of the fixed frame 44 can be replaced, so that different fixed frames 44 can be replaced according to the size and shape of the large semiconductor.

[0029] It should be noted that the rapid glue dispensing packaging device is used, first the large semiconductor is conveyed from left to right along the roller conveyor 1, then the positioning and clamping mechanism 3 is used for rapid positioning and clamping of the large semiconductor, without manual clamping, high work efficiency, after stable clamping, the glue dispensing mechanism 4 is used for multi-point integrated and rapid glue dispensing on the top of the large semiconductor, compared with the single-point glue dispensing mode, the work efficiency is high.

[0030] The above-described embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as limiting the scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which belong to the protection scope of the present application.

Claims

1. A rapid dispensing and encapsulation device, comprising a roller conveyor belt (1), characterized in that: The roller conveyor belt (1) is provided with a positioning clamping mechanism (3) for positioning and clamping large semiconductors in the middle. A fixed frame (5) is fixedly connected to the rear side of the roller conveyor belt (1). A first hydraulic cylinder (6) is fixedly connected to the top of the fixed frame (5). A dispensing mechanism (4) is provided between the output end of the first hydraulic cylinder (6) and the fixed frame (5). The dispensing mechanism (4) includes a dispensing machine body (42) fixedly connected to the top of the fixing frame (5). A suction tube (41) is fixedly connected to the input end of the dispensing machine body (42). One end of the suction tube (41) is located inside the glue storage cylinder. A connector tube (43) is fixedly connected to the output end of the dispensing machine body (42). A corrugated telescopic tube (49) is threadedly connected to the end of the connector tube (43) away from the dispensing machine body (42). An annular diverter tube (47) is fixedly connected to the bottom of the corrugated telescopic tube (49). A number of conveying pipes (46) are evenly installed on the annular diverter pipe (47). The ends of the multiple conveying pipes (46) away from the annular diverter pipe (47) are fixedly connected to a fixing frame (44). The fixing frame (44) is hollow inside, and a number of glue dots (45) are evenly installed at the bottom of the fixing frame (44). A cross fixing plate (48) is fixedly connected inside the fixing frame (44). The top center of the cross fixing plate (48) is fixedly connected to the bottom of the output end of the first hydraulic cylinder (6) by screws.

2. The rapid dispensing and encapsulation device according to claim 1, characterized in that: The roller conveyor belt (1) has four fixed support legs (2) at its bottom corners, and large semiconductors are conveyed from left to right along the roller conveyor belt (1).

3. The rapid dispensing and encapsulation device according to claim 1, characterized in that: The positioning and clamping mechanism (3) includes a drive assembly (31) and a clamping assembly (32). The drive assembly (31) includes a second hydraulic cylinder (312). A baffle (311) is fixedly connected to the top of the output end of the second hydraulic cylinder (312). The baffle (311) is located between two adjacent rollers on the roller conveyor belt (1). An L-shaped mounting plate (313) is fixedly sleeved on the upper part of the output end of the second hydraulic cylinder (312). A rack (314) is fixedly connected to the front side of the top of the L-shaped mounting plate (313).

4. The rapid dispensing and encapsulation device according to claim 3, characterized in that: A lead screw (316) is rotatably passed through the middle of the roller conveyor belt (1), and the lead screw (316) is located between two adjacent rollers. The front end of the lead screw (316) rotatably passes through the front side of the roller conveyor belt (1) and is fixedly sleeved with a spur gear (315) that meshes with a rack (314).

5. The rapid dispensing and encapsulation device according to claim 4, characterized in that: The clamping assembly (32) includes two movable blocks (322) symmetrically mounted on the lead screw (316). The movable blocks (322) and the lead screw (316) are connected by ball nuts. A guide rod (323) slides through the two movable blocks (322). The guide rod (323) is fixedly mounted on the roller conveyor belt (1). A slide rail (321) is fixedly connected to the top of each of the two movable blocks (322), and a stop block (326) is fixedly connected to both the front and rear ends of the two slide rails (321).

6. The rapid dispensing and encapsulation device according to claim 5, characterized in that: Both slide rails (321) are slidably connected to sliders (329). An L-shaped arm (325) is fixedly connected to the top of the slider (329) near the roller conveyor belt (1). A clamping block (324) is fixedly connected to the top of the L-shaped arm (325) near the roller conveyor belt (1). A nut block (327) is fixedly installed on the top of the slider (329) away from the roller conveyor belt (1). A locking screw (328) is threadedly connected to the center of the nut block (327). The bottom of the locking screw (328) is in contact with the top of the slide rail (321).

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