Polishing device

Abstract

The utility model provides a polishing device which comprises a workbench, a polishing device and a polishing device. The grinding assembly is configured to grind the workpiece; and the first adjusting mechanism is connected with the grinding assembly and is configured to adjust the relative position between the grinding assembly and the workpiece. According to the workpiece polishing device, the workpiece is placed on the workbench, then the polishing assembly is used for polishing the workpiece so that substances on the surface of the workpiece can be removed, the workpiece can meet the requirement only by polishing the workpiece through the polishing assembly, other additional consumables do not need to be added, and the manufacturing cost is reduced. And meanwhile, the relative position between the workpiece and the polishing assembly is adjusted through the first adjusting mechanism, so that the polishing device can be suitable for workpieces of more specifications.

Description

Technical Field

[0001] This application relates to the field of polishing equipment technology, specifically to a polishing device. Background Technology

[0002] In the field of liquid crystal display technology, a common connection method for LED strips in backlight modules includes using gold fingers to connect the LED strips and the terminal blocks. During the manufacturing process of the gold fingers, solder paste is typically applied directly to the copper foil pads of the gold fingers, with rosin used as a flux for soldering. However, rosin residue can adhere to the gold fingers, forming an insulating film that affects the electrical contact performance of the gold fingers, leading to poor contact or even open circuits. To improve this situation, related technologies often involve adding a gold plating process, utilizing gold's conductivity and oxidation resistance. However, gold is expensive, increasing manufacturing costs. Utility Model Content

[0003] Embodiments of this application provide a polishing apparatus that can reduce costs.

[0004] Embodiments of this application provide a polishing apparatus, comprising:

[0005] The worktable is configured to hold the workpiece;

[0006] The grinding assembly is configured to grind a workpiece;

[0007] The first adjustment mechanism, connected to the grinding assembly, is configured to adjust the relative position between the grinding assembly and the workpiece.

[0008] In some embodiments, the polishing apparatus further includes:

[0009] The support base has a receiving cavity, and the worktable is set inside the receiving cavity;

[0010] The drive mechanism, located on the side of the receiving cavity, is connected to the grinding assembly and is configured to drive the grinding assembly to grind the workpiece.

[0011] In some embodiments, the polishing apparatus further includes:

[0012] The transmission component, which connects the drive mechanism and the grinding component, is configured to drive the grinding component to move in accordance with the movement of the drive mechanism.

[0013] In some embodiments, the transmission component is a belt, the grinding component is a grinding wheel, and the drive mechanism includes an output shaft, with one end of the belt connected to the output shaft and the other end connected to one end of the grinding wheel.

[0014] In some embodiments, the first adjustment mechanism includes:

[0015] The telescopic rod, with one end connected to the grinding assembly and the other end connected to the bottom surface of the receiving cavity, is configured to adjust the relative position between the grinding assembly and the workpiece.

[0016] In some embodiments, the telescopic rod is rotatably connected to the grinding assembly and rotatably connected to the bottom surface of the receiving cavity.

[0017] In some embodiments, the polishing apparatus further includes:

[0018] A control mechanism, located on the side of the support base and connected to the drive mechanism and the first adjustment mechanism, is configured to control the operation of the drive mechanism and / or control the operation of the first adjustment mechanism to adjust the relative position between the grinding assembly and the workpiece.

[0019] In some embodiments, the polishing apparatus further includes:

[0020] The input component, connected to the control mechanism, is configured to allow operators to input workpiece parameters into the control mechanism;

[0021] The control mechanism is configured to control the action of the first adjustment mechanism according to parameters to adjust the relative position between the grinding assembly and the workpiece.

[0022] In some embodiments, the worktable has a carrying surface configured to carry a workpiece, and the grinding apparatus further includes:

[0023] The fixing component includes a first fixing block and a second fixing block disposed opposite to each other on opposite sides of the workpiece surface, and the fixing component is configured to fix the workpiece.

[0024] In some embodiments, the polishing apparatus further includes:

[0025] The second adjustment mechanism is connected to the fixed components and the control mechanism;

[0026] The control mechanism is configured to adjust the distance between the first fixed block and the second fixed block according to parameters.

[0027] The beneficial effects of the embodiments of this application are as follows:

[0028] In the embodiments of this application, the workpiece is placed on a worktable and then polished using a polishing assembly to remove substances from the workpiece surface. Polishing the workpiece using only the polishing assembly removes rosin residue from the gold finger surface, ensuring it meets electrical connection requirements. Compared to gold plating the gold finger area of ​​the workpiece, the polishing device of this application can be repeatedly used, allowing for polishing of the gold finger areas of multiple workpieces, thus reducing costs. Furthermore, the relative position between the workpiece and the polishing assembly is adjusted using a first adjusting mechanism, enabling the polishing device provided by this application to be applicable to workpieces of more specifications. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a three-dimensional structural schematic diagram of a grinding device provided in an embodiment of this application;

[0031] Figure 2 This is a three-dimensional structural schematic diagram of another polishing device provided in some embodiments of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Worktable; 11. Carrying surface; 2. Grinding assembly; 3. First adjustment mechanism; 4. Support base; 5. Drive mechanism; 6. Transmission assembly; 7. Control mechanism; 8. Input assembly; 9. Fixing assembly; 91. First fixing block; 92. Second fixing block; 10. Second adjustment mechanism. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application.

[0035] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features.

[0036] The use of “based on” in this application implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0037] In this application, the term "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use this application. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be made without using these specific details. In other instances, well-known structures and processes are not described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0038] In related technologies, particularly in the field of liquid crystal display technology, a common connection method for LED strips in backlight modules involves connecting the LED strips with gold fingers and sockets. However, during the manufacturing process of the gold fingers, solder paste is typically applied directly to the copper foil pads of the gold fingers, using rosin as a flux for soldering. Rosin residue can adhere to the gold fingers, forming an insulating film that affects their electrical contact performance, leading to poor contact and open circuits. To improve this situation, related technologies add a gold plating process, plating the gold fingers with gold. This utilizes gold's excellent conductivity and oxidation resistance to improve the problems caused by soldering. However, the high cost of gold significantly increases manufacturing costs.

[0039] In view of the above situation, this application provides a polishing device to at least partially improve the above situation.

[0040] Please see Figure 1 , Figure 1 This is a three-dimensional structural diagram of a grinding device provided in an embodiment of this application. The present application provides a grinding device including: a worktable 1 configured to support a workpiece; a grinding assembly 2 configured to grind the workpiece; and a first adjustment mechanism 3 connected to the grinding assembly 2 and configured to adjust the relative position between the grinding assembly 2 and the workpiece.

[0041] To mitigate the impact of rosin residue adsorbed on the gold fingers on their performance, in this embodiment, the workpiece (such as an electrical connector with gold fingers) is placed on a worktable 1, and then the gold fingers are polished using a polishing assembly 2 to remove substances (such as rosin residue) from the gold finger surface, ensuring the workpiece meets requirements such as surface roughness and electrical contact performance. This polishing alone, using the polishing assembly 2, achieves the desired results. Compared to gold plating the gold finger area of ​​the workpiece, this polishing device can be repeatedly used, allowing for polishing of the gold finger areas of multiple workpieces, thus reducing costs. Furthermore, the first adjusting mechanism 3 adjusts the relative position between the workpiece and the polishing assembly 2, enabling the polishing assembly 2 provided in this embodiment to be applicable to workpieces of more specifications. The adjustable relative position between the polishing assembly 2 and the workpiece means that even if multiple areas on the same workpiece require polishing, this can be achieved by adjusting the relative position between the polishing assembly 2 and the workpiece. This further expands the applicability of the polishing device provided in this embodiment.

[0042] Please continue reading. Figure 1 The aforementioned grinding device further includes: a support base 4 having a receiving cavity, with a worktable 1 disposed within the receiving cavity; and a drive mechanism 5 disposed on the side of the receiving cavity, connected to the grinding assembly 2, and configured to drive the grinding assembly 2 to grind the workpiece.

[0043] Grinding workpieces typically produces debris, powder, and other small particles. If these particles are swept directly from the worktable 1 onto the ground, they can easily spread further as the operator moves, making collection and disposal difficult. In this embodiment, the worktable 1 is placed within the receiving cavity of the support base 4. On one hand, the height of the worktable 1 can be adjusted using the support base 4 to facilitate grinding operations. On the other hand, the debris and powder generated during grinding can be collected using the receiving cavity, making it easier to process them after the grinding operation is completed.

[0044] Please continue reading. Figure 1 In some embodiments of this application, the above-mentioned polishing device further includes: a transmission component 6, which connects the drive mechanism 5 and the polishing component 2, and is configured to drive the polishing component 2 to move with the movement of the drive mechanism 5.

[0045] If the grinding component 2 is directly driven by the driving mechanism 5, the position and driving method of the driving mechanism 5 will also limit the position and grinding method (such as rolling grinding, reciprocating grinding), resulting in only a small number of workpieces being able to be ground. Therefore, in this embodiment, in order to be applicable to workpieces of various specifications (such as size, shape, etc.), the grinding device provided in this embodiment also has a transmission component 6. The transmission component 6 is used to connect the grinding component 2 and the driving mechanism 5, so that the grinding component 2 can be arranged in more positions, thereby being used to grind more types / specifications of workpieces.

[0046] In some embodiments of this application, the transmission component 6 is a belt, the grinding component 2 is a grinding wheel, and the drive mechanism 5 includes an output shaft, with one end of the belt connected to the output shaft and the other end connected to one end of the grinding wheel.

[0047] In some embodiments of this application, the first adjustment mechanism 3 includes a telescopic rod (not shown in the figure), one end of which is connected to the grinding assembly 2 and the other end of which is connected to the bottom surface of the receiving cavity, and is configured to adjust the relative position between the grinding assembly 2 and the workpiece.

[0048] Since the specifications of workpieces vary and the grinding areas of workpieces are also different, the first adjustment mechanism 3 in this embodiment of the application also includes a telescopic rod. The telescopic rod allows the grinding component 2 to have more positions, so that the appropriate position can be selected according to the specific situation of the workpiece, thereby making the grinding device provided in this embodiment of the application more applicable.

[0049] In some embodiments of this application, the telescopic rod is rotatably connected to the grinding assembly 2, and the telescopic rod is rotatably connected to the bottom surface of the receiving cavity.

[0050] Although the telescopic rod can adjust the position between the grinding component 2 and the workpiece, its adjustment range and method are relatively limited. Therefore, in this embodiment, the telescopic rod and the receiving cavity of the support base 4 are rotatably connected, so that the position of the grinding component 2 can be adjusted not only in the telescopic direction of the telescopic rod, but also in combination with the rotation of the telescopic rod. As a result, the applicability is further improved, and it can be applied to workpieces of more specifications.

[0051] It is understandable that when adjusting the position of the grinding component 2 using the telescopic rod, either rotation followed by extension or extension followed by rotation is acceptable, depending on the actual processing conditions. This application does not impose any restrictions on this.

[0052] Please see Figure 2 , Figure 2This is a three-dimensional structural schematic diagram of another grinding device provided in some embodiments of this application. In some embodiments of this application, the grinding device further includes: a control mechanism 7, which is disposed on the side of the support base 4 and connected to the drive mechanism 5 and the first adjustment mechanism 3, and is configured to control the operation of the drive mechanism 5; and / or control the operation of the first adjustment mechanism 3 to adjust the relative position between the grinding component 2 and the workpiece.

[0053] If the drive mechanism 5 is manually operated by the operator to process the workpiece, the grinding accuracy of the workpiece is difficult to control due to human limitations. In this embodiment, the control mechanism 7 is used to control the action of the grinding component 2, so that the grinding component 2 can grind the workpiece more finely and controllably, thereby improving the accuracy and controllability of the grinding.

[0054] Please continue reading. Figure 2 In some embodiments of this application, the above-mentioned polishing device further includes: an input component 8 connected to a control mechanism 7 and configured to allow an operator to input workpiece parameters to the control mechanism 7; the control mechanism 7 is configured to control the first adjustment mechanism 3 to adjust the relative position between the polishing component 2 and the workpiece according to the parameters.

[0055] Different workpieces may require different parts to be polished. If the polishing is judged manually to determine whether it meets the requirements, the results will be inaccurate, resulting in inconsistent quality of the polished workpieces. Therefore, the polishing device provided in this embodiment includes an input component 8. Before polishing the workpiece, the operator can input the relevant parameters of the workpiece through the input component 8. The input component 8 then sends the relevant parameters to the control mechanism 7. The control mechanism 7 can then control the polishing of the workpiece based on the relevant parameters. The relevant parameters of the workpiece may be the thickness of the material to be removed by polishing, etc.

[0056] In some embodiments of this application, the grinding device may further include a sensing component (not shown in the figure) configured to sense whether the workpiece is in contact with the grinding component 2. When the workpiece is in contact with the grinding component 2, the feed rate of the grinding component 2 is calculated to precisely control the thickness of the workpiece that is ground off and improve the grinding accuracy.

[0057] Please continue reading. Figure 2 In some embodiments of this application, the workbench 1 has a carrying surface 11, which is configured to carry a workpiece. The grinding device further includes a fixing component 9, which includes a first fixing block 91 and a second fixing block 92 disposed opposite to each other. The first fixing block 91 and the second fixing block 92 are respectively disposed on opposite sides of the carrying surface 11. The fixing component 9 is configured to fix the workpiece.

[0058] In this embodiment, the workpiece is polished by the friction between the workpiece and the polishing component 2. To prevent the workpiece from shifting due to friction during polishing and affecting the polishing process, the polishing device in this embodiment also includes a fixing component 9. The fixing component 9 is used to fix the workpiece and ensure the stability of the workpiece polishing process.

[0059] Please continue reading. Figure 2 In some embodiments of this application, the above-mentioned polishing device further includes: a second adjustment mechanism 10, which is connected to the fixing component 9 and the control mechanism 7; the control mechanism 7 is configured to adjust the distance between the first fixing block 91 and the second fixing block 92 according to parameters.

[0060] In this embodiment of the application, since the workpieces come in a variety of sizes, in order to be applicable to more specifications of workpieces, the grinding device provided in this embodiment of the application also includes a second adjustment mechanism 10, which can be used to adjust the fixed component 9.

[0061] Furthermore, in some embodiments of this application, the first fixing block 91 and the second fixing block 92 are symmetrically arranged, and the control mechanism 7 controls the first fixing block 91 and the second fixing block 92 to move along the axis of symmetry according to parameters. In this way, the fixing position of the workpiece can be flexibly determined according to the area of ​​the workpiece to be polished. For example, if the workpiece to be polished has multiple areas to be polished and multiple polishing operations are required, if the fixing component 9 cannot move along the axis of symmetry, then when polishing the workpiece multiple times, in order to avoid the fixing component 9 interfering with the polishing component 2, it may be necessary to adjust both the position of the polishing component 2 and the fixing position of the workpiece, which increases the polishing time and reduces efficiency. However, the fixing component 9 of the polishing device provided in this application can move along the axis of symmetry, so that the position of the fixing component 9 can be adjusted according to the position of the area to be polished on the workpiece. This allows the workpiece to be polished as many areas as possible after being fixed once, thereby reducing the number of times the workpiece position needs to be adjusted and improving processing efficiency.

[0062] The above provides a detailed description of a grinding device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A polishing device, characterized in that, include: The worktable is configured to hold the workpiece; A grinding assembly is configured to grind the workpiece; A first adjustment mechanism, connected to the grinding assembly, is configured to adjust the relative position between the grinding assembly and the workpiece.

2. The polishing device according to claim 1, characterized in that, Also includes: The support base has a receiving cavity, and the worktable is disposed within the receiving cavity; A drive mechanism is disposed on the side of the receiving cavity and connected to the grinding assembly. It is configured to drive the grinding assembly to grind the workpiece.

3. The polishing device according to claim 2, characterized in that, Also includes: A transmission assembly, connecting the drive mechanism and the polishing assembly, is configured to drive the polishing assembly to move in accordance with the movement of the drive mechanism.

4. The polishing device according to claim 3, characterized in that, The transmission component is a belt, the grinding component is a grinding wheel, and the drive mechanism includes an output shaft. One end of the belt is connected to the output shaft, and the other end is connected to one end of the grinding wheel.

5. The polishing device according to claim 2, characterized in that, The first adjustment mechanism includes: The telescopic rod, with one end connected to the grinding assembly and the other end connected to the bottom surface of the receiving cavity, is configured to adjust the relative position between the grinding assembly and the workpiece.

6. The polishing apparatus according to claim 5, characterized in that, The telescopic rod is rotatably connected to the grinding assembly, and the telescopic rod is rotatably connected to the bottom surface of the receiving cavity.

7. The polishing apparatus according to claim 5, characterized in that, Also includes: A control mechanism is disposed on the side of the support base and connected to the drive mechanism and the first adjustment mechanism, and is configured to control the operation of the drive mechanism; And / or control the first adjustment mechanism to adjust the relative position between the grinding assembly and the workpiece.

8. The polishing apparatus according to claim 7, characterized in that, Also includes: An input component, connected to the control mechanism, is configured to allow an operator to input parameters of the workpiece into the control mechanism; The control mechanism is configured to control the first adjustment mechanism to operate according to the parameters, so as to adjust the relative position between the grinding assembly and the workpiece.

9. The polishing apparatus according to claim 8, characterized in that, The worktable has a carrying surface configured to support the workpiece, and the grinding device further includes: The fixing component includes a first fixing block and a second fixing block disposed opposite to each other on opposite sides of the workpiece surface, and the fixing component is configured to fix the workpiece.

10. The polishing apparatus according to claim 9, characterized in that, Also includes: The second adjustment mechanism is connected to the fixed component and the control mechanism; The control mechanism is configured to adjust the distance between the first fixed block and the second fixed block according to the parameters.

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