Electrostatic adsorption mechanism and detection device

Abstract

The utility model relates to an electrostatic adsorption mechanism and a detection device, the electrostatic adsorption mechanism is used for adsorbing a base body, the electrostatic adsorption mechanism comprises a support, an adsorption plate and a leveling module, the adsorption plate is movably arranged on the support and can move in the direction close to or away from the base body, and the adsorption plate is used for adsorbing the base body; the leveling module is arranged on the support and used for adjusting the levelness of the adsorption plate. According to the electrostatic adsorption mechanism, the levelness of the adsorption plate is adjusted through the leveling module, so that the adsorption plate adsorbs the base body in the preset horizontal state, the alignment adsorption precision between the adsorption plate and the base body is guaranteed, and when the adsorption plate moves in the direction close to the base body and adsorbs the base body, the base body is attached to the adsorption plate; defective phenomena such as deflection and collapse of the middle position of the base body are avoided, and the flatness of the base body is guaranteed.

Description

Technical Field

[0001] This application relates to the field of panel manufacturing technology, and in particular to an electrostatic adsorption mechanism and a detection device. Background Technology

[0002] With the development of the display industry, various display modules used for user interaction are being applied more and more widely. For example, OLED (Organic Light-Emitting Diode), as an active light-emitting technology, is widely used in display products such as mobile phones and televisions due to its excellent color, contrast, and flexibility. In order to ensure the production quality of display panels, performance and appearance testing must be carried out on the display panels before they are put into the market.

[0003] In the process of display panel testing, in order to improve the testing efficiency, multiple display panels are generally supported by a carrier to form a substrate for batch testing. Because the carrier supports multiple display panels, under its own weight, the middle part of the substrate may experience defects such as bending and collapse, affecting the test results of substrate performance and appearance. Utility Model Content

[0004] Therefore, it is necessary to provide an electrostatic adsorption mechanism and detection device to address the problem that defects such as bending and collapse may occur in the middle of the substrate when multiple display panels are used as the substrate during the testing process.

[0005] An electrostatic adsorption mechanism for adsorbing a substrate, the electrostatic adsorption mechanism comprising:

[0006] support;

[0007] An adsorption plate, movably mounted on the support and capable of moving towards or away from the substrate, is used to adsorb the substrate; and

[0008] A leveling module, which is mounted on the bracket, is used to adjust the levelness of the adsorption plate.

[0009] In one embodiment, the bracket includes a base and a mounting plate, the leveling module includes multiple adjusting components, the mounting plate is movably connected to the base through the multiple adjusting components, and the adsorption plate is disposed on the mounting plate.

[0010] In one embodiment, the electrostatic adsorption mechanism further includes a lifting module, which is disposed on the bracket and is connected to the adsorption plate for driving the adsorption plate to move toward or away from the substrate.

[0011] In one embodiment, the electrostatic adsorption mechanism further includes a position adjustment module, which is disposed on the support and connected to the adsorption plate. The position adjustment module is used to adjust the position of the adsorption plate relative to the substrate.

[0012] In one embodiment, the electrostatic adsorption mechanism further includes multiple connecting shafts, which are spaced apart along the circumferential direction of the adsorption plate, and are used to connect the adsorption plate and the support.

[0013] In one embodiment, the electrostatic adsorption mechanism further includes a peeling component disposed on the support for peeling off the substrate adsorbed by the adsorption plate.

[0014] In one embodiment, the peeling assembly includes a drive source, a drive shaft, a movable plate, and at least one ejector pin. The movable plate is movably disposed on the bracket and is driven to the drive source via the drive shaft. The drive source can drive the movable plate to move toward a side closer to or further away from the adsorption plane of the adsorption plate. The ejector pin is disposed on the movable plate and is at least partially movably inserted into the adsorption plate.

[0015] When the movable plate moves toward the side closer to the adsorption plane of the adsorption plate, the ejector pin extends at least partially to the outside of the adsorption plane of the adsorption plate.

[0016] In one embodiment, the ejector pin includes a top post and an elastic member. The top post is connected to the movable plate, and the elastic member is disposed at the end of the top post away from the movable plate. When the movable plate moves toward the side close to the adsorption plane of the adsorption plate, the elastic member extends at least partially to the outside of the adsorption plane of the adsorption plate.

[0017] In one embodiment, the electrostatic adsorption mechanism further includes multiple guide rods, which are spaced apart on the support, and the extension direction of the guide rods is consistent with the movement direction of the adsorption plate.

[0018] A detection device for adsorption detection of a matrix, the detection device comprising:

[0019] The electrostatic adsorption mechanism as described in any of the above technical solutions.

[0020] The aforementioned electrostatic adsorption mechanism and detection device adjust the level of the adsorption plate through a leveling module, ensuring that the adsorption plate adsorbs the substrate in a preset horizontal state, thus guaranteeing the alignment and adsorption accuracy between the adsorption plate and the substrate. Furthermore, as the adsorption plate moves towards the substrate and adsorbs it, the substrate adheres to the adsorption plate, preventing bending or collapse in the middle of the substrate and ensuring its flatness. Attached Figure Description

[0021] Figure 1 This is a schematic diagram showing the position of the substrate during the detection process in some embodiments.

[0022] Figure 2 This is a schematic diagram of the electrostatic adsorption mechanism provided in some embodiments.

[0023] Figure 3 This is a schematic diagram of the detection device provided in some embodiments.

[0024] Figure 4 This is a side view of a portion of the electrostatic adsorption mechanism provided in some embodiments.

[0025] Figure 5 for Figure 4 Sectional view along the AA direction.

[0026] Figure label:

[0027] 100. Electrostatic adsorption mechanism;

[0028] 110. Bracket; 111. Base; 112. Mounting plate; 120. Adsorption plate; 130. Leveling module; 131. Adjusting component; 140. Lifting module; 141. Position adjustment module; 150. Connecting shaft; 160. Peeling assembly; 161. Drive source; 162. Transmission shaft; 163. Movable plate; 164. Ejector pin; 1641. Ejector column; 1642. Elastic component;

[0029] 200, Substrate; 210, Panel; 300, Frame;

[0030] 400. Detection device. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0037] The technical solutions provided by the embodiments of this application are described below with reference to the accompanying drawings.

[0038] Currently, see Figure 1 As shown, during the inspection of panel 210, in order to improve the inspection efficiency of panel 210, multiple panels 210 are generally supported by a carrier 300 to form a substrate 200 for batch inspection of multiple panels 210. Since the carrier 300 supports multiple panels 210, under its own weight, the middle position of the substrate 200 may experience defects such as deflection and collapse, affecting the inspection results of the substrate 200's performance and appearance.

[0039] Based on the above issues, please refer to... Figure 2 As shown, this application provides an electrostatic adsorption mechanism 100, which includes a support 110, an adsorption plate 120, and a leveling module 130. The electrostatic adsorption mechanism 100 is used to adsorb a substrate 200, and the substrate 200 includes multiple arrayed panels 210. Exemplarily, in this embodiment, the panels 210 can be display panels for mobile phones, computers, cameras, etc.

[0040] The adsorption plate 120 is movably mounted on the support 110 and can move towards or away from the substrate 200. The adsorption plate 120 is used to adsorb the substrate 200. For example, when the adsorption plate 120 moves towards the substrate 200 and adsorbs the substrate 200, the substrate 200 adheres to the adsorption plate 120, avoiding defects such as bending or collapse in the middle of the substrate 200, ensuring the flatness of the substrate 200, and thus ensuring the reliability of the test results such as the performance and appearance of the substrate 200. After the test of the substrate 200 is completed, the adsorption plate 120 moves away from the substrate 200 to release the adsorption of the substrate 200, facilitating the unloading and replacement of the substrate 200. It should be noted that the adsorption plane of the adsorption plate 120 is equal in size to the adsorption plane of the substrate 200, or the adsorption plane of the adsorption plate 120 is slightly larger than the adsorption plane of the substrate 200. This ensures that the substrate 200 can adhere to the adsorption plate 120 during the adsorption process, preventing bending, collapse, or other adverse phenomena in the middle of the substrate 200 during adsorption. In this embodiment, the adsorption plate 120 can be an electrostatic adsorption structure that uses electrostatic attraction to adsorb and fix the substrate 200, and separation between the adsorption plate 120 and the substrate 200 can be achieved when the electrostatic adsorption effect of the adsorption plate 120 on the substrate 200 is released.

[0041] The leveling module 130 is mounted on the bracket 110 and is used to adjust the level of the adsorption plate 120. By adjusting the level of the adsorption plate 120, the adsorption plate 120 adsorbs the substrate 200 in a preset horizontal state, ensuring the alignment and adsorption accuracy between the adsorption plate 120 and the substrate 200.

[0042] In one embodiment, see Figure 1 and Figure 2 As shown, the bracket 110 includes a base 111 and a mounting plate 112. The leveling module 130 includes multiple adjusting components 131. The mounting plate 112 is movably connected to the base 111 via the multiple adjusting components 131. The adsorption plate 120 is disposed on the mounting plate 112. Since the mounting plate 112 is movably connected to the base 111, the connection position of the mounting plate 112 relative to the base 111 can be adjusted via the multiple adjusting components 131 to adjust the levelness of the adsorption plate 120, so that the adsorption plate 120 adsorbs the substrate 200 in a preset horizontal state, ensuring the alignment and adsorption accuracy between the adsorption plate 120 and the substrate 200. Exemplarily, in one embodiment, the adjusting components 131 are set screws, bolts, etc., and multiple adjusting components 131 are spaced apart on the mounting plate 112. The mounting plate 112 is movably connected to the base 111 via the adjusting components 131, and the connection position of the mounting plate 112 relative to the base 111 can be adjusted via the adjusting components 131 to adjust the levelness of the adsorption plate 120.

[0043] In one embodiment, see Figure 1 and Figure 2 As shown, the electrostatic adsorption mechanism 100 also includes a lifting module 140, which is disposed on the bracket 110 and is connected to the adsorption plate 120. The lifting module 140 is used to drive the adsorption plate 120 to move towards or away from the substrate 200, so that the adsorption plate 120 can horizontally adsorb the substrate 200. In this embodiment, the lifting module 140 is a drive motor. Of course, in other feasible embodiments, the lifting module 140 can also be a drive cylinder, a drive hydraulic cylinder, or other components capable of outputting power.

[0044] Further, see Figure 1 and Figure 2 As shown, the electrostatic adsorption mechanism 100 also includes a position adjustment module 141, which is disposed on the bracket 110 and connected to the adsorption plate 120. The position adjustment module 141 is used to adjust the position of the adsorption plate 120 relative to the substrate 200. For example, see [reference needed]. Figure 2 As shown, the position adjustment module 141 is connected to the adsorption plate 120 via the lifting module 140. The position adjustment module 141 is used to drive the adsorption plate 120 to move along the X / Y direction and rotate in the θ direction. That is to say, the position adjustment module 141 and the lifting module 140 are connected in a transmission manner. Since the adsorption plate 120 is connected to the lifting module 140, the lifting module 140 can indirectly connect the adsorption plate 120 to the position adjustment module 141. The position adjustment module 141 enables the adsorption plate 120 to move relative to the substrate 200 in the X / Y direction and rotate in the θ direction. By adjusting the position of the adsorption plate 120 in the X, Y, and θ directions, the alignment operation between the adsorption plate 120 and the substrate 200 is performed.

[0045] In one embodiment, see Figure 1 and Figure 2 As shown, multiple adjustment components 131 are spaced apart along the circumferential direction of the mounting plate 112, so that each adjustment component 131 can independently adjust the levelness of each area of ​​the adsorption plate 120, thereby ensuring a large degree of adjustment freedom for each area of ​​the adsorption plate 120 and improving the adjustment accuracy of the adsorption plate 120.

[0046] During the adsorption process on the large-size substrate 200, the adsorption plate 120 is relatively large. Therefore, please refer to... Figure 1 and Figure 2As shown, the electrostatic adsorption mechanism 100 also includes multiple connecting shafts 150. These connecting shafts 150 are spaced apart along the circumferential direction of the adsorption plate 120. The connecting shafts 150 connect the adsorption plate 120 to the support 110, allowing the adsorption plate 120 to be movably positioned on the support 110. Because the multiple connecting shafts 150 are spaced apart along the circumferential direction of the adsorption plate 120, during the connection process, the connecting shafts 150 apply a uniform connecting force to each area of ​​the adsorption plate 120. When the adsorption plate 120 is connected to the support 110, the overall flatness of the adsorption plate 120 is ensured, guaranteeing that the substrate 200 can be flatly attached to the adsorption plate 120 during the adsorption process. This further prevents defects such as bending or collapse of the substrate 200 in the middle during adsorption.

[0047] Further, see Figure 1 and Figure 2 As shown, the adsorption plate 120 is detachably connected to the bracket 110, such as by screwing or snapping. Thus, when adsorbing substrates 200 of different sizes, different sizes of adsorption plates 120 can be used to achieve adsorption and leveling operations on substrates 200 of different specifications, expanding the applicable scenarios of the electrostatic adsorption mechanism 100 and reducing its operating cost.

[0048] In one embodiment, see Figure 1 , Figure 2 and Figure 4 As shown, the electrostatic adsorption mechanism 100 also includes a peeling component 160. The peeling component 160 is disposed on the support 110 and is used to peel the substrate 200 adsorbed by the adsorption plate 120 so that the adsorption plate 120 and the substrate 200 can be quickly separated after the substrate 200 is detected, which facilitates the unloading and replacement of the substrate 200.

[0049] Specifically, see Figure 1 , Figure 2 , Figure 4 and Figure 5As shown, the peeling assembly 160 includes a drive source 161, a drive shaft 162, a movable plate 163, and at least one ejector pin 164. The movable plate 163 is movably mounted on the bracket 110 and is connected to the drive source 161 via the drive shaft 162. The drive source 161 can drive the movable plate 163 to move toward a side closer to or away from the adsorption plane of the adsorption plate 120. The ejector pin 164 is disposed on the movable plate 163 and is at least partially movably inserted into the adsorption plate 120. If a through hole is provided in the adsorption plate 120, the ejector pin 164 is partially or completely inserted into the through hole. When the movable plate 163 moves toward a side closer to the adsorption plane of the adsorption plate 120, the ejector pin 164 extends at least partially to the outside of the adsorption plane of the adsorption plate 120. For example, when the adsorption plate 120 needs to adsorb the substrate 200, the drive source 161 drives the movable plate 163 to move away from the adsorption plane. The movable plate 163 drives the ejector pin 164 to move away from the adsorption plane of the adsorption plate 120. The ejector pin 164 is housed within the adsorption plate 120 and will not interfere with the adsorption of the substrate 200 by the adsorption plate 120. Conversely, when the adsorption plate 120 needs to be separated from the substrate 200, The drive source 161 drives the movable plate 163 to move toward the side close to the adsorption plane of the adsorption plate 120. The movable plate 163 drives the ejector pin 164 to move toward the side close to the adsorption plane of the adsorption plate 120. The ejector pin 164 extends at least partially to the outside of the adsorption plane of the adsorption plate 120. The ejector pin 164 abuts against the surface of the substrate 200 to apply abutting force to the surface of the substrate 200, thereby realizing the separation between the adsorption plate 120 and the substrate 200, which facilitates the unloading and replacement of the substrate 200.

[0050] Since the substrate 200 is typically large, multiple ejector pins 164 are preferably arranged at intervals on the movable plate 163. These multiple ejector pins 164 can simultaneously apply abutment force to various areas of the substrate 200, achieving rapid separation between the adsorption plate 120 and the substrate 200. The drive source 161 can be a linear motor, a drive cylinder, etc. This application does not limit the specific type of the drive source 161.

[0051] Further, see Figure 1 , Figure 2 , Figure 4 and Figure 5As shown, the ejector pin 164 includes an ejector pin 1641 and an elastic element 1642. The ejector pin 1641 is connected to the movable plate 163, and the elastic element 1642 is disposed at the end of the ejector pin 1641 away from the movable plate 163. That is, the two ends of the ejector pin 1641 are respectively connected to the movable plate 163 and the elastic element 1642. When the movable plate 163 moves toward the side close to the adsorption plane of the adsorption plate 120, the elastic element 1642 extends at least partially to the outside of the adsorption plane of the adsorption plate 120. Through the elastic force applied to the surface of the substrate 200 by the elastic element 1642, the adsorption plate 120 and the substrate 200 can be separated. The buffered contact between the elastic element 1642 and the substrate 200 will not cause scratches, pressure damage or other adverse phenomena to the surface of the substrate 200 due to excessive force applied to the surface of the substrate 200, thus protecting the substrate 200. Among them, the elastic element 1642 can be a flexible element such as a spring or an elastic sheet. This application does not limit the specific element type of the elastic element 1642.

[0052] Furthermore, see Figure 1 and Figure 2 As shown, the electrostatic adsorption mechanism 100 also includes multiple guide rods (not shown in the figure). The multiple guide rods are spaced apart on the bracket 110, and the extension direction of the guide rods is consistent with the movement direction of the adsorption plate 120. The guide rods can guide and limit the movement path of the movable plate 152, further improving the alignment and adsorption accuracy of the adsorption plate 120.

[0053] Additionally, see Figures 1-3 As shown, this application also provides a detection device 400, which includes an electrostatic adsorption mechanism 100 as described above. The detection device 400 is used to perform adsorption detection on a substrate 200. For example, after adsorbing the substrate 200, the detection device 400 can perform performance and appearance detection on the substrate 200. The substrate 200 includes multiple arrayed panels 210.

[0054] The aforementioned testing device 400 adjusts the level of the adsorption plate 120 via the leveling module 130, ensuring that the adsorption plate 120 adsorbs the substrate 200 in a preset horizontal state, thus guaranteeing the alignment and adsorption accuracy between the adsorption plate 120 and the substrate 200. Furthermore, as the adsorption plate 120 moves towards the substrate 200 and adsorbs it, the substrate 200 adheres to the adsorption plate 120, preventing bending or collapse in the middle of the substrate 200, ensuring the flatness of the substrate 200, and consequently guaranteeing the reliability of the test results regarding the performance and appearance of the substrate 200.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An electrostatic adsorption mechanism for adsorbing a substrate, characterized in that, The electrostatic adsorption mechanism includes: support; An adsorption plate, movably mounted on the support and capable of moving towards or away from the substrate, is used to adsorb the substrate; and A leveling module, which is mounted on the bracket, is used to adjust the levelness of the adsorption plate.

2. The electrostatic adsorption mechanism according to claim 1, characterized in that, The bracket includes a base and a mounting plate. The leveling module includes multiple adjusting components. The mounting plate is movably connected to the base through the multiple adjusting components. The adsorption plate is disposed on the mounting plate.

3. The electrostatic adsorption mechanism according to claim 2, characterized in that, The electrostatic adsorption mechanism also includes a lifting module, which is disposed on the bracket and is connected to the adsorption plate for driving the adsorption plate to move toward or away from the substrate.

4. The electrostatic adsorption mechanism according to claim 3, characterized in that, The electrostatic adsorption mechanism further includes a position adjustment module, which is disposed on the bracket and connected to the adsorption plate. The position adjustment module is used to adjust the position of the adsorption plate relative to the substrate.

5. The electrostatic adsorption mechanism according to claim 1, characterized in that, The electrostatic adsorption mechanism also includes multiple connecting shafts, which are spaced apart along the circumferential direction of the adsorption plate. The connecting shafts are used to connect the adsorption plate and the support.

6. The electrostatic adsorption mechanism according to claim 1, characterized in that, The electrostatic adsorption mechanism further includes a peeling component, which is disposed on the support and is used to peel off the substrate adsorbed by the adsorption plate.

7. The electrostatic adsorption mechanism according to claim 6, characterized in that, The peeling assembly includes a drive source, a transmission shaft, a movable plate, and at least one ejector pin. The movable plate is movably disposed on the bracket and is connected to the drive source via the transmission shaft. The drive source can drive the movable plate to move toward a side closer to or further away from the adsorption plane of the adsorption plate. The ejector pin is disposed on the movable plate and is at least partially movably inserted into the adsorption plate. When the movable plate moves toward the side closer to the adsorption plane of the adsorption plate, the ejector pin extends at least partially to the outside of the adsorption plane of the adsorption plate.

8. The electrostatic adsorption mechanism according to claim 7, characterized in that, The ejector pin includes an ejector post and an elastic element. The ejector post is connected to the movable plate, and the elastic element is disposed at the end of the ejector post away from the movable plate. When the movable plate moves toward the side close to the adsorption plane of the adsorption plate, the elastic element extends at least partially to the outside of the adsorption plane of the adsorption plate.

9. The electrostatic adsorption mechanism according to claim 1, characterized in that, The electrostatic adsorption mechanism also includes multiple guide rods, which are spaced apart on the support, and the extension direction of the guide rods is consistent with the movement direction of the adsorption plate.

10. A detection device for adsorption detection of a matrix, characterized in that, The detection device includes: The electrostatic adsorption mechanism as described in any one of claims 1-9.

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