Silicon wafer pulling device and degumming production line

Abstract

The utility model relates to a silicon wafer pulling device and a degumming production line. The silicon wafer pulling device comprises a first pushing assembly and a second pushing assembly. The first pushing and pressing assembly is used for being arranged on one side of a silicon wafer and comprises a first pushing and pressing piece used for driving the bottom of the silicon wafer to turn over. The second pushing assembly is used for being arranged on the other side of the silicon wafer. The second pushing assembly comprises a second pushing piece used for driving the top of the silicon wafer to turn over. Under the mutual synergistic effect of the first pushing and pressing assembly and the second pushing and pressing assembly, automatic sheet pulling can be achieved, the working efficiency can be improved, and meanwhile the product yield can be effectively improved; in addition, the automation degree is high, and manual sheet pulling is not needed, so that the safety can be improved, the accuracy can be improved, and the failure rate can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon wafer production, in particular to a silicon wafer prying device and a degumming production line. BACKGROUND

[0002] The manufacturing of solar silicon wafers is generally performed by cutting a silicon rod into silicon wafers on an online cutting machine. The silicon rod is generally bonded to a glass rod by glue, and the glass rod is bonded to a crystal holder by glue. The crystal holder with the silicon wafers is placed in an automatic degumming machine, and the silicon wafers are degummed by the automatic degumming machine. After the automatic degumming machine completes the degumming operation, the degummed silicon wafers are manually pried, that is, the silicon wafers are manually pried to separate the silicon wafers from the crystal holder. However, during the manual prying process, the silicon wafers are not uniformly stressed when being pried, which easily leads to uneven prying, large loss of silicon wafers, and poor product quality. In addition, a person needs to be arranged at the discharging position of the silicon wafer degumming production line to perform the prying operation, which is complicated and has low automation and low prying efficiency. In addition, the crystal holder is lifted by a cantilever for prying operation, and the silicon wafers are fragile, which easily leads to scratches on the silicon wafers and safety hazards. SUMMARY

[0003] Therefore, it is necessary to overcome the defects of the prior art and provide a silicon wafer prying device and a degumming production line, which can automatically pry the silicon wafers, improve work efficiency, effectively improve product yield, and improve safety.

[0004] A silicon wafer prying device is used for prying silicon wafers on a crystal holder to separate the silicon wafers from the crystal holder. The silicon wafer prying device comprises:

[0005] A first pushing assembly is arranged on one side of the silicon wafers, and the first pushing assembly comprises a first pushing piece for driving the bottom of the silicon wafers to flip; and

[0006] A second pushing assembly is arranged on the other side of the silicon wafers, and the second pushing assembly comprises a second pushing piece for driving the top of the silicon wafers to flip.

[0007] In one embodiment, the second pushing assembly further comprises a power mechanism connected to the second pushing piece, and the power mechanism is used for driving the second pushing piece to reciprocate along a direction X close to or away from the silicon wafers.

[0008] In one embodiment, the first pushing assembly further comprises a first reset piece connected to the first pushing piece, and the first reset piece is used for being connected and fixed with a fixed support.

[0009] The silicon wafer flipping device further comprises a locking member and an unlocking assembly arranged on the fixed support; the locking member is provided with a locking position and an unlocking position, and the unlocking assembly can drive the locking member to move from the locking position to the unlocking position;

[0010] When the locking member is in the locking position, the locking member is in position cooperation with the first pushing member, and the first reset member is in the compressed state or the stretched state; when the locking member is in the unlocking position, the first reset member drives the first pushing member to move towards the bottom of the silicon wafer under the action of the reset force of the first reset member;

[0011] When the power mechanism is used to drive the second pushing member to move in the direction X towards the silicon wafer, the power mechanism can also drive the first pushing member to move through the second pushing member, so that the first pushing member drives the first reset member to switch to the compressed state or the stretched state, and the locking member is synchronously moved from the unlocking position to the locking position.

[0012] In one embodiment, the unlocking assembly comprises a support rod for supporting the silicon wafer, a second reset member connected between the support rod and the fixed support, and a support base connected with the fixed support; the support rod is rotatably connected with the support base, the support rod is further connected with the locking member, and the locking member and the second reset member are respectively located on opposite sides of the rotation axis of the support rod; the first pushing assembly further comprises an abutting seat fixedly connected with the first pushing member;

[0013] When the unlocking assembly is in the locking position, the locking member and the abutting seat abut against each other to limit the movement of the abutting seat and the first pushing member towards the silicon wafer;

[0014] When the support rod is pressed by the silicon wafer and the wafer holder, the second reset member can be compressed, so that the locking member moves from the locking position to the unlocking position, and the locking member in the unlocking position is separated from the abutting seat.

[0015] In one embodiment, the silicon wafer flipping device further comprises a movable pressing rod and a third reset member, one end of the movable pressing rod close to the locking member is rotatably connected with the abutting seat, the movable pressing rod is further connected with the abutting seat through the third reset member, the first pushing member is provided with a bottom wall parallel to the direction X, and the movable pressing rod is arranged at an angle with the bottom wall.

[0016] In one of the embodiments, the silicon wafer turning device further comprises a controller and a thickness sensor; the thickness sensor is used to identify the thickness d of the silicon wafer; the controller is electrically connected with the thickness sensor and the power mechanism respectively; the controller is used to control the speed of the power mechanism according to the thickness d of the silicon wafer sensed by the thickness sensor.

[0017] In one of the embodiments, the silicon wafer turning device further comprises a controller and a position sensor; the position sensor is used to sense the position of the first pushing member; the controller is electrically connected with the position sensor and the power mechanism respectively; the controller is used to control the power mechanism to start working according to the position of the first pushing member.

[0018] In one of the embodiments, the first pushing member and the second pushing member are arranged opposite to each other; the first pushing member is provided with a first pressing part protruding towards the second pushing member; the first pressing part is in abutment with the bottom of the silicon wafer when the first pushing member pushes the silicon wafer, so as to make the bottom of the silicon wafer overturn; the second pushing member is provided with a second pressing part protruding towards the first pushing member; the second pressing part is in abutment with the top of the silicon wafer when the second pushing member pushes the silicon wafer, so as to make the top of the silicon wafer overturn.

[0019] In one of the embodiments, the power mechanism comprises a power motor and an eccentric wheel connected with the power motor; the eccentric wheel is in abutment with the second pushing member and is used to drive the second pushing member to move close to the silicon wafer; the first pushing assembly further comprises a fourth reset member connected with the second pushing member; the fourth reset member is further used to be connected with a fixed support.

[0020] A degumming production line, the degumming production line comprises the silicon wafer turning device.

[0021] The silicon wafer turning device described above, when it is needed to turn the silicon wafer on the wafer holder, the first pushing member of the first pushing assembly performs one or more pushing actions on the bottom of the silicon wafer from one side of the silicon wafer, so as to drive the bottom of the silicon wafer to overturn, for example, along the counterclockwise direction; the second pushing member of the second pushing assembly performs one or more pushing actions on the top of the silicon wafer from the other side of the silicon wafer, so as to drive the top of the silicon wafer to overturn, for example, along the counterclockwise direction. It can be seen that, under the mutual coordination of the first pushing assembly and the second pushing assembly, the automatic turning of the silicon wafer can be realized, the work efficiency can be improved, and the product yield can be effectively improved; in addition, the degree of automation is high, manual turning is not needed, the safety can be improved, the precision can be improved, and the failure rate can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1A front view of a wafer pulling device according to an embodiment of the present application.

[0023] Figure 2 A front view of a wafer pulling device according to an embodiment of the present application. Figure 1 A perspective view of the structure shown in FIG. 1.

[0024] Figure 3 A front view of a wafer pulling device according to an embodiment of the present application. Figure 2 An enlarged view of the structure at A.

[0025] 10, wafer boat; 20, wafer; 30, first pushing assembly; 31, first pushing member; 311, first pressing portion; 312, bottom wall; 32, first reset member; 33, abutting seat; 34, movable pressing rod; 35, third reset member; 36, clamping region; 40, second pushing assembly; 41, second pushing member; 411, second pressing portion; 42, power mechanism; 421, power motor; 422, eccentric wheel; 50, fixed support; 60, locking member; 70, unlocking assembly; 71, support rod; 72, second reset member; 73, support seat. DETAILED DESCRIPTION

[0026] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of ways beyond the specific embodiments described and claimed herein. It is therefore intended that the present application not be limited in scope to the specific embodiments disclosed but rather that the scope of the present application be measured by the broadest permissible interpretation of the claims.

[0027] Referring to Figures 1 to 3 , Figure 1 A front view of a wafer pulling device according to an embodiment of the present application. Figure 2 A front view of a wafer pulling device according to an embodiment of the present application. Figure 1 A perspective view of the structure shown in FIG. 1. Figure 3 A front view of a wafer pulling device according to an embodiment of the present application. Figure 2 An enlarged view of the structure at A. A wafer pulling device according to an embodiment of the present application is provided for pulling a wafer 20 on a wafer boat 10 so that the wafer 20 can be separated from the wafer boat 10. The wafer pulling device includes a first pushing assembly 30 and a second pushing assembly 40. The first pushing assembly 30 is arranged on one side of the wafer 20 and includes a first pushing member 31 for driving the bottom of the wafer 20 to flip over. The second pushing assembly 40 is arranged on the other side of the wafer 20 and includes a second pushing member 41 for driving the top of the wafer 20 to flip over.

[0028] The silicon wafer flipping device described above, when the silicon wafer 20 on the wafer boat 10 needs to be flipped, the first pushing component 31 of the first pushing assembly 30 pushes the bottom of the silicon wafer 20 from one side of the silicon wafer 20 once or multiple times, so as to drive the bottom of the silicon wafer 20 to flip, for example, counterclockwise. The second pushing component 41 of the second pushing assembly 40 pushes the top of the silicon wafer 20 from the other side of the silicon wafer 20 once or multiple times, so as to drive the top of the silicon wafer 20 to flip, for example, counterclockwise. It can be seen that, under the mutual cooperation of the first pushing assembly 30 and the second pushing assembly 40, automatic flipping can be realized, the work efficiency can be improved, and the product yield can be effectively improved. In addition, the degree of automation is high, manual flipping is not needed, the safety can be improved, the accuracy can be improved, and the failure rate can be reduced.

[0029] In the embodiment, the silicon wafer 20 is placed in a collection frame after being separated from the wafer boat 10, and the collection frame is used to collect the silicon wafer 20. In addition, the wafer boat 10 is placed in a collection trolley, and the collection trolley is used to collect the silicon wafer 20. Then, the whole flipping process is completed.

[0030] Generally, the silicon wafer 20 is usually hung on the wafer boat 10, so as to be carried to a required station by the wafer boat 10 for a process such as degumming or flipping. Therefore, the top of the silicon wafer 20 in the embodiment refers to an end of the silicon wafer 20 connected to the wafer boat 10, and the bottom of the silicon wafer 20 refers to an end of the silicon wafer 20 away from the wafer boat 10.

[0031] Please refer to Figure 2 and Figure 3 In one embodiment, the second pushing assembly 40 further comprises a power mechanism 42 connected to the second pushing component 41. The power mechanism 42 is used to drive the second pushing component 41 to reciprocate along the direction X approaching or away from the silicon wafer 20. In this way, the second pushing component 41 is driven by the power mechanism 42 to realize the flipping action of the top of the silicon wafer 20 and the resetting action, so that the degree of automation is high, the work efficiency is high, and the safety is improved.

[0032] In addition, through the implementation of the automatic flipping scheme, the difficulty of manual flipping can be reduced, and the safety hidden danger in the flipping process can be reduced. After the implementation of the scheme, the implementation of the degumming automatic process can be accelerated.

[0033] In one embodiment, the first pushing assembly 30 further comprises a first resetting component 32 connected to the first pushing component 31. The first resetting component 32 is used to be connected and fixed with the fixed support 50. In addition, the silicon wafer flipping device further comprises a locking component 60 and an unlocking assembly 70 arranged on the fixed support 50. The locking component 60 is provided with a locking position and an unlocking position, and the unlocking assembly 70 can drive the locking component 60 to move from the locking position to the unlocking position.

[0034] When the locking member 60 is in the locking position, the locking member 60 is in position limiting cooperation with the first push member 31, and the first return member 32 is in the compressed state or the stretched state; when the locking member 60 is in the unlocking position, the first return member 32 drives the first push member 31 to move towards the bottom of the silicon wafer 20 under the action of the self-return force of the first return member 32.

[0035] When the power mechanism 42 is used to drive the second push member 41 to move in the direction X approaching the silicon wafer 20, the power mechanism 42 can also drive the first push member 31 to move through the second push member 41, so that the first push member 31 drives the first return member 32 to switch to the compressed state or the stretched state, and the locking member 60 is synchronized to move from the unlocking position to the locking position.

[0036] Therefore, for the first push assembly 30, a power source does not need to be separately configured. When the wafer pulling operation needs to be performed, the locking member 60 is moved from the locking position to the unlocking position through the unlocking assembly 70, so that the locking member 60 no longer limits the first push member 31, but drives the first push member 31 to move towards the bottom of the silicon wafer 20 under the action of the self-return force of the first return member 32, thereby driving the bottom of the silicon wafer 20 to flip. At the same time, for the second push assembly 40, the power mechanism 42 also drives the second push member 41 to move towards the top of the silicon wafer 20, thereby driving the top of the silicon wafer 20 to flip and separate from the crystal holder 10. The power mechanism 42 also drives the first push member 31 to move through the second push member 41, so that the first push member 31 drives the first return member 32 to move and switch to the compressed state or the stretched state, and the locking member 60 is synchronized to reset from the unlocking position to the locking position, thereby limiting the first push member 31.

[0037] In order to completely separate the silicon wafer 20 from the crystal holder 10, the first push assembly 30 and the second push assembly 40 each perform more than one wafer pulling operation, for example, two, three or more times, until the silicon wafer 20 is completely separated from the crystal holder 10.

[0038] It should be noted that the fixed support 50 in the embodiment can be flexibly adjusted and arranged at various positions including but not limited to the ground, the wall, the workbench or the machine table according to actual needs, so as to be in a stable and immobile posture as much as possible, which is conducive to the wafer pulling operation.

[0039] In one embodiment, the unlocking assembly 70 comprises a support rod 71 for supporting the silicon wafer 20, a second return member 72 connected between the support rod 71 and the fixed support 50, and a support base 73 connected with the fixed support 50. The support rod 71 is rotatably connected with the support base 73, and the support rod 71 is further connected with the locking member 60. The locking member 60 and the second return member 72 are respectively located on opposite sides of the rotation axis of the support rod 71. The first pushing assembly 30 further comprises an abutting base 33 fixedly connected with the first pushing member 31.

[0040] When the unlocking assembly 70 is in the locking position, the locking member 60 and the abutting base 33 abut against each other to limit the movement of the abutting base 33 and the first pushing member 31 towards the silicon wafer 20.

[0041] When the support rod 71 is pressed by the silicon wafer 20 and the wafer boat 10, the second return member 72 is compressed to move the locking member 60 from the locking position to the unlocking position. In the unlocking position, the locking member 60 and the abutting base 33 are separated from each other.

[0042] Therefore, when the wafer boat 10 and the silicon wafer 20 press the support rod 71, the support rod 71 is compressed to move the locking member 60 from the locking position to the unlocking position, i.e. automatic unlocking, which is convenient to operate. Figures 1 to 3 In addition, when the silicon wafer 20 is removed, the second pushing member 41 drives the first pushing member 31 to move and reset under the driving of the power mechanism 42. Under the resetting force of the second return member 72, the support rod 71 rotates to move the locking member 60 to the locking position.

[0043] In one embodiment, the silicon wafer unloading device further comprises a movable pressing rod 34 and a third return member 35. One end of the movable pressing rod 34 close to the locking member 60 is rotatably connected with the abutting base 33. The movable pressing rod 34 is further connected with the abutting base 33 through the third return member 35. The first pushing member 31 is provided with a bottom wall 312 parallel to the direction X. Optionally, the abutting base 33 is located below the bottom wall 312 and is spaced apart from the bottom wall 312. The movable pressing rod 34 and the third return member 35 are arranged in the spacing space.

[0044] In addition, the movable pressing rod 34 is arranged at an angle with the bottom wall 312. Specifically, the angle a between the movable pressing rod 34 and the bottom wall 312 includes but is not limited to 5° to 60°, for example, 5°, 15°, 30°, 45°, 60°, and the like. When the first pressing member 31 moves towards the silicon wafer 20, the locking member 60 moves to the clamping area 36 formed between the movable pressing rod 34 and the bottom wall 312, and the pressing force on the movable pressing rod 34 increases with the movement of the locking member 60, and the movable pressing rod 34 is correspondingly pressed. Conversely, when the first pressing member 31 moves away from the silicon wafer 20, the locking member 60 moves along the movable pressing rod 34 and is reset to the locking position under the drive of the second reset member 72.

[0045] It should be noted that the thickness d of the silicon wafer 20 includes but is not limited to 3mm-10mm, and can be set according to actual needs. When the thickness d of the silicon wafer 20 is smaller, the silicon wafer 20 is more likely to break under external force; conversely, when the thickness d of the silicon wafer 20 is larger, the silicon wafer 20 is less likely to break under external force, and the integrity is relatively better.

[0046] In one embodiment, the silicon wafer bending device further comprises a controller and a thickness sensor. The thickness sensor is used to identify the thickness d of the silicon wafer 20, and the controller is electrically connected with the thickness sensor and the power mechanism 42. The controller is used to control the speed of the power mechanism 42 according to the thickness d of the silicon wafer 20 sensed by the thickness sensor. In this way, the movement speed of the power mechanism 42 is flexibly adjusted according to the size of the thickness d of the silicon wafer 20, so that the silicon wafer 20 and the wafer holder 10 are separated from each other, and the speed of the power mechanism 42 is prevented from being too large to cause the silicon wafer 20 to break.

[0047] Specifically, when the thickness of the silicon wafer 20 is smaller, the movement speed of the power mechanism 42 is correspondingly smaller.

[0048] In some embodiments, the speed adjustment mode of the power mechanism 42 can be stepless adjustment, or can be set to multiple working gears in order from small to large, or can be set to more adjustment modes, which is not limited here.

[0049] In one embodiment, the silicon wafer bending device further comprises a controller and a position sensor. The position sensor is used to sense the position of the first pressing member 31, and the controller is electrically connected with the position sensor and the power mechanism 42. The controller is used to control the power mechanism 42 to start working according to the position of the first pressing member 31.

[0050] Optionally, the position sensor includes but is not limited to a travel switch, an optical coupling, an ultrasonic sensor, a magnetic sensor, and the like.

[0051] Specifically, when the silicon wafer 20 and the wafer boat 10 press down to trigger the support rod 71 to actuate the locking member 60 to move to the unlocking position, the first push member 31 moves towards the bottom of the silicon wafer 20, and when it moves to the preset position and is sensed by the position sensor, the controller controls the power mechanism 42 to start working, and the power mechanism 42 moves towards the top of the silicon wafer 20 to perform the wafer pulling operation. In this way, the automation degree is high, and the first push assembly 30 and the second push assembly 40 can be cooperated with each other, so as to facilitate the separation of the silicon wafer 20 from the wafer boat 10.

[0052] Of course, as some optional solutions, the position sensor can not be provided, and when the silicon wafer 20 and the wafer boat 10 are pressed to the position, the controller controls the power mechanism 42 to act.

[0053] In an embodiment, the first push member 31 and the second push member 41 are arranged opposite to each other. The first push member 31 is provided with a first pressing portion 311 protruding towards the second push member 41, and the first pressing portion 311 abuts against the bottom of the silicon wafer 20 when the first push member 31 pushes the silicon wafer 20, so as to overturn the bottom of the silicon wafer 20; the second push member 41 is provided with a second pressing portion 411 protruding towards the first push member 31, and the second pressing portion 411 abuts against the top of the silicon wafer 20 when the second push member 41 pushes the silicon wafer 20, so as to overturn the top of the silicon wafer 20. In this way, since the first push member 31 and the second push member 41 are arranged opposite to each other and are both provided with the protruding pressing portions facing each other, when the wafer pulling operation is performed on the silicon wafer 20, the first pressing portion 311 and the second pressing portion 411 abut against the bottom and the top of the silicon wafer 20 respectively, so as to effectively overturn the silicon wafer 20 and separate it from the wafer boat 10, and then the power mechanism 42 continues to move, the second push member 41 abuts against the first push member 31, so as to drive the first push member 31 to move away from the silicon wafer 20 for resetting, in preparation for the next wafer pulling operation.

[0054] In an embodiment, the power mechanism 42 comprises a power motor 421 and an eccentric wheel 422 connected with the power motor 421. The eccentric wheel 422 abuts against and cooperates with the second push member 41 and is used to drive the second push member 41 to move close to the silicon wafer 20. The first push assembly 30 further comprises a fourth reset member connected with the second push member 41 and used to be connected and fixed with the fixed support 50. In this way, when the power motor 421 drives the eccentric wheel 422 to rotate, the eccentric wheel 422 can synchronously drive the second push member 41 to move close to the silicon wafer 20, so as to drive the top of the silicon wafer 20 to overturn, and at the same time, the fourth reset member is deformed to store elastic potential energy, so that when the eccentric wheel 422 is driven by the power motor 421 to rotate and reset, the second push member 41 pushed out by the eccentric wheel 422 can also move away from the silicon wafer 20 under the elastic resetting force of the fourth reset member to realize automatic resetting.

[0055] In addition, when the eccentric wheel 422 rotates, the multiple flipping actions can be easily realized. In addition, in order to prevent the flipping action from being incomplete, the eccentric wheel 422 is driven by the power motor 421 to reciprocate at least two rounds and then ends the flipping action.

[0056] In some embodiments, the first reset member 32 to the fourth reset member are independently set according to actual needs, including but not limited to springs, elastic sheets, elastic strips, elastic blocks, etc. In addition, the number of each of the first reset member 32 to the fourth reset member is not limited to one, and can be two, three or more, as long as the required elastic force is met.

[0057] In some optional schemes, the power mechanism 42 is not limited to the combination of the power motor 421 and the eccentric wheel 422 in the above embodiments, and can be, for example, a lead screw motor, a cylinder, a hydraulic cylinder, a cam mechanism, etc., as long as it can drive the second push member 41 to reciprocate. The specific setting can be flexibly set according to actual needs.

[0058] Please refer to Figures 1 to 3 In one embodiment, a degumming production line includes the silicon wafer flipping device of any of the above embodiments.

[0059] The degumming production line described above, when the silicon wafer 20 on the wafer holder 10 needs to be flipped, the first push member 31 of the first push assembly 30 pushes the bottom of the silicon wafer 20 from one side of the silicon wafer 20 one or more times, thereby driving the bottom of the silicon wafer 20 to flip, for example, counterclockwise. The second push member 41 of the second push assembly 40 pushes the top of the silicon wafer 20 from the other side of the silicon wafer 20 one or more times, thereby driving the top of the silicon wafer 20 to flip, for example, counterclockwise. As can be seen, under the mutual cooperation of the first push assembly 30 and the second push assembly 40, automatic flipping can be realized, work efficiency can be improved, product yield can be effectively improved, and the degree of automation is high. Manual flipping is not required, safety can be improved, accuracy can be improved, and failure rate can be reduced.

[0060] The degumming production line and the silicon wafer flipping device of the above embodiments have been tested for one month, and the use effect is obvious:

[0061] 1. The success rate of flipping is 100%;

[0062] 2. The flipped silicon wafer 20 is flat, and the integrity rate reaches 90%;

[0063] 3. The time consumed for flipping is reduced by 60% compared with manual flipping;

[0064] 4. The automatic flipping device has been implemented and tested in the degumming automation project.

[0065] In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "counterclockwise", "clockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0066] In addition, if the terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0067] In the present application, unless otherwise explicitly specified and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0068] In the present application, unless otherwise explicitly specified and limited, if the first feature appears "on" or "under" the second feature or similar description, it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0069] It is to be noted that when an element such as a layer, film, or region is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. It will be understood that, when an element or layer is referred to as being "connected" to or "coupled" to another element or layer, it can be directly connected or coupled or intervening elements can be present. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0070] Various technical features described in the above embodiments can be combined in any manner, and for the sake of brevity, not all possible combinations are described. It will be apparent to those skilled in the art, however, that the scope of the disclosure includes all such possible combinations.

[0071] The above-described embodiments are merely illustrative for the present application and are not to be used in a limiting manner. It should be noted that, for those skilled in the art, some modifications and improvements can be made without departing from the concept of the present application, and these modifications and improvements should be considered within the scope of the present application. Therefore, the patent protection scope of the present application should be defined by the claims.

Claims

1. A silicon wafer bonding device for bonding a silicon wafer (20) on a crystal holder (10) so that the silicon wafer (20) can be separated from the crystal holder (10), characterized in that, The silicon wafer tiling device includes: A first pressing assembly (30), the first pressing assembly (30) being disposed on one side of the silicon wafer (20), the first pressing assembly (30) including a first pressing member (31) for driving the bottom of the silicon wafer (20) to flip; and A second pressing assembly (40) is arranged on the other side of the silicon wafer (20), and the second pressing assembly (40) includes a second pressing member (41) for driving the top of the silicon wafer (20) to flip.

2. The silicon wafer bonding apparatus according to claim 1, characterized in that, The second pressing assembly (40) further includes a power mechanism (42) connected to the second pressing member (41), the power mechanism (42) being used to drive the second pressing member (41) to reciprocate along a direction X that is close to or away from the silicon wafer (20).

3. The silicon wafer tiling device according to claim 2, characterized in that, The first pushing assembly (30) further includes a first reset member (32) connected to the first pushing member (31), the first reset member (32) being used to connect and fix to the fixed bracket (50); The silicon wafer slab assembly further includes a locking member (60) and an unlocking component (70) for mounting on the fixed bracket (50); the locking member (60) has a locking position and an unlocking position, and the unlocking component (70) enables the locking member (60) to move from the locking position to the unlocking position; When the locking member (60) is in the locked position, the locking member (60) is in a limiting cooperation with the first pushing member (31), and the first reset member (32) is in a pressed state or a stretched state; when the locking member (60) is in the unlocked position, the first reset member (32) drives the first pushing member (31) to move towards the bottom of the silicon wafer (20) under its own reset force; When the power mechanism (42) drives the second pusher (41) to move along the direction X close to the silicon wafer (20), the power mechanism (42) can also drive the first pusher (31) to move through the second pusher (41), so that the first pusher (31) drives the first reset member (32) to switch to the pressing state or the stretching state, and the locking member (60) moves from the unlocked position to the locked position simultaneously.

4. The silicon wafer tiling device according to claim 3, characterized in that, The unlocking assembly (70) includes a support rod (71) for supporting the silicon wafer (20), a second reset member (72) connected between the support rod (71) and the fixed bracket (50), and a support base (73) connected to the fixed bracket (50); the support rod (71) and the support base (73) are rotatably connected, and the support rod (71) is also connected to the locking member (60), the locking member (60) and the second reset member (72) are respectively located on opposite sides of the rotation axis of the support rod (71); the first pushing assembly (30) also includes an abutment seat (33) connected and fixed to the first pushing member (31); When the unlocking component (70) is in the locked position, the locking member (60) abuts against the abutment (33) to restrict the abutment (33) and the first pusher (31) from moving toward the silicon wafer (20); When the support rod (71) is pressed by the silicon wafer (20) and the crystal holder (10), it can compress the second reset member (72) so that the locking member (60) moves from the locked position to the unlocked position, and the locking member (60) in the unlocked position is separated from the abutment seat (33).

5. The silicon wafer tiling device according to claim 4, characterized in that, The silicon wafer slab assembly further includes a movable pressure rod (34) and a third reset member (35). The movable pressure rod (34) is rotatably connected to the abutment seat (33) at one end near the locking member (60). The movable pressure rod (34) is also connected to the abutment seat (33) through the third reset member (35). The first push member (31) has a bottom wall (312) parallel to the direction X. The movable pressure rod (34) and the bottom wall (312) are set at an angle.

6. The silicon wafer tiling device according to claim 2, characterized in that, The silicon wafer tiling device further includes a controller and a thickness sensor; the thickness sensor is used to identify the thickness d of the silicon wafer (20), and the controller is electrically connected to the thickness sensor and the power mechanism (42) respectively; the controller is used to control and adjust the speed of the power mechanism (42) according to the thickness d of the silicon wafer (20) sensed by the thickness sensor.

7. The silicon wafer tiling device according to claim 2, characterized in that, The silicon wafer slab assembly further includes a controller and a position sensor; the position sensor is used to sense the position of the first pusher (31), and the controller is electrically connected to the position sensor and the power mechanism (42) respectively; the controller is used to control the power mechanism (42) to start working according to the position of the first pusher (31).

8. The silicon wafer tiling device according to claim 2, characterized in that, The first pressing member (31) and the second pressing member (41) are arranged opposite to each other; the first pressing member (31) is provided with a first pressing part (311) protruding toward the second pressing member (41), the first pressing part (311) abuts against the bottom of the silicon wafer (20) when the first pressing member (31) presses the silicon wafer (20), so that the bottom of the silicon wafer (20) flips over; the second pressing member (41) is provided with a second pressing part (411) protruding toward the first pressing member (31), the second pressing part (411) abuts against the top of the silicon wafer (20) when the second pressing member (41) presses the silicon wafer (20), so that the top of the silicon wafer (20) flips over.

9. The silicon wafer tiling apparatus according to any one of claims 2 to 8, characterized in that, The power mechanism (42) includes a power motor (421) and an eccentric wheel (422) connected to the power motor (421). The eccentric wheel (422) abuts against the second pressing member (41) and is used to drive the second pressing member (41) to move closer to the silicon wafer (20). The first pressing assembly (30) also includes a fourth reset member connected to the second pressing member (41). The fourth reset member is also used to connect and fix to the fixed bracket (50).

10. A degumming production line, characterized in that, The degumming production line includes a silicon wafer slab assembly as described in any one of claims 1 to 9.

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