Automatic cleaning equipment for semiconductor packaging mold

Abstract

The utility model relates to the technical field of cleaning equipment, in particular to automatic cleaning equipment for a semiconductor packaging mold, which comprises an electric control system, a dry ice gun, and a lifting base, a movable platform and a stop device which are respectively and electrically connected with the electric control system, the dry ice gun is arranged on the moving platform, and the stop device is arranged on the front side of the moving platform. According to the automatic cleaning equipment for the semiconductor packaging mold, manual participation steps are reduced, the safety is higher, and the quality and efficiency of dry ice mold cleaning are improved.

Description

Technical Field

[0001] This utility model relates to the field of cleaning equipment technology, and in particular to an automatic cleaning equipment for semiconductor packaging molds. Background Technology

[0002] Dry ice cleaning technology is a mature and widely used cleaning technique, especially in industrial production where convenient dry ice cleaning is particularly needed. Dry ice cleaning involves using high-pressure air to spray dry ice particles from a dry ice cleaning machine onto the work surface to be cleaned. The physical reaction caused by the temperature difference causes different substances to detach at different contraction rates. Currently, dry ice mold cleaning is mainly done manually. However, due to the high temperature of the molds, operators are prone to burns when working at close range, and two people are required to operate the machine simultaneously, which consumes manpower and cannot guarantee the cleaning effect or time.

[0003] It is evident that existing technologies still need improvement and enhancement. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of this utility model is to provide an automatic cleaning device for semiconductor packaging molds, so as to solve the technical problems of high danger and low cleaning effect and efficiency when manually cleaning molds with dry ice.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An automatic cleaning device for semiconductor packaging molds includes an electrical control system, a dry ice gun, and a lifting base, a moving platform, and a stop device, all electrically connected to the electrical control system. The moving platform is mounted on the lifting base, the dry ice gun is mounted on the moving platform, and the stop device is located on the front side of the moving platform.

[0007] As described above, an automatic cleaning device for semiconductor packaging molds includes a moving platform comprising a housing, a cover, a moving device, and a mounting frame. The housing is mounted on the lifting base, the cover is fitted onto the housing, the moving device is located inside the housing, a sliding groove is provided on the front side of the housing, the mounting frame passes through the sliding groove and is connected to the moving device, and the dry ice gun is mounted on the mounting frame.

[0008] As described above, an automatic cleaning device for semiconductor packaging molds includes a moving device comprising an X-axis slide rod, a Y-axis slide rod, a first moving seat, a second moving seat, a connecting frame, and four guide rods. The X-axis slide rod is mounted inside the housing. The connecting frame is perpendicularly positioned above the X-axis slide rod. The four guide rods are respectively located on the left and right sides of the housing. Two guide rods are respectively clamped to the upper and lower sides of either end of the connecting frame. The first moving seat is slidably mounted on the X-axis slide rod and connected to the connecting frame. The Y-axis slide rod is mounted on the connecting frame. The second moving seat is slidably mounted on the Y-axis slide rod. The mounting frame is connected to the second moving seat.

[0009] As described above, an automatic cleaning device for semiconductor packaging molds has the same structure for the first and second movable seats. The first movable seat includes a seat body, rollers, a servo motor, and two pressure rollers. The seat body is slidably mounted on the X-axis slide rod. The two pressure rollers are rotatably mounted in the seat body and abut against the X-axis slide rod. The servo motor is mounted on the seat body. The rollers are connected to the output end of the servo motor and abut against the X-axis slide rod.

[0010] As described above, an automatic cleaning device for semiconductor packaging molds includes a mounting bracket comprising a mounting component, two telescopic rods, two pulleys, and a sliding rail. The mounting component is U-shaped, with one end passing through the sliding groove and connected to the moving device. One end of each of the two telescopic rods is connected to the other end of the mounting component. The two pulleys are respectively disposed on the other ends of the two telescopic rods. The sliding rail is disposed on the side of the cover away from the sliding groove, and the two pulleys are slidably disposed within the sliding rail. The dry ice gun is disposed on the mounting component.

[0011] As described above, the automatic cleaning equipment for semiconductor packaging molds includes a mounting bracket that further comprises a reinforcing block. Two through slots are provided on the reinforcing block, and two telescopic rods are respectively inserted into the two through slots. A snap-fit ​​slot is provided at one end of each through slot. Each telescopic rod includes a rod body, a sleeve, and a snap-fit ​​block. The snap-fit ​​block is connected to the rod body, and the rod body passes through the through slot. One end of the sleeve is connected to the reinforcing block and communicates with the through slot. The snap-fit ​​block snaps into the snap-fit ​​slot.

[0012] As described above, in an automatic cleaning device for semiconductor packaging molds, the reinforcing block has at least two ball bearings on the side facing the cover.

[0013] As described above, an automatic cleaning device for semiconductor packaging molds includes a dry ice gun comprising a gun rod, a nozzle, a limiting ring, a threaded tube, and a threaded sleeve. The gun rod is mounted on the mounting frame, the threaded sleeve passes through one end of the nozzle, the limiting ring is located inside the threaded sleeve and connected to the nozzle, the threaded tube is connected to the gun rod, and the threaded sleeve and the threaded tube are threadedly connected.

[0014] The automatic cleaning equipment for semiconductor packaging molds described above includes a stop device comprising one of a laser sensor, an infrared sensor, and a camera.

[0015] Beneficial effects:

[0016] This utility model discloses an automatic cleaning device for semiconductor packaging molds, including an electrical control system, a dry ice gun, and a lifting base, a moving platform, and a stop device, all electrically connected to the electrical control system. The electrical control system supplies power and controls the device. The lifting base moves the moving platform and the dry ice gun upwards. The stop device detects the relative position of the moving platform and the mold, thereby triggering the lifting base to stop moving and the moving platform to move the dry ice gun within the mold to perform dry ice cleaning. This automatic cleaning device reduces manual intervention steps, increases safety, and improves the quality and efficiency of dry ice mold cleaning. Attached Figure Description

[0017] Figure 1 A schematic diagram of the structure of the automatic cleaning equipment provided by this utility model;

[0018] Figure 2 Exploded view of the mobile platform provided by this utility model;

[0019] Figure 3 Another exploded view of the mobile platform provided by this utility model;

[0020] Reference numerals: 1. Dry ice gun; 11. Gun barrel; 12. Nozzle; 13. Limiting ring; 14. Threaded pipe; 15. Threaded sleeve; 2. Lifting base; 3. Moving platform; 31. Box; 32. Cover; 33. Moving device; 331. X-axis slide bar; 332. Y-axis slide bar; 333. First moving seat; 334. Second moving seat; 335. Connecting frame; 336. Guide rod; 337. Seat body; 338. Roller; 339. Servo motor; 330. Pressure wheel; 34. Mounting frame; 341. Mounting component; 342. Telescopic rod; 343. Pulley; 344. Sliding rail; 345. Rod body; 346. Sleeve; 347. Snap-fit ​​block; 35. Sliding groove; 36. Reinforcing block; 37. Connecting groove; 38. Ball bearing; 4. Stopping device. Detailed Implementation

[0021] This utility model provides an automatic cleaning device for semiconductor packaging molds. To make the purpose, technical solution and effects of this utility model clearer and more explicit, the following describes this utility model in further detail with reference to the accompanying drawings and embodiments.

[0022] In the description of this utility model, it should be understood that the terms "top," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and should not be construed as limiting this utility model; in addition, the terms "installation," "connection," etc. should be interpreted broadly, and those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] like Figure 1-3 As shown in the figure, this application provides an automatic cleaning device for semiconductor packaging molds, including an electrical control system, a dry ice gun 1, and a lifting base 2, a moving platform 3, and a stop device 4, which are electrically connected to the electrical control system. The moving platform 3 is mounted on the lifting base 2, the dry ice gun 1 is mounted on the moving platform 3, and the stop device 4 is located on the front side of the moving platform 3.

[0024] This utility model discloses an automatic cleaning device for semiconductor packaging molds, including an electrical control system, a dry ice gun 1, and a lifting base 2, a moving platform 3, and a stop device 4, all electrically connected to the electrical control system. Powered and controlled by the electrical control system, the lifting base 2 moves the moving platform 3 and the dry ice gun 1 upwards. The stop device 4 detects the relative position of the moving platform 3 and the mold, thereby triggering the lifting base 2 to stop moving and the moving platform 3 to move the dry ice gun 1 within the mold, performing dry ice cleaning on the mold. This automatic cleaning device reduces manual intervention steps, increases safety, and improves the quality and efficiency of dry ice mold cleaning.

[0025] The mobile platform 3 includes a housing 31, a cover 32, a moving device 33, and a mounting frame 34. The housing 31 is mounted on the lifting base 2, and the cover 32 covers the housing 31. The moving device 33 is located inside the housing 31. A sliding groove 35 is provided on the front side of the housing 31. The mounting frame 34 passes through the sliding groove 35 and is connected to the moving device 33. The dry ice gun 1 is mounted on the mounting frame 34. The moving device 33 includes an X-axis slide rod 331, a Y-axis slide rod 332, a first moving seat 333, a second moving seat 334, a connecting frame 335, and four guide rods 336. The X-axis slide rod 331 is mounted inside the housing 31. The connecting frame 335 is perpendicular to the X-axis slide rod 331 and positioned above it. The four guide rods 336... The guide rods 336 are respectively located on the left and right sides inside the housing 331. The two guide rods 336 are respectively clamped on the upper and lower sides of either end of the connecting frame 335. The first movable seat 333 is slidably mounted on the X-axis slide rod 331 and connected to the connecting frame 335. The Y-axis slide rod 332 is located on the connecting frame 335. The second movable seat 334 is slidably mounted on the Y-axis slide rod 332. The mounting frame 34 is connected to the second movable seat 334. The four guide rods 336 clamp and restrict the movement of the connecting frame 335. The first movable seat 333 moves along the X-axis slide rod 331 and drives the connecting frame 335 to move. The second movable seat 334 moves along the Y-axis slide rod 332 on the connecting frame 335, thereby driving the mounting frame 34 to move in the plane.

[0026] The first movable seat 333 and the second movable seat 334 have the same structure. The first movable seat 333 includes a seat body 337, rollers 338, a servo motor 339, and two clamping rollers 330. The seat body 337 is slidably mounted on the X-axis slide rod 331. The two clamping rollers 330 are respectively rotatably mounted inside the seat body 337 and abut against the X-axis slide rod 331. The servo motor 339 is mounted on the seat body 337. The rollers 338 are connected to the output end of the servo motor 339 and abut against the X-axis slide rod 331. The servo motor 339 ensures the movement speed. The rollers 338 and the two clamping rollers 330 respectively clamp the X-axis slide rod 331, improving the stability of operation and ensuring the mold clearing effect.

[0027] The mounting bracket 34 includes a mounting component 341, two telescopic rods 342, two pulleys 343, and a sliding rail 344. The mounting component 341 is U-shaped, with one end passing through the sliding groove 35 and connected to the moving device 33. One end of each of the two telescopic rods 342 is connected to the other end of the mounting component 341. The two pulleys 343 are respectively disposed on the other ends of the two telescopic rods 342. The sliding rail 344 is located on the cover 32 away from the moving device 33. On one side of the sliding groove 35, two pulleys 343 are slidably disposed within the sliding rail 344. The dry ice gun 1 is disposed on the mounting member 341. When the moving device 33 pushes the mounting member 341 out of the housing 31, the mounting member 341 is suspended in the air and experiences a large force. The two telescopic rods 342 provide a certain support or pulling force to the mounting member 341 to prevent the mounting member 341 from being damaged due to excessive force. At the same time, they can also share part of the weight to prevent the automatic cleaning equipment from tipping over.

[0028] The mounting bracket 34 also includes a reinforcing block 36, on which two connecting slots 37 are provided. The two telescopic rods 342 are respectively inserted into the two connecting slots 37. One end of each connecting slot 37 is provided with a snap-fit ​​groove. The telescopic rod 342 includes a rod body 345, a sleeve 346, and a snap-fit ​​block 347. The snap-fit ​​block 347 is connected to the rod body 345. The rod body 345 is inserted into the connecting slot 37. One end of the sleeve 346 is connected to the reinforcing block 36 and communicates with the connecting slot 37. The snap-fit ​​block 347 snaps into the snap-fit ​​groove. The side of the reinforcing block 36 facing the cover 32 is provided with at least two ball bearings 38. The reinforcing block 36 shares part of the weight of the dry ice gun 1, and the ball bearings 38 can convert the sliding friction between the reinforcing block 36 and the cover 32 into rolling friction, thereby improving the smoothness of the movement of the dry ice gun 1.

[0029] The dry ice gun 1 includes a gun rod 11, a nozzle 12, a limiting ring 13, a threaded tube 14, and a threaded sleeve 15. The gun rod 11 is mounted on the mounting bracket 34. The threaded sleeve 15 passes through one end of the nozzle 12. The limiting ring 13 is located inside the threaded sleeve 15 and connected to the nozzle 12. The threaded tube 14 is connected to the gun rod 11. The threaded sleeve 15 and the threaded tube 14 are threadedly connected. Through the quick-connect of the threaded sleeve 15 and the threaded tube, the nozzle 12 with a single nozzle or a double nozzle can be quickly replaced, making it more applicable to a wider range of scenarios and convenient to assemble and disassemble.

[0030] The stopping device 4 includes one of a laser sensor, an infrared sensor, and a camera. The electronic control system includes a power supply and a control device, and the control device includes an SMT32.

[0031] It is understood that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of this utility model, and all such substitutions or changes should fall within the protection scope of this utility model.

Claims

1. An automatic cleaning device for semiconductor packaging molds, characterized in that, It includes an electronic control system, a dry ice gun (1), and a lifting base (2), a moving platform (3), and a stop device (4) that are electrically connected to the electronic control system. The moving platform (3) is mounted on the lifting base (2), the dry ice gun (1) is mounted on the moving platform (3), and the stop device (4) is located on the front side of the moving platform (3).

2. The automatic cleaning equipment for semiconductor packaging molds according to claim 1, characterized in that, The mobile platform (3) includes a housing (31), a cover (32), a moving device (33), and a mounting frame (34). The housing (31) is mounted on the lifting base (2), the cover (32) covers the housing (31), the moving device (33) is located inside the housing (31), a sliding groove (35) is provided on the front side of the housing (31), the mounting frame (34) passes through the sliding groove (35) and is connected to the moving device (33), and the dry ice gun (1) is mounted on the mounting frame (34).

3. The automatic cleaning equipment for semiconductor packaging molds according to claim 2, characterized in that, The moving device (33) includes an X-axis slide rod (331), a Y-axis slide rod (332), a first moving seat (333), a second moving seat (334), a connecting frame (335), and four guide rods (336). The X-axis slide rod (331) is mounted inside the housing (31). The connecting frame (335) is perpendicular to the X-axis slide rod (331) and positioned above it. The four guide rods (336) are respectively located inside the housing (31). On the left and right sides, the two guide rods (336) are respectively clamped on the upper and lower sides of either end of the connecting frame (335). The first movable seat (333) is slidably mounted on the X-axis slide rod (331) and connected to the connecting frame (335). The Y-axis slide rod (332) is mounted on the connecting frame (335). The second movable seat (334) is slidably mounted on the Y-axis slide rod (332). The mounting frame (34) is connected to the second movable seat (334).

4. The automatic cleaning equipment for semiconductor packaging molds according to claim 3, characterized in that, The first movable seat (333) and the second movable seat (334) have the same structure. The first movable seat (333) includes a seat body (337), a roller (338), a servo motor (339) and two pressure rollers (330). The seat body (337) is slidably mounted on the X-axis slide rod (331). The two pressure rollers (330) are respectively rotatably mounted inside the seat body (337) and abut against the X-axis slide rod (331). The servo motor (339) is mounted on the seat body (337). The roller (338) is connected to the output end of the servo motor (339) and abuts against the X-axis slide rod (331).

5. The automatic cleaning equipment for semiconductor packaging molds according to claim 2, characterized in that, The mounting bracket (34) includes a mounting component (341), two telescopic rods (342), two pulleys (343), and a sliding rail (344). The mounting component (341) is U-shaped. One end of the mounting component (341) passes through the sliding groove (35) and is connected to the moving device (33). One end of each of the two telescopic rods (342) is connected to the other end of the mounting component (341). The two pulleys (343) are respectively located on the other end of the two telescopic rods (342). The sliding rail (344) is located on the side of the cover (32) away from the sliding groove (35). The two pulleys (343) slide within the sliding rail (344). The dry ice gun (1) is mounted on the mounting component (341).

6. The automatic cleaning equipment for semiconductor packaging molds according to claim 5, characterized in that, The mounting bracket (34) also includes a reinforcing block (36), on which two connecting slots (37) are provided. Two telescopic rods (342) are respectively inserted into the two connecting slots (37). One end of each connecting slot (37) is provided with a snap-fit ​​groove. The telescopic rod (342) includes a rod body (345), a sleeve (346) and a snap-fit ​​block (347). The snap-fit ​​block (347) is connected to the rod body (345). The rod body (345) is inserted into the connecting slot (37). One end of the sleeve (346) is connected to the reinforcing block (36) and communicates with the connecting slot (37). The snap-fit ​​block (347) snaps into the snap-fit ​​groove.

7. An automatic cleaning device for semiconductor packaging molds according to claim 6, characterized in that, The reinforcing block (36) has at least two ball bearings (38) on the side facing the cover (32).

8. An automatic cleaning device for semiconductor packaging molds according to claim 2, characterized in that, The dry ice gun (1) includes a gun rod (11), a nozzle (12), a limiting ring (13), a threaded tube (14), and a threaded sleeve (15). The gun rod (11) is mounted on the mounting bracket (34). The threaded sleeve (15) passes through one end of the nozzle (12). The limiting ring (13) is located inside the threaded sleeve (15) and connected to the nozzle (12). The threaded tube (14) is connected to the gun rod (11). The threaded sleeve (15) and the threaded tube (14) are threadedly connected.

9. An automatic cleaning device for semiconductor packaging molds according to claim 1, characterized in that, The stopping device (4) includes one of a laser sensor, an infrared sensor, and a camera.

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