Bionic friction-increasing pad preparation equipment for wafer transportation

Abstract

The utility model discloses bionic friction-increasing pad preparation equipment for wafer transportation, and relates to the technical field of bionic friction-increasing pad preparation, the bionic friction-increasing pad preparation equipment for wafer transportation comprises a device main body, and the bionic friction-increasing pad preparation equipment for wafer transportation is also provided with a texture mold, a lower mold is fixedly connected in the device body, an upper mold is arranged at the upper end of the lower mold, the upper end of the upper mold is fixedly connected with the inner wall of the device body, a worker controls the upper mold to descend, at the moment, the upper mold drives the two fixing plates and the first abutting block to descend, and the texture can increase the contact area with a wafer and improve friction force; the wafer is more stable in the transportation process and can be better attached to the surface of the wafer, local pressure is reduced, small particles can be adsorbed, the risk that the wafer is polluted is reduced, after injection molding succeeds, the spring pops up to push the bionic friction increasing pad to be separated from the mold, and the demolding convenience of the device body is improved.

Description

Technical Field

[0001] This utility model relates to the field of biomimetic friction pad preparation technology, and in particular to a biomimetic friction pad preparation device for wafer transport. Background Technology

[0002] Bionic friction-enhancing pads for wafer transport are pads used in the wafer transport process. Designed based on biomimetic principles, they effectively increase friction, preventing the wafer from sliding and colliding during transport, thus providing excellent protection. The equipment for manufacturing bionic friction-enhancing pads mainly consists of mold casting equipment. This equipment can precisely inject the material used to make the bionic friction-enhancing pads into the mold. By controlling parameters such as the amount and speed of casting, the dimensional accuracy and quality stability of the pads are ensured, ultimately producing bionic friction-enhancing pads that meet the requirements for use in wafer transport scenarios. In practical applications, the equipment for manufacturing bionic friction-enhancing pads for wafer transport typically requires the following technologies:

[0003] 1. Precise raw material proportioning technology: The raw materials are precisely metered and transported using relevant equipment, and the performance indicators can be adjusted to meet the requirements;

[0004] 2. High-precision mold forming technology: The mold manufacturing and forming process ensures the shape and size accuracy of the friction pad. The mold can be quickly replaced and has high interchangeability and repeatability.

[0005] 3. Biomimetic texture micro / nano fabrication technology: Biomimetic texture structures are fabricated using micro / nano fabrication methods, combined with surface treatment technology to ensure that the wafers do not slip during transportation;

[0006] 4. High-efficiency curing control technology: The curing method and parameter control module are used to ensure the curing effect and the performance of the friction pad, meeting the requirements for long-term use.

[0007] Currently, manufacturers employ various equipment and methods to achieve traceability of edible agricultural products. The biomimetic friction-enhancing pad manufacturing equipment used for wafer transportation plays a crucial role. In wafer protection, its shape and material prevent collisions and scratches, reducing damage and ensuring integrity and yield. Regarding transportation stability, the biomimetic texture increases friction, preventing slippage and ensuring safety and reliability. In terms of adaptability, precise proportioning and high-precision molding technology enable the production of friction-enhancing pads suitable for different wafers, meeting diverse needs. In terms of production efficiency, the equipment is highly automated, with close coordination between systems, resulting in a highly efficient and orderly production process, reducing labor and time constraints, and contributing to the development of the semiconductor industry.

[0008] However, the above methods have a significant hardware structural problem: although the wafer surface undergoes precision machining, it still possesses a certain degree of roughness and inhomogeneity at the microscopic scale. Friction-enhancing pads without nano-protrusions cannot fully conform to these microscopic unevennesses. This application proposes a solution to this problem: textures can increase the contact area with the wafer, improve friction, and make the wafer more stable during transportation. It can also better conform to the wafer surface, reduce localized pressure, and help adsorb tiny particles, reducing the risk of wafer contamination. Utility Model Content

[0009] To address the shortcomings of existing technologies, this invention provides a biomimetic friction pad preparation device for wafer transport, which solves the technical problem that although the wafer surface has undergone precision processing, there is still a certain degree of roughness and inhomogeneity at the microscale, and friction pads without nano-protrusions cannot fully conform to these microscopic unevennesses.

[0010] To achieve the above objectives, this utility model provides the following technical solution:

[0011] A biomimetic friction pad preparation device for wafer transport includes a main body and a textured mold. A lower mold is fixedly connected inside the main body, and an upper mold is provided at the upper end of the lower mold. The upper end of the upper mold is fixedly connected to the inner wall of the main body.

[0012] Preferably, the upper mold has two fixed plates that are parallel to each other, and each of the two fixed plates has a stop block fixedly connected to one of its opposite ends.

[0013] Preferably, the lower mold has an internal slot, and a textured mold is installed inside the slot.

[0014] Preferably, the upper end of the texture mold passes through the upper end of the lower mold.

[0015] Preferably, springs are fixedly connected to the four corners of the texture mold, and the lower end of each of the four springs is fixedly connected to the inner wall of the lower mold.

[0016] Preferably, the inner wall of the lower mold is fixedly connected to two abutment blocks, both of which are located at both ends inside the lower mold.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The operator controls the upper mold to descend. At this time, the upper mold drives the two fixed plates and the first stop block to descend. The first stop block blocks the descending texture mold, and the spring is compressed when the texture mold descends. After the texture mold is compressed, the nano-protrusions are retained inside the mold. At this time, the main body of the device pours into the mold, and the generated biomimetic friction pad forms a texture. The texture can increase the contact area with the wafer, improve friction, make the wafer more stable during transportation, and better conform to the wafer surface, reduce local pressure, and help to adsorb small particles, reducing the risk of wafer contamination. When the injection molding is successful, the spring pops out and pushes the biomimetic friction pad to detach from the mold, improving the convenience of demolding the main body of the device.

[0019] 2. When the two abutment blocks 1 descend to a certain distance against the texture mold, the bottom of the texture mold will abut against the abutment block 2, ensuring that the texture mold descends the required distance. This precise limiting mechanism effectively avoids the risk of mold damage that may result from excessive descent of the texture mold. Attached Figure Description

[0020] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0021] Figure 1 This is a structural diagram of the entire utility model;

[0022] Figure 2 This is a structural diagram of the upper mold of this utility model;

[0023] Figure 3 This is a structural diagram of the lower mold of this utility model;

[0024] Figure 4 This utility model Figure 3 Enlarged structural diagram at point A in the middle;

[0025] Figure 5 This is a structural diagram of the texture mold of this utility model;

[0026] Figure 6 This utility model Figure 5 Enlarged structural diagram at point B in the middle.

[0027] Legend: 11. Main body of the device; 12. Lower mold; 13. Upper mold; 14. Texture mold; 15. Fixing plate; 16. Block 1; 17. Spring; 18. Block 2; 19. Empty groove. Detailed Implementation

[0028] This application provides a biomimetic friction pad preparation device for wafer transportation, effectively solving the technical problem that although the wafer surface has undergone precision processing, it still has a certain degree of roughness and inhomogeneity at the microscopic scale, and friction pads without nano-protrusions cannot fully conform to these microscopic unevennesses. The operator controls the upper mold to descend, which in turn drives two fixing plates and abutment block to descend. Abutment block block abuts against the descending textured mold, and the spring is compressed during the descent. After the textured mold is compressed, the nano-protrusions remain inside the mold. The main body of the device then pours the molding process into the mold, generating a textured biomimetic friction pad. This texture increases the contact area with the wafer, enhances friction, makes the wafer more stable during transportation, better conforms to the wafer surface, reduces localized pressure, and helps adsorb microparticles, reducing the risk of wafer contamination. After successful injection molding, the spring pops out, pushing the biomimetic friction pad out of the mold, improving the ease of demolding the main body of the device.

[0029] Example: The technical solution in this application effectively solves the technical problem that although the wafer surface has undergone precision processing, it still has a certain degree of roughness and non-uniformity at the microscale, and friction pads without nano-protrusions cannot fully conform to these microscopic unevennesses. The overall idea is as follows:

[0030] To address the problems existing in the prior art, this utility model provides a biomimetic friction-enhancing pad preparation device for wafer transport, including a main body 11. This biomimetic friction-enhancing pad preparation device for wafer transport is also provided with a texture mold 14. A lower mold 12 is fixedly connected inside the main body 11, and an upper mold 13 is provided at the upper end of the lower mold 12. The upper end of the upper mold 13 is fixedly connected to the inner wall of the main body 11. Two fixing plates 15 are fixedly connected inside the upper mold 13. The two fixing plates 15 are parallel to each other, and a stop block 16 is fixedly connected to one opposite end of each of the two fixing plates 15. When the operator controls the upper mold 13 to descend, the upper mold 13 drives the two fixing plates 15 and the stop block 16 to descend. The stop block 16 will stop the texture mold 14 from descending. When the texture mold 14 descends, the spring 17 will be compressed. After the texture mold 14 is compressed, the nano-protrusions are retained inside the mold. At this time, the main body 11 of the device pours the mold, and the resulting biomimetic friction pad forms a texture. The texture can increase the contact area with the wafer, improve the friction, make the wafer more stable during transportation, better fit the wafer surface, reduce local pressure, and help adsorb tiny particles, reducing the risk of wafer contamination.

[0031] The lower mold 12 has an internal slot 19, and a textured mold 14 is installed inside the slot 19. The upper end of the textured mold 14 passes through the upper end of the lower mold 12. When the injection molding is successful, the spring 17 pops out and pushes the bionic friction pad to detach from the mold, which improves the ease of demolding of the main body 11 of the device.

[0032] Springs 17 are fixedly connected to the four corners of the texture mold 14. The lower end of each of the four springs 17 is fixedly connected to the inner wall of the lower mold 12. Two abutment blocks 18 are fixedly connected to the inner wall of the lower mold 12. The two abutment blocks 18 are located at both ends inside the lower mold 12. When the two abutment blocks 16 push against the texture mold 14 and descend to a certain distance, the bottom of the texture mold 14 will push against the abutment blocks 18, ensuring that the texture mold 14 descends the specified distance. This precise limiting mechanism effectively avoids the risk of mold damage that may result from excessive descent of the texture mold 14.

[0033] Working principle: The operator controls the upper mold 13 to descend. At this time, the upper mold 13 drives the two fixed plates 15 and the first abutment 16 to descend. The first abutment 16 will abut against the texture mold 14 as it descends. When the texture mold 14 descends, the spring 17 will be compressed. After the texture mold 14 is compressed, the nano-protrusions are retained inside the mold. At this time, the main body of the device 11 pours into the mold, and the generated biomimetic friction pad forms a texture. The texture can increase the contact area with the wafer, improve the friction, make the wafer more stable during transportation, and better fit the wafer surface, reduce local pressure, and help to adsorb small particles, reducing the risk of wafer contamination. When the injection molding is successful, the spring 17 pops out and pushes the biomimetic friction pad to detach from the mold, improving the demolding convenience of the main body of the device 11. When the two abutments 16 abut against the texture mold 14 and descend to a certain distance, the bottom of the texture mold 14 will abut against the second abutment 18, ensuring the descent distance of the texture mold 14. This precise limiting mechanism effectively avoids the risk of mold damage that may be caused by the texture mold 14 descending too far.

[0034] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A biomimetic friction pad fabrication device for wafer transport, comprising a main body (11), characterized in that, The biomimetic friction pad preparation equipment for wafer transport is also equipped with a texture mold (14). The device body (11) is internally fixedly connected to a lower mold (12), and an upper mold (13) is provided at the upper end of the lower mold (12). The upper end of the upper mold (13) is fixedly connected to the inner wall of the device body (11). The upper mold (13) has two fixed plates (15) inside, and the two fixed plates (15) are parallel to each other; Among them, the two fixed plates (15) are fixedly connected to the opposite ends of the abutment block (16). The lower mold (12) has a hollow groove (19) inside; The interior of the empty slot (19) is provided with a texture mold (14). The upper end of the texture mold (14) passes through the upper end of the lower mold (12); Springs (17) are fixedly connected to the four corners of the texture mold (14). The lower end of each of the four springs (17) is fixedly connected to the inner wall of the lower mold (12).

2. The biomimetic friction pad fabrication equipment for wafer transport as described in claim 1, characterized in that: The inner wall of the lower mold (12) is fixedly connected to two abutment blocks (18). Both of the two abutment blocks (18) are located at both ends inside the lower mold (12).

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