Wafer chip bearing tray

Abstract

The utility model discloses a wafer chip bearing tray, which is applied to the technical field of semiconductors, and comprises a bearing tray, the top of the bearing tray is provided with a placing groove, the inner surface of the placing groove is symmetrically connected with four trapezoidal abutting blocks in a sliding manner, and the inclined surfaces of the four trapezoidal abutting blocks are welded with clamping blocks. The wafer chip is placed in the placement groove, and the four trapezoidal abutting blocks are driven to be attached to the surface of the wafer through the elastic force of the springs, so that the wafer chip is clamped in the placement groove. The trapezoid abutting blocks can be adjusted in a sliding mode according to the sizes of various different wafer chips, and the practicability of the bearing tray is improved. The wedge-shaped sliding blocks and the wedge-shaped sliding grooves are clamped in a sliding mode, so that the multiple bearing trays can be stacked, and the stability is improved. The wafer chips can be transported conveniently, and meanwhile, the bearing tray at the top can cover the wafer chips at the bottom for dust prevention, so that the risk of chip damage is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor technology, and specifically relates to a wafer chip carrier tray. Background Technology

[0002] After the wafer is thinned to a specified thickness through grinding, it is then cut into individual chips using laser dicing and blade cutting according to the application requirements. In the COG process, the chips are placed in carrier trays of different sizes for packaging and shipping to the end panel manufacturers.

[0003] Currently, Chinese utility model patent CN218751930U discloses a chip carrier tray. However, in actual operation, different sized carrier trays are used for wafer chips, so the sorting machine after cutting operates according to the size of this carrier tray. Due to the uncertainty of the demand for some wafer chips shipped to end customers, the size of the carrier tray is inconsistent with the size used during operation, making it impossible to adjust for various wafer chip sizes, which is inconvenient. Furthermore, the stability of the carrier tray during shipment is poor, and the carrier trays are prone to vertical vibration due to vehicle movement, which can damage the internal wafer chips. Utility Model Content

[0004] The purpose of this utility model is to provide a wafer chip carrier tray, which has the advantages of being adjustable according to the size of various wafer chips and improving the stability of the carrier tray placement.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a wafer chip carrier tray, including a carrier tray, the top of the carrier tray is provided with a placement groove, four trapezoidal blocks are symmetrically slidably connected to the inner surface of the placement groove, the inclined surfaces of the four trapezoidal blocks are all welded with locking blocks, and the sides of the four trapezoidal blocks that are far apart from each other are all bolted with springs that are fixedly connected to the carrier tray.

[0006] The above technical solution involves placing the wafer chip inside a placement slot. Spring force causes four trapezoidal blocks to adhere to the wafer surface, thus clamping the wafer chip within the slot. The trapezoidal blocks can be adjusted to accommodate various wafer chip sizes, improving the practicality of the carrier tray. By utilizing wedge-shaped sliders and wedge-shaped grooves that slide and engage with each other, multiple carrier trays can be stacked, enhancing stability. This not only facilitates wafer chip transportation but also allows the top carrier tray to cover and protect the bottom wafer chip from dust, reducing the risk of chip damage.

[0007] The present invention is further configured such that: a reinforcing plate is welded to the bottom of the bearing tray, wedge-shaped sliders are welded to both sides of the bottom of the reinforcing plate, and four wedge-shaped grooves that are symmetrically connected to the wedge-shaped sliders are welded to the top of the bearing tray.

[0008] The above technical solution not only facilitates the transportation of wafer chips, but also allows the top support tray to cover the bottom wafer chips to prevent dust and reduce the risk of chip damage.

[0009] The present invention is further configured such that: the interior of the reinforcing plate has a bottom hole communicating with the placement groove.

[0010] The above technical solution facilitates pushing the chip out of the placement slot from the bottom of the wafer upwards, thereby reducing the risk of chip damage.

[0011] The present invention is further configured such that: straight grooves are provided on both sides of the top of the bearing tray, a dustproof cover is provided on the top of the bearing tray, and a strip rod that is slidably connected to the straight groove is welded to the bottom of the dustproof cover.

[0012] By using the above technical solution, the dust cover is placed on top of the carrying pallet by inserting the strip rod into the inside of the straight groove and sliding it. This can cover the topmost carrying pallet to prevent dust, and the dust cover can also be used to prevent dust from the carrying pallets when they are not stacked.

[0013] The present invention is further configured such that: the inside of the wedge-shaped groove and the bottom of the wedge-shaped slider are both fixedly connected with magnet blocks that are attracted to each other by magnetic force.

[0014] By adopting the above technical solution, the magnetic force of the magnet block is used to firmly attract the wedge-shaped slider into the inside of the wedge-shaped groove, thereby preventing vibration from causing it to slide off.

[0015] In summary, this utility model has the following beneficial effects:

[0016] 1. By placing the wafer chip inside the placement slot, the spring force drives four trapezoidal blocks to adhere to the wafer surface, thereby clamping the wafer chip inside the placement slot. The trapezoidal blocks can be slidably adjusted to accommodate various wafer chip sizes, improving the practicality of the support tray;

[0017] 2. By utilizing wedge-shaped sliders and wedge-shaped grooves to slide and engage with each other, multiple carrier trays can be stacked on top of each other, improving stability. This not only facilitates the transportation of wafer chips, but also allows the top carrier tray to cover the bottom wafer chips to prevent dust and reduce the risk of chip damage. Attached Figure Description

[0018] Figure 1This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a partial structural schematic diagram of the present invention;

[0020] Figure 3 This is a partial structural cross-sectional view of this utility model.

[0021] Reference numerals: 1. Supporting tray; 2. Placement slot; 3. Trapezoidal stop block; 4. Spring; 5. Locking block; 6. Reinforcing plate; 7. Wedge slider; 8. Wedge groove; 9. Straight groove; 10. Strip rod; 11. Dustproof cover; 12. Bottom hole; 13. Magnet block. Detailed Implementation

[0022] The present invention will be further described in detail below with reference to the accompanying drawings.

[0023] Example 1:

[0024] refer to Figure 1 , Figure 2 , Figure 3 A wafer chip carrier tray includes a carrier tray 1 with a placement groove 2 on its top. Four trapezoidal blocks 3 are symmetrically slidably connected to the inner surface of the placement groove 2. Each of the four trapezoidal blocks 3 has a locking block 5 welded to its inclined surface. A spring 4, fixedly connected to the carrier tray 1, is bolted to the side of each trapezoidal block 3 furthest from each other. By placing the wafer chip inside the placement groove 2, the spring force of the spring 4 causes the four trapezoidal blocks 3 to conform to the wafer surface, thereby clamping the wafer chip inside the placement groove 2. The trapezoidal blocks 3 can be slidably adjusted according to the size of various wafer chips, improving the practicality of the carrier tray.

[0025] refer to Figure 1 , Figure 2 The top of the carrying pallet 1 has straight grooves 9 on both sides. A dust cover 11 is provided on the top of the carrying pallet 1. A strip rod 10 is welded to the bottom of the dust cover 11 and is slidably connected to the straight grooves 9. By inserting the strip rod 10 into the straight grooves 9 and sliding it, the dust cover 11 is placed on top of the carrying pallet 1. This can cover the topmost carrying pallet 1 to prevent dust. At the same time, the dust cover 11 can also be used to prevent dust from the carrying pallets 1 when they are not stacked.

[0026] Brief description of the usage process: By placing the wafer chip inside the placement slot 2, the trapezoidal blocks 3 can adhere to the wafer surface using the elastic force of the spring 4, thereby clamping the wafer with the four trapezoidal blocks 3. Then, when the wafer is subjected to clamping force, it slides upward along the inclined side of the trapezoidal blocks 3 until it reaches the position of the locking block 5, which locks and limits the wafer surface, thus ensuring that the four trapezoidal blocks 3 firmly clamp the wafer surface.

[0027] Example 2:

[0028] refer to Figure 1 , Figure 2 A wafer chip carrier tray 1 has a reinforcing plate 6 welded to its bottom. Wedge-shaped sliders 7 are welded to both sides of the bottom of the reinforcing plate 6. Four wedge-shaped grooves 8 are symmetrically welded to the top of the carrier tray 1, slidingly connected to the wedge-shaped sliders 7. By utilizing the sliding engagement of the wedge-shaped sliders 7 and the wedge-shaped grooves 8, multiple carrier trays 1 can be stacked on top of each other, improving stability. This not only facilitates the transportation of wafer chips, but also allows the top carrier tray 1 to cover and protect the bottom wafer chips from dust, reducing the risk of chip damage.

[0029] refer to Figure 2 , Figure 3 The reinforcement plate 6 has a bottom hole 12 that communicates with the placement slot 2. This facilitates pushing the chip upwards from the bottom of the wafer into the placement slot 2, thereby reducing the risk of chip damage.

[0030] refer to Figure 1 , Figure 2 Both the inside of the wedge-shaped groove 8 and the bottom of the wedge-shaped slider 7 are fixedly connected to magnet blocks 13 that are attracted to each other by magnetic force. The magnetic force of the magnet blocks 13 is used to firmly attract the wedge-shaped slider 7 to the inside of the wedge-shaped groove 8, thereby preventing vibration from causing it to slide off.

[0031] Brief description of usage: By placing two support trays 1 close together, align the wedge-shaped slider 7 at the bottom of the reinforcing plate 6 with the inside of the wedge-shaped groove 8 and push it forward, thereby sliding the wedge-shaped slider 7 into the inside of the wedge-shaped groove 8, allowing the two support trays 1 to be stacked vertically together and magnetically attracted to each other by the magnetic force of the magnet block 13. Similarly, the tops of the support trays 1 can be continuously stacked in this manner.

[0032] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

Claims

1. A wafer chip carrier tray, comprising a carrier tray (1), characterized in that: The top of the carrying tray (1) is provided with a placement groove (2), and four trapezoidal blocks (3) are symmetrically slidably connected to the inner surface of the placement groove (2). Each of the four trapezoidal blocks (3) has a locking block (5) welded to its inclined surface. Each of the four trapezoidal blocks (3) has a spring (4) fixedly connected to the carrying tray (1) on the side that is far away from each other.

2. The wafer chip carrier tray according to claim 1, characterized in that: The bottom of the support tray (1) is welded with a reinforcing plate (6), and wedge-shaped sliders (7) are welded on both sides of the bottom of the reinforcing plate (6). The top of the support tray (1) is symmetrically welded with four wedge-shaped grooves (8) that are slidably connected to the wedge-shaped sliders (7).

3. A wafer chip carrier tray according to claim 2, characterized in that: The reinforcing plate (6) has a bottom hole (12) that communicates with the placement groove (2).

4. A wafer chip carrier tray according to claim 1, characterized in that: The top of the carrying tray (1) has straight grooves (9) on both sides. The top of the carrying tray (1) is provided with a dust cover (11). The bottom of the dust cover (11) is welded with a strip rod (10) that is slidably connected to the straight groove (9).

5. A wafer chip carrier tray according to claim 2, characterized in that: The inside of the wedge-shaped groove (8) and the bottom of the wedge-shaped slider (7) are both fixedly connected to magnet blocks (13) that are attracted to each other by magnetic force.

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