Cooling substrate table mechanism for MPCVD equipment

Abstract

The utility model discloses a cooling substrate table mechanism for MPCVD (Micro-Pressure Chemical Vapor Deposition) equipment, which relates to the technical field of MPCVD equipment and comprises a substrate table and a water injection component, uniformly distributed mounting grooves are formed in the upper end of the substrate table, second temperature sensors are mounted in the mounting grooves, uniformly distributed annular flow guide grooves and connecting grooves are formed in the substrate table, all the annular flow guide grooves are connected through all the connecting grooves, and a water outlet is formed in the right end of the circumferential surface of the substrate table. The water outlet is communicated with the annular flow guide groove in the edge portion, a water drainage pipe is fixed in the water outlet, a third electromagnetic valve is installed on the circumferential face of the water drainage pipe, and an adsorption assembly is installed on the end face of the substrate table. The water injection assembly comprises a connecting plate, a storage box, a first temperature sensor, a water pump, a water injection pipe and a first electromagnetic valve, and the water flow can be automatically controlled according to the process requirement in the cooling process.

Description

Technical Field

[0001] This utility model relates to the field of MPCVD equipment technology, specifically to a cooling substrate stage mechanism for MPCVD equipment. Background Technology

[0002] Metal-organic chemical vapor deposition (MPCVD) is a widely used technique for preparing high-quality thin film materials. Temperature control of the substrate is crucial during MPCVD, as it directly affects the film growth rate, crystal quality, and uniformity. Traditional substrate cooling stages typically employ a fixed water flow rate. This method cannot adjust the cooling intensity according to the substrate's cooling requirements, resulting in imprecise substrate temperature control and consequently impacting substrate quality and production efficiency. Therefore, we propose a substrate cooling stage mechanism for MPCVD equipment. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the existing defects and provide a cooling substrate stage mechanism for MPCVD equipment, which can automatically control the water flow rate according to process requirements during the cooling process, and can effectively solve the problems in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a cooling substrate stage mechanism for MPCVD equipment, comprising a substrate stage and a water injection assembly;

[0005] Substrate stage: The upper end has evenly distributed mounting slots, and a second temperature sensor is installed inside the mounting slots. The interior of the substrate stage has evenly distributed annular guide slots and connecting slots. All the annular guide slots are connected through all the connecting slots. The right end of the circumferential surface of the substrate stage has a drain outlet, which is connected to the annular guide slots on the side. A drain pipe is fixed inside the drain outlet, and a third solenoid valve is installed on the circumferential surface of the drain pipe. An adsorption component is installed on the end face of the substrate stage.

[0006] Water injection assembly: includes a connecting plate, a storage tank, a first temperature sensor, a water pump, a water injection pipe, and a first solenoid valve. The connecting plate is fixed to the lower end of the substrate stage, and the storage tank is fixed to the lower side of the connecting plate. The first temperature sensor is installed inside the storage tank, and the water pump is installed inside the storage tank. The water injection pipe is fixed inside the outlet of the water pump. A water injection groove is opened in the middle of the lower end of the substrate stage, and the upper end of the water injection pipe is fixed inside the water injection groove. All connecting grooves are connected to the water injection groove. The first solenoid valve is installed on the circumference of the water injection pipe. A cooling assembly is installed on the side of the storage tank, and an air extraction assembly is installed on the side of the storage tank. The air extraction assembly is connected to the adsorption assembly. Water is injected into the interior of all connecting grooves by setting up the water injection assembly.

[0007] Wherein: the input terminals of the first solenoid valve and the third solenoid valve are both electrically connected to the output terminal of an external PLC controller, and the first temperature sensor and the second temperature sensor are both bidirectionally electrically connected to the external PLC controller.

[0008] Furthermore, the adsorption assembly includes suction cups and annular tubes. The upper end of the substrate stage has evenly distributed mounting openings, and suction cups are fixed inside the mounting openings. The lower end of the substrate stage is fixed with an annular tube, and the lower ends of all the suction cups are connected to the inner cavities of the annular tubes. The substrate is adsorbed by setting up the adsorption assembly.

[0009] Furthermore, the air extraction assembly includes an air pump, an air extraction pipe, an exhaust pipe, and a second solenoid valve. An air pump is installed on the side of the storage box. An air extraction pipe is fixed inside the air extraction port of the air pump. The upper end of the air extraction pipe is fixed to the lower end of the annular pipe, and the air extraction pipe communicates with the inner cavity of the annular pipe. An opening is formed on the circumferential surface of the air extraction pipe, and an exhaust pipe is fixed inside the opening. A second solenoid valve is installed on the circumferential surface of the exhaust pipe. The input ends of both the air pump and the second solenoid valve are electrically connected to the output end of an external PLC controller. By setting up the air extraction assembly to extract air from the suction cups, the suction cups can then adsorb the substrate that needs cooling. After cooling, the second solenoid valve is opened, allowing external air to enter the interior of all the suction cups through the exhaust pipes. This allows all the suction cups to separate from the substrate, making it extremely convenient to remove the substrate.

[0010] Furthermore, the cooling assembly includes a thermoelectric cooler, a mounting frame, and a cooling fan. A groove is provided on the front side of the storage box, and a thermoelectric cooler is installed inside the groove. The heat dissipation end of the thermoelectric cooler is located outside the groove, and the cooling end of the thermoelectric cooler is located inside the groove. A mounting frame is fixed to the front side of the storage box, and evenly distributed cooling fans are installed inside the mounting frame. The input ends of the thermoelectric cooler and the cooling fans are electrically connected to the output end of an external PLC controller. The cooling assembly is used to cool the water inside the storage box.

[0011] Furthermore, a drain outlet is provided on the right side of the storage tank, and a water outlet pipe is fixed inside the drain outlet. A sealing cap is threaded to the right end of the water outlet pipe, and the water inside the storage tank is discharged by setting the water outlet pipe.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: This cooling substrate stage mechanism for MPCVD equipment has the following advantages:

[0013] The substrate that needs to be cooled is adsorbed and fixed by an adsorption component. After fixation, the water pump is started to inject water into the substrate stage. After injection, the water will enter the interior of all the annular guide grooves along the evenly distributed connecting grooves. In this way, the substrate can be cooled. During the cooling process, all the second temperature sensors can detect the temperature of the substrate. After detection, the external PLC controller will automatically control the water output of the first solenoid valve according to the detected temperature. In this way, the quality of the substrate can be effectively improved. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the front structure of this utility model;

[0015] Figure 2 This is a top sectional view of the present invention;

[0016] Figure 3 This is a rear sectional view of the present invention.

[0017] In the diagram: 1. Substrate stage, 2. Annular guide groove, 3. Connecting groove, 4. Drain pipe, 5. Water injection assembly, 51. Connecting plate, 52. Storage box, 53. First temperature sensor, 54. Water pump, 55. Water injection pipe, 56. First solenoid valve, 6. Adsorption assembly, 61. Suction cup, 62. Annular pipe, 7. Air extraction assembly, 71. Air extraction pump, 72. Air extraction pipe, 73. Exhaust pipe, 74. Second solenoid valve, 8. Cooling assembly, 81. Semiconductor cooling chip, 82. Mounting frame, 83. Cooling fan, 9. Water outlet pipe, 10. Sealing cover, 11. Third solenoid valve, 12. Second temperature sensor. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1-3 This embodiment provides a technical solution: a cooling substrate stage mechanism for MPCVD equipment, including a substrate stage 1 and a water injection assembly 5;

[0020] Substrate stage 1: The upper end is provided with uniformly distributed mounting grooves, and the second temperature sensor 12 is installed inside the mounting grooves. The interior of substrate stage 1 is provided with uniformly distributed annular guide grooves 2 and connecting grooves 3. All the annular guide grooves 2 are connected through all the connecting grooves 3. The right end of the circumferential surface of substrate stage 1 is provided with a drain outlet, which is connected to the annular guide groove 2 on the side. A drain pipe 4 is fixed inside the drain outlet. A third solenoid valve 11 is installed on the circumferential surface of the drain pipe 4. An adsorption component 6 is installed on the end face of substrate stage 1.

[0021] Water injection assembly 5 includes a connecting plate 51, a storage tank 52, a first temperature sensor 53, a water pump 54, a water injection pipe 55, and a first solenoid valve 56. The connecting plate 51 is fixed to the lower end of the substrate stage 1, and the storage tank 52 is fixed to the lower side of the connecting plate 51. The first temperature sensor 53 is installed inside the storage tank 52, and the water pump 54 is installed inside the storage tank 52. The water injection pipe 55 is fixed inside the outlet of the water pump 54. A water injection groove is formed in the middle of the lower end of the substrate stage 1, and the upper end of the water injection pipe 55 is fixed inside the water injection groove. All connecting grooves 3 communicate with the water injection groove. The first solenoid valve 56 is installed on the circumferential surface of the water injection pipe 55. A cooling assembly 8 is installed on the side of the storage tank 52. A vacuum assembly 7 is installed on the side of the storage box 52. The vacuum assembly 7 is connected to the adsorption assembly 6. The adsorption assembly 6 includes suction cups 61 and annular tubes 62. The upper end of the substrate stage 1 has evenly distributed mounting ports, and suction cups 61 are fixed inside the mounting ports. The lower end of the substrate stage 1 is fixed with an annular tube 62. The lower ends of all suction cups 61 are evenly connected to the inner cavity of the annular tube 62. The vacuum assembly 7 includes a vacuum pump 71, a vacuum pipe 72, an exhaust pipe 73, and a second solenoid valve 74. The vacuum pump 71 is installed on the side of the storage box 52. A vacuum pipe 72 is fixed inside the vacuum port of the vacuum pump 71. The upper end of the vacuum pipe 72 is fixed to the lower end of the annular tube 62. The vacuum pipe 72 is connected to the inner cavity of the annular tube 62. An opening is formed on the circumferential surface of the air pipe 72, and an exhaust pipe 73 is fixed inside the opening. A second solenoid valve 74 is installed on the circumferential surface of the exhaust pipe 73. The input terminals of the air pump 71 and the second solenoid valve 74 are electrically connected to the output terminal of an external PLC controller. The cooling assembly 8 includes a semiconductor cooling chip 81, a mounting frame 82, and a cooling fan 83. A groove is formed on the front side of the storage box 52, and a semiconductor cooling chip 81 is installed inside the groove. The heat dissipation end of the semiconductor cooling chip 81 is located outside the groove, and the cooling end of the semiconductor cooling chip 81 is located inside the groove. A mounting frame 82 is fixed on the front side of the storage box 52, and evenly distributed cooling fans 83 are installed inside the mounting frame 82. The input terminals of the conductor cooling chip 81 and the cooling fan 83 are electrically connected to the output terminal of the external PLC controller. The water inside the storage tank 52 is cooled by the cooling component 8, and the air extraction component 7 is used to extract the air from the suction cups 61. In this case, the suction cups 61 can adsorb the substrate that needs to be cooled. After cooling, the second solenoid valve 74 is opened to allow external air to enter the interior of all the suction cups 61 through the exhaust pipe 73. In this case, all the suction cups 61 can be separated from the substrate, and the substrate can be easily removed. The substrate is adsorbed by the adsorption component 6, and water is injected into the interior of all the connecting slots 3 by the water injection component 5.

[0022] Among them, the input terminals of the first solenoid valve 56 and the third solenoid valve 11 are both electrically connected to the output terminal of the external PLC controller, and the first temperature sensor 53 and the second temperature sensor 12 are both bidirectionally electrically connected to the external PLC controller.

[0023] Wherein: a drain outlet is provided on the right side of the storage tank 52, and a water outlet pipe 9 is fixed inside the drain outlet. A sealing cap 10 is threaded to the right end of the water outlet pipe 9, and the water inside the storage tank 52 is drained by setting the water outlet pipe 9.

[0024] The working principle of the cooling substrate stage mechanism for MPCVD equipment provided by this utility model is as follows: During use, the substrate can be placed on top of the substrate stage 1, and then the vacuum pump 71 is started to evacuate the air from inside all the suction cups 61. After evacuation, all the suction cups 61 can adsorb and fix the substrate. After fixing, the water pump 54 is started to inject water into the interior of the substrate stage 1. After injection, the water will enter the interior of all the annular guide grooves 2 along the evenly distributed connecting grooves 3. In this way, the substrate can be cooled. During the cooling process, all the second temperature sensors 12 can detect the temperature of the substrate. After detection, the external PLC controller will... The water output of the first solenoid valve 56 is automatically controlled based on the detected temperature, which can effectively improve the quality of the substrate. During the cooling process, the third solenoid valve 11 can be opened to re-inject water into the storage tank 52 through the drain pipe 4. After entering, the first temperature sensor 53 located inside the storage tank 52 will detect the water temperature. When the temperature is too high, the external PLC controller will automatically turn on the semiconductor cooler 81 and all the cooling fans 83. After the semiconductor cooler 81 is turned on, it cools the water inside the storage tank 52, which facilitates subsequent use. All the cooling fans 83 can be turned on to dissipate heat from the semiconductor cooler 81, which facilitates its operation.

[0025] It is worth noting that the external PLC controller disclosed in the above embodiments is specifically a Siemens S7-200. The water pump 54, the air pump 71, the first solenoid valve 56, the second solenoid valve 74, the third solenoid valve 11, the first temperature sensor 53, and the second temperature sensor 12 can be freely configured according to the actual application scenario. The external PLC controller controls the operation of the water pump 54, the air pump 71, the first solenoid valve 56, the second solenoid valve 74, and the third solenoid valve 11 using methods commonly used in the prior art.

[0026] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A substrate cooling stage mechanism for an MPCVD equipment, characterized in that: Includes substrate stage (1) and water injection assembly (5); Substrate stage (1): The upper end is provided with uniformly distributed mounting grooves. The second temperature sensor (12) is installed inside the mounting grooves. The substrate stage (1) is provided with uniformly distributed annular guide grooves (2) and connecting grooves (3). All the annular guide grooves (2) are connected through all the connecting grooves (3). The right end of the circumferential surface of the substrate stage (1) is provided with a drain outlet. The drain outlet is connected to the annular guide grooves (2) on the side. A drain pipe (4) is fixed inside the drain outlet. A third solenoid valve (11) is installed on the circumferential surface of the drain pipe (4). An adsorption component (6) is installed on the end face of the substrate stage (1). Water injection assembly (5): includes a connecting plate (51), a storage tank (52), a first temperature sensor (53), a water pump (54), a water injection pipe (55), and a first solenoid valve (56). The lower end of the substrate stage (1) is fixed with the connecting plate (51), and the lower side of the connecting plate (51) is fixed with the storage tank (52). The first temperature sensor (53) is installed inside the storage tank (52), and the water pump (54) is installed inside the storage tank (52). The water pump (54) outputs... A water inlet pipe (55) is fixed inside the water inlet. A water inlet groove is opened in the middle of the lower end of the substrate stage (1). The upper end of the water inlet pipe (55) is fixed inside the water inlet groove. All the connecting grooves (3) are connected to the water inlet groove. A first solenoid valve (56) is installed on the circumferential surface of the water inlet pipe (55). A cooling component (8) is installed on the side of the storage box (52). An air extraction component (7) is installed on the side of the storage box (52). The air extraction component (7) is connected to the adsorption component (6). Wherein: the input terminals of the first solenoid valve (56) and the third solenoid valve (11) are both electrically connected to the output terminal of the external PLC controller, and the first temperature sensor (53) and the second temperature sensor (12) are both bidirectionally electrically connected to the external PLC controller.

2. The cooling substrate stage mechanism for MPCVD equipment according to claim 1, characterized in that: The adsorption assembly (6) includes a suction cup (61) and an annular tube (62). The upper end of the substrate stage (1) is provided with uniformly distributed mounting ports. The suction cup (61) is fixed inside the mounting port. The lower end of the substrate stage (1) is fixed with an annular tube (62). The lower ends of all the suction cups (61) are connected to the inner cavity of the annular tube (62).

3. A cooling substrate stage mechanism for an MPCVD equipment according to claim 2, characterized in that: The air extraction assembly (7) includes an air extraction pump (71), an air extraction pipe (72), an exhaust pipe (73), and a second solenoid valve (74). The air extraction pump (71) is installed on the side of the storage box (52). An air extraction pipe (72) is fixed inside the air extraction port of the air extraction pump (71). The upper end of the air extraction pipe (72) is fixed to the lower end of the annular pipe (62). The air extraction pipe (72) communicates with the inner cavity of the annular pipe (62). An opening is provided on the circumferential surface of the air extraction pipe (72). An exhaust pipe (73) is fixed inside the opening. A second solenoid valve (74) is installed on the circumferential surface of the exhaust pipe (73). The input ends of the air extraction pump (71) and the second solenoid valve (74) are both electrically connected to the output end of an external PLC controller.

4. A cooling substrate stage mechanism for an MPCVD equipment according to claim 1, characterized in that: The cooling assembly (8) includes a thermoelectric cooler (81), a mounting frame (82), and a cooling fan (83). The front side of the storage box (52) has a groove, and the thermoelectric cooler (81) is installed inside the groove. The heat dissipation end of the thermoelectric cooler (81) is located outside the groove, and the cooling end of the thermoelectric cooler (81) is located inside the groove. The front side of the storage box (52) is fixed with a mounting frame (82), and the cooling fans (83) are evenly distributed inside the mounting frame (82). The input ends of the thermoelectric cooler (81) and the cooling fans (83) are electrically connected to the output end of an external PLC controller.

5. A cooling substrate stage mechanism for an MPCVD equipment according to claim 1, characterized in that: The storage box (52) has a drain outlet on the right side, and a water outlet pipe (9) is fixed inside the drain outlet. A sealing cap (10) is threaded to the right end of the water outlet pipe (9).

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