LED lamp strip heat dissipation aluminum substrate attaching structure

Abstract

The utility model discloses an LED lamp strip heat dissipation aluminum substrate attaching structure which comprises an aluminum substrate body, upper heat dissipation holes are formed in the aluminum substrate body, a connecting column is fixedly connected to the bottom of the aluminum substrate body, an installation sleeve column is arranged on the outer wall of the connecting column in a sleeved mode, a groove is formed in the inner wall of the installation sleeve column, one end of the connecting column is of an arc-shaped structure, and the other end of the connecting column is of an arc-shaped structure. The lower ends of the upper heat dissipation holes are communicated with the lower heat dissipation holes, the lower heat dissipation holes are located at the bottoms of the upper heat dissipation holes, the upper heat dissipation holes are distributed at equal intervals in a rectangular mode relative to the outer walls of the lamp beads, the lamp beads are arranged on the aluminum substrate body, the upper heat dissipation holes are located on the outer sides of the lamp beads, and the lower heat dissipation holes are formed in the bottom of the aluminum substrate body. The lower heat dissipation holes are of an arc-shaped structure, the multiple lower heat dissipation holes are transversely distributed at equal intervals relative to the bottom of the aluminum substrate body, and a heat dissipation plate is fixed to the bottoms of the lower heat dissipation holes. The heat dissipation effect of the lamp beads on the aluminum substrate body is improved while the installation stability of the aluminum substrate body is guaranteed, and the use temperature of the lamp beads is prevented from being too high.

Description

Technical Field

[0001] This utility model relates to the field of LED light strip processing technology, specifically to a bonding structure for heat dissipation aluminum substrate of LED light strip. Background Technology

[0002] LED light strip aluminum substrate is a circuit board specifically designed for LED lighting fixtures. It boasts excellent heat dissipation performance, crucial for ensuring the stability of LED lighting fixtures and extending their lifespan. Structural features include: Metal substrate: The main characteristic of the aluminum substrate is the use of aluminum alloy as the base material, providing excellent thermal conductivity; Insulation layer: Between the aluminum substrate and copper foil is a thin layer of ceramic insulation material (such as alumina or boron nitride), which not only provides electrical insulation but also effectively transfers heat; Copper circuit layer: The top layer is copper foil etched with a specific pattern, used to solder LED chips and other electronic components.

[0003] Currently, LED strips generate heat when LED chips are installed on aluminum substrates. Since the bottom of the aluminum substrate is horizontal, it adheres to the wall or table after installation, affecting heat dissipation. Therefore, improvements are needed. Utility Model Content

[0004] The purpose of this invention is to provide a bonding structure for an aluminum substrate for heat dissipation in LED light strips, so as to solve the problem of poor heat dissipation effect of aluminum substrates for LED light strips mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an LED light strip heat dissipation aluminum substrate bonding structure, comprising an aluminum substrate body, an upper heat dissipation hole on the aluminum substrate body, an LED bead disposed on the aluminum substrate body, the upper heat dissipation hole being located on the outside of the LED bead, a lower heat dissipation hole being disposed at the bottom of the aluminum substrate body, and a heat dissipation plate being fixed at the bottom of the lower heat dissipation hole.

[0006] Preferably, the lower heat dissipation holes have an arc-shaped structure, and there are multiple lower heat dissipation holes distributed horizontally at equal intervals about the bottom of the aluminum substrate.

[0007] Preferably, the upper heat dissipation holes are distributed in a rectangular, equally spaced manner about the outer wall of the lamp bead, and multiple sets of upper heat dissipation holes are provided.

[0008] Preferably, the lower end of the upper heat dissipation hole is connected to the lower heat dissipation hole, and the lower heat dissipation hole is located at the bottom of the upper heat dissipation hole.

[0009] Preferably, a connecting post is fixedly connected to the bottom of the aluminum substrate, and one end of the connecting post has an arc-shaped structure.

[0010] Preferably, the outer wall of the connecting column is fitted with an installation sleeve, and the inner wall of the installation sleeve is provided with a groove, which matches the lower end structure of the connecting column.

[0011] Preferably, the mounting sleeve has a "T" shaped structure when viewed from the front, and a patch is provided at the bottom of the mounting sleeve.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] (1) This device improves the heat dissipation effect of the LED beads on the aluminum substrate while ensuring the installation stability of the aluminum substrate, thus avoiding excessively high operating temperature of the LED beads.

[0014] (2) This device provides a space for heat dissipation at the bottom of the aluminum substrate by opening a lower heat dissipation hole. At the same time, it provides a space for heat dissipation by opening an upper heat dissipation hole through the aluminum substrate. The upper heat dissipation hole and the lower heat dissipation hole are connected and located on the outside of the lamp bead. This can dissipate the heat around the lamp bead in time, improve the heat dissipation efficiency of the lamp bead, and avoid the lamp bead temperature from being too high.

[0015] (3) This device can quickly attach and fix the aluminum substrate by setting connecting columns, mounting columns and attaching blocks at the bottom of the aluminum substrate, thereby improving the installation efficiency of the aluminum substrate. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the bonding structure of an LED light strip heat dissipation aluminum substrate according to the present invention;

[0017] Figure 2 This is a top view of an LED light strip heat dissipation aluminum substrate bonding structure according to the present invention;

[0018] Figure 3 This utility model relates to a bonding structure for heat dissipation aluminum substrate of LED light strip. Figure 1 Enlarged view of point A in the middle;

[0019] Figure 4 This is a cross-sectional view of the connection between the connecting column and the mounting sleeve column in the bonding structure of the heat dissipation aluminum substrate for LED light strips according to this utility model.

[0020] In the diagram: 1. Aluminum substrate; 2. LED chip; 3. Upper heat dissipation hole; 4. Heat sink; 5. Lower heat dissipation hole; 6. Connecting post; 7. Mounting sleeve post; 8. Attachment block. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-4This utility model provides a technical solution: an LED light strip heat dissipation aluminum substrate bonding structure, including an aluminum substrate body 1, an upper heat dissipation hole 3 on the aluminum substrate body 1, and a connecting post 6 fixedly connected to the bottom of the aluminum substrate body 1. One end of the connecting post 6 has an arc-shaped structure; this structure facilitates the separation of the connecting post 6 from the mounting sleeve post 7; the outer wall of the connecting post 6 is fitted with the mounting sleeve post 7, and the inner wall of the mounting sleeve post 7 has a groove that matches the lower end structure of the connecting post 6; in this structure, the connecting post 6 can be inserted into the mounting sleeve post 7 and can be locked inside the mounting sleeve post 7, while the connecting post 6 can be quickly separated from the mounting sleeve post 7 by pulling, facilitating the quick installation and disassembly of the aluminum substrate body 1; the mounting sleeve post 7 has a "T" shaped structure when viewed from the front, and a sticking block 8 is provided at the bottom of the mounting sleeve post 7; this structure allows the mounting sleeve post 7 to be quickly pasted and fixed by the sticking block 8, and the aluminum substrate body 1 can be fixed by fixing the mounting sleeve post 7, improving the installation efficiency of the aluminum substrate body 1; The heat dissipation holes 3 are distributed in a rectangular, evenly spaced pattern on the outer wall of the LED bead 2, with multiple sets of upper heat dissipation holes 3. This structure can dissipate heat around the LED bead 2 in a timely manner. The lower end of the upper heat dissipation hole 3 is connected to the lower heat dissipation hole 5, which is located at the bottom of the upper heat dissipation hole 3. This structure can ensure rapid heat flow and improve heat dissipation effect. The LED bead 2 is set on the aluminum substrate 1, and the upper heat dissipation hole 3 is located on the outside of the LED bead 2. The lower heat dissipation hole 5 is set at the bottom of the aluminum substrate 1. The lower heat dissipation hole 5 has an arc-shaped structure and multiple lower heat dissipation holes 5 are distributed horizontally at equal intervals on the bottom of the aluminum substrate 1. This structure prevents the aluminum substrate 1 from directly contacting the desktop or wall surface, which would affect heat dissipation. A heat dissipation plate 4 is fixed at the bottom of the lower heat dissipation hole 5. This device can support the aluminum substrate 1 through the connecting column 6, the mounting sleeve column 7, and the mounting block 8, thereby ensuring that the aluminum substrate 1 maintains a certain distance from the desktop or wall surface and ensuring space for air flow.

[0023] Working principle: When using this LED strip heat dissipation aluminum substrate bonding structure, first press the mounting sleeve 7 into the outer wall of the connecting column 6, then stick the patch 8 on the designated mounting area of ​​the aluminum substrate 1. Once the patch 8 is stuck on the aluminum substrate 1, the fixing is complete. If it is necessary to remove the aluminum substrate 1, the connecting column 6 at the bottom of the aluminum substrate 1 can be pulled to separate the connecting column 6 from the inside of the mounting sleeve 7. During the use of this device, when the LED bead 2 generates heat, some of the heat is dissipated through the air around the upper heat dissipation hole 3, and some of the heat is dissipated through the heat dissipation plate 4 from the lower heat dissipation hole 5, thereby improving the heat dissipation effect of this device and ensuring the service life of this device.

[0024] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heat dissipation aluminum substrate bonding structure for LED light strips, comprising an aluminum substrate body (1), characterized in that: The aluminum substrate (1) has an upper heat dissipation hole (3) and an LED bead (2) is provided on the aluminum substrate (1). The upper heat dissipation hole (3) is located outside the LED bead (2). The bottom of the aluminum substrate (1) has a lower heat dissipation hole (5) and a heat dissipation plate (4) is fixed at the bottom of the lower heat dissipation hole (5).

2. The LED strip heat dissipation aluminum substrate bonding structure according to claim 1, characterized in that: The lower heat dissipation hole (5) has an arc-shaped structure, and there are multiple lower heat dissipation holes (5) distributed horizontally at equal intervals about the bottom of the aluminum substrate (1).

3. The LED strip heat dissipation aluminum substrate bonding structure according to claim 1, characterized in that: The upper heat dissipation holes (3) are distributed in a rectangular and equally spaced manner on the outer wall of the lamp bead (2), and multiple sets of upper heat dissipation holes (3) are provided.

4. The LED strip heat dissipation aluminum substrate bonding structure according to claim 1, characterized in that: The lower end of the upper heat dissipation hole (3) is connected to the lower heat dissipation hole (5), and the lower heat dissipation hole (5) is located at the bottom of the upper heat dissipation hole (3).

5. The LED strip heat dissipation aluminum substrate bonding structure according to claim 1, characterized in that: The bottom of the aluminum substrate (1) is fixedly connected to a connecting post (6), and one end of the connecting post (6) has an arc-shaped structure.

6. The LED strip heat dissipation aluminum substrate bonding structure according to claim 5, characterized in that: The outer wall of the connecting column (6) is fitted with an installation sleeve (7), and the inner wall of the installation sleeve (7) is provided with a groove, which matches the lower end structure of the connecting column (6).

7. The LED strip heat dissipation aluminum substrate bonding structure according to claim 6, characterized in that: The mounting sleeve (7) has a "T" shaped structure when viewed from the front, and a patch (8) is provided at the bottom of the mounting sleeve (7).

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