Thermal diffusion device and electronic equipment

Abstract

The utility model provides a thermal diffusion device and electronic equipment. A vapor chamber (1) according to one embodiment of a heat diffusion device is provided with: a housing (10) having a first inner surface (11a) and a second inner surface (12a) facing each other in the thickness direction (Z), and having an evaporation section (EP) provided in the internal space; a working medium (20) sealed in the internal space of the housing (10); and a core (30) disposed in the internal space of the housing (10). A liquid flow path (40) for the working medium (20) is formed in a space surrounded by at least a part of the housing (10) and a part of the core (30). At least a portion of the liquid flow path (40) is disposed along the inner edge of the housing (10) when viewed from the thickness direction (Z). When viewed from the thickness direction (Z), the liquid flow path (40) is not connected and is cut off at a position that does not overlap the evaporation section (EP), and a pocket section (51) that is continuous with the vapor space (50) of the working medium (20) is formed in a space in which the liquid flow path (40) is cut off.

Description

Technical Field

[0001] This utility model relates to a heat diffusion device and electronic equipment. Background Technology

[0002] In recent years, the increasing integration and performance of components have led to a rise in heat generation. Furthermore, the miniaturization of products has increased heat density, making heat dissipation strategies particularly important. This is especially evident in mobile devices such as smartphones and tablets. While graphite sheets are commonly used as heat-resistant components, their insufficient heat transfer capacity necessitates research into various heat-resistant components. Among these, the use of vapor chambers, which function as planar heat pipes, is being studied as a highly effective heat dissipation device.

[0003] The vapor chamber has the following structure: a working medium (also called a working fluid) is sealed inside the shell, and a core that transports the working medium using capillary force. The working medium absorbs heat from heating elements such as electronic components in the evaporation section and evaporates within the vapor chamber. Afterward, the working medium moves within the vapor chamber, is cooled, and returns to a liquid phase. The liquid-phase working medium then moves again towards the evaporation section on the heating element side using the capillary force of the core, cooling the heating element. By repeating this process, the vapor chamber can operate independently without external power, utilizing the latent heat of vaporization and condensation of the working medium to achieve high-speed, two-dimensional heat diffusion.

[0004] Such a heat spreader can be manufactured, for example, by joining the first and second pieces, which are configured with the core, in the circumferential direction except for the position of the injection port for the working medium, thereby forming a shell in which the core is configured in the internal space. Then, the working medium is injected into the internal space from the injection port, and after the internal space is degassed, the injection port is sealed.

[0005] Patent Document 1 discloses a heat diffusion plate, characterized in that a heating section is provided in a part of a thin plate-shaped main body for transferring heat from the outside, so that the heat transferred to the heating section diffuses from the heating section to other parts of the main body. A plurality of hollow paths are formed to pass through the heating section inside the main body, and the hollow paths are interconnected in the heating section. A working fluid that is heated and evaporated and cooled and condensed is sealed inside the hollow paths. Inside each hollow path, a core that generates capillary force through the permeation of the liquid phase of the working fluid is configured to open a vapor flow path inside the hollow path to allow the vapor of the working fluid to flow. A part of each core is located in the heating section, and the vapor flow paths formed inside each hollow path are interconnected in the heating section.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2016-223673 Utility Model Content

[0009] Problems to be solved by utility models

[0010] Generally, in a vapor chamber, in the evaporation section (the heating section described in Patent Document 1), the liquid working medium located on the surface of the core evaporates and changes into a gaseous phase. The gaseous working medium moves through a vapor flow path to a position away from the evaporation section, where it condenses and changes into a liquid phase. After the liquid working medium is recovered to the core and moves back to the evaporation section, it evaporates again from the surface of the core in the evaporation section. In this way, the working medium circulates while repeating the gas-liquid phase change.

[0011] In the heat diffusion plate described in Patent Document 1, such as in Patent Document 1... Figure 1 or Figure 4 As shown, multiple cores are arranged throughout the entire interior of the main body. Therefore, in the heat diffusion plate described in Patent Document 1, since the area occupied by the vapor flow path in the internal space of the shell is restricted, not only is the heat homogenization area reduced, but the thermal conductivity itself is also reduced.

[0012] Furthermore, if the liquid working medium is recycled to the core, the accumulation of the working medium or non-condensable gas (NCG) in the vapor flow path can also cause problems that hinder heat diffusion. Here, non-condensable gases include, for example, air that was not degassed during manufacturing and remains in the internal space of the casing.

[0013] Furthermore, the aforementioned problems are not limited to heat spreaders, but are the same problems for heat diffusion devices that can use the same structure as heat spreaders to diffuse heat.

[0014] This invention was made to solve the aforementioned problems, and its purpose is to provide a heat diffusion device with high thermal conductivity and excellent heat diffusion performance. Furthermore, this invention aims to provide an electronic device equipped with the aforementioned heat diffusion device.

[0015] Solution for solving the problem

[0016] The heat diffusion device of this invention comprises: a housing having a first inner surface and a second inner surface opposite each other in the thickness direction, and an evaporation section provided in the internal space; a working medium sealed in the internal space of the housing; and a core disposed in the internal space of the housing. A liquid flow path of the working medium is formed in the space at least surrounded by a portion of the housing and a portion of the core. At least a portion of the liquid flow path is disposed along the inner edge of the housing when viewed from the thickness direction. The liquid flow path is not connected and is cut off at a position not overlapping with the evaporation section when viewed from the thickness direction, and a bag portion continuous with the vapor space of the working medium is formed in the space where the liquid flow path is cut off.

[0017] Preferably, the housing has an injection port mark on its outer surface that communicates with the bag portion for the working medium.

[0018] Preferably, the core located in the liquid flow path is connected at the bag portion.

[0019] Preferably, the core located in the liquid flow path is not connected and is cut off at the bag portion.

[0020] Preferably, when viewed from the thickness direction, when the intersection of the first imaginary line passing through both ends of the truncated liquid flow path with two locations on the outer edge of the housing is defined as the first edge end and the second edge end, the distance between the two ends of the truncated liquid flow path on the first imaginary line is less than 1 / 2 of the distance between the first edge end and the second edge end.

[0021] Preferably, when viewed from the thickness direction, when the intersection of the second imaginary line passing through the evaporation section and the bag section with two locations on the outer edge of the shell is defined as the third edge end and the fourth edge end, the evaporation section is located closer to the third edge end than to the fourth edge end, and the bag section is located closer to the fourth edge end than to the third edge end.

[0022] Preferably, the first inner surface of the housing also has a guide rail-shaped partition wall that is spaced apart from the inner edge of the housing and arranged along the inner edge. The liquid flow path is formed in the space surrounded by the first inner surface of the housing, the core and the partition wall, and the two ends of the truncated liquid flow path are closed by the partition wall.

[0023] Preferably, the internal space of the housing has: a flow path region, which is a region along the inner edge of the housing where the liquid flow path exists when viewed from the thickness direction; a first vapor region, which overlaps with a portion of the core when viewed from the thickness direction; and a second vapor region, which does not overlap with the core when viewed from the thickness direction, wherein the first vapor region has a portion located between the second vapor region and the flow path region when viewed in a cross-section perpendicular to the extension direction of the flow path region.

[0024] Preferably, the first inner surface of the housing also has a guide rail-shaped partition wall disposed at intervals along the inner edge of the housing. When viewed in a cross section perpendicular to the extension direction of the flow path region, the flow path region is held in the thickness direction by the first inner surface of the housing and a portion of the core, and in the plane direction orthogonal to the thickness direction by a portion of the housing and the partition wall.

[0025] Preferably, in the first vapor region, the core is away from the first inner surface.

[0026] Preferably, in the first vapor region, at least a portion of the core is in contact with the first inner surface.

[0027] Preferably, when viewed in a cross-section perpendicular to the extension direction of the flow path region, the flow path region is held in the thickness direction by the first inner surface of the housing and a portion of the core, and in a plane direction orthogonal to the thickness direction by a portion of the housing and a portion of the core.

[0028] Preferably, when viewed in a cross-section perpendicular to the extension direction of the flow path region, the flow path region is held in the thickness direction by the first inner surface of the housing and a portion of the core, and in a plane direction orthogonal to the thickness direction by a portion of the core and a portion of the core.

[0029] Preferably, when viewed in a cross-section perpendicular to the extension direction of the flow path region, the flow path region includes a first flow path region and a second flow path region. The first flow path region is held in the thickness direction by the first inner surface of the housing and a portion of the core, and in a plane direction orthogonal to the thickness direction by a portion of the core and a portion of the core. The second flow path region is held in the thickness direction by the second inner surface of the housing and a portion of the core, and in a plane direction orthogonal to the thickness direction by a portion of the core and a portion of the core.

[0030] Preferably, the flow path region also includes a plurality of support pillars for supporting the core.

[0031] The electronic device of this invention includes the heat diffusion device of this invention.

[0032] Effects of the utility model

[0033] According to this invention, a heat diffusion device with high thermal conductivity and excellent heat diffusion performance can be provided. Furthermore, according to this invention, an electronic device equipped with the aforementioned heat diffusion device can be provided. Attached Figure Description

[0034] Figure 1 This is a perspective view schematically illustrating an example of a heat diffusion device according to the first embodiment of the present invention.

[0035] Figure 2 This is an exploded perspective view schematically illustrating an example of a heat diffusion device according to the first embodiment of the present invention.

[0036] Figure 3 This is a top view schematically showing an example of the internal structure of the heat diffusion device according to the first embodiment of the present invention.

[0037] Figure 4 It is along Figure 3 A cross-sectional view of the heat diffusion device along line IV-IV.

[0038] Figure 5 This is a top view schematically illustrating an example of the internal structure of a heat diffusion device in which the liquid flow path is not interrupted.

[0039] Figure 6 It is along Figure 5 A cross-sectional view of the heat diffusion device along line VI-VI.

[0040] Figure 7 It is used to explain in Figure 3 A schematic diagram showing the dimensions of the bag portion formed by the heat spreader.

[0041] Figure 8 This is an enlarged top view schematically illustrating an example of the internal structure of a heat diffusion device with inlet marks on the outer surface of the casing.

[0042] Figure 9 This is a top view schematically illustrating an example of the internal structure of a heat diffusion device in which the core is truncated at the pouch section.

[0043] Figure 10 It is along Figure 9 A cross-sectional view of the heat diffusion device shown along line XX.

[0044] Figure 11This is a top view schematically illustrating an example of the internal structure of a heat diffusion device where the two ends of a cut-off liquid flow path are not sealed by a partition wall.

[0045] Figure 12 It is along Figure 11 A cross-sectional view of the heat diffusion device along line XII-XII.

[0046] Figure 13 This is a schematic diagram used to illustrate the location where the liquid flow path is cut off.

[0047] Figure 14 This is a top view schematically showing an example of the internal structure of the heat diffusion device according to the second embodiment of the present invention.

[0048] Figure 15 It is along Figure 14 A cross-sectional view of the heat diffusion device along line XV-XV.

[0049] Figure 16 This is a cross-sectional view schematically illustrating another example of a heat diffusion device according to the second embodiment of the present invention.

[0050] Figure 17 This is a cross-sectional view schematically illustrating an example of a heat diffusion device according to the third embodiment of the present invention.

[0051] Figure 18 This is a cross-sectional view schematically illustrating another example of a heat diffusion device according to the third embodiment of the present invention.

[0052] Figure 19 This is a cross-sectional view schematically illustrating an example of a heat diffusion device according to the fourth embodiment of the present invention.

[0053] Figure 20 This is a cross-sectional view schematically illustrating another example of the heat diffusion device according to the fourth embodiment of the present invention.

[0054] Figure 21 This is a cross-sectional view schematically illustrating an example of a heat diffusion device according to the fifth embodiment of the present invention.

[0055] Figure 22 This is a top view schematically showing a first modified example of the internal structure of the heat diffusion device of this utility model.

[0056] Figure 23 This is a top view schematically showing a second modified example of the internal structure of the heat diffusion device of this utility model.

[0057] Figure 24 This is a top view schematically showing a third variation of the internal structure of the heat diffusion device of the present invention. Detailed Implementation

[0058] The following describes the heat diffusion device of this utility model.

[0059] However, this invention is not limited to the following embodiments, and can be appropriately modified and applied without changing the spirit of this invention. Furthermore, this invention also includes embodiments that combine two or more preferred structures of this invention described below.

[0060] In the thermal diffusion device of this invention, a liquid flow path for the working medium is formed in a space surrounded by at least a portion of the housing and a portion of the core. Therefore, not only can capillary force be generated using the core surrounding the liquid flow path, but the working medium can also move smoothly within the liquid flow path by reducing the liquid resistance. As a result, the permeability is improved.

[0061] Furthermore, at least a portion of the liquid flow path is arranged along the inner edge of the shell when viewed from the thickness direction. By ensuring that the liquid flow path is not arranged throughout the entire internal space of the shell, a larger vapor space can be ensured within the internal space of the shell. As a result, thermal conductivity is improved.

[0062] Based on this, the liquid flow path is interrupted at a position that does not overlap with the evaporation section when viewed from the thickness direction, and a bag section is formed in the space where the liquid flow path is interrupted, which is continuous with the vapor space of the working medium. The working medium or non-condensable gas can accumulate in the bag section where the liquid flow path is interrupted, thus expanding the heat diffusion area. As a result, heat diffusion performance is improved.

[0063] The embodiments shown below are illustrative; of course, partial substitutions or combinations of the structures shown in different embodiments are possible. From the second embodiment onwards, descriptions of items identical to those in the first embodiment are omitted, and only the differences are explained. In particular, the same effects based on the same structure are not mentioned repeatedly in each embodiment.

[0064] In the following description, unless otherwise specified, each embodiment will be referred to as "the thermal diffusion device of this utility model".

[0065] The following description uses a heat spreader as an example to illustrate one embodiment of the heat diffusion device of this invention. The heat diffusion device of this invention can also be applied to heat diffusion devices such as heat pipes.

[0066] The accompanying drawings are schematic and their dimensions, aspect ratios, and scales may differ from the actual product.

[0067] [First Implementation]

[0068] In the heat diffusion device of the first embodiment of the present invention, a portion of the core is configured not to protrude from the liquid flow path into the vapor space.

[0069] Figure 1 This is a perspective view schematically illustrating an example of a heat diffusion device according to the first embodiment of the present invention. Figure 2 This is an exploded perspective view schematically illustrating an example of a heat diffusion device according to the first embodiment of the present invention. Figure 3 This is a top view schematically showing an example of the internal structure of the heat diffusion device according to the first embodiment of the present invention. Figure 4 It is along Figure 3 A cross-sectional view of the heat diffusion device along line IV-IV.

[0070] Figure 1 The heat spreader (heat diffusion device) 1 shown has a hollow shell 10 that is sealed in an airtight state. For example... Figure 4 As shown, the housing 10 has a first inner surface 11a and a second inner surface 12a opposite each other in the thickness direction Z. The heat spreader 1 also includes a working medium 20 sealed inside the internal space of the housing 10 and a core 30 disposed inside the internal space of the housing 10.

[0071] like Figure 3 As shown, a working medium 20 (see reference) is provided in the internal space of the housing 10 for sealing. Figure 4 The evaporation portion (EP) of the evaporator. Figure 1 As shown, a heat source HS, serving as a heating element, is disposed on the outer surface of the housing 10. Examples of heat sources HS include electronic components of electronic devices such as central processing units (CPUs). Within the interior space of the housing 10, the portion near the heat source HS and heated by it corresponds to the evaporator EP.

[0072] Preferably, the heat spreader 1 is integrally planar. That is, preferably, the housing 10 is integrally planar. Here, "planar" means a shape that includes plate-like and sheet-like shapes, where the dimensions in the width direction X (hereinafter referred to as width) and length direction Y (hereinafter referred to as length) are quite large relative to the dimensions in the thickness direction Z (hereinafter referred to as thickness or height), for example, the width and length are more than 10 times the thickness, preferably more than 100 times the thickness.

[0073] There is no particular limitation on the size of the heat spreader 1, i.e., the size of the housing 10. The width and length of the heat spreader 1 can be appropriately set according to the application. For example, the width and length of the heat spreader 1 can be 5 mm or more and 500 mm or less, 20 mm or more and 300 mm or less, or 50 mm or more and 200 mm or less, respectively. The width and length of the heat spreader 1 can be the same or different.

[0074] Preferably, the housing 10 is composed of a first piece 11 and a second piece 12 opposite to each other at the outer edge of the joint.

[0075] When the housing 10 is composed of a first piece 11 and a second piece 12, the materials constituting the first piece 11 and the second piece 12 are not particularly limited, as long as they possess properties suitable for use as a heat diffusion device such as a heat spreader, such as thermal conductivity, strength, flexibility, etc. For the materials constituting the first piece 11 and the second piece 12, metals are preferred, such as copper, nickel, aluminum, magnesium, titanium, iron, or alloys with these as main components, with copper being particularly preferred. The materials constituting the first piece 11 and the second piece 12 may be the same or different, but it is preferred that they are the same.

[0076] When the housing 10 is composed of a first piece 11 and a second piece 12, the first piece 11 and the second piece 12 are joined together at their outer edges. The method of joining is not particularly limited, and for example, laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inactive gas welding), ultrasonic bonding, or resin sealing can be used. Laser welding, resistance welding, or brazing is preferred.

[0077] The thickness of the first sheet 11 and the second sheet 12 is not particularly limited, but preferably is 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, and even more preferably 40 μm or more and 60 μm or less. The thickness of the first sheet 11 and the second sheet 12 may be the same or different. In addition, the thickness of each sheet of the first sheet 11 and the second sheet 12 may be the same overall or locally thinner.

[0078] The shapes of the first piece 11 and the second piece 12 are not particularly limited. For example, the first piece 11 and the second piece 12 may also be shapes in which the outer edge is thicker than the parts other than the outer edge.

[0079] The overall thickness of the heat spreader 1 is not particularly limited, but it is preferably 50μm or more and 500μm or less.

[0080] The planar shape of the housing 10 when viewed from the thickness direction Z is not particularly limited. Examples include polygons such as triangles or rectangles, circles, ellipses, and combinations thereof. Furthermore, the planar shape of the housing 10 can also be L-shaped, C-shaped, stepped, etc. Additionally, the housing 10 may have a through-hole. The planar shape of the housing 10 can also correspond to the purpose of the heat diffusion device such as the heat spreader, the shape of the assembly location of the heat diffusion device, or other components present nearby.

[0081] The working medium 20 is not particularly limited as long as it is a substance capable of producing a gas-liquid phase change within the environment of the housing 10. For example, water, alcohols, or Freon substitutes can be used. For example, if the working medium is an aqueous compound, water is preferred.

[0082] The core 30 has a capillary structure that enables the working medium 20 to move using capillary force. The capillary structure of the core 30 can also be a known structure used in conventional heat diffusion devices. Examples of capillary structures include microstructures with pores, grooves, protrusions, etc., such as porous structures, fiber structures, groove structures, and mesh structures.

[0083] The material of the core 30 is not particularly limited. For example, it can be a porous metal membrane, mesh, nonwoven fabric, sintered body, or porous body formed by etching or metalworking. The mesh used as the material of the core 30 can be, for example, a metal mesh, a resin mesh, or a surface-coated mesh, preferably a copper mesh, a stainless steel (SUS) mesh, or a polyester fiber mesh. The sintered body used as the material of the core 30 can be, for example, a porous metal sintered body, a porous ceramic sintered body, etc., preferably a porous copper or nickel sintered body. The porous body used as the material of the core 30 can also be, for example, a porous metal body, a porous ceramic body, a porous resin body, etc.

[0084] The thickness of the core 30 is not particularly limited, for example, it is 2μm or more and 200μm or less, preferably 5μm or more and 100μm or less, and more preferably 10μm or more and 40μm or less. The thickness of the core 30 may also vary locally.

[0085] like Figure 2 , Figure 3 as well as Figure 4 As shown, a liquid flow path 40 for the working medium 20 is formed in a space at least surrounded by a portion of the housing 10 and a portion of the core 30. On the other hand, a vapor space 50 for the working medium 20 is formed in the gaps within the housing 10 other than the liquid flow path 40.

[0086] exist Figure 2 , Figure 3 as well as Figure 4 In the example shown, the guide rail-shaped partition wall 60 is arranged along the inner edge of the first inner surface 11a of the housing 10 with a gap from the inner edge of the housing 10.

[0087] Therefore, a liquid flow path 40 is formed in the space surrounded by the first inner surface 11a of the shell 10, the core 30 and the partition wall 60.

[0088] At least a portion of the liquid flow path 40 is configured along the inner edge of the housing 10 when viewed from the thickness direction Z. Figure 3 In the example shown, the liquid flow path 40 is only located on the inner edge of the housing 10.

[0089] like Figure 3 and Figure 4 As shown, the liquid flow path 40 is cut off at a position where it does not overlap with the evaporation section EP when viewed from the thickness direction Z. The liquid flow path 40 is absent in the cut-off portion.

[0090] A bag section 51, continuous with the vapor space 50 of the working medium 20, is formed in the space where the liquid flow path 40 is cut off. For example... Figure 3 As shown, the bag portion 51 is the part where the liquid flow path 40 is cut off and is continuous with the vapor space 50 of the working medium 20. Moreover, the bag portion 51 is in contact with the inner edge of the housing 10.

[0091] Figure 5 This is a top view schematically illustrating an example of the internal structure of a heat diffusion device in which the liquid flow path is not interrupted. Figure 6 It is along Figure 5 A cross-sectional view of the heat diffusion device along line VI-VI.

[0092] exist Figure 5 and Figure 6 In the heat spreader (heat diffusion device) 1a shown, the liquid flow path 40 is connected without being cut off.

[0093] exist Figure 3 The heat spreader 1 shown and Figure 5 In the heat diffusion device such as the heat spreader 1a shown, the working medium 20 in the gas phase evaporated in the evaporation section EP passes through the vapor space 50 to a position away from the evaporation section EP (for example, in...). Figure 3 and Figure 5 The vapor space 50, located in the region shown by CP, moves and condenses into a liquid phase. The liquid working medium 20 is recycled to the core 30 and the liquid flow path 40 and moves towards the evaporation section EP.

[0094] like Figure 3 and Figure 4 As shown, if a bag portion 51 is formed in the space where the liquid flow path 40 is cut off, not only can the working medium 20 be stored in the bag portion 51, but also, if non-condensable gas remains in the internal space of the housing 10, the non-condensable gas can be stored in the bag portion 51, thus expanding the heat diffusion area. As a result, the heat diffusion performance is improved.

[0095] like Figure 3 and Figure 4 As shown, preferably, the core 30 located in the liquid flow path 40 is connected at the bag portion 51. Figure 3 and Figure 4In the example shown, the core 30, located in the portion overlapping with the liquid flow path 40 when viewed from the thickness direction Z, is connected at the bag portion 51. Not limited to the thickness direction Z, the recyclability of the working medium 20 can be ensured by having the core 30 also present in the portion overlapping with the bag portion 51 when viewed from a certain direction.

[0096] like Figure 3 and Figure 4 As shown, preferably, both ends of the cut-off liquid flow path 40 are sealed by the partition wall 60. In this case, the working medium 20 in the liquid phase is easily kept in the liquid flow path 40, and therefore, it is not easy for it to flow back into the vapor space 50.

[0097] Figure 7 It is used to explain in Figure 3 A schematic diagram showing the dimensions of the bag portion formed by the heat spreader.

[0098] like Figure 7 As shown, preferably, when viewing the heat exchanger 1 from the thickness direction Z, when the intersection points of the first imaginary line IL1 passing through both ends of the truncated liquid flow path 40 and the two positions of the outer edge of the housing 10 are set as the first edge end P1 and the second edge end P2, the distance between the two ends of the truncated liquid flow path 40 on the first imaginary line IL1 (in Figure 7 In the diagram, the length shown by D1 is the distance between the first edge end P1 and the second edge end P2 (in... Figure 7 The distance D1 between the two ends of the cut-off liquid flow path 40 is less than 1 / 2, and more preferably less than 1 / 3. The longer the distance D1 between the two ends of the cut-off liquid flow path 40, the larger the size of the bag portion 51 can be. However, on the other hand, since the size of the liquid flow path 40 becomes smaller, it is difficult to recover the working medium 20 into the liquid flow path 40. If the distance D1 between the two ends of the cut-off liquid flow path 40 is less than 1 / 2 of the distance D2 between the first edge end P1 and the second edge end P2, the heat diffusion performance of the bag portion 51 is improved, and it is easy to recover the working medium 20 into the liquid flow path 40.

[0099] On the other hand, from the viewpoint of improving the thermal diffusion performance of the bag portion 51, it is preferable that the distance D1 between the two ends of the cut-off liquid flow path 40 on the first imaginary line IL1 is more than 1 / 7 of the distance D2 between the first edge end P1 and the second edge end P2.

[0100] Figure 8 This is an enlarged top view schematically illustrating an example of the internal structure of a heat diffusion device with inlet marks on the outer surface of the casing.

[0101] like Figure 8As shown in the heat spreader (heat diffusion device) 1A, the housing 10 may also have an injection port mark 13 on its outer surface that communicates with the working medium 20 in the bag portion 51.

[0102] like Figure 5 As shown in the heat spreader 1a, if the outer periphery of the internal space of the housing 10 is covered by the partition wall 60, it is difficult to inject the working medium 20 into the internal space of the housing 10 and to degas the internal space of the housing 10 during manufacturing. In contrast, in Figure 8 In the heat spreader 1A shown, the bag portion 51 can be used to form a path for injecting the working medium 20 into the internal space of the housing 10 and degassing the internal space of the housing 10. As a result, the discharge effect of non-condensable gases can be improved.

[0103] Figure 9 This is a top view schematically illustrating an example of the internal structure of a heat diffusion device in which the core is truncated at the pouch section. Figure 10 It is along Figure 9 A cross-sectional view of the heat diffusion device shown along line XX.

[0104] exist Figure 9 and Figure 10 In the vapor chamber (heat diffusion device) 1B shown, the core 30 located in the liquid flow path 40 is cut off at the bag portion 51 without being connected. Figure 9 and Figure 10 In the example shown, when viewed from the thickness direction Z, the core 30 located in the portion overlapping with the liquid flow path 40 is cut off at the bag portion 51 without being connected. Not limited to the thickness direction Z, but by eliminating the core 30 in the portion overlapping with the bag portion 51 when viewed from a certain direction, the vapor space 50 is increased, thus allowing a larger volume of non-condensable gas to be stored in the bag portion 51.

[0105] like Figure 9 and Figure 10 As shown, the end of the cut-off core 30 may coincide with the end of the cut-off liquid flow path 40, or it may not coincide with the end of the cut-off liquid flow path 40. For example, the end of the cut-off core 30 may also be located at a position overlapping with the cut-off liquid flow path 40 when viewed from the thickness direction Z.

[0106] Figure 11 This is a top view schematically illustrating an example of the internal structure of a heat diffusion device where the two ends of a cut-off liquid flow path are not sealed by a partition wall. Figure 12 It is along Figure 11 A cross-sectional view of the heat diffusion device along line XII-XII.

[0107] exist Figure 11 and Figure 12In the heat spreader (heat diffusion device) 1C shown, the two ends of the interrupted liquid flow path 40 are not sealed by the partition wall 60. In this case, according to the design, the working medium 20 accumulated in the bag section 51 can be easily recovered into the liquid flow path 40.

[0108] Furthermore, the location where the liquid flow path 40 is cut off is not particularly limited, as long as it does not overlap with the evaporation section EP when viewed from the thickness direction Z. Generally, the working medium 20 or non-condensable gas tends to accumulate in locations far from the evaporation section EP. Therefore, it is preferable that the liquid flow path 40 is cut off without connection at a location far from the evaporation section EP.

[0109] exist Figure 3 In the heat spreader 1 shown, when viewed from the thickness direction Z, the evaporation section EP overlaps with the inner edge of the shell 10. In this case, as... Figure 3 As shown, preferably, the bag portion 51 is located opposite the evaporation portion EP when viewed from the thickness direction Z.

[0110] Figure 13 This is a schematic diagram used to illustrate the location where the liquid flow path is cut off.

[0111] exist Figure 13 In the vapor chamber (heat diffusion device) 1D shown, when viewed from the thickness direction Z, the evaporation section EP does not overlap with the inner edge of the housing 10. In this case, as... Figure 13 As shown, preferably, when viewed from the thickness direction Z, when the intersection of the second imaginary line IL2 passing through the evaporation section EP and the bag section 51 with two positions on the outer edge of the housing 10 is set as the third edge end P3 and the fourth edge end P4, the evaporation section EP is located at a position closer to the third edge end P3 than to the fourth edge end P4, and the bag section 51 is located at a position closer to the fourth edge end P4 than to the third edge end P3.

[0112] like Figure 2 and Figure 3 As shown in the heat spreader 1, when a partition wall 60 is provided on the first inner surface 11a of the housing 10, the core 30 is supported by the partition wall 60. Therefore, even when the core 30 is thinner as the heat spreader 1 is made thinner, the liquid flow path 40 is not easily crushed, thus ensuring the volume of the liquid flow path 40.

[0113] exist Figure 2 and Figure 3 In the example shown, one column of partition walls 60 is configured, but two or more columns of partition walls 60 may also be configured in parallel. In this case, a liquid flow path 40 may also be formed, in which the partition walls 60 surround each other.

[0114] When there are multiple liquid flow paths 40 in the housing 10, at least one liquid flow path 40 can be cut off at a position where it does not overlap with the evaporation section EP when viewed from the thickness direction Z. In this case, the bag section 51 can be formed by cutting off the liquid flow path 40 on the side close to the vapor space 50.

[0115] The material forming the partition wall 60 is not particularly limited; examples include resin, metal, ceramic or mixtures thereof, laminates, etc. Furthermore, such as... Figure 2 and Figure 4 As shown, the partition wall 60 can also be integral with the housing 10, for example, it can also be formed by etching the inner surface of the housing 10.

[0116] The core 30 can also be fixed to the partition wall 60. For example, if the core 30 and the partition wall 60 are made of metal, the core 30 can also be joined to the partition wall 60. The joining method is not particularly limited; for example, diffusion bonding can be used.

[0117] The core 30 can also be fixed to the housing 10. For example, if the housing 10 and the core 30 are made of metal, the core 30 can also be joined to the housing 10. The joining method is not particularly limited; for example, diffusion bonding can be used.

[0118] like Figure 4 As shown, preferably, there is no space between the second inner surface 12a of the housing 10 and the core 30. In this case, the core 30 can also be fixed to the second inner surface 12a of the housing 10. For example, the core 30 can also be engaged with the second inner surface 12a of the housing 10.

[0119] As will be described later Figure 15 As shown, preferably, there is no space between the outer edge of the second piece 12 of the housing 10 and the end of the core 30. In this case, the end of the core 30 may also be fixed to the outer edge of the second piece 12 of the housing 10. For example, the end of the core 30 may also be engaged with the outer edge of the second piece 12 of the housing 10.

[0120] As will be described later Figure 15 As shown, the end of the core 30 can also be supported by the outer edge of the first piece 11 of the housing 10. In this case, the end of the core 30 can also be fixed to the outer edge of the first piece 11 of the housing 10. For example, the end of the core 30 can also be engaged with the outer edge of the first piece 11 of the housing 10.

[0121] like Figure 2 and Figure 3 As shown, preferably, a plurality of supports 70 are arranged within the vapor space 50. The vapor space 50 is interrupted between the supports 70. The housing 10 or the core 30 can be supported by arranging the supports 70 within the vapor space 50.

[0122] like Figure 2 and Figure 3 As shown, it is preferable that the support column 70 is arranged throughout the entire vapor space 50, but it is also possible that the support column 70 is not arranged in a part of the vapor space 50. The support column 70 may or may not be arranged in the bag section 51.

[0123] The support 70 may be connected to at least one of the first inner surface 11a and the second inner surface 12a, or it may not be connected to the first inner surface 11a and the second inner surface 12a.

[0124] The material used to form the support column 70 is not particularly limited; examples include resin, metal, ceramic, or mixtures or laminates thereof. Furthermore, the support column 70 can also be integral with the housing 10, for example, it can be formed by etching the inner surface of the housing 10.

[0125] The shape of the support column 70 is not particularly limited as long as it can support the shell 10, but the shape of the cross section of the support column 70 perpendicular to the height direction can be, for example, a polygon such as a rectangle, a circle, an ellipse, etc.

[0126] The height of the support column 70 can be the same or different in a heat exchange plate.

[0127] exist Figure 4 In the cross-section shown, the width of the support 70 is not particularly limited as long as it provides sufficient strength to suppress deformation of the housing 10. The equivalent circle diameter of the section perpendicular to the height direction at the end of the support 70 is, for example, 100 μm or more and 2000 μm or less, preferably 300 μm or more and 1000 μm or less. By increasing the equivalent circle diameter of the support 70, deformation of the housing 10 can be further suppressed. On the other hand, by decreasing the equivalent circle diameter of the support 70, more space can be ensured for the movement of the vapor of the working medium 20.

[0128] The arrangement of the supports 70 is not particularly limited, but it is preferable that they are uniform within a defined area, and more preferably uniform throughout the entire area, for example, by arranging them with a constant distance between the supports 70. By uniformly arranging the supports 70, uniform strength can be ensured throughout the entire heat diffusion device such as the heat spreader.

[0129] [Second Implementation]

[0130] In the heat diffusion device of the second embodiment of this invention, a portion of the core is configured to protrude from the liquid flow path into the vapor space. This increases the gas-liquid exchange surface area.

[0131] In the heat diffusion device of the second embodiment of this utility model, the guide rail-shaped partition wall is arranged at intervals along the inner edge of the first inner surface of the housing. When viewed in a cross section from the extension direction of the flow path region, the flow path region is held in the thickness direction by the first inner surface of the housing and a portion of the core, and in the plane direction orthogonal to the thickness direction by a portion of the housing and the partition wall.

[0132] Figure 14 This is a top view schematically showing an example of the internal structure of the heat diffusion device according to the second embodiment of the present invention. Figure 15 It is along Figure 14 A cross-sectional view of the heat diffusion device along line XV-XV.

[0133] exist Figure 14 and Figure 15 In the heat spreader (heat diffusion device) 2 shown, the internal space of the housing 10 has: a flow path region Ra, which is a region along the inner edge of the housing 10 where a liquid flow path 40 exists when viewed from the thickness direction Z; a first vapor region Rb, which overlaps with a portion of the core 30 when viewed from the thickness direction Z; and a second vapor region Rc, which does not overlap with the core 30 when viewed from the thickness direction Z. The flow path region Ra is arranged along the inner edge of the housing 10 when viewed from the thickness direction Z. In the extending direction of the flow path region Ra (in Figure 15 When viewed in a cross-section (within the Y direction), the first vapor region Rb has a portion located between the second vapor region Rc and the flow path region Ra. Preferably, when viewed from the cross-section described above, the first vapor region Rb is located entirely between the second vapor region Rc and the flow path region Ra, but it is also possible that it is not located in a portion between the second vapor region Rc and the flow path region Ra. Furthermore, the first vapor region Rb is a region that does not overlap with the liquid flow path 40 when viewed from the thickness direction Z.

[0134] The liquid flow path 40 has: a bottom surface 40a, which is formed by a first inner surface 11a or a second inner surface 12a of the housing 10; an upper surface 40b, which is separated from the first inner surface 11a and the second inner surface 12a of the housing 10; and a first side surface 40c and a second side surface 40d, which are continuous with the upper surface 40b and in contact with the first inner surface 11a or the second inner surface 12a of the housing 10. Figure 15 In the example shown, the bottom surface 40a of the liquid flow path 40 is formed by the first inner surface 11a of the housing 10, but it could also be formed by the second inner surface 12a of the housing 10. Therefore, in this specification, the bottom surface 40a of the liquid flow path 40 does not refer to the surface located vertically below. Similarly, the upper surface 40b of the liquid flow path 40 does not refer to the surface located vertically above.

[0135] exist Figure 14 In the section where the liquid flow path 40 is cut off, the flow path region Ra is also cut off. The region where the flow path region Ra is cut off is the first vapor region Rb.

[0136] When observing a cross-section perpendicular to the extension direction of the flow path region Ra, the width of the flow path region Ra is not particularly limited, for example, it is 500 μm or more and 3000 μm or less. In addition, when observing a cross-section perpendicular to the extension direction of the flow path region Ra, if the width of the flow path region Ra is different in the thickness direction Z, the width of the widest part is defined as the width of the flow path region Ra.

[0137] When observing a cross-section perpendicular to the extension direction of the flow path region Ra, the width of the first vapor region Rb is not particularly limited. For example, the width of the first vapor region Rb in the uninterrupted portion of the flow path region Ra is 1 mm or more and 10 mm or less. Furthermore, when observing a cross-section perpendicular to the extension direction of the flow path region Ra, if the width of the first vapor region Rb in the uninterrupted portion of the flow path region Ra differs in the thickness direction Z, the width of the widest portion is defined as the width of the first vapor region Rb.

[0138] exist Figure 14 and Figure 15 In the example shown, the guide rail-shaped partition wall 60 is arranged along the inner edge of the first inner surface 11a of the housing 10 with a gap from the inner edge of the housing 10.

[0139] Therefore, a liquid flow path 40 is formed by being surrounded by a portion of the housing 10, a portion of the core 30, and a partition wall 60. Specifically, the liquid flow path 40 has: a bottom surface 40a, which is formed by a first inner surface 11a of the housing 10; an upper surface 40b, which is formed by a portion of the core 30; a first side surface 40c, which is formed by an outer edge of the housing 10; and a second side surface 40d, which is formed by the partition wall 60.

[0140] In this case, when observing a cross-section perpendicular to the extension direction of the flow path region Ra, the flow path region Ra is held in the thickness direction Z by the first inner surface 11a of the housing 10 and a portion of the core 30, and in the plane direction orthogonal to the thickness direction Z by a portion of the housing 10 and the partition wall 60. In other words, the flow path region Ra is surrounded by the first inner surface 11a of the housing 10, the outer edge of the housing 10, a portion of the core 30, and the partition wall 60.

[0141] exist Figure 14 and Figure 15 In the example shown, one column of partition walls 60 is configured, but two or more columns of partition walls 60 may also be configured in parallel. In this case, a liquid flow path 40 may also be formed, in which the partition walls 60 surround each other.

[0142] like Figure 14 and Figure 15 As shown, preferably, a plurality of supports 70 are arranged within the vapor space 50. The vapor space 50 is interrupted between the supports 70. The housing 10 or the core 30 can be supported by arranging the supports 70 within the vapor space 50.

[0143] like Figure 14 and Figure 15 As shown, preferably, the support column 70 is arranged throughout the entire steam space 50, but it is also possible that the support column 70 is not arranged in a part of the steam space 50. The support column 70 can be arranged in both the first steam region Rb and the second steam region Rc, or it can be arranged in only either the first steam region Rb or the second steam region Rc.

[0144] exist Figure 15 In the example shown, the support 70 disposed in the first vapor region Rb is in contact with the first inner surface 11a of the housing 10, and the support 70 disposed in the second vapor region Rc is in contact with both the first inner surface 11a and the second inner surface 12a. The support 70 may be in contact with at least one of the first inner surface 11a and the second inner surface 12a, or it may not be in contact with either of the first inner surface 11a or the second inner surface 12a.

[0145] exist Figure 15 In the vapor chamber 2 shown, in the first vapor region Rb, the core 30 is separated from the first inner surface 11a. (As shown...) Figure 15 As shown, the core 30 can also be supported in the first vapor region Rb by means of a support column 70 disposed on the side of the first inner surface 11a of the housing 10.

[0146] Figure 16 This is a cross-sectional view schematically illustrating another example of a heat diffusion device according to the second embodiment of the present invention.

[0147] exist Figure 16 In the heat spreader (heat diffusion device) 2A shown, at least a portion of the core 30 is in contact with the first inner surface 11a in the first vapor region Rb.

[0148] In the first vapor region Rb, in the heat spreader 2A where at least a portion of the core 30 is in contact with the first inner surface 11a, the core 30 droops towards the first inner surface 11a. Therefore, compared to the heat spreader 2A where the core 30 is away from the first inner surface 11a, the gas-liquid exchange surface can be increased. Moreover, leakage at the interface between the core 30 and the partition wall 60 can be reduced.

[0149] like Figure 16As shown, the core 30 can also be supported in the first vapor region Rb by a support column 70 disposed on the second inner surface 12a side of the housing 10. Compared with the heat spreader 2, the heat spreader 2A that uses the support column 70 to press the core 30 can be easily manufactured.

[0150] [Third Implementation]

[0151] In the heat diffusion device of the third embodiment of the present invention, when a cross-section perpendicular to the extension direction of the flow path region is observed, the flow path region is held in the thickness direction by the first inner surface of the shell and a part of the core, and in the plane direction orthogonal to the thickness direction by a part of the shell and a part of the core.

[0152] Figure 17 This is a cross-sectional view schematically illustrating an example of a heat diffusion device according to the third embodiment of the present invention.

[0153] exist Figure 17 In the heat spreader (heat diffusion device) 3 shown, with Figure 16 Unlike the heat spreader 2A shown, it is not equipped with a partition wall 60.

[0154] In the heat spreader 3, a liquid flow path 40 is formed by being surrounded by a portion of the housing 10 and a portion of the core 30. Specifically, the liquid flow path 40 has: a bottom surface 40a, which is formed by the first inner surface 11a of the housing 10; an upper surface 40b and a second side surface 40d, which are formed by a portion of the core 30; and a first side surface 40c, which is formed by the outer edge of the housing 10.

[0155] In this case, when observing a cross-section perpendicular to the extension direction of the flow path region Ra, the flow path region Ra is held in the thickness direction Z by the first inner surface 11a of the housing 10 and a portion of the core 30, and in the plane direction orthogonal to the thickness direction Z by a portion of the housing 10 and a portion of the core 30. In other words, the flow path region Ra is surrounded by the first inner surface 11a of the housing 10, the outer edge of the housing 10, and a portion of the core 30.

[0156] Compared to the heat spreader 2A, the heat spreader 3 does not have a partition wall 60, thus increasing the cross-sectional area of ​​the liquid flow path 40.

[0157] Figure 18 This is a cross-sectional view schematically illustrating another example of a heat diffusion device according to the third embodiment of the present invention.

[0158] exist Figure 18In the heat spreader (heat diffusion device) 3A shown, a plurality of support pillars 75 for supporting the core 30 are arranged in the flow path region Ra. By arranging the support pillars 75 in the flow path region Ra, the shape of the core 30 can be easily maintained. Furthermore, since the core 30 can be easily expanded in the planar direction, the cross-sectional area of ​​the flow path region Ra can be increased compared to the heat spreader 3.

[0159] Preferably, when viewing the heat exchanger 3A from the thickness direction Z, the support pillar 75 is arranged throughout the entire flow path region Ra, but it is also possible that the support pillar 75 is not arranged in a part of the flow path region Ra.

[0160] The arrangement of the supports 75 is not particularly limited, but it is preferable that they are uniform within a defined area, and more preferably uniform throughout the entire area, for example, by arranging them with a constant distance between the supports 75. The distance between the supports 75 may be the same as or different from the distance between the supports 70.

[0161] The support column 75 may or may not be connected to the first inner surface 11a of the housing 10.

[0162] As the material for forming the support column 75, the same material as the support column 70 is used. The material of the support column 75 may be the same as or different from the material of the support column 70. Furthermore, the support column 75 may be integral with the housing 10, for example, it may be formed by etching the inner surface of the housing 10.

[0163] The shape of the support column 75 is not particularly limited as long as it can support the core 30. The shape of the cross section of the support column 75 perpendicular to the height direction can be, for example, a rectangle, a polygon, a circle, an ellipse, etc. The shape of the support column 75 can be the same as or different from the shape of the support column 70.

[0164] The height of the support column 75 can be the same or different in a heat exchange plate.

[0165] exist Figure 18 In the cross-section shown, the width of support 75 can be the same as or different from the width of support 70.

[0166] [Fourth Implementation]

[0167] In the heat diffusion device of the fourth embodiment of the present invention, when a cross section perpendicular to the extension direction of the flow path region is observed, the flow path region is held in the thickness direction by the first inner surface of the shell and a part of the core, and in the plane direction orthogonal to the thickness direction by a part of the core and a part of the core.

[0168] Figure 19 This is a cross-sectional view schematically illustrating an example of a heat diffusion device according to the fourth embodiment of the present invention.

[0169] exist Figure 19 In the heat spreader (heat diffusion device) 4 shown, a liquid flow path 40 is formed by being surrounded by a part of the core 30, except for the first inner surface 11a of the housing 10. Specifically, the liquid flow path 40 has a bottom surface 40a formed by the first inner surface 11a of the housing 10, an upper surface 40b formed by a part of the core 30, a first side surface 40c, and a second side surface 40d.

[0170] In this case, when observing a cross-section perpendicular to the extension direction of the flow path region Ra, the flow path region Ra is held in the thickness direction Z by the first inner surface 11a of the housing 10 and a portion of the core 30, and in the plane direction orthogonal to the thickness direction Z by a portion of the core 30 and a portion of the core 30. In other words, the flow path region Ra is surrounded by the first inner surface 11a of the housing 10 and a portion of the core 30.

[0171] In the heat exchanger 4, similarly to the heat exchanger 3, the cross-sectional area of ​​the liquid flow path 40 can be increased compared to the heat exchanger 2A.

[0172] For example, a heat spreader plate 4 can be made by configuring a core 30 formed into a specified shape by compression molding using a mold.

[0173] Figure 20 This is a cross-sectional view schematically illustrating another example of the heat diffusion device according to the fourth embodiment of the present invention.

[0174] exist Figure 20 In the heat spreader (heat diffusion device) 4A shown, a plurality of support pillars 75 for supporting the core 30 are arranged in the flow path region Ra. The shape of the core 30 is easily maintained by arranging the support pillars 75 in the flow path region Ra. Furthermore, since the core 30 can be easily enlarged in the planar direction, the cross-sectional area of ​​the flow path region Ra can be increased compared to the heat spreader 4.

[0175] [Fifth Implementation]

[0176] In the heat diffusion device of the fifth embodiment of this utility model, when viewed in a cross-section perpendicular to the extension direction of the flow path region, the flow path region includes a first flow path region and a second flow path region. The first flow path region is held in the thickness direction by a first inner surface of the housing and a portion of the core, and in the plane direction orthogonal to the thickness direction by a portion of the core and a portion of the core. The second flow path region is held in the thickness direction by a second inner surface of the housing and a portion of the core, and in the plane direction orthogonal to the thickness direction by a portion of the core and a portion of the core.

[0177] Figure 21 This is a cross-sectional view schematically illustrating an example of a heat diffusion device according to the fifth embodiment of the present invention.

[0178] exist Figure 21 In the vapor chamber (heat diffusion device) 5 shown, a liquid flow path 40 is formed by being surrounded by a portion of the core 30, except for the first inner surface 11a or the second inner surface 12a of the housing 10. The liquid flow path 40 includes a first liquid flow path 41 and a second liquid flow path 42. Specifically, the first liquid flow path 41 has a bottom surface 41a formed by the first inner surface 11a of the housing 10 and an upper surface 41b, a first side surface 41c, and a second side surface 41d formed by a portion of the core 30. The second liquid flow path 42 has a bottom surface 42a formed by the second inner surface 12a of the housing 10 and an upper surface 42b, a first side surface 42c, and a second side surface 42d formed by a portion of the core 30.

[0179] In this case, when observing a cross-section perpendicular to the extension direction of the flow path region Ra, the flow path region Ra includes a first flow path region Ra1 and a second flow path region Ra2. The first flow path region Ra1 is held in the thickness direction Z by the first inner surface 11a of the housing 10 and a portion of the core 30, and in a plane direction orthogonal to the thickness direction Z by a portion of the core 30 and a portion of the core 30. The second flow path region Ra2 is held in the thickness direction Z by the second inner surface 12a of the housing 10 and a portion of the core 30, and in a plane direction orthogonal to the thickness direction Z by a portion of the core 30 and a portion of the core 30. In other words, the first flow path region Ra1 is surrounded by the first inner surface 11a of the housing 10 and a portion of the core 30, and the second flow path region Ra2 is surrounded by the second inner surface 12a of the housing 10 and a portion of the core 30.

[0180] In the heat exchanger 5, if one of the first liquid flow path 41 and the second liquid flow path 42 cannot be used, the operation of the heat exchanger can be guaranteed by using the other flow path. Therefore, it is possible to prevent the flow of the liquid working medium 20 from stagnating.

[0181] In the heat spreader 5, if at least the second liquid flow path 42 of the first liquid flow path 41 and the second liquid flow path 42 is cut off, a bag portion 51 can be formed.

[0182] In the heat spreader 5, multiple supports 75 of the support core 30 may also be arranged in the flow path region Ra. In this case, multiple supports 75 may be arranged in the first flow path region Ra1, multiple supports 75 may be arranged in the second flow path region Ra2, or multiple supports 75 may be arranged in both the first flow path region Ra1 and the second flow path region Ra2.

[0183] In the heat spreader 5, the liquid flow path 40 may also include a third liquid flow path or other liquid flow paths. That is, the flow path region Ra may also include a third flow path region or other flow path regions. In this case, the bag portion 51 can be formed by cutting off the liquid flow path on the side closest to the vapor space 50.

[0184] [Other implementation methods]

[0185] The heat diffusion device of this utility model is not limited to the above-described embodiments. Various applications and modifications can be made to the structure and manufacturing conditions of the heat diffusion device within the scope of this utility model.

[0186] In the thermal diffusion device of this invention, the location where the liquid flow path is cut off is not limited to one location, but can be two or more locations.

[0187] In the heat diffusion device of this invention, the evaporation section may or may not overlap with the inner edge of the shell when viewed from the thickness direction.

[0188] Figure 22 This is a top view schematically showing a first modified example of the internal structure of the heat diffusion device of this utility model.

[0189] exist Figure 22 In the vapor chamber (heat diffusion device) 6 shown, the planar shape of the housing 10, when viewed from the thickness direction Z, is L-shaped. Unlike the vapor chamber 2, in the vapor chamber 6, when viewed from the thickness direction Z, the evaporation section EP does not overlap with the inner edge of the housing 10. However, in the vapor chamber 6, the liquid flow path 40, when viewed from the thickness direction Z, is also located in a position other than along the area along the inner edge of the housing 10. Therefore, the liquid flow path 40 extends into the evaporation section EP when viewed from the thickness direction Z.

[0190] In the heat diffusion device of this invention, the evaporation section can also be located in the center of the shell or around its periphery.

[0191] Figure 23 This is a top view schematically showing a second modified example of the internal structure of the heat diffusion device of this utility model. Figure 24 This is a top view schematically showing a third variation of the internal structure of the heat diffusion device of the present invention.

[0192] exist Figure 23 The heat spreader (heat diffusion device) 7 shown is... Figure 24 In the heat spreader (heat diffusion device) 8 shown, the evaporation section EP is disposed near the center of the housing 10.

[0193] exist Figure 23 In the heat spreader 7 shown, when viewed from the thickness direction Z, the liquid flow path 40 is configured to pass through the interior of the evaporation section EP.

[0194] exist Figure 24 In the heat spreader 8 shown, when viewed from the thickness direction Z, the liquid flow path 40 is configured to run along the outer periphery of the evaporation section EP.

[0195] exist Figure 23 In the heat spreader 7 shown, with Figure 24 Compared to the heat spreader 8 shown, it can increase the proportion of the vapor space 50 within the internal space of the casing 10. On the other hand, in Figure 24 In the heat spreader 8 shown, with Figure 23 Compared to the heat spreader 7 shown, it is easier to transfer heat from the heat source HS (see reference) in the evaporator section EP. Figure 1 The heat is transferred to the working medium 20.

[0196] In the thermal diffusion device of this invention, a portion of the core can be configured to protrude from the liquid flow path into the vapor space, or it can be configured not to protrude.

[0197] In the heat diffusion device of this invention, the shell may have one evaporation section or multiple evaporation sections. That is, one heat source or multiple heat sources may be disposed on the outer surface of the shell. The number of evaporation sections and heat sources is not particularly limited.

[0198] In the heat diffusion device of this utility model, when the shell is composed of a first piece and a second piece, the first piece and the second piece can overlap in a manner where the ends are aligned or in a manner where the ends are staggered.

[0199] In the heat diffusion device of this invention, when the shell is composed of a first piece and a second piece, the materials constituting the first piece and the second piece can be different. For example, by using a material with higher strength in the first piece, the stress applied to the shell can be dispersed. Furthermore, by using different materials for the two pieces, one piece can achieve one function, and the other piece can achieve other functions. The functions described are not particularly limited; for example, heat conduction and electromagnetic wave shielding functions are also included.

[0200] The heat diffusion device of this invention can be mounted on electronic devices for the purpose of heat dissipation. Therefore, an electronic device equipped with the heat diffusion device of this invention is also a manifestation of this invention. Examples of electronic devices that can be equipped with this invention include smartphones, tablets, laptops, gaming devices, and wearable devices. As described above, the heat diffusion device of this invention can operate independently without external power, utilizing the latent heat of vaporization and latent heat of condensation of the working medium to achieve high-speed, two-dimensional heat diffusion. Therefore, by using an electronic device equipped with the heat diffusion device of this invention, heat dissipation can be effectively achieved within the limited space inside the electronic device.

[0201] Industrial availability

[0202] The heat dissipation device of this invention can be widely used in portable information terminals and other fields. For example, it can be used to lower the temperature of heat sources such as CPUs, thereby extending the service life of electronic devices, and can be used in smartphones, tablets, laptops, etc.

[0203] Explanation of reference numerals in the attached figures

[0204] 1, 1A, 1B, 1C, 1D, 1a, 2, 2A, 3, 3A, 4, 4A, 5, 6, 7, 8, Heat spreader (heat diffusion device); 10, Shell; 11, First piece; 11a, First inner surface; 12, Second piece; 12a, Second inner surface; 13, Inlet mark; 20, Working medium; 30, Core; 40, Liquid flow path; 40a, Bottom surface of liquid flow path; 40b, Top surface of liquid flow path; 40c, First side surface of liquid flow path; 40d, Second side surface of liquid flow path; 41, First liquid flow path; 41a, Bottom surface of first liquid flow path; 41b, Top surface of first liquid flow path; 41c, First side surface of first liquid flow path; 41d, Second side surface of first liquid flow path; 42, Second liquid flow path; 42a, Second liquid flow path 42b, the bottom surface of the second liquid flow path; 42c, the first side surface of the second liquid flow path; 42d, the second side surface of the second liquid flow path; 50, vapor space; 51, bag section; 60, partition wall; 70, 75, support column; D1, the distance between the two ends of the cut-off liquid flow path; D2, the distance between the first edge end and the second edge end; EP, evaporation section; HS, heat source; IL1, the first imaginary line; IL2, the second imaginary line; P1, the first edge end; P2, the second edge end; P3, the third edge end; P4, the fourth edge end; Ra, flow path region; Ra1, the first flow path region; Ra2, the second flow path region; Rb, the first vapor region; Rc, the second vapor region; X, width direction; Y, length direction; Z, thickness direction.

Claims

1. A heat diffusion device, characterized in that, This heat diffusion device has the following features: The housing has a first inner surface and a second inner surface that are opposite each other in the thickness direction, and an evaporation section is provided in the internal space; The working medium is sealed within the internal space of the housing; as well as The core, which is disposed within the internal space of the housing. A liquid flow path for the working medium is formed in a space at least surrounded by a portion of the housing and a portion of the core. At least a portion of the liquid flow path is arranged along the inner edge of the housing when viewed from the thickness direction. The liquid flow path is interrupted at a position that does not overlap with the evaporation section when viewed from the thickness direction. A bag portion is formed in the space where the liquid flow path is cut off, which is continuous with the vapor space of the working medium.

2. The heat diffusion device according to claim 1, characterized in that, The housing has an injection port mark on its outer surface that communicates with the bag portion for the working medium.

3. The heat diffusion device according to claim 1 or 2, characterized in that, The core located in the liquid flow path is connected at the bag portion.

4. The heat diffusion device according to claim 1 or 2, characterized in that, The core located in the liquid flow path is not connected and is cut off at the bag portion.

5. The heat diffusion device according to claim 1 or 2, characterized in that, When viewed from the thickness direction, if the intersection of the first imaginary line passing through both ends of the truncated liquid flow path with two locations on the outer edge of the shell is defined as the first edge end and the second edge end, The distance between the two ends of the truncated liquid flow path on the first imaginary line is less than half the distance between the first edge end and the second edge end.

6. The heat diffusion device according to claim 1 or 2, characterized in that, When viewed from the thickness direction, if the intersection points of the second imaginary line passing through the evaporation section and the bag section with two locations on the outer edge of the shell are designated as the third edge end and the fourth edge end, The evaporation section is located closer to the third edge end than to the fourth edge end. The bag portion is located closer to the fourth edge end than to the third edge end.

7. The heat diffusion device according to claim 1 or 2, characterized in that, The first inner surface of the housing also has guide rail-shaped partition walls that are spaced apart from the inner edge of the housing and arranged along the inner edge. The liquid flow path is formed within the space surrounded by the first inner surface of the housing, the core, and the partition wall. The two ends of the cut-off liquid flow path are sealed by the partition wall.

8. The heat diffusion device according to claim 1 or 2, characterized in that, The internal space of the housing has: The flow path region is the region along the inner edge of the housing where the liquid flow path exists, as viewed from the thickness direction; The first vapor region overlaps with a portion of the core when viewed from the thickness direction; as well as The second vapor region does not overlap with the core when viewed from the thickness direction. When viewed in a cross-section perpendicular to the extension direction of the flow path region, the first vapor region has a portion located between the second vapor region and the flow path region.

9. The heat diffusion device according to claim 8, characterized in that, The first inner surface of the housing also has guide rail-shaped partition walls that are spaced apart from the inner edge of the housing and arranged along the inner edge. When viewed in a cross-section perpendicular to the extension direction of the flow path region, the flow path region is held in the thickness direction by the first inner surface of the housing and a portion of the core, and in the plane direction orthogonal to the thickness direction by a portion of the housing and the partition wall.

10. The heat diffusion device according to claim 9, characterized in that, In the first vapor region, the core is separated from the first inner surface.

11. The heat diffusion device according to claim 9, characterized in that, In the first vapor region, at least a portion of the core is in contact with the first inner surface.

12. The heat diffusion device according to claim 8, characterized in that, When viewed in a cross-section perpendicular to the extension direction of the flow path region, the flow path region is held in the thickness direction by the first inner surface of the housing and a portion of the core, and in a plane direction orthogonal to the thickness direction by a portion of the housing and a portion of the core.

13. The heat diffusion device according to claim 8, characterized in that, When viewed in a cross-section perpendicular to the extension direction of the flow path region, the flow path region is held in the thickness direction by the first inner surface of the housing and a portion of the core, and in the plane direction orthogonal to the thickness direction by a portion of the core and a portion of the core.

14. The heat diffusion device according to claim 8, characterized in that, When viewed in a cross-section perpendicular to the extension direction of the flow path region, the flow path region includes a first flow path region and a second flow path region. The first flow path region is held in the thickness direction by the first inner surface of the housing and a portion of the core, and in a plane direction orthogonal to the thickness direction by a portion of the core and a portion of the core. The second flow path region is held in the thickness direction by the second inner surface of the housing and a portion of the core, and in a plane direction orthogonal to the thickness direction by a portion of the core and a portion of the core.

15. The heat diffusion device according to claim 12, characterized in that, The flow path area also includes multiple support pillars that support the core.

16. An electronic device, characterized in that, The electronic device includes the heat diffusion device as described in any one of claims 1 to 15.

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