Thermal diffusion device and electronic equipment

Abstract

The utility model provides a heat diffusion device capable of improving soaking performance and electronic equipment. A heat diffusion device (1A) is provided with: a housing (10) having a first inner surface (10a) and a second inner surface (10b) facing each other in the thickness direction (T), and having an internal space provided therein; a working medium (20) sealed in the internal space of the housing (10); a core (30) provided in the internal space of the housing (10); and a support body (40) which is provided in the internal space of the housing (10) and which is in contact with the first inner surface (10a) of the housing (10) and the core (30) in the thickness direction (T), in which the first inner surface (10a) of the housing (10) is provided with a recessed portion located around the support body (40), and in plan view from the thickness direction (T), at least a portion of the recessed portion (50) is in contact with a base portion (41) of the support body (40) located on the first inner surface (10a) side of the housing (10).

Description

Technical Field

[0001] This utility model relates to a heat diffusion device and electronic equipment. Background Technology

[0002] In recent years, the increasing integration and performance of components have led to increased heat generation. Furthermore, product miniaturization has increased heat density. This is particularly evident in mobile devices such as smartphones and tablets. Therefore, effective heat dissipation strategies have become crucial.

[0003] Graphite sheets are commonly used as components for heat dissipation, but due to their insufficient heat transfer capacity, research is underway on the use of various heat diffusion devices that can diffuse heat.

[0004] Patent Document 1 discloses a heat spreader comprising: a shell including opposing upper and lower shell sheets joined at their outer edges, having an internal space; a working fluid sealed within the internal space; microchannels disposed in the internal space of the lower shell sheet, forming flow paths for the working fluid; and a sheet-like core disposed in the internal space of the shell, in contact with the microchannels, wherein the contact area between the core and the microchannels is 5% to 40% of the area of ​​the internal space when viewed from above.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: International Publication No. 2021 / 229961 Utility Model Content

[0008] Problems to be solved by utility models

[0009] In patent document 1 Figure 1 The diagram shows a structure in which the core is sandwiched between a convex portion of a microchannel in the lower shell and a support column in the upper shell. Furthermore, Patent Document 1 describes a process where the vaporized working fluid releases heat in the internal space of the shell and reverts to liquid form. The reverted working fluid then moves within the microchannel using capillary force through the pores of the core and is transported back to the vicinity of the heat source.

[0010] On the other hand, Patent Document 1 Figure 1 The described heat spreader plate has a flat structure on the inner surface of the upper shell plate, except for the support pillars. Therefore, when the vaporized working fluid reverts to a liquid state, it is easily dispersed in the flat area of ​​the inner surface of the upper shell plate. Thus, in Patent Document 1... Figure 1In the described heat spreader, the working fluid that should be recovered by the core tends to disperse in the flat area of ​​the inner surface of the upper shell plate, making it difficult to recover the working fluid using the core. Therefore, in Patent Document 1... Figure 1 In the recorded heat spreader, the working fluid circulation becomes difficult due to the reduced recovery efficiency of the core-based heat recovery system, resulting in a decrease in heat spreader performance.

[0011] Furthermore, the aforementioned problems are not limited to heat spreaders, but are the same problems for heat diffusion devices that can use the same structure as heat spreaders to diffuse heat.

[0012] This invention was made to solve the aforementioned problems, and its purpose is to provide a heat diffusion device capable of improving heat dissipation performance. Furthermore, this invention also aims to provide an electronic device incorporating the aforementioned heat diffusion device.

[0013] Solution for solving the problem

[0014] The present invention is characterized in that the heat diffusion device comprises: a housing having a first inner surface and a second inner surface opposite to each other in the thickness direction, and having an internal space in the housing; a working medium sealed in the internal space of the housing; a core disposed in the internal space of the housing; and a support body disposed in the internal space of the housing and in contact with the first inner surface of the housing and the core in the thickness direction. A recessed portion is provided on the first inner surface of the housing around the support body. When viewed from the thickness direction, at least a portion of the recessed portion contacts the root portion of the support body located on the side of the first inner surface of the housing. When viewed from the thickness direction, the recessed portion is located at a position that does not overlap with the support body.

[0015] Preferably, the planar shape of the support body when viewed from above in the thickness direction is a shape in which the outer edge is partially concave inward.

[0016] Preferably, when viewed from above in the thickness direction, the recessed portion is in contact with the root of the support body.

[0017] Preferably, when viewed from above in the thickness direction, the recessed portion is in full circumference contact with the root of the support.

[0018] Preferably, when viewed from above in the thickness direction, the inner edge of the recess is along the outer edge of the support.

[0019] Preferably, when viewed from above in the thickness direction, the outer edge of the recess is along the outer edge of the support.

[0020] Preferably, when viewed in section from a plane orthogonal to the thickness direction, the cross-sectional shape of the recess is such that its outer edge is composed of at least one of a straight line and a curve.

[0021] The electronic device of this invention is characterized in that it has the heat diffusion device of this invention.

[0022] Effects of the utility model

[0023] According to this invention, a heat diffusion device capable of improving heat dissipation performance can be provided. Furthermore, according to this invention, an electronic device having the aforementioned heat diffusion device can be provided. Attached Figure Description

[0024] Figure 1 This is a perspective schematic diagram showing an example of a heat diffusion device according to Embodiment 1 of the present invention.

[0025] Figure 2 This is a top view schematic diagram showing an example of the internal structure of the heat diffusion device according to Embodiment 1 of this utility model.

[0026] Figure 3 It means Figure 2 A schematic cross-sectional view of an example of the heat diffusion device shown along line segment a1-a2.

[0027] Figure 4 It is an enlarged representation Figure 3 The diagram shows a cross-sectional view of the support and the recess.

[0028] Figure 5 This indicates a top view from the thickness direction. Figure 4 A top view schematic diagram showing an example of the state of the support and the recess.

[0029] Figure 6 This is a cross-sectional view of the support and recess of the heat diffusion device according to Embodiment 1 of this utility model. Figure 4 Cross-sectional diagrams of different examples.

[0030] Figure 7 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 Top-down diagrams of different examples.

[0031] Figure 8 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 and Figure 7 Top-down diagrams of different examples.

[0032] Figure 9 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 , Figure 7 and Figure 8 Top-down diagrams of different examples.

[0033] Figure 10 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 , Figure 7 , Figure 8 and Figure 9 Top-down diagrams of different examples.

[0034] Figure 11 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 , Figure 7 , Figure 8 , Figure 9 and Figure 10 Top-down diagrams of different examples.

[0035] Figure 12 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 Top-down diagrams of different examples.

[0036] Figure 13 This is a top view schematic diagram showing an example of the internal structure of the heat diffusion device according to Embodiment 2 of this utility model.

[0037] Figure 14 It means Figure 13 A schematic cross-sectional view of an example of the heat diffusion device shown along line segment b1-b2.

[0038] Figure 15 This is a perspective schematic diagram illustrating an example of the electronic device of the present invention. Detailed Implementation

[0039] The heat diffusion device and electronic device of this invention will be described below. Furthermore, this invention is not limited to the structures described below, and appropriate modifications can be made without changing the spirit of this invention. In addition, this invention also includes embodiments combining multiple preferred structures described below.

[0040] The embodiments shown below are illustrative, and of course, parts of the structures shown in different embodiments can be replaced or combined. From Embodiment 2 onwards, descriptions of matters identical to those in Embodiment 1 are omitted, and the differences are mainly explained. In particular, the same effects produced by the same structures are not mentioned sequentially in each embodiment.

[0041] In the following description, unless otherwise specified, the various embodiments are referred to as "the heat diffusion device of the present invention" and "the electronic device of the present invention".

[0042] In the following embodiments, a heat spreader is shown as an example of the heat diffusion device of this invention. The heat diffusion device of this invention can also be applied to heat diffusion devices such as heat pipes.

[0043] The accompanying drawings are schematic and their dimensions, aspect ratios, and scales may differ from the actual product.

[0044] In this specification, terms indicating the relationship between elements (e.g., "parallel", "orthogonal") and terms indicating the shape of elements not only mean the strict manner of the literal meaning, but also include substantially equivalent ranges, such as ranges of differences of several percentage degrees.

[0045] [Heat diffusion device]

[0046] The heat diffusion device of this utility model is characterized by comprising: a housing having a first inner surface and a second inner surface opposite to each other in the thickness direction, and having an internal space in the housing; a working medium sealed in the internal space of the housing; a core disposed in the internal space of the housing; and a support body disposed in the internal space of the housing and in contact with the first inner surface of the housing and the core in the thickness direction, wherein a recess is provided on the first inner surface of the housing around the support body, and when viewed from above in the thickness direction, at least a portion of the recess is in contact with the root of the support body located on the side of the first inner surface of the housing.

[0047] <Implementation Method 1>

[0048] The following describes an example of the heat diffusion device of the present invention as Embodiment 1 of the present invention.

[0049] Figure 1 This is a perspective schematic diagram showing an example of a heat diffusion device according to Embodiment 1 of the present invention.

[0050] Figure 1 The heat spreader (heat diffusion device) 1A shown has a housing 10.

[0051] The shell 10 is airtight and has a hollow structure.

[0052] A heat source HS, which serves as a heating element, is provided on the outer surface of the housing 10.

[0053] As a heat source, HS can be exemplified by electronic components.

[0054] In this instruction manual, such as Figure 1 As shown, the length direction, thickness direction, and width direction are defined by L, T, and W, respectively. The length direction L, thickness direction T, and width direction W are orthogonal to each other. Furthermore, the direction orthogonal to the thickness direction T, and which includes both the length direction L and the width direction W, is defined as the surface direction.

[0055] The heat spreader 1A is preferably planar as a whole. That is, the shell 10 is preferably planar as a whole.

[0056] In this specification, "planar" refers to a shape that includes plate-like and sheet-like shapes, and is a shape whose dimensions in the length direction and width direction are relatively large compared to the dimensions in the thickness direction. For example, the dimensions in the length direction and width direction are more than 10 times, preferably more than 100 times, the dimensions in the thickness direction.

[0057] There is no particular limitation on the size of the heat spreader 1A.

[0058] The dimensions of the heat spreader 1A in the length direction L and the width direction W are preferably 5 mm or more and 500 mm or less, more preferably 20 mm or more and 300 mm or less, and even more preferably 50 mm or more and 200 mm or less.

[0059] The dimensions of the heat spreader 1A in the length direction L and the width direction W can be the same or different.

[0060] The thickness direction T of the heat spreader 1A is preferably 50 μm or more and 500 μm or less.

[0061] The dimensions of the heat spreader 1A in the length direction L, thickness direction T, and width direction W are determined as the maximum dimensions in the length direction L, thickness direction T, and width direction W, respectively.

[0062] The housing 10 is preferably composed of a first piece 11 and a second piece 12 whose outer edges are joined together. In this case, the first piece 11 and the second piece 12 may overlap with their ends aligned or with their ends staggered.

[0063] Methods for joining the outer edges of the first piece 11 and the second piece 12 to each other include laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inactive gas welding), ultrasonic bonding, and resin sealing. Among these, laser welding, resistance welding, or brazing are preferred.

[0064] The materials used to construct the first sheet 11 and the second sheet 12 are not particularly limited, as long as they possess properties suitable for a heat spreader, such as thermal conductivity, strength, flexibility, etc. The materials used to construct the first sheet 11 and the second sheet 12 are preferably metals, such as copper, nickel, aluminum, magnesium, titanium, iron, or alloys with at least one of these metals as a main component, with copper or aluminum being particularly preferred.

[0065] The materials used to make piece 11 and piece 22 can be the same or different from each other.

[0066] When the constituent materials of the first piece 11 and the second piece 12 are different, different functions can be performed in the first piece 11 and the second piece 12. Such functions are not particularly limited, for example, thermal conduction function, electromagnetic wave shielding function, etc.

[0067] The shapes of the first piece 11 and the second piece 12 are not particularly limited. For example, the first piece 11 can be a flat plate with a constant dimension in the thickness direction T, and the second piece 12 can be a shape where the outer edge has a larger dimension in the thickness direction T compared to the portion other than the outer edge. Alternatively, the first piece 11 can be a flat plate with a constant dimension in the thickness direction T, and the second piece 12 can be a shape where the thickness direction T is constant and the portion other than the outer edge protrudes outward relative to the outer edge. In this case, a recess is provided at the outer edge of the housing 10. Such a recess at the outer edge of the housing 10 can be utilized when mounting the heat spreader 1A. Furthermore, other components can be arranged at the recess at the outer edge of the housing 10.

[0068] The thickness direction T of the first sheet 11 and the thickness direction T of the second sheet 12 are preferably 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, and even more preferably 40 μm or more and 60 μm or less.

[0069] The thickness direction T of the first piece 11 and the second piece 12 can be the same or different.

[0070] The dimensions of the thickness direction T of the first piece 11 and the second piece 12 are determined to be the maximum dimensions of the thickness direction T.

[0071] As the planar shape of the housing 10 when viewed from above in the thickness direction T, for example, polygons such as triangles and rectangles, circles, ellipses, shapes formed by combining them, etc. may be cited. In addition, the planar shape of the housing 10 may also be an L-shaped letter, a C-shaped letter (katakana "コ" shape in Japanese), a stepped shape, etc. Further, a through-hole may be provided in the housing 10 in the thickness direction T. The planar shape of the housing 10 may be a shape corresponding to the use of the heat spreader 1A, a shape corresponding to the mounting portion of the heat spreader 1A, or a shape corresponding to other components existing nearby.

[0072] The size of the housing 10 is not particularly limited.

[0073] The dimension in the length direction L and the dimension in the width direction W of the housing 10 are each preferably 5 mm or more and 500 mm or less, more preferably 20 mm or more and 300 mm or less, and still more preferably 50 mm or more and 200 mm or less.

[0074] The dimension in the length direction L and the dimension in the width direction W of the housing 10 may be the same as each other or may be different from each other.

[0075] The dimension in the thickness direction T of the housing 10 is preferably 50 μm or more and 500 μm or less.

[0076] The dimension in the length direction L, the dimension in the thickness direction T, and the dimension in the width direction W of the housing 10 are each determined as the maximum dimension in the length direction L, the thickness direction T, and the width direction W.

[0077] In Figure 1 an example of a manner in which the housing 10 is composed of two sheets, i.e., the first sheet 11 and the second sheet 12, is illustrated, but the housing 10 may also be composed of one sheet or may be composed of three or more sheets.

[0078] Figure 2 is a top view schematic diagram showing an example of the internal structure of the heat diffusion device according to Embodiment 1 of the present utility model. Figure 3 is showing Figure 2 a cross-sectional view schematic diagram showing an example of the cross-section along the line segment a1 - a2 of the heat diffusion device shown.

[0079] Figure 2 and Figure 3 The heat spreader 1A shown has a housing 10, a working medium 20, a core 30, and a support 40.

[0080] As Figure 3 shown, the housing 10 has a first inner surface 10a and a second inner surface 10b that are opposite to each other in the thickness direction T.

[0081] In Figure 3In the example shown, the housing 10 is composed of a first piece 11 and a second piece 12. The inner surface of the first piece 11 corresponds to the first inner surface 10a of the housing 10, and the inner surface of the second piece 12 corresponds to the second inner surface 10b of the housing 10.

[0082] The housing 10 has an internal space. More specifically, the housing 10 has an internal space surrounded by a first inner surface 10a and a second inner surface 10b.

[0083] Preferably, such as Figure 2 As shown, the housing 10 has an evaporation section EP in its internal space.

[0084] The evaporation section EP is the part that evaporates the liquid working medium 20 (described later) into a gaseous working medium 20. More specifically, the evaporation section EP corresponds to the part located within the internal space of the housing 10. Figure 1 The portion near the heat source HS shown, and the portion heated by the heat source HS.

[0085] The number of evaporator sections (EP) can be correspondingly matched with the number of heat sources (HS) as follows: Figure 2 The image shown shows only one heat source, but there could be multiple heat sources. That is, there could be only one heat source HS on the outer surface of the housing 10, or there could be multiple heat sources HS.

[0086] The heat source HS can be located on the outer surface of the housing 10 opposite to the first inner surface 10a, which is the outer surface of the first piece 11 in this case, or on the outer surface of the housing 10 opposite to the second inner surface 10b, which is the outer surface of the second piece 12 in this case.

[0087] like Figure 2 and Figure 3 As shown, the working medium 20 is sealed inside the housing 10.

[0088] The working medium 20 is not particularly limited as long as it is a substance capable of producing a gas-liquid phase change within the environment of the housing 10. Examples of working media 20 include water, alcohols, and Freon substitutes. The working medium 20 is preferably an aqueous compound, and water is particularly preferred.

[0089] like Figure 2 and Figure 3 As shown, the core 30 is located in the internal space of the housing 10.

[0090] The core 30 has a capillary structure that enables the working medium 20 to move using capillary force.

[0091] The capillary structure of the core 30 can be a known structure used in conventional heat diffusion devices (such as heat spreaders). Examples of such capillary structures include microstructures with pores, grooves, protrusions, etc., such as porous structures, fiber structures, groove structures, mesh structures, etc.

[0092] The core 30 functions as a liquid transport unit that uses capillary force to lift and transport the working medium 20 in liquid phase.

[0093] Preferably, the core 30 is composed of a porous material.

[0094] Examples of porous materials include sintered bodies, nonwoven fabrics, meshes, etched porous plates, and fiber bundles.

[0095] Examples of sintered bodies include porous metal sintered bodies and porous ceramic sintered bodies. Among these, porous metal sintered bodies are preferred, and porous copper or nickel sintered bodies are more preferred.

[0096] As a nonwoven fabric, for example, a metallic nonwoven fabric. Core 30 can be manufactured inexpensively when it is made of nonwoven fabric.

[0097] Examples of meshes include metal mesh, resin mesh, and surface-coated meshes. Copper mesh, stainless steel (SUS) mesh, or polyester mesh are preferred. Core 30 can be manufactured inexpensively when it is made of mesh.

[0098] Etched porous plates are manufactured, for example, by etching a flat metal plate. Core 30 exhibits excellent flatness when constructed from such an etched porous plate.

[0099] Fiber bundles are made, for example, by bundling multiple fibers into a thread. The fiber bundle functions as a liquid holding part of the working medium 20 that uses capillary force to lift and hold the liquid phase, and also functions as a liquid conveying part that transports the lifted liquid phase of the working medium 20.

[0100] When the core 30 is composed of fiber bundles, it is preferably composed of braided fiber bundles. In braided fiber bundles composed of multiple fibers, since unevenness is easily present on the surface, it is easy to transport the liquid working medium 20 when the core 30 is composed of braided fiber bundles.

[0101] Examples of fibers that constitute fiber bundles include metal wires such as copper, aluminum, and stainless steel, and non-metal wires such as carbon fiber and glass fiber. Among these, metal wires are preferred due to their high thermal conductivity. For example, fiber bundles can be formed by bundling approximately 200 copper wires with a diameter of about 0.03 mm together.

[0102] The thickness direction T of the core 30 is preferably 2 μm or more and 200 μm or less, more preferably 5 μm or more and 100 μm or less, and even more preferably 10 μm or more and 40 μm or less.

[0103] The thickness direction T of core 30 can be the same overall or different in some parts.

[0104] like Figure 2 and Figure 3 As shown, the internal space of the housing 10 contains a liquid flow path LP, which mainly contains the working medium 20 in liquid phase, and a vapor flow path VP, which mainly contains the working medium 20 in gas phase.

[0105] exist Figure 3 In the example shown, a liquid flow path LP, primarily containing a liquid working medium 20, exists between the second inner surface 10b of the housing 10 and the core 30. Furthermore, in Figure 3 In the example shown, there is a vapor flow path VP between the first inner surface 10a of the housing 10 and the core 30, which mainly contains the working medium 20 in the gas phase.

[0106] The liquid flow path LP can include the gaseous working medium 20 as long as the region is mainly composed of the liquid phase. Similarly, the vapor flow path VP can include the liquid phase working medium 20 as long as the region is mainly composed of the gaseous working medium 20.

[0107] like Figure 2 and Figure 3 As shown, the support 40 is disposed in the internal space of the housing 10. More specifically, the support 40 is disposed in the vapor flow path VP in the internal space of the housing 10.

[0108] like Figure 2 and Figure 3 As shown, the support body 40 contacts the first inner surface 10a of the housing 10 and the core 30 in the thickness direction T. Thus, the core 30 is supported by the support body 40.

[0109] exist Figure 2 and Figure 3 In the example shown, multiple support bodies 40 are provided, and the multiple support bodies 40 are in contact with the first inner surface 10a of the housing 10 and the core 30 in the thickness direction T. It is sufficient that at least one of the multiple support bodies 40 is in contact with the core 30 in the thickness direction T, as shown below. Figure 3 All the supports 40 shown are in contact with the core 30 in the thickness direction T, or some of the supports 40 may be in contact with the core 30 in the thickness direction T.

[0110] exist Figure 2 and Figure 3In the example shown, it is preferable that the plurality of supports 40 are uniformly arranged with a constant center-to-center distance (spacing). In this case, the plurality of supports 40 are preferably uniformly arranged in a local area within the internal space of the housing 10, specifically in the vapor flow path VP, and more preferably uniformly arranged in the overall area. In the area where the plurality of supports 40 are uniformly arranged, the uniform strength of the heat spreader 1A can be ensured.

[0111] It can also be like Figure 3 As shown, the support 40 is arranged in the internal space of the housing 10, in this case the vapor flow path VP, in a manner that protrudes from the first inner surface 10a toward the second inner surface 10b along the thickness direction T. The direction in which the support 40 protrudes from the first inner surface 10a of the housing 10 does not need to be strictly parallel to the thickness direction T.

[0112] The support 40 can also be integrated with the first inner surface 10a of the housing 10. In this case, the support 40 is formed, for example, by etching the first inner surface 10a of the housing 10, or in this case, the inner surface of the first piece 11.

[0113] In this specification, the integration of two elements refers to a state in which there is no interface between the elements, such as a state in which the boundary between the elements cannot be determined.

[0114] The support 40 can also be engaged with the first inner surface 10a of the housing 10. In this case, the support 40 is engaged with the first inner surface 10a of the housing 10, which is the inner surface of the first piece 11, for example, by a bonding method such as diffusion bonding.

[0115] Materials used to construct the support 40 include, for example, resin, metal, ceramic, or mixtures or laminates of more than one of these materials.

[0116] The material of the support 40 is preferably the same as that of the housing 10, which is the material of the first piece 11 in this case, but it may also be different from the material of the first piece 11.

[0117] exist Figure 2 and Figure 3 In the example shown, there are multiple supports 40, but the constituent materials of the multiple supports 40 can be the same, different, or partially different.

[0118] The support 40 can be composed of a single layer or multiple layers.

[0119] As will be described later, the planar shape of the support 40 when viewed from the thickness direction T is not limited to Figure 3 The circle shown.

[0120] exist Figure 2 and Figure 3 In the example shown, there are multiple supports 40, but the planar shapes of the multiple supports 40 can be the same as each other, different from each other, or partially different.

[0121] The cross-sectional shape of the support body 40 when viewed from a plane orthogonal to the thickness direction T can be, for example, a rectangle or a polygon. The cross-sectional shape of the support body 40 can be... Figure 3 The cone shape shown can also be... Figure 3 Different cone shapes.

[0122] exist Figure 2 and Figure 3 In the example shown, there are multiple supports 40, but the cross-sectional shapes of the multiple supports 40 can be the same as each other, different from each other, or partially different.

[0123] The heat spreader 1A operates as follows.

[0124] In the heat spreader 1A, the liquid working medium 20 evaporates by absorbing heat from the heat source HS in the core 30 and liquid flow path LP, which are located in the region near the evaporation section EP, and changes into a gaseous working medium 20. Then, the gaseous working medium 20 generated in the evaporation section EP moves through the vapor flow path VP to the periphery of the end opposite to the evaporation section EP in the longitudinal direction L of the vapor flow path VP, where it is cooled and changes into a liquid working medium 20. Then, the liquid working medium 20 is fed back to the evaporation section EP after being recovered by the core 30 and liquid flow path LP.

[0125] In the vapor chamber 1A, the above process is repeated, causing the working medium 20 to circulate while undergoing a gas-liquid phase change. During this process, the heat from the heat source HS is absorbed in the evaporation section EP as the latent heat of vaporization that changes the liquid phase of the working medium 20 into the gas phase, and then released in the region away from the evaporation section EP as the latent heat of condensation that changes the gas phase of the working medium 20 into the liquid phase. In this way, the vapor chamber 1A can operate independently without external power, and by utilizing the latent heat of vaporization and condensation of the working medium 20, heat diffusion from the heat source HS can be achieved at high speed in two dimensions.

[0126] like Figure 3 As shown, in the heat spreader 1A, a recess 50 is provided on the first inner surface 10a of the housing 10, which is in this case the inner surface of the first piece 11, located around the support 40. More specifically, as Figure 3As shown, a recess 50 is provided around the support 40 in the region of the vapor flow path VP that overlaps with the core 30 in the thickness direction T, and which contacts the first inner surface 10a of the housing 10, which is the inner surface of the first piece 11, and the core 30 in the thickness direction T.

[0127] Figure 4 It is an enlarged representation Figure 3 The diagram shows a cross-sectional view of the support and the recess. Figure 5 This indicates a top view from the thickness direction. Figure 4 A top view schematic diagram showing an example of the state of the support and the recess.

[0128] In addition, Figure 5 The image shows a top view along the thickness direction from the second inner surface side of the housing towards the first inner surface side. Figure 4 The condition of the support and the recess shown. Furthermore, in Figure 5 In order to clearly indicate the location of the recess when viewed from above in the thickness direction, the recess is represented by a pattern different from the first inner surface (first piece) of the shell, more specifically, a white pattern. The same applies to the subsequent figures showing the support and the recess when viewed from above in the thickness direction.

[0129] Viewed from the thickness direction T Figure 4 When the support body 40 and the recessed portion 50 are shown, as Figure 5 As shown, at least a portion of the recess 50 contacts the root 41 of the support 40 located on the side of the first inner surface 10a of the housing 10.

[0130] In the heat spreader 1A, a recess 50 is provided on the first inner surface 10a of the housing 10, so that the liquid working medium 20, which changes from the gaseous working medium 20 in the vapor flow path VP, can easily accumulate in the recess 50. Furthermore, in the heat spreader 1A, when viewed from the thickness direction T, at least a portion of the recess 50 contacts the root 41 of the support 40, so that the liquid working medium 20 accumulated in the recess 50 can easily move along the side of the support 40 toward the core 30. In other words, in the heat spreader 1A, the liquid working medium 20 can be easily recovered by the core 30.

[0131] As described above, in the heat spreader 1A, by utilizing the support 40 and the recess 50, the recovery efficiency of the working medium 20 in the liquid phase by the core 30 is improved. As a result, in the heat spreader 1A, the heat dissipation performance is improved because the working medium 20 is easier to circulate.

[0132] Furthermore, in the heat spreader 1A, since a recess 50 is provided on the first inner surface 10a of the housing 10, the internal space of the housing 10, specifically the vapor flow path VP, is enlarged compared to the case where the housing 10 has the same thickness direction T but no recess 50 is provided. Thus, in the heat spreader 1A, by ensuring a larger vapor flow path VP, a larger heat spreader area is ensured, resulting in improved thermal conductivity.

[0133] On the other hand, in Patent Document 1 Figure 1 In the described heat spreader, if it is desired to expand the vapor flow path while maintaining the same thickness dimension of the shell, it is necessary to reduce the overall thickness dimension of the upper shell sheet constituting the shell. However, in Patent Document 1... Figure 1 In the described heat spreader, if the thickness of the upper shell plate is reduced overall, the shell becomes prone to deformation due to insufficient rigidity of the upper shell plate and consequently, insufficient rigidity of the shell itself. Therefore, in Patent Document 1... Figure 1 In the described heat spreader, it is impossible to expand the internal space of the shell, especially the steam flow path corresponding to the area where the support is provided, while keeping the thickness dimension of the shell unchanged.

[0134] In contrast, in the vapor chamber 1A, instead of reducing the overall thickness T of the first piece 11, a recess 50 is provided around the relatively rigid support 40. Therefore, the rigidity of the shell 10 is not insufficient, and the shell 10 does not deform. Thus, in the vapor chamber 1A, the vapor flow path VP can be expanded while maintaining the thickness T of the shell 10. In other words, in the vapor chamber 1A, since the vapor flow path VP is ensured to be large while maintaining the thickness T of the shell 10, the vapor distribution area is ensured to be large, resulting in improved thermal conductivity.

[0135] The dimension of the recess 50 in the thickness direction T is preferably 10% or more and 50% or less of the dimension of the support 40 in the thickness direction T.

[0136] The dimension of the recess 50 in the thickness direction T is preferably 5% or more and 30% or less of the dimension of the housing 10 in the thickness direction T.

[0137] The dimension of the recess 50 in the thickness direction T is preferably 10% or more and 50% or less of the dimension of the first piece 11 in the thickness direction T.

[0138] exist Figure 3 In the example shown, there are multiple recesses 50, but the thickness direction T of the multiple recesses 50 can be the same as each other, different from each other, or partially different.

[0139] The dimension of the recess 50 in the surface direction (e.g., the length direction L or the width direction W) is preferably more than 5% and less than 30% of the center-to-center distance of the support 40.

[0140] exist Figure 3 In the example shown, there are multiple recesses 50, but the dimensions of the multiple recesses 50 in the surface direction (e.g., the length direction L or the width direction W) can be the same as each other, different from each other, or partially different.

[0141] The dimensions of the recess 50 in the thickness direction T and the surface direction (e.g., the length direction L or the width direction W) are determined as the maximum dimensions in the thickness direction T and the surface direction (e.g., the length direction L or the width direction W), respectively.

[0142] When viewed in section from a plane orthogonal to the thickness direction T, the cross-sectional shape of the recess 50 is preferably a shape in which the outer edge is composed of at least one of a straight line and a curve.

[0143] like Figure 4 As shown, the cross-sectional shape of the recess 50 when viewed from the surface direction, or in this case, the length direction L, can be a shape in which the outer edge is composed of straight lines.

[0144] Figure 6 This is a cross-sectional view of the support and recess of the heat diffusion device according to Embodiment 1 of this utility model. Figure 4 Cross-sectional diagrams of different examples.

[0145] like Figure 6 As shown, the cross-sectional shape of the recess 50 when viewed in the plane direction, specifically the length direction L, can also be a shape with an outer edge formed by a curve. In this case, the radius of curvature of the outer edge of the recess 50 is not particularly limited.

[0146] The cross-sectional shape of the recess 50 when viewed in the direction of the surface, or in this case, the length direction L, can also be a shape in which the outer edge is composed of both straight lines and curves.

[0147] exist Figure 3 In the example shown, there are multiple recesses 50, but the cross-sectional shapes of the multiple recesses 50 can be the same as each other, different from each other, or partially different.

[0148] The planar shape of the support 40 when viewed from above in the thickness direction T is not limited to Figure 5 The circle shown.

[0149] Figure 7 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 Top-down diagrams of different examples. Figure 8The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 and Figure 7 Top-down diagrams of different examples.

[0150] like Figure 7 and Figure 8 As shown, the planar shape of the support 40 can also be a quadrilateral.

[0151] In addition, the planar shape of the recessed portion 50 is Figure 7 The example shown is with Figure 5 Same shape, but Figure 8 In the example shown, it becomes with Figure 5 Different shapes.

[0152] Figure 9 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 , Figure 7 and Figure 8 Top-down diagrams of different examples. Figure 10 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 , Figure 7 , Figure 8 and Figure 9 Top-down diagrams of different examples.

[0153] like Figure 9 and Figure 10 As shown, the planar shape of the support 40 when viewed from the thickness direction T can be a shape with a local inward concavity at the outer edge. In this case, since the surface area of ​​the side of the support 40 increases, the path of the liquid working medium 20 accumulated in the concave portion 50 as it moves towards the core 30 along the side of the support 40 increases. Therefore, the recovery efficiency of the liquid working medium 20 by the core 30 is further improved, resulting in a further improvement in heat homogenization performance.

[0154] In addition to the aforementioned circular, quadrilateral, and shapes with a partially inwardly recessed outer edge, the planar shape of the support 40 when viewed from above in the thickness direction T can also be a triangle, an ellipse, etc.

[0155] like Figure 5 , Figure 8 , Figure 9 and Figure 10As shown, preferably, when viewed from above in the thickness direction T, the recess 50 is in contact with the root 41 of the support 40. In this case, the liquid working medium 20 accumulated in the recess 50 travels a greater distance along the side of the support 40 towards the core 30. Therefore, the core 30's recovery efficiency of the liquid working medium 20 is further improved, resulting in further improvement in heat homogenization performance.

[0156] like Figure 7 As shown, when viewed from above in the thickness direction T, the recess 50 may not be in contact with the root 41 of the support 40 entirely. That is, it may be as follows: Figure 7 As shown, when viewed from above in the thickness direction T, a portion of the recess 50 contacts the root 41 of the support 40, while the remaining portion of the recess 50 does not contact the root 41 of the support 40. Figure 7 In the example shown, the recess 50 contacts the root 41 of the support 40 at four locations, but the number and location of the recess 50 in contact with the root 41 of the support 40 are not particularly limited.

[0157] like Figure 5 , Figure 8 , Figure 9 and Figure 10 As shown, preferably, when viewed from above in the thickness direction T, the recess 50 is in full circumferential contact with the root 41 of the support 40. In this case, the working medium 20 in the liquid phase accumulated in the recess 50 moves along the side of the support 40 toward the core 30 along a longer path. Therefore, the recovery efficiency of the working medium 20 in the core 30 is further improved, resulting in further improvement in heat homogenization performance.

[0158] Figure 11 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 , Figure 7 , Figure 8 , Figure 9 and Figure 10 Top-down diagrams of different examples.

[0159] It can also be like Figure 11 As shown, when viewed from above in the thickness direction T, the recess 50 does not make full circumferential contact with the root 41 of the support 40. In this case, it is also possible to... Figure 11 As shown, when viewed from above in the thickness direction T, the recess 50 is not connected to the entire circumference of the root 41 of the support 40, but rather forms a partially interrupted shape. Figure 11 In the example shown, the recess 50 is interrupted at two opposite locations in the width direction W, but the number and location of the interrupted locations of the recess 50 are not particularly limited.

[0160] In addition, Figure 7 In the example shown, when viewed from above in the thickness direction T, the recess 50 does not contact the entire circumference of the root 41 of the support 40.

[0161] like Figure 5 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, when viewed from above in the thickness direction T, the inner edge of the recess 50 can also be along the outer edge of the support 40. That is, when viewed from above in the thickness direction T, the inner edge of the recess 50 can also be parallel to the outer edge of the support 40.

[0162] like Figure 7 As shown, when viewed from above in the thickness direction T, the inner edge of the recess 50 may not be along the outer edge of the support 40. That is, when viewed from above in the thickness direction T, the inner edge of the recess 50 may not be parallel to the outer edge of the support 40.

[0163] like Figure 5 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, when viewed from above in the thickness direction T, the outer edge of the recess 50 can also be along the outer edge of the support 40. That is, when viewed from above in the thickness direction T, the outer edge of the recess 50 can also be parallel to the outer edge of the support 40.

[0164] Figure 12 The support and recess of the heat diffusion device according to Embodiment 1 of this utility model are shown in a top view from the thickness direction. Figure 5 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 Top-down diagrams of different examples.

[0165] like Figure 12 As shown, when viewed from above in the thickness direction T, the outer edge of the recess 50 may not be along the outer edge of the support 40. That is, when viewed from above in the thickness direction T, the outer edge of the recess 50 may not be parallel to the outer edge of the support 40. In this case, as... Figure 12 As shown, when viewed from above in the thickness direction T, the outer edge of the recess 50 may not be equidistant from the center of the support 40.

[0166] In addition, Figure 7 In the example shown, when viewed from above in the thickness direction T, the outer edge of the recess 50 does not follow the outer edge of the support 40.

[0167] exist Figure 3In the example shown, there are multiple recesses 50, but the planar shapes of the multiple recesses 50 can be the same as each other, different from each other, or partially different.

[0168] The recess 50 is formed together with the support 40, for example, by etching the first inner surface 10a of the housing 10, which is the inner surface of the first piece 11, as follows.

[0169] For example, regarding the first inner surface 10a of the housing 10, which is in this case the inner surface of the first piece 11, when etching is performed on the basis of a resist being applied to the area where the support 40 is to be formed, the etching rate of the region near the end of the resist on the inner surface of the first piece 11 is accelerated. As a result, the region near the end of the resist on the inner surface of the first piece 11 is over-etched. Consequently, the recess 50, which is the over-etched region, is formed to contact the root 41 of the support 40. This method of forming the recess 50 is useful when the constituent material of the first piece 11 is aluminum.

[0170] Alternatively, for example, for the first inner surface 10a of the housing 10, which in this case is the inner surface of the first piece 11, an etching process is performed on the area where a resist is to be formed of the support 40, thereby first forming the support 40. Then, for the inner surface of the first piece 11, an etching process is performed on the area (including the area where the support 40 is formed) where a resist is applied, except for the area contacting the root 41 of the support 40. Thus, the area on the inner surface of the first piece 11 that contacts the root 41 of the support 40 is etched, forming a recess 50 as the etched area. This method of forming the recess 50 is useful when the constituent material of the first piece 11 is copper.

[0171] like Figure 3 As shown, the heat spreader 1A preferably also has a microchannel 60 that forms the liquid flow path LP. The microchannel 60, together with the core 30, functions as a liquid transport section for transporting the working medium 20 of the liquid phase.

[0172] like Figure 3 As shown, the microchannel 60 is configured as a region (flow path) between a plurality of protrusions 61 provided on the second inner surface 10b of the housing 10, which is the inner surface of the second piece 12.

[0173] like Figure 3 As shown, multiple protrusions 61 contact the second inner surface 10b of the housing 10 and the core 30 in the thickness direction T. Thus, the core 30 is supported by the multiple protrusions 61.

[0174] Preferably, the plurality of protrusions 61 are uniformly arranged with a constant center-to-center distance (spacing). In this case, the plurality of protrusions 61 are preferably uniformly arranged in local areas within the internal space of the housing 10, specifically in the liquid flow path LP, and more preferably uniformly arranged in the overall area. In areas where the plurality of protrusions 61 are uniformly arranged, the strength of the heat spreader 1A is ensured to be uniform.

[0175] The protrusion 61 can also be integrated with the second inner surface 10b of the housing 10. In this case, the protrusion 61 is formed, for example, by etching the second inner surface 10b of the housing 10, which is the inner surface of the second piece 12 in this case.

[0176] The protrusion 61 can also engage with the second inner surface 10b of the housing 10. In this case, the protrusion 61 engages with the second inner surface 10b of the housing 10, which is the inner surface of the second piece 12, for example, by a bonding method such as diffusion bonding.

[0177] Examples of materials that can be used to form protrusion 61 include resin, metal, ceramic, or mixtures or laminates thereof.

[0178] The material of the protrusion 61 is preferably the same as that of the shell 10, which is the material of the second piece 12 in this case, but it may also be different from the material of the second piece 12.

[0179] The protrusion 61 can be composed of a single layer or multiple layers.

[0180] The planar shape of the protrusion 61 when viewed from above in the thickness direction T includes, for example, polygons such as triangles and rectangles, circles, ellipses, and shapes formed by combining them.

[0181] The cross-sectional shape of the protrusion 61 when viewed from a plane orthogonal to the thickness direction T can be, for example, a rectangle or a polygon. The cross-sectional shape of the protrusion 61 can be... Figure 3 The cone shape shown can also be the same as... Figure 3 Different cone shapes.

[0182] <Implementation Method 2>

[0183] The heat diffusion device of this utility model may further include a partition wall that, when viewed from the thickness direction, is at least partially disposed on the first inner surface of the shell along the inner edge of the shell. The core may also be partially disposed between the second inner surface of the shell and the partition wall, and disposed at least partially along the partition wall. Hereinafter, a heat diffusion device that differs from the heat diffusion device of Embodiment 1 of this utility model in this respect will be described as Embodiment 2 of the heat diffusion device of this utility model.

[0184] Figure 13This is a top view schematic diagram showing an example of the internal structure of the heat diffusion device according to Embodiment 2 of this utility model. Figure 14 It means Figure 13 A schematic cross-sectional view of an example of the heat diffusion device shown along line segment b1-b2.

[0185] Figure 13 and Figure 14 The heat spreader 1B shown has a housing 10, a working medium 20, a core 30, and a support 40, as well as a partition wall 70.

[0186] like Figure 13 and Figure 14 As shown, the partition wall 70, when viewed from the thickness direction T, is provided at least partially along the inner edge 15 of the housing 10 on the first inner surface 10a of the housing 10, with a gap between the partition wall 70 and the inner edge 15.

[0187] exist Figure 13 and Figure 14 In the example shown, when viewed from the thickness direction T, the partition wall 70 is arranged along the entire circumference of the inner edge 15 of the housing 10.

[0188] Alternatively, when viewed from the thickness direction T, the partition wall 70 may not be positioned along the entire circumference of the inner edge 15 of the housing 10.

[0189] like Figure 14 As shown, the partition wall 70 can also be provided in the internal space of the housing 10 such that it protrudes along the thickness direction T from the first inner surface 10a toward the second inner surface 10b. The direction in which the partition wall 70 protrudes from the first inner surface 10a of the housing 10 does not need to be strictly parallel to the thickness direction T.

[0190] It can also be like Figure 14 As shown, the partition wall 70 is integrated with the first inner surface 10a of the housing 10. In this case, the partition wall 70 is formed, for example, by etching the first inner surface 10a of the housing 10, or in this case, the inner surface of the first piece 11.

[0191] The partition wall 70 can also be joined to the first inner surface 10a of the housing 10. In this case, the partition wall 70 is joined to the first inner surface 10a of the housing 10, which is the inner surface of the first piece 11, for example, by a joining method such as diffusion joining.

[0192] Materials that make up the partition wall 70 include, for example, resin, metal, ceramic, or mixtures or laminates of more than one thereof.

[0193] The material of the partition wall 70 is preferably the same as that of the shell 10, which is the material of the first piece 11 in this case, but it may also be different from the material of the first piece 11.

[0194] The partition wall 70 can be composed of a single layer or multiple layers.

[0195] like Figure 13 and Figure 14 As shown, the core 30 is partially disposed between the second inner surface 10b of the housing 10 and the partition wall 70, and is disposed at least partially along the partition wall 70.

[0196] exist Figure 13 In the example shown, when viewed from the thickness direction T, the core 30 is positioned along the entire circumference of the partition wall 70.

[0197] Alternatively, when viewed from the thickness direction T, the core 30 is not positioned along the entire circumference of the partition wall 70.

[0198] exist Figure 13 In the example shown, when viewed from the thickness direction T, the core 30 is arranged along the entire circumference of the inner edge 15 of the housing 10.

[0199] Alternatively, when viewed from the thickness direction T, the core 30 is not positioned along the entire circumference of the inner edge 15 of the housing 10.

[0200] like Figure 14 As shown, the core 30 preferably contacts the second inner surface 10b of the housing 10 in the thickness direction T.

[0201] like Figure 14 As shown, the core 30 preferably contacts the partition wall 70 in the thickness direction T. In this case, the core 30 is supported by both the support body 40 and the partition wall 70. Therefore, even if the core 30 is to deform under external pressure, the liquid flow path LP, described later, is not easily crushed. As a result, the permeability of the working medium 20 in the liquid flow path LP can be ensured.

[0202] As described above, the core 30 preferably contacts at least one of the second inner surface 10b of the housing 10 and the partition wall 70 in the thickness direction T. Wherein, as Figure 14 As shown, the core 30 is particularly preferably in contact with both the second inner surface 10b of the housing 10 and the partition wall 70 in the thickness direction T.

[0203] The core 30 is preferably fixed to the second inner surface 10b of the housing 10. For example, the core 30 is preferably joined to the second inner surface 10b of the housing 10. Examples of joining methods between the core 30 and the second inner surface 10b of the housing 10 include diffusion bonding, ultrasonic bonding, spot welding, etc.

[0204] The core 30 is preferably fixed to the partition wall 70. For example, the core 30 is preferably joined to the partition wall 70. Examples of joining methods between the core 30 and the partition wall 70 include diffusion bonding, ultrasonic bonding, spot welding, etc.

[0205] As described above, the partition wall 70 is provided at least partially along the inner edge 15 of the housing 10, spaced apart from it. Furthermore, the core 30 is partially disposed between the second inner surface 10b of the housing 10 and the partition wall 70, and is also disposed at least partially along the partition wall 70. With this configuration of the partition wall 70 and the core 30, the liquid flow path LP is disposed at least partially along the inner edge 15 of the housing 10 within the internal space of the housing 10, in the region surrounded by a portion of the housing 10, a portion of the partition wall 70, and a portion of the core 30.

[0206] In the vapor chamber 1B, a liquid flow path LP is provided as described above, allowing the capillary force of the core 30 to act on the liquid working medium 20 present in the liquid flow path LP. Furthermore, since the liquid flow path LP in the vapor chamber 1B is configured as a cavity without the core 30, the liquid working medium 20 can move smoothly within the liquid flow path LP. Based on the above, the permeability of the liquid working medium 20 in the vapor chamber 1B is improved, resulting in an increased liquid transport capacity.

[0207] In the heat spreader 1B, the vapor flow path VP is located in the internal space of the housing 10 in a region other than the liquid flow path LP.

[0208] In the heat spreader 1B, since the liquid flow path LP is at least partially arranged along the inner edge 15 of the housing 10 as described above, the vapor flow path VP is arranged in the planar direction relative to the liquid flow path LP within the internal space of the housing 10. Therefore, in the heat spreader 1B, the vapor flow path VP can be made larger in the planar direction within the internal space of the housing 10. As a result, in the heat spreader 1B, a larger heat-spreading area can be ensured, and the thermal conductivity is improved.

[0209] In the vapor chamber 1B, even if the internal space of the shell 10 is relatively thin in the thickness direction T, the vapor flow path VP can still be made large in the planar direction. For example, in the vapor chamber 1B, even if the thickness direction T of the internal space of the shell 10 is small, between 100 μm and 200 μm, the vapor flow path VP can still be made large in the planar direction. Furthermore, the thickness direction T of the internal space of the shell 10 is determined to be the maximum dimension. Thus, in the vapor chamber 1B, even if the internal space of the shell 10 is relatively thin in the thickness direction T, the vapor flow path VP can still be made large in the planar direction, thereby ensuring a large heat dissipation area and improving thermal conductivity.

[0210] like Figure 14As shown, in the heat spreader 1B, similar to the heat spreader 1A, a recess 50 is provided on the first inner surface 10a of the housing 10, which is the inner surface of the first piece 11, located around the support 40. More specifically, as Figure 14 As shown, in the heat spreader 1B, a recess 50 is provided around the support 40 in the region of the vapor flow path VP that overlaps with the core 30 in the thickness direction T, and which contacts the first inner surface 10a of the shell 10, which is here the inner surface of the first piece 11, and the core 30 in the thickness direction T. Moreover, when viewed from above in the thickness direction T, at least a portion of the recess 50 contacts the root 41 of the support 40.

[0211] Therefore, in the heat spreader 1B, similar to the heat spreader 1A, the core 30's recovery efficiency of the liquid working medium 20 is improved, thus improving the heat spreader performance. Furthermore, in the heat spreader 1B, similar to the heat spreader 1A, while maintaining the thickness direction T of the shell 10, the vapor flow path VP is ensured to be larger, thus ensuring a larger heat spreader area, resulting in improved thermal conductivity.

[0212] In the heat spreader 1B, a recess 50 is provided around the support 40 in the region of the vapor flow path VP that overlaps with the core 30 in the thickness direction T, and which contacts the first inner surface 10a of the shell 10 (here, the inner surface of the first piece 11) and the core 30 in the thickness direction T. Alternatively, in the heat spreader 1B, a recess may or may not be provided around the support 40 in the region of the vapor flow path VP that does not overlap with the core 30 in the thickness direction T.

[0213] like Figure 14 As shown, the support body 40 may also have multiple regions in the vapor flow path VP that overlap with the core 30 in the thickness direction T and regions that do not overlap with the core 30 in the thickness direction T.

[0214] like Figure 14 As shown, preferably, a support 40 is provided in the vapor flow path VP in a region that does not overlap with the core 30 in the thickness direction T. This support 40 contacts the first inner surface 10a of the housing 10 in the thickness direction T, and another support 40 contacts the second inner surface 10b in the thickness direction T. Thus, the housing 10 is supported from the vapor flow path VP side by the support 40, and therefore, even if the housing 10 is to deform under external pressure, the vapor flow path VP is not easily crushed. As a result, the permeability of the working medium 20 in the gas phase through the vapor flow path VP can be ensured.

[0215] Alternatively, in the region of the vapor flow path VP that does not overlap with the core 30 in the thickness direction T, the support 40 is integrated with the second inner surface 10b of the housing 10. In this case, the support 40 is formed, for example, by etching the second inner surface 10b of the housing 10, which is in this case, the inner surface of the second piece 12.

[0216] Alternatively, in a region of the vapor flow path VP that does not overlap with the core 30 in the thickness direction T, the support 40 may engage with the second inner surface 10b of the housing 10. In this case, the support 40 may engage with the second inner surface 10b of the housing 10, which is, in this case, the inner surface of the second piece 12, by a bonding method such as diffusion bonding.

[0217] like Figure 14 As shown, in the region of the vapor flow path VP where the core 30 does not overlap with the core 30 in the thickness direction T, the two supports 40 can also be connected to each other in the thickness direction T to form a composite, and multiple such composites can also be provided.

[0218] The constituent material of the support 40 may be the same or different in the region of the vapor flow path VP that overlaps with the core 30 in the thickness direction T and the region that does not overlap with the core 30 in the thickness direction T.

[0219] The cross-sectional shape of the support 40 in the vapor flow path VP can be the same or different between the region that overlaps with the core 30 in the thickness direction T and the region that does not overlap with the core 30 in the thickness direction T.

[0220] The planar shape of the support 40 in the vapor flow path VP can be the same or different between the region that overlaps with the core 30 in the thickness direction T and the region that does not overlap with the core 30 in the thickness direction T.

[0221] The dimensions of the multiple supports 40 in the surface direction (e.g., the length direction L or the width direction W) can be the same or different between the regions in the vapor flow path VP that overlap with the core 30 in the thickness direction T and the regions that do not overlap with the core 30 in the thickness direction T.

[0222] The dimensions of the multiple supports 40 in the thickness direction T can be the same or different between the regions in the vapor flow path VP that overlap with the core 30 in the thickness direction T and the regions that do not overlap with the core 30 in the thickness direction T.

[0223] The multiple supports 40 only need to include, in the region of the vapor flow path VP that overlaps with the core 30 in the thickness direction T, a support 40 that contacts the first inner surface 10a of the housing 10 (here, the inner surface of the first piece 11) and the core 30 in the thickness direction T. If this is the case, the multiple supports 40 can be provided in the region of the vapor flow path VP that does not overlap with the core 30 in the thickness direction T, or they can be omitted from this region.

[0224] exist Figure 13 In the example shown, when viewed from the thickness direction T, the evaporator EP overlaps with the vapor flow path VP, but the evaporator EP may also overlap with the liquid flow path LP. In this case, when viewed from the thickness direction T, the evaporator EP may also overlap with the inner edge 15 of the housing 10.

[0225] exist Figure 13 In the example shown, the liquid flow path LP is located in the region along the inner edge 15 of the housing 10, but the liquid flow path LP may also be located in a region not along the inner edge 15 of the housing 10, in addition to being located in the region along the inner edge 15 of the housing 10.

[0226] exist Figure 13 In the example shown, when viewed from the thickness direction T, the liquid flow path LP is set to not pass through the interior of the evaporation section EP, but the liquid flow path LP can also be set to pass through the interior of the evaporation section EP.

[0227] exist Figure 13 In the example shown, when viewed from the thickness direction T, the liquid flow path LP is not set along the outer periphery of the evaporation section EP, but the liquid flow path LP can also be set along the outer periphery of the evaporation section EP.

[0228] [Electronic Devices]

[0229] The electronic device of this invention is characterized by having the heat diffusion device of this invention.

[0230] The following description, as an example of an electronic device according to the present invention, describes an electronic device having the heat diffusion device of Embodiment 1 of the present invention. The same applies to electronic devices having heat diffusion devices according to other embodiments of the present invention.

[0231] Figure 15 This is a perspective schematic diagram illustrating an example of the electronic device of the present invention.

[0232] Figure 15 The electronic device 100 shown has a heat spreader 1A.

[0233] like Figure 15 As shown, the electronic device 100 preferably also has an electronic component 110.

[0234] like Figure 15 As shown, the electronic component 110 is preferably disposed on the outer surface of the housing 10 of the heat spreader 1A. In this case, the electronic component 110 is used as... Figure 1 The heat source HS shown can function as a heat spreader 1A.

[0235] Electronic component 110 relative to Figure 3 The housing 10 of the heat spreader 1A shown can be provided on the outer surface of the housing 10 opposite to the first inner surface 10a, which is the outer surface of the first piece 11 in this case, or on the outer surface of the housing 10 opposite to the second inner surface 10b, which is the outer surface of the second piece 12 in this case.

[0236] Electronic components 110 can be directly disposed on the outer surface of housing 10, or they can be disposed on the outer surface of housing 10 by means of other components such as adhesives, sheets, and strips with high thermal conductivity.

[0237] Preferably, the electronic component 110 is located in Figure 2 When viewed from the thickness direction T, the outer surface of the shell 10 shown overlaps with the evaporation section EP.

[0238] Examples of electronic components 110 include central processing units (CPUs), light-emitting diodes (LEDs), power semiconductors, and other heat-generating elements.

[0239] like Figure 15 As shown, the electronic device 100 preferably also has a device housing 120.

[0240] exist Figure 15 In the example shown, the heat spreader 1A and the electronic component 110 are located in the internal space of the device housing 120.

[0241] The housing 10 and the equipment housing 120 are preferably joined by means of a joining member. More specifically, the outer surface of the housing 10 and the inner surface of the equipment housing 120 are preferably joined by means of a joining member. In this case, the tightness of the fit between the housing 10 and the equipment housing 120 is improved.

[0242] The joining member of the housing 10 and the device housing 120 is preferably a thermally conductive member. In this case, heat from the heat source HS, in this case, heat from the electronic component 110, is easily conducted from the housing 10 to the device housing 120. That is, the heat from the heat source HS, in this case, heat from the electronic component 110, is also easily diffused via the path from the housing 10 to the device housing 120.

[0243] Examples of thermally conductive components include thermally conductive tapes and thermally conductive adhesives.

[0244] As described above, the vapor chamber 1A operates independently without external power, utilizing the latent heat of vaporization and condensation of the working medium 20 to achieve high-speed, two-dimensional heat diffusion from the heat source HS, specifically from the electronic component 110. Furthermore, in the vapor chamber 1A, as described above, the core 30 improves the recovery efficiency of the liquid working medium 20, thus enhancing heat dissipation performance. Moreover, in the vapor chamber 1A, as described above, the vapor flow path VP is maximized while maintaining the thickness direction T of the housing 10, thereby ensuring a larger heat dissipation area and resulting in improved thermal conductivity. Based on the above, the electronic device 100 equipped with the vapor chamber 1A can effectively achieve heat dissipation within the limited internal space of the electronic device 100.

[0245] The following information is disclosed in this specification.

[0246] <1>

[0247] A heat diffusion device, characterized in that the heat diffusion device comprises:

[0248] A housing having a first inner surface and a second inner surface opposite each other in the thickness direction, and having an internal space therein;

[0249] The working medium is sealed within the aforementioned internal space of the aforementioned housing;

[0250] The core, which is disposed in the aforementioned internal space of the aforementioned housing; and

[0251] A support body is disposed in the aforementioned internal space of the housing and contacts the aforementioned first inner surface of the housing and the aforementioned core in the aforementioned thickness direction.

[0252] The first inner surface of the housing is provided with a recess located around the support body.

[0253] When viewed from above in the thickness direction, at least a portion of the recessed portion contacts the root of the support located on the side of the first inner surface of the housing.

[0254] <2>

[0255] According to the heat diffusion device described in <1>, the planar shape of the support body when viewed from the thickness direction is a shape in which the outer edge is partially concave inward.

[0256] <3>

[0257] According to the heat diffusion device described in <1> or <2>, when viewed from the thickness direction, the recessed portion is in overall contact with the root portion of the support.

[0258] <4>

[0259] According to the heat diffusion device described in <3>, when viewed from the thickness direction, the recessed portion is in full circumferential contact with the root portion of the support body.

[0260] <5>

[0261] According to any one of <1> to <4>, in the heat diffusion device, when viewed from the thickness direction, the inner edge of the recessed portion is along the outer edge of the support body.

[0262] <6>

[0263] According to any one of <1> to <5>, the heat diffusion device, when viewed from the thickness direction, has an outer edge along the outer edge of the support body.

[0264] <7>

[0265] According to any one of <1> to <6>, the heat diffusion device wherein, when viewed in section from a surface direction orthogonal to the thickness direction, the cross-sectional shape of the recess is a shape in which the outer edge is composed of at least one of a straight line and a curve.

[0266] <8>

[0267] An electronic device, characterized in that it comprises any one of <1> to <7>.

[0268] Industrial availability

[0269] The heat dissipation device of this invention can be widely used in portable information terminals and other fields. For example, it can be used to lower the temperature of heat sources such as central processing units, thereby extending the service life of electronic devices. It can be used in smartphones, tablet computers, laptops, gaming devices, wearable devices, etc.

[0270] Explanation of reference numerals in the attached figures

[0271] 1A, 1B, heat spreader (heat diffusion device); 10, shell; 10a, first inner surface; 10b, second inner surface; 11, first piece; 12, second piece; 15, inner edge; 20, working medium; 30, core; 40, support body; 41, root of support body; 50, recess; 60, microchannel; 61, protrusion; 70, partition wall; 100, electronic equipment; 110, electronic components; 120, equipment shell; EP, evaporation section; HS, heat source; L, length direction; LP, liquid flow path; T, thickness direction; VP, vapor flow path; W, width direction.

Claims

1. A heat diffusion device, characterized in that, This heat diffusion device has the following features: A housing having a first inner surface and a second inner surface opposite each other in the thickness direction, and having an internal space therein; The working medium is sealed within the internal space of the housing; The core is located in the internal space of the housing; as well as A support body is disposed within the internal space of the housing and contacts the first inner surface of the housing and the core in the thickness direction. The first inner surface of the housing is provided with a recess located around the support body. When viewed from above in the thickness direction, at least a portion of the recess contacts the root of the support located on the first inner surface side of the housing. When viewed from above in the thickness direction, the recess is located in a position that does not overlap with the support.

2. The heat diffusion device according to claim 1, characterized in that, The planar shape of the support body when viewed from above in the thickness direction is a shape in which the outer edge is partially concave inward.

3. The heat diffusion device according to claim 1 or 2, characterized in that, When viewed from above in the thickness direction, the recessed portion is in contact with the root of the support body.

4. The heat diffusion device according to claim 3, characterized in that, When viewed from above in the thickness direction, the recessed portion is in full circumference contact with the root of the support.

5. The heat diffusion device according to claim 1 or 2, characterized in that, When viewed from above in the thickness direction, the inner edge of the recess is along the outer edge of the support.

6. The heat diffusion device according to claim 1 or 2, characterized in that, When viewed from above in the thickness direction, the outer edge of the recess is along the outer edge of the support.

7. The heat diffusion device according to claim 1 or 2, characterized in that, The cross-sectional shape of the recess, when viewed from a plane orthogonal to the thickness direction, is a shape in which the outer edge is composed of at least one of a straight line and a curve.

8. An electronic device, characterized in that, The electronic device includes the heat diffusion device as described in any one of claims 1 to 7.

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