Packaging chip testing device

Abstract

The utility model discloses a packaged chip testing device, which comprises a base and an upper cover connected with the base, a bearing groove and a light emitting groove are arranged on the base, and the bearing groove is arranged on one side of the base close to the upper cover and is used for accommodating a packaged chip; the light outlet groove is communicated with the bearing groove and comprises a light outlet communicated with the outside of the packaged chip testing device; the upper cover can be opened or closed relative to the base, and when the upper cover is closed relative to the base, the upper cover is in elastic contact with the packaging chip so as to press the packaging chip in the bearing groove. Through the design that the upper cover is matched with the base, and the base is provided with the light emitting groove communicated with the bearing groove, the packaged chip testing device can meet the requirement for testing the quality of light beams, the packaged chip is tightly pressed in the bearing groove through the upper cover, a welding process does not need to be introduced, and the cost is reduced. The risk that the yield is reduced due to the fact that welding affects the performance of the packaged chip can be avoided, the base and the upper cover can be repeatedly used, and the testing cost is low.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a packaged chip testing device. Background Technology

[0002] In the research and development and production of semiconductor lasers, it is necessary to test the various performance indicators of the packaged semiconductor laser chip multiple times in the testing and aging process, and select qualified products based on the test results to improve the product yield.

[0003] However, existing testing methods typically require soldering the packaged chip onto a heat sink for testing. This not only adds a soldering step to the testing process, but also may affect the performance of the packaged chip, reducing the yield. Furthermore, existing testing methods often neglect to test the laser beam quality during the testing process, resulting in inaccurate test results. Utility Model Content

[0004] In view of this, the present invention provides a packaged chip testing device to solve the problem that the existing testing process requires the packaged chip to be soldered onto a heat sink and ignores the beam quality test.

[0005] A packaged chip testing device includes a base and a top cover connected to the base. The base has a support groove and a light-emitting groove. The support groove is located on the side of the base near the top cover and is used to accommodate the packaged chip. The light-emitting groove communicates with the support groove and includes a light-emitting port communicating with the outside of the packaged chip testing device. The top cover can be opened or closed relative to the base. When the top cover is closed relative to the base, the top cover elastically contacts the packaged chip to press the packaged chip tightly within the support groove.

[0006] In some embodiments, the light-emitting groove includes an inner end and an outer end, the inner end being connected to the bearing groove, and the light-emitting port being disposed at the outer end. In the extension direction perpendicular to the light-emitting groove, the cross-sectional area of ​​the inner end is smaller than the cross-sectional area of ​​the outer end.

[0007] In some embodiments, the cross-sectional area of ​​the light-emitting groove gradually increases from the inner end to the outer end.

[0008] In some embodiments, the upper cover has a through hole corresponding to the light outlet of the light outlet groove, and the light outlet groove is connected to the outside of the packaged chip testing device through the through hole. The diameter of the through hole is larger than the size of the light outlet.

[0009] In some embodiments, the top cover includes a fixed base and a movable cover. The fixed base is connected to the base, and the fixed base has an opening corresponding to the position where the base has a support groove. The movable cover is movably connected to the fixed base and can switch between opening and closing relative to the base.

[0010] In some embodiments, the base includes a base and a protrusion on one side of the base, the bearing groove and the light-emitting groove are located on the side of the protrusion facing the movable cover, the fixing seat is mounted on the base, and the protrusion is located in the opening.

[0011] In some embodiments, the movable cover is provided with an elastic conductive element, the elastic conductive element including an abutting end protruding from the side surface of the movable cover facing the base, and in the closed state of the upper cover relative to the base, the abutting end of the elastic conductive element is in elastic contact with the packaged chip.

[0012] In some embodiments, the packaged chip testing apparatus further includes a circuit board disposed outside the movable cover, and the elastic conductive element further includes a connecting end protruding from the side surface of the movable cover away from the base, the connecting end being used for electrical connection with the circuit board.

[0013] In some embodiments, one side of the movable cover is rotatably connected to the fixed base via an elastic connector. A locking structure is provided between the side of the movable cover away from the elastic connector and the fixed base. The locking structure has a locked state and an unlocked state. In the locked state, the movable cover presses the packaged chip into the carrier groove. In the unlocked state, the elastic restoring force of the elastic connector is used to drive the movable cover to rotate away from the base.

[0014] In some embodiments, the base is a heat-conducting component, the base has a groove communicating with the support groove, the upper cover has a liquid injection tube, and when the upper cover is closed relative to the base, the groove is connected to the outside of the packaged chip testing device through the liquid injection tube.

[0015] The packaged chip testing device provided by this utility model adopts a design in which a base and a top cover cooperate. The top cover can be opened or closed relative to the base. In the open state, the carrier groove can be exposed to place the packaged chip into or remove it from the carrier groove. In the closed state, the top cover and the packaged chip in the carrier groove make elastic contact, thereby pressing the packaged chip tightly in the carrier groove. Compared with the method of soldering the packaged chip to the heat sink, there is no need to introduce a soldering process, which can avoid the risk of reduced yield due to the impact of soldering on the performance of the packaged chip. Moreover, the base and the top cover can be reused, resulting in lower testing costs. Secondly, by setting a light-emitting groove on the base that is connected to the carrier groove, the light beam generated by the packaged chip placed in the carrier groove can be emitted to the outside of the testing device through the light-emitting groove, so that the packaged chip testing device can meet the test of beam quality and improve the accuracy of test results. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a packaged chip testing device provided in an embodiment of the present invention;

[0017] Figure 2 for Figure 1 A cross-sectional view of the packaged chip testing apparatus shown in the figure;

[0018] Figure 3 for Figure 1 A top view of the base shown in the image;

[0019] Figure 4 for Figure 1 A side view of the base shown;

[0020] Figure 5 for Figure 1 The diagram shows the structure of the upper cover, in which the movable cover is in a closed state.

[0021] Figure 6 for Figure 5 A cross-sectional view of the top cover shown;

[0022] Figure 7 for Figure 6 The diagram shows the movable cover in the open position;

[0023] Figure 8 for Figure 1 The circuit board shown is a top view.

[0024] In the diagram: 10. Packaging chip testing device; 12. Base; 14. Top cover; 16. Support groove; 18. Light emission groove; 20. Light emission port; 22. Inner end; 24. Outer end; 26. Through hole; 28. First hole; 30. Second hole; 32. Fixing base; 34. Movable cover; 36. Opening; 38. Base; 40. Protrusion; 42. Elastic conductive element; 44. Abutment end; 46. Circuit board; 48. Connection end; 50. Electrical interface; 52. Soldering hole; 54. Threaded hole; 56. Elastic connector; 58. Locking structure; 60. Buckle; 62. Bayonet; 64. Groove; 66. Liquid injection tube; 68. Clearance opening. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0026] It should be noted that all directional indicators (such as up, down, left, right, front, back, inside, outside, top, bottom, etc.) in the embodiments of this utility model are only used to explain the relative positional relationship between the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0027] It should also be noted that when a component is referred to as "fixed to" or "set on" another component, the component may be directly on the other component or there may be an intervening component present. When a component is referred to as "connected to" another component, it may be directly connected to the other component or there may be an intervening component present.

[0028] Please see Figure 1 and Figure 2An embodiment of the present invention provides a packaged chip testing device 10, including a base 12 and an upper cover 14 connected to the base 12. The base 12 is provided with a support groove 16 on the side near the upper cover 14 for accommodating the packaged chip. The upper cover 14 can be opened or closed relative to the base 12. When the upper cover 14 is open relative to the base 12, the support groove 16 can be exposed so that the packaged chip can be placed into the support groove 16 or removed from the support groove 16. When the upper cover 14 is closed relative to the base 12, the upper cover 14 is in elastic contact with the packaged chip so as to press the packaged chip tightly in the support groove 16. The packaged chip is pressed into the carrier groove 16 by the top cover 14. The packaged chip can be easily placed in the carrier groove 16 of the base 12. The test conditions can be met by keeping the top cover 14 closed and pressing it. Compared with the method of soldering the packaged chip to the heat sink, there is no need to introduce a soldering process to fix the packaged chip. This can avoid the risk of reduced yield due to the impact of soldering operation on the performance of the packaged chip. Moreover, the top cover 14 and the base 12 can be reused, and the test cost is relatively low.

[0029] Specifically, the carrier groove 16 is located on the top of the base 12, which facilitates the placement or removal of the packaged chip from the carrier groove 16. When the upper cover 14 is closed relative to the base 12, the upper cover 14 covers the base 12, thereby pressing the packaged chip located in the carrier groove 16, so that the packaged chip contacts the surface of the base 12 in the carrier groove 16 and the inner surface of the upper cover 14. At this time, electrical connection contact points can be further provided on the surface of the carrier groove 16 and / or the inner surface of the upper cover 14, so that the packaged chip can directly contact the electrical connection contact points to form an electrical connection in the pressed state.

[0030] The shape of the carrier groove 16 is adapted to the shape of the packaged chip; specifically, the carrier groove 16 is square.

[0031] The circumferential dimension of the carrier groove 16 is slightly larger than that of the packaged chip, so that the packaged chip can be placed in the carrier groove 16, while also providing a certain positioning effect for the packaged chip and reducing the risk of the packaged chip shaking in the carrier groove 16.

[0032] The depth of the carrier groove 16 is the same as the depth of the packaged chip, so that after the packaged chip is placed in the carrier groove 16, the outer surface of the packaged chip is flush with the corresponding outer surface of the base 12, so as to contact the top cover 14, while avoiding the connection between the base 12 and the top cover 14 due to protrusion outside the carrier groove 16.

[0033] The walls of the carrier groove 16 are polished to form a smooth surface, thereby reducing the friction between the packaged chip and the walls of the carrier groove 16 and reducing the wear of the packaged chip.

[0034] The packaged chip can be a packaged chip formed from various semiconductor integrated circuit chips. In this embodiment, the packaged chip is a semiconductor laser packaged chip, which includes a package body and a semiconductor laser disposed within the package body. After the semiconductor laser generates a beam, it is emitted from the light-emitting end face of the packaged chip. The packaged chip is made using COS (Chip on Substrate) packaging technology, which can meet the requirements of high integration, small size, low power consumption, and high performance.

[0035] Understandably, a semiconductor laser can be a laser chip or a laser bar composed of multiple laser chips arranged together.

[0036] Please see Figure 3 The base 12 is provided with a light-emitting groove 18 that communicates with the support groove 16. The light-emitting groove 18 extends from the support groove 16 to the outer surface of the base 12 to form a light-emitting port 20 that communicates with the outside of the packaged chip testing device 10. The light-emitting groove 18 is arranged corresponding to the light-emitting end face of the packaged chip in the support groove 16, so that the light beam generated by the packaged chip will not be blocked by the base 12 when it is emitted outward. That is, the diameter of the part of the light beam located in the light-emitting groove 18 is smaller than the size of the light-emitting groove 18. The light beam generated by the packaged chip can be emitted along the light-emitting groove 18 to the outside of the packaged chip testing device 10, thereby enabling the packaged chip testing device 10 to meet the requirements for testing the beam quality of the packaged chip, such as laser divergence angle and power, and improving the accuracy of the test results.

[0037] The specific shape of the light outlet groove 18 is not limited, such as cylindrical, prismatic, frustum, or truncated cone.

[0038] In one embodiment, the light-emitting groove 18 includes an inner end 22 and an outer end 24 disposed opposite to each other. The inner end 22 communicates with the carrier groove 16, and the light-emitting port 20 is disposed at the outer end 24. The light beam generated by the packaged chip extends from the inner end 22 toward the outer end 24. In the direction perpendicular to the extension of the light-emitting groove 18, i.e. from the inner end 22 to the outer end 24, the cross-sectional area of ​​the inner end 22 is smaller than the cross-sectional area of ​​the outer end 24. Since the light beam usually has a divergent spot shape in the emission direction, the diameter of the light beam gradually increases in the emission direction. By setting the cross-sectional area of ​​the outer end 24 to be larger than the cross-sectional area of ​​the inner end 22, the shape of the light-emitting groove 18 is adapted to the shape of the light beam, and it can be compatible with packaged chips with a larger divergence angle.

[0039] Preferably, the cross-sectional area of ​​the light-emitting groove 18 gradually increases from the inner end 22 to the outer end 24, so that the shape of the light-emitting groove 18 can be better matched with the shape of the light beam.

[0040] In the horizontal direction perpendicular to the extension direction of the light-emitting groove 18, the inner end 22 of the light-emitting groove 18 is smaller than the size of the carrier groove 16, and the inner end 22 is located in the middle of one side of the carrier groove 16. The groove wall of the carrier groove 16 near the light-emitting groove 18 can still contact the surface of the packaged chip to prevent the light-emitting groove 18 from affecting the positioning of the packaged chip.

[0041] Typically, the distance between the carrier groove 16 and the outer surface of the packaged chip testing device 10 near the light outlet 20 should be set as small as possible to minimize the travel distance of the light beam to the outside of the packaged chip testing device 10, reduce light loss, and make it easier for the detector located outside the packaged chip testing device 10 to receive the complete light beam, thus ensuring the accuracy of the test results.

[0042] In one embodiment, the length of the light-emitting groove 18 in its extending direction is between 0.5 mm and 1.5 mm, and the light-emitting groove 18 extends from the supporting groove 16 to the outer surface of one side of the base 12. That is, the distance between the supporting groove 16 and the outer surface of the base 12 on that side is between 0.5 mm and 1.5 mm. Controlling the distance within this range can avoid the strength being too weak due to the distance being too small, which would affect the reliability of positioning, and can also avoid the light beam extending too far due to the distance being too large, which would affect the detector receiving the complete light beam. Specifically, the length of the light-emitting groove 18 in its extending direction is 1 mm.

[0043] Please see Figure 5 In one embodiment, the upper cover 14 has a through hole 26 corresponding to the light emission port 20 of the light emission slot 18. The light emission slot 18 is connected to the outside of the packaged chip testing device 10 through the through hole 26. The diameter of the through hole 26 is larger than the size of the light emission port 20. The through hole 26 is farther from the packaged chip than the light emission port 20, so the diameter of the light beam will be larger when it is emitted to the through hole 26, making the diameter of the through hole 26 larger than the size of the light emission port 20, thus preventing the upper cover 14 from blocking the light beam emitted from the light emission port 20.

[0044] Understandably, the through hole 26 of the top cover 14 can be a complete hole or it can be formed by multiple separate holes connected to each other. Moreover, there may be gaps between adjacent separate holes or no gaps. When gaps are formed between adjacent separate holes, the gaps between adjacent holes can be regarded as part of the through hole 26.

[0045] In this embodiment, the through hole 26 includes a first hole portion 28 and a second hole portion 30. The first hole portion 28 is located directly below the second hole portion 30, and the shape and size of the first hole portion 28 are the same as those of the second hole portion 30.

[0046] Understandably, the ability of the upper cover 14 to open or close relative to the base 12 can refer to the entire upper cover 14 opening or closing relative to the base 12, or it can refer to a portion of the upper cover 14 opening or closing relative to the base 12. The specific manner in which the upper cover 14 opens or closes relative to the base 12 is not limited. For example, it can be through a rotatable connection, where the upper cover 14 rotates relative to the base 12 to switch between open and closed states; or it can be through a detachable connection, where the upper cover 14 can be removed and installed to switch between open and closed states.

[0047] Please see Figure 2 , Figure 6 as well as Figure 7 In one embodiment, the upper cover 14 includes a fixed base 32 and a movable cover 34. The fixed base 32 is connected to the base 12, and the fixed base 32 has an opening 36 corresponding to the position where the base 12 has a support groove 16. The movable cover 34 is movably connected to the fixed base 32 and can switch between opening and closing relative to the base 12. That is, the movable cover 34 can move relative to the fixed base 32, thereby switching between opening and closing relative to the base 12. Since the base 12 has an opening 36 corresponding to the support groove 16, when the movable cover 34 is open relative to the base 12, the fixed base 32 can expose the support groove 16 through the opening 36 to pick up and put in the packaged chip. When the movable cover 34 is closed relative to the base 12, the movable cover 34 presses the packaged chip into the support groove 16.

[0048] The first hole 28 of the through hole 26 is provided on the fixed base 32 and passes through the fixed base 32. The first hole 28 extends from the side of the fixed base 32 near the movable cover 34 in a direction away from the movable cover 34. The second hole 30 is correspondingly provided on the movable cover 34 and passes through the movable cover 34. The second hole 30 extends from the side of the movable cover 34 near the fixed base 32 in a direction away from the fixed base 32. The two sides of the first hole 28 and the second hole 30 that are close to each other are connected to each other.

[0049] The connection method between the fixing seat 32 and the base 12 is not limited. It can be a mechanical connection using bolts or other connectors, or it can be a bonding connection using glue or other adhesives. In this embodiment, the fixing seat 32 and the base 12 are provided with corresponding threaded holes 54. The connector passes through the threaded holes 54 on the fixing seat 32 and the base 12 to fix the fixing seat 32 and the base 12 together.

[0050] Further reading Figure 4The base 12 includes a base 38 and a protrusion 40 on one side of the base 38. A support groove 16 and a light-emitting groove 18 are located on the side of the protrusion 40 facing the movable cover 34. A fixing seat 32 is mounted on the base 38, and the protrusion 40 is located within an opening 36. Specifically, the protrusion 40 is located in the middle of the base 38, and the opening 36 penetrates the fixing seat 32, making the fixing seat 32 annular. The fixing seat 32 surrounds the outer periphery of the protrusion 40 through the opening 36 and is stacked on the top of the base 38. By providing an opening 36 on the fixing seat 32, the protrusion 40 of the base 12 is inserted into the opening 36, which helps to improve the fit and assembly between the base 12 and the upper cover 14 and the compactness after assembly, thereby reducing the overall size of the packaged chip.

[0051] Preferably, the base 38 and the protrusion 40 are integrally formed from the same material to ensure the connection strength between the base 38 and the protrusion 40, while eliminating the need for a fixing process.

[0052] The upper cover 14 makes elastic contact with the packaged chip. This can be achieved by providing an elastic element between the upper cover 14 and the base 12 to maintain elastic contact between the upper cover 14 and the base 12, thereby forming elastic contact with the packaged chip located on the base 12. Alternatively, an elastic element can be provided on the upper cover 14 to press the packaged chip into the carrier groove 16, thereby forming elastic contact with the packaged chip.

[0053] Please see Figure 2 and Figure 6 In one embodiment, the movable cover 34 is provided with an elastic conductive element 42. The elastic conductive element 42 includes an abutting end 44 protruding from the side surface of the movable cover 34 facing the base 12. When the movable cover 34 moves relative to the fixed base 32, it drives the elastic conductive element 42 to move together. When the upper cover 14 is closed relative to the base 12, the abutting end 44 of the elastic conductive element 42 elastically contacts the packaged chip to press the packaged chip into the carrier groove 16 and form an electrical connection with the packaged chip. Specifically, the length of the abutment end 44 protruding outside the movable cover 34 is greater than the distance between the movable cover 34 and the packaged chip in the closed state. During the movement of the movable cover 34 to the closed state, the abutment end 44 passes through the opening 36 on the fixed base 32 and gradually approaches the packaged chip. As the movable cover 34 continues to move, the abutment end 44 interferes with the packaged chip in the carrier groove 16. The abutment end 44 deforms under the action of the movable cover 34 and the packaged chip, thereby generating elastic force. Under the action of its own elastic force, the abutment end 44 presses tightly onto the packaged chip, thereby pressing the packaged chip tightly into the carrier groove 16 to ensure the pressing effect. At the same time, the elastic conductive element 42 also has the effect of conducting electricity. When the abutment end 44 presses the packaged chip into the carrier groove 16, it will form an electrical connection with the packaged chip.

[0054] The specific type of the elastic conductive element 42 is not limited, as long as it has both elasticity and conductivity, such as a metal spring.

[0055] The specific number of elastic conductive elements 42 is not limited; it can be one or more. In this embodiment, there are multiple elastic conductive elements 42, which are spaced apart, and the contact end 44 of each elastic conductive element 42 can contact the packaged chip. That is, each elastic conductive element 42 can form a pressing effect on the packaged chip, thereby enhancing the pressing effect on the packaged chip. Specifically, there are four elastic conductive elements 42, which are arranged symmetrically in pairs.

[0056] Please see Figure 2 and Figure 8 The packaged chip testing device 10 also includes a circuit board 46 disposed on the outside of the movable cover 34. The circuit board 46 is fixedly attached to the movable cover 34. The elastic conductive element 42 also includes a connecting end 48 protruding from the side surface of the movable cover 34 away from the base 12. That is, the two ends of the elastic conductive element 42 are an abutment end 44 and a connecting end 48, respectively. The abutment end 44 is used to press the packaged chip into the carrier groove 16 and electrically connect it to the packaged chip. The connecting end 48 is used to electrically connect to the circuit board 46. The circuit board 46 is electrically connected to the packaged chip housed in the carrier groove 16 through the elastic conductive element 42. During the testing of the packaged chip, the packaged chip can be electrically connected to external devices through the elastic conductive element 42 and the circuit board 46. The elastic conductive element 42 simultaneously serves the functions of pressing and conducting electricity, which can reduce the use of related functional components and help reduce the overall size of the packaged chip testing device 10.

[0057] The circuit board 46 is provided with an electrical interface 50. The circuit board 46 is electrically connected to an external device, such as a power supply, through the electrical interface 50 to realize the connection between the packaged chip and the external device for powering the packaged chip and measuring the corresponding parameters.

[0058] A soldering hole 52 is provided through the circuit board 46. The connecting end 48 of the elastic conductive element 42 extends into the soldering hole 52 and is soldered together with the circuit board 46, so that the elastic conductive element 42 and the circuit board 46 form an electrical connection and a fixed connection.

[0059] The circuit board 46 and the movable cover 34 can be mechanically connected by bolts or other connectors, or they can be glued together. In this embodiment, the circuit board 46 and the movable cover 34 are provided with corresponding threaded holes 54. The connector passes through the threaded holes 54 on the circuit board 46 and the movable cover 34 to fix the circuit board 46 and the movable cover 34 together.

[0060] Please see Figure 6 and Figure 7In one embodiment, one side of the movable cover 34 is rotatably connected to the fixed base 32 via an elastic connector 56. The movable cover 34 can rotate relative to the fixed base 32 to switch between open and closed relative to the base 12. When the movable cover 34 switches from open to closed relative to the base 12, the movable cover 34 will squeeze the elastic connector 56, causing it to deform and generate an elastic restoring force. When the movable cover 34 in the closed state is released from the fixed base 32, the movable cover 34 can automatically rotate away from the base 12 under the action of the elastic restoring force of the elastic connector 56, without the need for manual rotation by the operator, reducing the difficulty of operation and improving testing efficiency.

[0061] The specific type of the elastic connector 56 is not limited, such as a torsion spring.

[0062] A locking structure 58 is provided between the side of the movable cover 34 away from the elastic connector 56 and the fixed base 32. The locking structure 58 has a locked state and an unlocked state. In the locked state, the movable cover 34 and the fixed base 32 remain relatively fixed, and the movable cover 34 presses the packaged chip into the carrier groove 16. In the unlocked state, the elastic connector 56 drives the movable cover 34 to rotate away from the base 12 through elastic restoring force. When it is necessary to press the packaged chip into the carrier groove 16, the locking structure 58 can be locked after the movable cover 34 moves to the closed state, so that the movable cover 34 and the fixed base 32 remain relatively fixed. When it is necessary to remove or insert the packaged chip, the locking structure 58 can be switched from the locked state to the unlocked state. Under the action of the elastic connector 56, the movable cover 34 automatically moves away from the base 12, so that the movable cover 34 opens relative to the base 12, exposing the carrier groove 16 on the protrusion 40.

[0063] The specific form of the locking structure 58 is not limited, as long as it has a locked state and an unlocked state and can switch between the two states. For example, it can be the cooperation of the bolt and the key hole, or the cooperation of the latch and the latch 62.

[0064] In this embodiment, the locking structure 58 is a snap-fit ​​structure, which includes a snap-fit ​​member 60 and a latch 62. The snap-fit ​​member 60 is movably mounted on the fixed base 32, allowing it to move relative to the movable cover 34. The latch 62 is correspondingly mounted on the movable cover 34 and is located at the top of the movable cover 34. When the snap-fit ​​member 60 is inserted into the latch 62, it presses the movable cover 34 against the fixed base 32, keeping the movable cover 34 and the fixed base 32 relatively fixed. At this time, the locking structure 58 is in a locked state. When the snap-fit ​​member 60 is withdrawn from the latch 62, it separates from the movable cover 34 and no longer presses against it. The movable cover 34 can then move away from the base 12 under the action of the elastic connector 56. The snap-fit ​​member can move relative to the movable cover 34, allowing it to insert into or withdraw from the latch 62, thereby switching between the locked and unlocked states.

[0065] Please see Figure 3 In one embodiment, the base 12 is a heat-conducting component, and the base 12 has a groove 64 that communicates with the support groove 16. Since the groove 64 is connected to the support groove 16, the groove 64 can serve as a liquid injection tank. When a heat-conducting liquid, such as water droplets, is added to the groove 64, the heat-conducting liquid can flow from the groove 64 into the support groove 16 and be adsorbed between the bottom surface of the packaged chip and the bottom wall of the support groove 16 under capillary action, serving as a heat-conducting medium between the packaged chip and the base 12. During the operation of the packaged chip, heat is generated, which can be conducted to the base 12 through the heat-conducting liquid. The base 12 assists in heat dissipation, increases the contact area with air, thereby improving the heat dissipation effect of the packaged chip and preventing the normal operation of the packaged chip from being affected by excessive temperature. This enables the packaged chip testing device 10 to have the ability to test high-power semiconductor lasers. At the same time, the groove 64 can also serve as a chip removal slot. Tweezers and other tools can be inserted into the groove 64 to clamp the chip package structure, making it convenient to remove the packaged chip from the support groove 16.

[0066] Preferably, an indium sheet is provided within the carrier groove 16. When the packaged chip is placed in the carrier groove 16, the indium sheet is located between the packaged chip and the inner wall of the carrier groove 16. The indium sheet has good thermal conductivity and can be used in conjunction with a thermally conductive liquid. The indium sheet and the thermally conductive liquid together form a thermally conductive medium between the base 12 and the packaged chip, enhancing the thermal conductivity between the packaged chip and the base 12, thereby enhancing the heat dissipation efficiency of the packaged chip.

[0067] Understandably, in order to enhance the heat dissipation effect of the base 12, in addition to using materials with good thermal conductivity to make the base 12, heat dissipation fins or cold plates or other heat sinks can be set on the outside of the base 12 to further enhance the heat dissipation capacity of the base 12, thereby enhancing the heat dissipation capacity of the packaged chip.

[0068] In this embodiment, both the protrusion 40 and the base 38 of the base 12 are heat-conducting, and the protrusion 40 and the base 38 are made of the same heat-conducting material, so that the base 12 forms a heat-equalizing seat.

[0069] The specific number of grooves 64 is not limited; there can be one or more. In this embodiment, the carrier groove 16 has a square circumferential outline. One side of the carrier groove 16 is provided with a light-emitting groove 18, and the other three sides are respectively provided with grooves 64. The light-emitting groove 18 and the grooves 64 are respectively located in the middle of the corresponding side of the carrier groove 16, so that the four corners of the carrier groove 16 remain intact. This avoids the light-emitting groove 18 and the grooves 64 affecting the positioning of the packaged chip, ensuring that the packaged chip can be accurately positioned and placed in the carrier groove 16, while also being easy to remove.

[0070] Please see Figure 2 and Figure 8 In one embodiment, the upper cover 14 is provided with a liquid injection tube 66, and the circuit board 46 is provided with a clearance opening 68 corresponding to the liquid injection tube 66. The top end of the liquid injection tube 66 extends through the clearance opening 68 to the outside of the circuit board 46. When the upper cover 14 is closed relative to the base 12, the bottom end of the liquid injection tube 66 is located above the groove 64, or extends into the groove 64 and is spaced apart from the bottom surface of the groove 64. At this time, the groove 64 is connected to the outside of the packaged chip testing device through the liquid injection tube 66. In this application, the liquid injection tube 66 is installed on the movable cover 34, and the top and bottom ends of the liquid injection tube 66 protrude to the outside of the movable cover 34, respectively. The groove 64 can be injected with heat-conducting liquid through the liquid injection tube 66 without opening the upper cover 14, which facilitates the liquid injection operation. During the test, the packaged chip will generate heat, and the thermally conductive liquid may evaporate. The liquid injection tube 66 allows the packaged chip test device 10 to replenish the thermally conductive liquid into the groove 64 in a timely manner during the test, ensuring the thermal conductivity between the packaged chip and the base 12 to meet the testing requirements of high-power semiconductor lasers.

[0071] Optionally, the end of the injection tube 66 away from the groove 64 can be connected to an external injection device, which can automatically inject heat-conducting liquid into the groove 64 through the injection tube 66 to improve testing efficiency.

[0072] The specific number of injection tubes 66 is not limited; there can be one or more, with each injection tube 66 corresponding to one of the multiple grooves 64. In this embodiment, there is one injection tube 66, which is connected to one of the grooves 64. After the thermally conductive liquid is injected into the groove 64 through the injection tube 66, the thermally conductive liquid can move under capillary action to the space between the bottom surface of the packaged chip and the bottom wall of the support groove 16, reducing the number of injection tubes 66 used and thus reducing production costs and difficulty.

[0073] In one embodiment, the base 12 and the top cover 14 are detachably connected, allowing the base 12 to be separated from the top cover 14. The base 12 accommodates the corresponding packaged chip by providing a carrier groove 16 adapted to the packaged chip, while the top cover 14 acts as a clamping member, pressing the packaged chip firmly within the carrier groove 16. Therefore, when the size of the packaged chip being tested changes, only the base 12 can be replaced without replacing the top cover 14, improving the compatibility of the packaged chip testing device 10. Multiple bases 12 can be arranged in an array to obtain the energy for batch testing of packaged chips.

[0074] Specifically, the base 38 of the base 12 is connected to the fixing seat 32 of the upper cover 14 by bolts or other connectors, so as to achieve the effect of detachable connection between the base 12 and the upper cover 14.

[0075] The packaged chip testing apparatus provided in this application has at least the following characteristics:

[0076] 1. By providing a carrier groove 16 on the base 12 to accommodate the packaged chip, and pressing the packaged chip tightly in the carrier groove 16 with the top cover 14, there is no need to introduce a soldering step to fix the packaged chip, avoiding the risk of reduced yield due to the impact of soldering on the performance of the packaged chip. Moreover, the base 12 and the top cover 14 can be reused, which can reduce testing costs.

[0077] 2. By setting a light-emitting groove 18 on the base 12 that is connected to the carrier groove 16, and the light-emitting groove 18 is set corresponding to the light-emitting end face of the packaged chip, the light beam generated by the packaged chip can be emitted to the outside of the test device 10 through the light-emitting groove 18, so that the packaged chip test device 10 can meet the test of beam quality and improve the accuracy of test results; moreover, the cross-sectional area of ​​the light-emitting groove 18 gradually increases from the inner end 22 to the outer end 24 in order to accommodate packaged chips with a larger divergence angle.

[0078] 3. By setting a locking structure 58 and an elastic connector 56 between the fixed base 32 and the movable cover 34, when the locking structure 58 is in the unlocked state, the movable cover 34 can automatically rotate away from the protrusion 40 under the action of the elastic connector 56 to expose the bearing groove 16, which is convenient for inserting or removing the packaged chip. At the same time, the groove 64 on the base 12 also facilitates the removal of the packaged chip, which can reduce the difficulty of operation and improve the testing efficiency.

[0079] 4. With the injection tube 66, heat-conducting liquid can be injected into the groove 64. The heat-conducting liquid moves between the bottom surface of the packaged chip and the bottom wall of the support groove 16 under capillary action, acting as a heat-conducting medium between the packaged chip and the base 12. At the same time, the indium sheet in the support groove 16 can also conduct heat, enhancing the heat dissipation capacity of the packaged chip, so that the packaged chip testing device 10 has the ability to test high-power semiconductor lasers.

[0080] 5. The base 12 and the top cover 14 are detachably connected to form a split structure. The base 12 can be replaced to obtain the ability to be compatible with a variety of packaged chips. Multiple bases 12 can be made into an array to obtain the ability to test packaged chips in batches.

[0081] 6. The base 12 and the top cover 14 can be further fitted by inserting the protrusion 40 into the opening 36 of the fixing seat 32 of the top cover 14. The top of the top cover 14 is provided with a circuit board 46 that fits therein, which helps to enhance the compactness of the structure of the packaged chip test device 10 and thus reduce the overall volume of the packaged chip test device 10.

[0082] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A packaged chip testing device, characterized in that, The device includes a base (12) and a top cover (14) connected to the base (12). The base (12) is provided with a support groove (16) and a light-emitting groove (18). The support groove (16) is located on the side of the base (12) near the top cover (14) and is used to accommodate the packaged chip. The light-emitting groove (18) communicates with the support groove (16) and includes a light-emitting port (20) that communicates with the outside of the packaged chip testing device. The top cover (14) can be opened or closed relative to the base (12). When the top cover (14) is closed relative to the base (12), the top cover (14) is in elastic contact with the packaged chip to press the packaged chip into the support groove (16).

2. The packaged chip testing apparatus according to claim 1, characterized in that, The light-emitting groove (18) includes an inner end (22) and an outer end (24) opposite to each other. The inner end (22) is connected to the bearing groove (16). The light-emitting port (20) is disposed at the outer end (24). In the extension direction perpendicular to the light-emitting groove (18), the cross-sectional area of ​​the inner end (22) is smaller than the cross-sectional area of ​​the outer end (24).

3. The packaged chip testing apparatus according to claim 2, characterized in that, The cross-sectional area of ​​the light-emitting groove (18) gradually increases from the inner end (22) to the outer end (24).

4. The packaged chip testing apparatus according to claim 2, characterized in that, The upper cover (14) is provided with a through hole (26) corresponding to the light outlet (20) of the light outlet groove (18). The light outlet groove (18) is connected to the outside of the packaged chip testing device through the through hole (26). The diameter of the through hole (26) is larger than the size of the light outlet (20).

5. The packaged chip testing apparatus according to claim 1, characterized in that, The upper cover (14) includes a fixed base (32) and a movable cover (34). The fixed base (32) is connected to the base (12), and the fixed base (32) has an opening (36) corresponding to the position where the base (12) has a bearing groove (16). The movable cover (34) is movably connected to the fixed base (32) and can switch between opening and closing relative to the base (12).

6. The packaged chip testing apparatus according to claim 5, characterized in that, The base (12) includes a base (38) and a protrusion (40) on one side of the base (38). The bearing groove (16) and the light-emitting groove (18) are located on the side of the protrusion (40) facing the movable cover (34). The fixed seat (32) is mounted on the base (38), and the protrusion (40) is located in the opening (36).

7. The packaged chip testing apparatus according to claim 5, characterized in that, The movable cover (34) is provided with an elastic conductive element (42). The elastic conductive element (42) includes an abutting end (44) protruding from the side surface of the movable cover (34) facing the base (12). When the upper cover (14) is closed relative to the base (12), the abutting end (44) of the elastic conductive element (42) is in elastic contact with the packaged chip.

8. The packaged chip testing apparatus according to claim 7, characterized in that, The packaged chip testing device also includes a circuit board (46) disposed outside the movable cover (34), and the elastic conductive element (42) also includes a connecting end (48) protruding from the side surface of the movable cover (34) away from the base (12), the connecting end (48) being used for electrical connection with the circuit board (46).

9. The packaged chip testing apparatus according to claim 5, characterized in that, One side of the movable cover (34) is rotatably connected to the fixed base (32) via an elastic connector (56). A locking structure (58) is provided between the side of the movable cover (34) away from the elastic connector (56) and the fixed base (32). The locking structure (58) has a locked state and an unlocked state. In the locked state, the movable cover (34) presses the packaged chip into the carrier groove (16). In the unlocked state, the elastic restoring force of the elastic connector (56) is used to drive the movable cover (34) to rotate away from the base (12).

10. The packaged chip testing apparatus according to any one of claims 1-9, characterized in that, The base (12) is a heat-conducting component. The base (12) is provided with a groove (64) that communicates with the bearing groove (16). The upper cover is provided with a liquid injection tube (66). When the upper cover (14) is closed relative to the base (12), the groove (64) communicates with the outside of the packaged chip testing device through the liquid injection tube (66).

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