Temperature detection control system
By employing a temperature detection and control system in semiconductor equipment, utilizing PLC controllers and wireless communication technology, the problem of difficult placement of traditional RTD and thermocouple sensors in confined spaces is solved, achieving efficient temperature detection and control and ensuring the normal operation of the equipment.
Patent Information
- Application Number
- CN202423314237.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-31
AI Technical Summary
In semiconductor devices, where space is limited and there are many temperature detection points, the wiring layout and mechanical structure arrangement of traditional resistance temperature detectors (RTDs) and thermocouples present challenges.
The temperature detection and control system includes a detection and control module, a PLC controller, a PCB board, a temperature sensor, a microcontroller, a wireless transmitter, and a semiconductor heating and cooling chip. Temperature control is achieved through wireless communication and PID algorithms, reducing wiring connections and improving space utilization.
It enables efficient temperature detection and control in confined spaces, simplifies wiring layout, and ensures normal operation and temperature stability of the equipment.
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Figure CN223650919U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of temperature detection technology, and specifically to a temperature detection and control system. Background Technology
[0002] In the semiconductor industry, in order to ensure the normal operation of semiconductor equipment, temperature detection points are usually set on the equipment. The traditional temperature detection method is to use resistance temperature detectors (RTDs) and thermocouples to detect the temperature at the temperature detection points of the equipment.
[0003] In some existing semiconductor-related devices, there are situations where the space size is small and there are many temperature detection points. The traditional method of using RTD and thermocouple sensors for temperature detection is difficult to implement in such cases. This is because RTD and thermocouple sensors require connecting wires and occupy a lot of space, which makes wiring layout and mechanical structure arrangement very difficult. Utility Model Content
[0004] The purpose of this invention is to design a temperature detection and control system that can solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A temperature detection and control system includes a detection and control module and a PLC controller. The detection and control module has several groups of devices, each fixed to a specific detection position on the device to be tested. The detection and control module includes a PCB board and a semiconductor heating and cooling element. A temperature sensor and a microcontroller are mounted on the PCB board. The temperature sensor is electrically connected to the microcontroller, and the microcontroller is signal-connected to the PLC controller. The semiconductor heating and cooling element is electrically connected to the PLC controller.
[0007] Furthermore, the PLC controller is electrically connected to a computer, and the computer is signal-connected to the microcontroller.
[0008] Furthermore, a wireless transmitter electrically connected to the microcontroller is mounted on the PCB board, and a wireless receiver is electrically connected to the computer. The wireless transmitter and the wireless receiver are connected in signal connection.
[0009] Furthermore, the PLC controller is electrically connected to an alarm.
[0010] Furthermore, the PLC controller is electrically connected to the power switch of the device under test.
[0011] Furthermore, the temperature sensor is model number TMP117.
[0012] The beneficial effects of this utility model are as follows:
[0013] By setting up a PCB board, on which temperature sensors and microcontrollers are installed, temperature detection can be performed while reducing wire connections and space occupation, and improving the convenience of wiring layout and mechanical structure arrangement.
[0014] By configuring a PLC controller and a semiconductor heating and cooling element, the PLC controller can control the semiconductor heating and cooling element to heat or cool after receiving the temperature collected by the temperature sensor, thereby controlling the operating temperature of the equipment at the temperature detection location within a suitable range and ensuring the normal operation of the equipment. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the structure of this utility model.
[0017] The names of the components shown in the diagram are as follows:
[0018] 1. PLC controller; 2. PCB board; 3. Semiconductor heating and cooling element; 4. Temperature sensor; 5. Microcontroller; 6. Computer; 7. Wireless transmitter; 8. Wireless receiver; 9. Alarm; 10. Power switch. Detailed Implementation
[0019] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.
[0020] like Figure 1As shown, a temperature detection and control system includes a detection and control module and a PLC controller 1. The detection and control module has several groups of sensors, each fixed to a specific detection position on the device to be tested. Based on the temperature measurement requirements of the device, it performs temperature detection and control at multiple temperature detection positions. The detection and control module includes a PCB board 2 and a semiconductor heating and cooling element 3. A temperature sensor 4 and a microcontroller 5 are mounted on the PCB board 2. The temperature sensor 4 is a TMP117 model, which has high temperature detection accuracy. The temperature sensor 4 is electrically connected to the microcontroller 5. The microcontroller 5 reads the temperature sensed by the temperature sensor 4 to achieve digital temperature acquisition. The PLC controller 1 is electrically connected to a computer 6. A wireless transmitter 7, electrically connected to the microcontroller 5, is mounted on the PCB board 2. The computer 6 is electrically connected to a wireless receiver 8. The wireless transmitter 7 and the wireless receiver 8 are signal connected. The microcontroller 5 transmits the acquired temperature data through the wireless transmitter 7, and the wireless receiver 8 then transmits the received temperature data to the computer 6. The computer 6's display screen can show temperature data for easy observation. The computer 6 then transmits the received temperature data to the PLC controller 1. A wireless transmitter 7 and a wireless receiver 8 are used to establish a signal connection between the microcontroller 5 and the PLC controller 1, avoiding the need for network cables and reducing wiring complexity. The semiconductor heating / cooling element 2 is electrically connected to the PLC controller 1. The PLC uses a PID algorithm to calculate the current to control the semiconductor heating / cooling element 2 based on the temperature feedback from the TMP117, and then outputs the current to the semiconductor heating / cooling element 2 for heating or cooling control, ensuring the operating temperature of the equipment's temperature detection location is within a suitable range. The PLC controller 1 is electrically connected to an alarm 9. When the temperature feedback from the TMP117 exceeds the set upper temperature limit, the PLC controller 1 will control the alarm 9 to sound an alarm for alert purposes. The PLC controller 1 is electrically connected to the power switch 10 of the device under test. Simultaneously with the alarm, the PLC controller 1 controls the power switch 10 to shut down, preventing damage to the equipment.
[0021] Working principle:
[0022] like Figure 1As shown, when the temperature detection and control system is in use, several sets of detection and control modules are first fixed one by one at several detection positions of the equipment to be tested. Then, during the operation of the equipment, the temperature sensor 4 of the detection and control module will sense the temperature at the detection position. The microcontroller 5 will read the temperature sensed by the temperature sensor 4 to realize the acquisition of the temperature digital value. The microcontroller 5 transmits the acquired temperature data through the wireless transmitter 7. The wireless receiver 8 then transmits the received temperature data to the computer 6. The temperature data can be displayed on the screen of the computer 6. The computer 6 then transmits the received temperature data to the PLC controller 1. The PLC uses the PID algorithm to calculate the magnitude of the current controlling the semiconductor heating and cooling chip 2 based on the temperature feedback from the TMP117, and then outputs the current to the semiconductor heating and cooling chip 2 to control the temperature, so as to keep the operating temperature of the temperature detection position of the equipment within a suitable range and ensure the normal operation of the equipment.
[0023] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.
Claims
1. A temperature detection and control system, characterized in that, The device includes a detection control module and a PLC controller (1). The detection control module has several sets of devices, each fixed to a specific detection position on the device to be tested. The detection control module includes a PCB board (2) and a semiconductor heating and cooling chip (3). A temperature sensor (4) and a microcontroller (5) are installed on the PCB board (2). The temperature sensor (4) is electrically connected to the microcontroller (5). The microcontroller (5) is signal connected to the PLC controller (1). The semiconductor heating and cooling chip (2) is electrically connected to the PLC controller (1).
2. The temperature detection and control system according to claim 1, characterized in that, The PLC controller (1) is electrically connected to the computer (6), and the computer (6) is connected to the microcontroller (5) via signal.
3. The temperature detection and control system according to claim 2, characterized in that, A wireless transmitter (7) electrically connected to a microcontroller (5) is installed on the PCB board (2), and a wireless receiver (8) is electrically connected to the computer (6). The wireless transmitter (7) and the wireless receiver (8) are connected by signal.
4. The temperature detection and control system according to claim 1, characterized in that, The PLC controller (1) is electrically connected to an alarm (9).
5. The temperature detection and control system according to claim 1, characterized in that, The PLC controller (1) is electrically connected to the power switch (10) of the device under test.
6. The temperature detection and control system according to claim 1, characterized in that, The temperature sensor (4) is model TMP117.