Computer mainboard suitable for various processor heat dissipation hole sites

Abstract

The utility model relates to the technical field of computer mainboards, and discloses a computer mainboard suitable for various processor heat dissipation hole sites, which comprises a circuit board mechanism, the circuit board mechanism comprises a board body with computer elements on the surface and mounting holes arranged on the outer side board body of a central processing unit (CPU), four mounting holes form a group, and three groups are arranged in total. The heat dissipation device is suitable for an AM4 heat dissipation device, an LGA115x heat dissipation device and an LGA1700 heat dissipation device. The positioning mechanism comprises an open sleeve and a positioning hole, the positioning hole is formed in the plate body, the open sleeve is fixed to the positioning hole through a screw and a base, three sets of mounting holes are adopted to be directly suitable for radiators of common models, meanwhile, movable and fixed threaded bases are used for fixing radiators of uncommon models, and therefore the radiators of common models can be fixed conveniently. Compared with the prior art, the device is more powerful in application capability, more choices are provided for a user during use, and the device is more user-friendly.

Description

Technical Field

[0001] This utility model relates to the field of computer motherboard technology, specifically a computer motherboard that adapts to the heat dissipation hole positions of various processors. Background Technology

[0002] The motherboard, also called the mainboard, system board, or motherboard, is one of the most basic and important components of a computer. A motherboard is generally a rectangular circuit board on which the main circuitry of the computer is installed. It typically includes a BIOS chip, I / O control chip, keyboard and front panel control switch interfaces, indicator light connectors, expansion slots, and DC power supply connectors for the motherboard and expansion cards.

[0003] Traditional computer motherboards have four heatsink mounting holes on their outer panel to help cool the CPU. However, there are many types of heatsinks available, and the mounting hole spacing varies between different manufacturers. This makes it difficult for the same motherboard to be compatible with heatsinks from different brands, which is inconvenient in actual use. Therefore, there is an urgent need for a computer motherboard that can accommodate heatsink mounting holes for various processors to solve the above problems. Utility Model Content

[0004] In order to overcome the above-mentioned technical problems, the purpose of this utility model is to provide a computer motherboard that can adapt to the heat dissipation hole positions of various processors, so as to solve the problem mentioned in the background art that traditional computer motherboards have four heat sink mounting holes on their outer plate to help dissipate heat from the CPU. However, there are many types of common heat sinks, and the mounting hole spacing of different manufacturers is different, which makes it difficult for the same motherboard to be used with heat sinks from different brands, and still has certain inconveniences in actual use.

[0005] This utility model provides the following technical solution: a computer motherboard that adapts to the heat dissipation hole positions of various processors, including a circuit board mechanism. The circuit board mechanism includes a board body with computer components on its surface and mounting holes opened on the outer side of the CPU board body. The mounting holes are in groups of four, and there are three groups in total, which are respectively suitable for AM4 heat sinks, LGA115x heat sinks and LGA1700 heat sinks.

[0006] The positioning mechanism includes an open sleeve and a positioning hole. The positioning hole is provided on the plate body, and the open sleeve is fixed to the positioning hole by screws and a base. A slidable threaded seat is placed in the open sleeve for fixing the screws of the heat sink. An adjustment strip hole is provided on the side of the open sleeve away from the CPU, and a screw connected to the threaded seat passes through the adjustment strip hole. A nut is rotatably sleeved on the screw.

[0007] To achieve the above technical solution, three sets of mounting holes are used to directly accommodate common radiator models, while movable and fixed threaded seats are used to fix uncommon radiator models. Compared with existing technologies, this device has a stronger applicability, giving users more choices and making it more user-friendly.

[0008] Furthermore, the positioning hole is straight and elongated.

[0009] Implementing the above technical solution makes it easier to change the position of the threaded seat on the Y-axis.

[0010] Furthermore, the height of the adjusting strip hole is at least twice that of the screw, for the screw to move up and down.

[0011] Implementing the above technical solution makes it easier to change the position of the threaded seat on the Z-axis, thereby improving the adhesion between the bottom of the heatsink and the thermal paste on the CPU.

[0012] Furthermore, the number of threaded seats is at least two.

[0013] To achieve the above technical solution, the applicability will be further enhanced.

[0014] Furthermore, a rubber sheet is connected to the top of the threaded seat, and the thickness of the rubber sheet is at least one millimeter.

[0015] The above technical solution improves the stability of the radiator when fixed to the top of the threaded seat.

[0016] Furthermore, the outer opening of the rubber sheet is coated with scale lines and numerical values, and the rubber sheet has a notch for indication at the position facing the scale lines.

[0017] Implementing the above technical solution makes it easier to determine the specific value of the threaded seat moving along the X-axis.

[0018] The technical effects and advantages of this utility model are as follows:

[0019] 1. This utility model uses three sets of mounting holes to directly accommodate common radiator models, while using movable and fixed threaded seats to fix uncommon radiator models.

[0020] 2. Compared with the prior art, this device has a more powerful applicability, giving users more choices and making it more user-friendly. Attached Figure Description

[0021] Figure 1 This is a top-view perspective view of the overall structure of this utility model.

[0022] Figure 2 This is a partial top-view perspective view of the plate structure near the CPU of this utility model.

[0023] Figure 3 This is a top-down perspective view of the positioning mechanism structure of this utility model from the right side after an explosion.

[0024] Figure 4 This is a top-down perspective view of the positioning mechanism structure of this utility model from the left side after an explosion.

[0025] The attached figures are labeled as follows: 1. Circuit board mechanism; 110. Board body; 111. Mounting hole; 2. Positioning mechanism; 210. Opening sleeve; 211. Positioning hole; 212. Adjustment strip hole; 213. Threaded seat; 214. Screw; 215. Nut; 216. Rubber sheet. Detailed Implementation

[0026] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0027] Example 1:

[0028] Refer to the attached diagram in the instruction manual. Figure 1-3 This utility model provides a computer motherboard that adapts to the heat dissipation hole positions of various processors, including a circuit board mechanism 1. The circuit board mechanism 1 includes a board body 110 with computer components on its surface and mounting holes 111 opened on the outer side of the CPU board body 110. The mounting holes 111 are four in a group, and there are three groups in total, which are respectively suitable for AM4 heat dissipation devices, LGA115x heat dissipation devices and LGA1700 heat dissipation devices.

[0029] The positioning mechanism 2 includes an open sleeve 210 and a positioning hole 211. The positioning hole 211 is provided on the plate 110, and the open sleeve 210 is fixed to the positioning hole 211 by screws and a base. A slidable threaded seat 213 is placed in the open sleeve 210 for fixing the screws of the heat sink. An adjustment strip hole 212 is provided on the side of the open sleeve 210 away from the CPU, and a screw 214 connected to the threaded seat 213 passes through the adjustment strip hole 212. A nut 215 is rotatably sleeved on the screw 214. There are at least two threaded seats 213. A rubber sheet 216 is connected to the top of the threaded seat 213, and the thickness of the rubber sheet 216 is at least one millimeter. The open sleeve 210 on the outside of the rubber sheet 216 is coated with scale lines and values, and the rubber sheet 216 has a notch for indication facing the scale lines.

[0030] When using AM4 heatsink, LGA115x heatsink, or LGA1700 heatsink, first remove the open sleeve 210 from the board 110, and then find the corresponding mounting hole 111 to fix the heatsink.

[0031] When the model used cannot fit all the mounting holes 111, the threaded seat 213 can be pulled to change its fixed position on the X-axis. Finally, rotate the nut 215, and under the meshing action of the screw 214, gradually move it towards the open sleeve 210 until the threaded seat 213 is fixed in the open sleeve 210. Finally, fix the radiator directly to the top of the threaded seat 213.

[0032] Example 2:

[0033] Refer to the attached diagram in the instruction manual. Figure 4 The difference between Embodiment 2 and Embodiment 1 is that the positioning hole 211 is straight and elongated, and the height of the adjusting strip hole 212 is at least twice that of the screw 214, for the screw 214 to move up and down.

[0034] In use, this changes the fixed position of the open sleeve 210 and the threaded seat 213 on the Y-axis, and at the same time, it can pull the screw 214 up and down in the adjusting strip hole 212, thereby changing the fixed position of the threaded seat 213 on the Z-axis.

[0035] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

Claims

1. A computer motherboard adaptable to various processor heat dissipation hole positions, comprising a circuit board mechanism (1), said circuit board mechanism (1) comprising a board body (110) with computer components on its surface and mounting holes (111) formed on the outer side of the CPU board body (110), characterized in that: The mounting holes (111) are in groups of four, and there are three groups in total, which are respectively applicable to AM4 heat sinks, LGA115x heat sinks and LGA1700 heat sinks; The positioning mechanism (2) includes an open sleeve (210) and a positioning hole (211). The positioning hole (211) is provided on the plate (110), and the open sleeve (210) is fixed on the positioning hole (211) by screws and a base. A slidable threaded seat (213) is placed in the open sleeve (210) for fixing the screws of the heat sink. An adjustment strip hole (212) is provided on the side of the open sleeve (210) away from the CPU, and a screw (214) connected to the threaded seat (213) passes through the adjustment strip hole (212). A nut (215) is rotatably sleeved on the screw (214).

2. A computer motherboard adaptable to various processor heat dissipation hole positions according to claim 1, characterized in that: The positioning hole (211) is straight and elongated.

3. A computer motherboard adaptable to various processor heat dissipation hole positions according to claim 2, characterized in that: The height of the adjustment bar hole (212) is at least twice that of the screw (214), and is used for the screw (214) to move up and down.

4. A computer motherboard adaptable to various processor heat dissipation hole positions according to claim 1, characterized in that: The number of the threaded seats (213) is at least two.

5. A computer motherboard adaptable to various processor heat dissipation hole positions according to claim 4, characterized in that: The top of the threaded seat (213) is connected to a rubber sheet (216), and the thickness of the rubber sheet (216) is at least one millimeter.

6. A computer motherboard adaptable to various processor heat dissipation hole positions according to claim 5, characterized in that: The rubber sheet (216) has scale markings and numerical values ​​coated on the open sleeve (210) on the outside, and the rubber sheet (216) has a notch for indication facing the markings.

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