Computer chip water cooling device

Abstract

The utility model discloses a computer chip water cooling device, and relates to the technical field of computer heat dissipation. Comprising a mainboard, the top end of the mainboard is provided with a CPU, the outer side of the CPU is provided with a backboard, the top end of the backboard is provided with a buckle plate, the buckle plate is located on the outer side of an annular base, the inner side of the annular base is provided with a water cooling head, the water cooling head is connected with a cooling row through a water cooling pipe, the cooling row is provided with a fan, and the outer side of the cooling row is provided with a positioning mechanism and a pressing and plugging mechanism which are arranged on the inner side of the backboard. An installer pulls a handle to drive a pushing plate to move, the pushing plate drives a first fixing rod and a second fixing rod to move in the moving process, the first fixing rod drives a plugging block and a telescopic rod to move in the translation process, and then the fixing block is pushed to move from the transverse position of an inverted-L-shaped groove to the vertical position. And after the vertical plate descends, the handle is loosened, so that the vertical plate is clamped, the buckle plate is convenient to disassemble, and the water cooling head is mounted.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation technology, specifically a water-cooling device for computer chips. Background Technology

[0002] A computer consists of two parts: a hardware system and a software system. The hardware units of a traditional computer system can generally be divided into input units, output units, arithmetic logic units, control units, and memory units. Among them, the arithmetic logic unit and the control unit are collectively called the central processing unit, or simply the CPU. As the core of the computer system for operation and control, the central processing unit is the final execution unit for information processing and program execution. Since its inception, the CPU has made great progress in logical structure, operating efficiency, and functional extension.

[0003] Computer chip heat dissipation mainly refers to CPU heat dissipation. Currently, traditional computer chips use air cooling, which is not very effective, especially in high-temperature environments, and is also difficult to install and disassemble. Therefore, a new type of computer chip water cooling device is proposed. Utility Model Content

[0004] The purpose of this invention is to provide a water-cooling device for computer chips to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a computer chip water-cooling device, comprising:

[0006] The motherboard has a CPU at its top, a backplate on the outside of the CPU, a clip plate at the top of the backplate, the clip plate being located outside the annular seat, a water cooling head on the inside of the annular seat, a radiator connected to the water cooling head via water cooling pipes, a fan on the radiator, and a positioning mechanism on the outside of the radiator for positioning and installing the radiator on the chassis.

[0007] The push-to-pull mechanism is located on the inside of the back panel and is used to connect the buckle plate to the back panel.

[0008] As a specific solution in this application, the positioning mechanism includes:

[0009] An oblong groove is set on the inner side of the radiator. A sliding groove is set on the oblong groove. A square plate is set in the sliding groove. A rotating shaft is set on one side of the square plate. The rotating shaft passes through to the outer side of the radiator. An oblong plate is set on the outer wall of one end of the rotating shaft. A connecting plate is connected to one end of the oblong plate through a fixed shaft. A positioning plate is set on the top of the connecting plate.

[0010] As a specific solution in this application, the outer wall of the annular seat is provided with multiple arc-shaped grooves, and the inner wall of the buckle is provided with multiple limiting blocks. The limiting blocks correspond to the arc-shaped grooves, and the buckle is connected to the annular seat by rotating on the arc-shaped grooves through the limiting blocks.

[0011] As a specific solution in this application, the pressing and inserting mechanism includes:

[0012] The top two sides of the buckle plate have through grooves that extend to the bottom of the buckle plate. A vertical plate is installed in the through groove, and a fixing block is installed on one side of the vertical plate. Inverted L-shaped grooves are installed on both sides of the buckle plate, extending to the through groove. The fixing block is located in the inverted L-shaped groove.

[0013] As a specific solution in this application, the back plate is provided with square grooves on both sides, the square grooves are located below the inverted L-shaped grooves, the interior of the square grooves is divided into upper and lower parts by a partition plate, the partition plate is provided with movable slots, the movable slots are used for the vertical plate to be raised and lowered, and the first fixed groove and the second fixed groove on the vertical plate are separated by the partition plate.

[0014] As a specific solution in this application, a telescopic rod is provided at one end of the inner wall of the square groove, a second spring is provided on the outer wall of the telescopic rod, the telescopic rod is located below the isolation plate, a fixed seat is connected to the piston end of the telescopic rod, a locking plate is provided at the top of the fixed seat, the locking plate is located in the second fixed groove, and a second fixed rod is provided on one side of the fixed seat.

[0015] As a specific solution in this application, a push plate is provided on the outer wall of one end of the second fixing rod. The push plate is located on the inner wall of one end of the square groove. A fixing plate is provided on one side of the push plate and a handle is provided on the other side. A first fixing rod is provided on the inner side of the upper end of the push plate. The first fixing rod passes through the push plate and the fixing plate in sequence and extends to the inner side of the square groove.

[0016] As a specific solution in this application, a pull plate is provided at one end of the first fixed rod, a first spring is provided on the outer wall of the first fixed rod, sliders are provided at both ends of the pull plate, the sliders are located in the sliding grooves on both sides of the inner wall of the square groove, a sealing block is provided on one side of the pull plate, the sealing block is located in the first fixed groove, and the pull plate is located above the isolation plate.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] In this computer chip water-cooling device, the installer moves a push plate by pulling a handle. During this movement, the push plate moves the first and second fixed rods. The first fixed rod, during its translation, moves the sealing block on one side of the pull-out plate, compressing the first spring. The second fixed rod, through its fixed base, extends the telescopic rod, simultaneously extending the second spring. The fixed block is then pushed from the horizontal position of the inverted L-shaped groove to the vertical position, causing the vertical plate to descend along the moving strip hole. After descent, the handle is released, locking the latch plate in the second fixed groove and the sealing block in the first fixed groove, facilitating the removal of the latch plate and thus the installation of the water-cooling head. Attached Figure Description

[0019] Figure 1 This is an isometric view of the present invention;

[0020] Figure 2 This is a schematic diagram of the positioning mechanism of this utility model;

[0021] Figure 3 This is a cross-sectional schematic diagram of the positioning mechanism of this utility model;

[0022] Figure 4 This is a partial equiaxed side view of the present invention;

[0023] Figure 5 This is a partial cross-sectional view of the equiaxed side of the present invention;

[0024] Figure 6 This is a partial schematic diagram of the water cooling head of this utility model;

[0025] Figure 7 This is a partial cross-sectional view of the buckle plate of this utility model;

[0026] Figure 8 This is a schematic diagram of the pressing and inserting mechanism of this utility model;

[0027] Figure 9 This is a schematic diagram showing the distribution of the pressing and inserting mechanism of this utility model;

[0028] Figure 10 This is a schematic diagram of the water cooling head installation of this utility model.

[0029] In the diagram: 1. Motherboard; 101. Water block; 102. Water cooling tube; 103. Radiator; 104. Fan; 105. Ring mount; 106. Mounting plate; 107. Backplate; 108. CPU; 109. Arc-shaped groove; 110. Limiting block; 2. Positioning mechanism; 201. Waist-shaped groove; 202. Positioning plate; 203. Rotating shaft; 204. Fixed shaft; 205. Waist-shaped plate; 206. Square plate; 207. Connecting plate; 3. Press-to-plug mechanism; 301. Through groove; 302. Inverted L-shaped... 303. Groove; 304. Square groove; 305. Push plate; 306. Fixing block; 307. Fixing seat; 308. Handle; 309. First fixing rod; 310. Second fixing rod; 311. Vertical plate; 312. Pull-out plate; 313. Isolation plate; 314. Slider; 315. First fixing groove; 316. Telescopic rod; 317. Second spring; 318. Moving strip hole; 319. Locking plate; 320. Sealing block; 321. First spring; 322. Fixing plate. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] like Figures 1-10 As shown, this utility model provides a technical solution: a computer chip water cooling device, including a motherboard 1, a water block 101, water cooling pipes 102, a radiator 103, a fan 104, a positioning mechanism 2, and a pressing and plugging mechanism 3, etc., which can adapt to different sizes of computer cases. Existing heat sinks are installed by snapping on both sides of the mounting base 306 to install the heat sink on the CPU 108. However, snap-on heat sinks require one side of the snap to be snapped on the mounting base 306 first, and then the other side of the snap is pressed down with great force, which makes the installation of the heat sink very inconvenient. When the heat sink needs to be removed for cleaning dust after long-term use, the snap connection point must be pressed down with force before the snap can be pried open. Slight carelessness may cause fingers to be cut and cause unnecessary damage. By designing the pressing and plugging mechanism 3, the heat sink (i.e., the water block 101) can be installed quickly and disassembled easily.

[0032] In this embodiment, when installing the water cooling device, the fan 104 first needs to be installed on the radiator 103. Before installing the fan 104, the installation position of the radiator 103 needs to be determined, thereby determining the orientation of the fan 104. The fan blades of the computer fan 104 are the air intake surface, and the side with the motor model and parameters is the exhaust surface. When constructing the airflow of the chassis, it should follow the principle of front-to-back exhaust, bottom-to-top exhaust. Therefore, the radiator 103 is usually installed on the top or front of the chassis. (Refer to the attached diagram.) Figure 10 This time, the radiator 103 is installed on the top of the case. At this time, the fan blades of the fan 104 need to face the inside of the case and the motor needs to face the radiator 103 to dissipate the heat inside the case. Place the fan 104 on the radiator 103. After placing the fan 104, fix it on the radiator 103 with the fixing screws. The fixing screws do not need to be tightened too much. Most fans 104 have rubber pads at the four corners to reduce the vibration of the fan 104.

[0033] In this embodiment, after the fan 104 is installed, the top cover of the chassis is removed, and the radiator 103 along with the fan 104 is fixed to the top of the chassis. The square plate 206 slides in the waist-shaped groove 201, which can drive the waist-shaped plate 205 to slide along the radiator 103. During the sliding process of the waist-shaped plate 205, the positioning plate 202 is moved through the connecting plate 207, thereby adjusting the distance between the positioning plates 202. When the waist-shaped plate 205 moves to one end of the waist-shaped groove 201, it still cannot reach the position of the mounting hole. The distance between the positioning plates 202 can be slightly increased by rotating the waist-shaped plate 205, so that it reaches the position of the mounting hole, so as to adapt to different sizes of chassis. After the positioning plate 202 is aligned with the mounting hole, the inlet and outlet of the radiator 103 is placed in front of the chassis. The left hand holds the radiator 103, and the right hand tightens the fixing screws from the top outside the chassis.

[0034] In this embodiment, after the radiator 103 is installed, the water cooling head 101 will be installed. The water cooling head 101 is used to fix the CPU 108 and absorb the heat generated by the CPU 108. This heat will be carried to the radiator 103 by the water flow of the water pump and finally exhausted outside the chassis by the fan 104. Before fixing the water cooling head 101, the chassis must be laid flat. The bottom outer wall of the water cooling head 101 is provided with an annular seat 105. The limiting block 110 on the inner wall of the mounting plate 106 is aligned with the arc groove 109 on the annular seat 105 and rotated so that the limiting block 110 is locked in the arc groove 109, so that the mounting plate 106... Fixed to the ring seat 105, the vertical plate 310 is completely located in the through groove 301, and the fixing block 305 is located horizontally in the inverted L-shaped groove 302. Align one end of the through groove 301 with one end of the movable strip hole 318 on the back plate 107 and place it on the back plate 107. Before placing it, thermal grease needs to be applied to the surface of the CPU 108 at the top of the motherboard 1. The surface of the CPU 108 and the surface of the water cooling head 101 are rough. The contact of the two rough surfaces will cause heat transfer to be blocked. The function of the thermal grease is to fill the gap between the CPU 108 and the base of the water cooling head 101 and drain the gap for better heat dissipation.

[0035] In this embodiment, when the buckle plate 106 is placed on the back plate 107, the handle 307 on one side of the back plate 107 is pulled. The handle 307 drives the push plate 304 to move horizontally. The fixing plate 322 is fixed to the inner wall of the square groove 303, and the first fixing rod 308 and the second fixing rod 309 are slidably connected to the fixing plate 322 and fixedly connected to the push plate 304. When the push plate 304 moves, it drives the first fixing rod 308 and the second fixing rod 309 to move. During the movement of the first fixing rod 308, it drives the pull plate 311 to move horizontally. During the movement of the pull plate 311, it drives the sealing block 320 to move. The sealing block 320 is fixedly connected to the pull plate 311. During the movement of the pull plate 311, the first spring 321 is compressed. During the movement of the second fixing rod 309, it drives the fixing seat 306 to move horizontally. During the movement of the fixing seat 306, it drives the telescopic rod 316 to extend. During the extension of the telescopic rod 316, it drives the second spring 317 to extend. 7. One end is fixed to the inner wall of the square groove 303, and the other end is fixed to the piston of the telescopic rod 316. Then, push the fixing block 305 on the vertical plate 310 in the through groove 301 on one side of the buckle plate 106, so that the fixing block 305 turns from the horizontal position of the inverted L-shaped groove 302 to the vertical position. As a result, the vertical plate 310 will descend along the through groove 301, and the bottom end of the vertical plate 310 will pass through the moving strip hole 318 and fall on the top of the fixing seat 306. After the vertical plate 310 has fallen, release the handle 307, and the first spring 32 1. When the second spring 317 rebounds simultaneously, it causes the locking plate 319 and the sealing block 320 at the top of the fixing seat 306 to move horizontally, so that the locking plate 319 enters the second fixing groove 315 of the vertical plate 310 and the sealing block 320 enters the first fixing groove 314 of the vertical plate 310. The same operation is performed on the vertical plate 310 on the other side of the back plate 107, thereby making the vertical plate 310 double-layered snap-fit, which can fix the buckle plate 106 to the back plate 107 and facilitate disassembly.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended embodiments and their equivalents.

Claims

1. A water-cooling device for a computer chip, characterized in that, include: A motherboard (1) is provided with a CPU (108) at the top of the motherboard (1). A backplate (107) is provided on the outside of the CPU (108). A buckle plate (106) is provided at the top of the backplate (107). The buckle plate (106) is located on the outside of the ring seat (105). A water cooling head (101) is provided on the inside of the ring seat (105). The water cooling head (101) is connected to a radiator (103) through a water cooling pipe (102). A fan (104) is provided on the radiator (103). A positioning mechanism (2) is provided on the outside of the radiator (103) for positioning and installing the radiator (103) on the chassis. The press-and-pull mechanism (3) is located inside the back plate (107) and is used for the connection between the buckle plate (106) and the back plate (107).

2. The computer chip water-cooling device according to claim 1, characterized in that: The positioning mechanism (2) includes: A waist-shaped groove (201) is provided on the inner side of the radiator (103). A sliding groove is provided on the waist-shaped groove (201). A square plate (206) is provided in the sliding groove. A rotating shaft (203) is provided on one side of the square plate (206). The rotating shaft (203) extends through to the outside of the radiator (103). A waist-shaped plate (205) is provided on the outer wall of one end of the rotating shaft (203). A connecting plate (207) is connected to one end of the waist-shaped plate (205) through a fixed shaft (204). A positioning plate (202) is provided at the top of the connecting plate (207).

3. The computer chip water-cooling device according to claim 1, characterized in that: The outer wall of the annular seat (105) is provided with a plurality of arc-shaped grooves (109), and the inner wall of the buckle plate (106) is provided with a plurality of limiting blocks (110). The limiting blocks (110) correspond to the arc-shaped grooves (109), and the buckle plate (106) rotates on the arc-shaped grooves (109) through the limiting blocks (110) to connect with the annular seat (105).

4. A computer chip water-cooling device according to claim 3, characterized in that: The pressing and inserting mechanism (3) includes: A through groove (301) is provided on both sides of the top of the buckle plate (106). The through groove (301) extends to the bottom of the buckle plate (106). A vertical plate (310) is provided in the through groove (301). A fixing block (305) is provided on one side of the vertical plate (310). An inverted L-shaped groove (302) is provided on both sides of the buckle plate (106). The inverted L-shaped groove (302) extends to the through groove (301). The fixing block (305) is located in the inverted L-shaped groove (302).

5. A computer chip water-cooling device according to claim 1, characterized in that: The back plate (107) has square grooves (303) on both sides. The square grooves (303) are located below the inverted L-shaped grooves (302). The interior of the square grooves (303) is divided into upper and lower parts by the partition plate (312). The partition plate (312) is provided with movable slots (318). The movable slots (318) are used for the vertical plate (310) to be raised and lowered, and the first fixed slot (314) and the second fixed slot (315) on the vertical plate (310) are separated by the partition plate (312).

6. A computer chip water-cooling device according to claim 5, characterized in that: A telescopic rod (316) is provided at one end of the inner wall of the square groove (303), and a second spring (317) is provided on the outer wall of the telescopic rod (316). The telescopic rod (316) is located below the isolation plate (312). A fixed seat (306) is connected to the piston end of the telescopic rod (316). A locking plate (319) is provided at the top of the fixed seat (306). The locking plate (319) is located in the second fixed groove (315). A second fixed rod (309) is provided on one side of the fixed seat (306).

7. A computer chip water-cooling device according to claim 6, characterized in that: A push plate (304) is provided on the outer wall of one end of the second fixing rod (309). The push plate (304) is located on the inner wall of one end of the square groove (303). A fixing plate (322) is provided on one side of the push plate (304), and a handle (307) is provided on the other side. A first fixing rod (308) is provided on the inner side of the upper end of the push plate (304). The first fixing rod (308) passes through the push plate (304) and the fixing plate (322) in sequence and extends to the inner side of the square groove (303).

8. A computer chip water-cooling device according to claim 7, characterized in that: A pull plate (311) is provided at one end of the first fixed rod (308), a first spring (321) is provided on the outer wall of the first fixed rod (308), and sliders (313) are provided at both ends of the pull plate (311). The sliders (313) are located in the sliding grooves on both sides of the inner wall of the square groove (303). A sealing block (320) is provided on one side of the pull plate (311). The sealing block (320) is located in the first fixed groove (314), and the pull plate (311) is located above the isolation plate (312).

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