Liquid cooling heat dissipation module and electronic device with liquid cooling heat dissipation module

Abstract

A liquid cooling heat dissipation module is used for solving the problem that the thickness of a whole electronic device is increased due to an existing cooling circulation module. Comprising a heat absorption piece which is provided with a flow channel, and the flow channel is provided with a liquid inlet hole and a liquid outlet hole; the heat absorption piece is provided with a first liquid flow channel, the heat dissipation piece is provided with a flow channel, the flow channel of the heat dissipation piece is provided with a liquid inlet hole and a liquid outlet hole, a relative height difference exists between the heat absorption piece and the heat dissipation piece, and the liquid inlet hole of the heat dissipation piece is communicated with the liquid outlet hole of the heat absorption piece through a first liquid flow channel. The liquid outlet hole of the heat dissipation piece is communicated with the liquid inlet hole of the heat absorption piece through a second liquid flow channel. The utility model further relates to an electronic device with the liquid cooling heat dissipation module. Therefore, the increase of the overall thickness of the electronic device can be avoided.

Description

Technical Field

[0001] This utility model relates to a liquid cooling heat dissipation module, and more particularly to a liquid cooling heat dissipation module that can help electronic devices maintain an appropriate operating temperature, and an electronic device having the liquid cooling heat dissipation module. Background Technology

[0002] Modern electronic devices, such as laptops, boast high performance and are increasingly trending towards thinner and lighter designs. However, these devices generate significant amounts of waste heat during operation, leading to elevated temperatures and increased thermal failure and wear rates. Therefore, heat generated by heat sources within the device, such as chips, is typically channeled into a cooling circulation module with superior heat dissipation efficiency. However, the various components within an electronic device create varying elevations, and existing cooling circulation modules, typically a plate with meandering flow channels, struggle to accommodate these elevation differences within the device's interior. This results in gaps between the module and adjacent components, creating unusable space and increasing the overall thickness of the electronic device.

[0003] In view of this, there is indeed a need to improve the existing cooling circulation module. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this utility model is to provide a liquid cooling heat dissipation module and an electronic device having the liquid cooling heat dissipation module, which has a flow channel with a height difference.

[0005] The directional terms or similar terms used throughout this utility model, such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc., are mainly for reference to the directions in the accompanying drawings. Each directional term or similar term is only used to assist in explaining and understanding the various embodiments of this utility model and is not intended to limit this utility model.

[0006] The use of the quantifiers “a” or “an” for the elements and components described throughout this utility model is merely for convenience and to provide the general meaning of the scope of this utility model; in this utility model, it should be interpreted as including one or at least one, and a single concept also includes multiple cases, unless it clearly means otherwise.

[0007] The liquid cooling heat dissipation module of this utility model includes: a heat absorption element having a flow channel having a liquid inlet and a liquid outlet; and a heat dissipation element having a flow channel having a liquid inlet and a liquid outlet. The heat absorption element and the heat dissipation element have a relative height difference. The liquid inlet of the heat dissipation element is connected to the liquid outlet of the heat absorption element by a first liquid flow channel, and the liquid outlet of the heat dissipation element is connected to the liquid inlet of the heat absorption element by a second liquid flow channel.

[0008] Therefore, in this liquid cooling heat dissipation module, the heat absorber and the heat dissipation component partially overlap in the vertical direction, and the flow channels of the heat absorber and the heat dissipation component are connected in the vertical direction through the first liquid flow channel and the second liquid flow channel, thereby causing the heat absorber and the heat dissipation component to be misaligned and have a step difference in the vertical direction. Therefore, by installing this liquid cooling heat dissipation module in conjunction with the step differences formed by various components within the electronic device, the internal space of the electronic device can be effectively utilized, thereby avoiding an increase in the overall thickness of the electronic device.

[0009] The heat sink is partially integrated with the heat absorber, such that the liquid inlet of the heat sink is adjacent to the liquid outlet of the heat absorber in a vertical direction to form the first liquid flow channel, and the liquid outlet of the heat sink is adjacent to the liquid inlet of the heat absorber in the same vertical direction to form the second liquid flow channel. This allows the heat absorber and heat sink to be misaligned, creating a step difference, and the heat absorber and heat sink have a relative height difference in the vertical direction, which can be used to accommodate the step differences formed by various components within the electronic device.

[0010] The heat sink is hot-pressed to the heat absorber. This allows the heat sink and the heat absorber to achieve a better liquid-tight bond.

[0011] The heat-absorbing component includes a pump that drives a working fluid to circulate between the heat-absorbing component and the heat-dissipating component through the first and second fluid flow channels. Thus, heat dissipation is achieved through the circulation of the working fluid.

[0012] The heat sink has direct or indirect thermal contact with a fin assembly. This improves the heat dissipation efficiency of the heat sink.

[0013] The fin assembly is located at the airflow inlet of a fan. This allows the heat generated by the fin assembly to be carried away by the fan airflow.

[0014] The liquid cooling heat dissipation module of this utility model may further include a connector, through which the heat-absorbing component and the heat-dissipating component are combined. The connector has two through holes, which respectively form the first liquid flow channel and the second liquid flow channel. In this way, the working fluid can flow between the heat-absorbing component and the heat-dissipating component through the connector.

[0015] The liquid cooling heat dissipation module of this utility model further includes two connecting members. The heat-absorbing component and the heat-dissipating component are connected by the two connecting members. Each of the two connecting members has a through hole, and each connecting member forms a first liquid flow channel and a second liquid flow channel through the through hole. In this way, the working fluid can flow between the heat-absorbing component and the heat-dissipating component through the connecting members.

[0016] The connector has a first mating surface and a second mating surface that are opposite each other. Two through holes pass through the first mating surface and the second mating surface, respectively, and the first mating surface and the second mating surface connect the heat-absorbing component and the heat-dissipating component. In this way, the heat-absorbing component and the heat-dissipating component can form a relatively large step difference through the connector, thereby making it easier for the liquid cooling module to be installed to accommodate the step differences formed by various components in the electronic device.

[0017] Each through-hole forms a first liquid flow channel and a second liquid flow channel in a vertical direction. This allows the working fluid to flow between the heat-absorbing element and the heat-dissipating element through the connector.

[0018] The vertical distance between the first mating surface and the second mating surface is less than or equal to 5 mm. This allows the heat-absorbing component and the heat-dissipating component to form a relatively large step difference through the connector, thereby making it easier for the liquid cooling module to be installed to accommodate the step differences formed by various components within the electronic device.

[0019] The electronic device of this invention includes: a main body with a heat source inside; and a liquid cooling heat dissipation module as described above, wherein the heat-absorbing component is in thermal contact with the heat source. This effectively utilizes the internal space of the electronic device, thereby avoiding an increase in the overall thickness of the device. Attached Figure Description

[0020] Figure 1 The first embodiment of this utility model is used in an electronic device diagram;

[0021] Figure 2 : An exploded perspective view of the first embodiment of this utility model;

[0022] Figure 3 : A combined diagram of the first embodiment of this utility model;

[0023] Figure 4 :along Figure 3 AA-line cross-section;

[0024] Figure 5 : An exploded perspective view of the second embodiment of this utility model;

[0025] Figure 6: Cross-sectional view of the second embodiment of this utility model.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1: Heat-absorbing components

[0028] 1a, 2a: First board

[0029] 1b, 2b: Second board

[0030] 11: Flow channel

[0031] 11a, 21a: Liquid inlet holes

[0032] 11b, 21b: Liquid outlet holes

[0033] 12: Pump

[0034] 12a: Liquid inlet

[0035] 12b: Liquid outlet

[0036] 13: Opening

[0037] 2: Heat sink

[0038] 21: Flow channel

[0039] 3: Connectors

[0040] 3a: First mating surface

[0041] 3b: Second mating surface

[0042] 31: Through-hole

[0043] L: Working fluid

[0044] M: Liquid cooling heat dissipation module

[0045] H: Heat source

[0046] T: Fin assembly

[0047] F: Fan

[0048] F1: Airflow Inlet

[0049] S1: First fluid flow channel

[0050] S2: Second fluid flow channel

[0051] Y: Vertical direction

[0052] G1: First reference plane

[0053] G2: Second reference plane

[0054] D: Vertical distance

[0055] E: Electronic devices

[0056] E1: Main unit. Detailed Implementation

[0057] To make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments of this utility model are described below in detail with reference to the accompanying drawings; in addition, those symbols that are marked with the same symbols in different drawings are considered to be the same and their descriptions will be omitted.

[0058] Please refer to Figure 1 , Figure 2 As shown, it is the first embodiment of the liquid cooling heat dissipation module M of this utility model, which includes a heat absorption component 1 and a heat dissipation component 2, wherein the heat absorption component 1 and the heat dissipation component 2 are partially aligned in a vertical direction Y.

[0059] Please refer to Figure 2 , Figure 3 As shown, the heat-absorbing element 1 can be used to contact a heat source H to absorb the heat generated by the heat source H. The heat-absorbing element 1 can be made of, for example, copper, aluminum, titanium, stainless steel or other thermally conductive materials. The shape of the heat-absorbing element 1 can generally be a thin plate. For example, the heat-absorbing element 1 can have a first plate 1a and a second plate 1b. The first plate 1a and the second plate 1b can be joined together by hot pressing or welding. The heat-absorbing element 1 can directly or indirectly contact the heat source H through the first plate 1a, or the heat-absorbing element 1 can directly or indirectly contact the heat source H through the second plate 1b. This utility model does not limit this.

[0060] Please refer to Figure 2 , Figure 4As shown, the heat absorber 1 has a flow channel 11 for circulating a working liquid L. The first plate 1a and the second plate 1b together form the flow channel 11. For example, the flow channel 11 may be recessed into the first plate 1a and / or the second plate 1b. The heat absorber 1 has a pump 12 through which the flow channel 11 can pass. For example, the pump 12 may connect to the flow channel 11 through an opening 13 connected to the second plate 1b. Furthermore, the pump 12 may have an inlet 12a and an outlet 12b, and the flow channel 11 may connect the inlet 12a and the outlet 12b so that the working liquid L can flow through the pump 12 and be propelled by the pump 12. Thus, the pump 12 can be used to drive the flow of the working liquid L in the flow channel 11. In this embodiment, the flow channel 11 may have an inlet hole 11a and an outlet hole 11b, which may extend through the first plate 1a or the second plate 1b. Preferably, the inlet hole 11a and the outlet hole 11b are adjacent to the side edge of the heat absorber 1, so that the working fluid L of the flow channel 11 can enter the heat dissipation component 2 (described in detail later) through the inlet hole 11a and the outlet hole 11b.

[0061] The heat sink 2 can be made of, for example, copper, aluminum, titanium, stainless steel, or other thermally conductive materials. The heat sink 2 is generally plate-shaped and allows the working fluid L of the heat absorber 1 to flow into it, thereby dissipating the heat of the working fluid L. Specifically, the heat sink 2 has a flow channel 21. The length of the flow channel 21 can be extended by forming several straight channels and several curved channels within the heat sink 2, making the flow channel 21 almost completely fill the heat sink 2, so that the working fluid L can dissipate heat as it flows through the flow channel 21. The flow channel 21 of the heat sink 2 connects to the flow channel 11 of the heat absorber 1, allowing the working fluid L to circulate within the flow channel 11 of the heat absorber 1 and the flow channel 21 of the heat sink 2, driven by the pump 12. That is, the working fluid L enters the heat sink 2 from the heat absorber 1 and then flows back to the heat absorber 1. Preferably, the heat sink 2 can directly or indirectly contact a fin assembly T, and the heat from the heat sink 2 can be transferred to the fin assembly T. The fin assembly T can then be exposed to an airflow port F1 located on a fan F, so that the airflow from the fan F can carry away the heat energy from the fin assembly T. In this way, the working fluid L can absorb heat from the heat sink 1 and then dissipate heat from the heat sink 2.

[0062] Furthermore, the heat sink 2 may have a first plate 2a and a second plate 2b, which can be joined together by hot pressing or welding. The flow channel 21 may be recessed into the first plate 2a and / or the second plate 2b. It is worth noting that the flow channel 21 of the heat sink 2 and the flow channel 11 of the heat absorber 1 can be connected through a first liquid flow channel S1 and a second liquid flow channel S2.

[0063] Please continue reading. Figure 3 , Figure 4 As shown, specifically, the heat absorber 1 and the heat dissipation component 2 can have a relative height difference. For example, the relative positional relationship between the heat dissipation component 2 and the heat absorber 1 can be partially stacked so that the flow channel 21 and the flow channel 11 can be partially aligned. More specifically, the flow channel 11 of the heat absorber 1 can be distributed on a virtual first reference plane G1, and the flow channel 21 of the heat dissipation component 2 can be distributed on a virtual second reference plane G2. The first liquid flow channel S1 and the second liquid flow channel S2 can be located between the first reference plane G1 and the second reference plane G2 to connect the flow channel 21 of the heat dissipation component 2 and the flow channel 11 of the heat absorber 1. The flow channel 21 can have an inlet hole 21a and an outlet hole 21b. The inlet hole 21a and the outlet hole 21b are preferably located at both ends of the flow channel 21 so that the working liquid L can flow in from one end of the flow channel 21 and flow out from the other end. The inlet hole 21a can be connected to the outlet hole 11b of the flow channel 11 through the first liquid flow channel S1, and the outlet hole 21b can be connected to the inlet hole 11a of the flow channel 11 through the second liquid flow channel S2. In this way, the working fluid L can circulate between the heat absorber 1 and the heat dissipation member 2 through the first liquid flow channel S1 and the second liquid flow channel S2.

[0064] Furthermore, the liquid inlet hole 21a of the flow channel 21 and the liquid outlet hole 11b of the flow channel 11, or the liquid outlet hole 21b of the flow channel 21 and the liquid inlet hole 11a of the flow channel 11, can be partially aligned (for example, the above holes can be inclined channels to form incomplete alignment) or completely aligned to be directly connected, or indirectly connected (detailed later). This utility model does not limit this. In this embodiment, the heat sink 2 is partially combined with the heat absorber 1, so that the liquid inlet hole 21a is adjacent to the liquid outlet hole 11b, and the liquid outlet hole 21b is adjacent to the liquid inlet hole 11a. Preferably, the liquid inlet hole 21a can be adjacent to the liquid outlet hole 11b in a vertical direction Y to form the first liquid flow channel S1, and the liquid outlet hole 21b can be adjacent to the liquid inlet hole 11a in the vertical direction Y to form the second liquid flow channel S2. The heat sink 2 can be thermally bonded to the heat absorber 1. Alternatively, the heat sink 2 can be bonded to the second plate 1b of the heat absorber 1 via the first plate 2a, or vice versa. This invention does not limit the stacking order of the heat absorber 1 and the heat sink 2; that is, the heat absorber 1 can be located above or below the heat sink 2. Thus, the heat sink 2 and the heat absorber 1 can be misaligned to form a height difference. Specifically, the first reference plane G1 and the second reference plane G2 are not on the same horizontal plane. For example, the first reference plane G1 and the second reference plane G2 can be parallel to each other, causing the flow channel 21 of the heat sink 2 to be misaligned with the flow channel 11 of the heat absorber 1, resulting in the height difference. Therefore, when the liquid cooling module M of this invention is used in an electronic device E, the liquid cooling module M can be located in the electronic device E, which can be a laptop or a tablet computer. The electronic device E has a main body E1, which can be the main body of a laptop or tablet computer. The main body E1 has a heat source H, and the heat-absorbing component 1 of the liquid cooling module M can make thermal contact with the heat source H. The liquid cooling module M can form a relative height difference between the heat-absorbing component 1 and the heat-dissipating component 2, which can be installed to match the step differences formed by various components within the main body E1, thereby effectively utilizing the internal space of the electronic device E.

[0065] Please refer to Figure 5 , Figure 6As shown, this is the second embodiment of the liquid cooling heat dissipation module of this utility model. This embodiment is largely the same as the first embodiment described above. In this embodiment, at least one connector 3 is further included. The heat-absorbing component 1 and the heat-dissipating component 2 are connected by the at least one connector 3, so that the liquid inlet hole 21a of the flow channel 21 and the liquid outlet hole 11b of the flow channel 11, or the liquid outlet hole 21b of the flow channel 21 and the liquid inlet hole 11a of the flow channel 11 can be indirectly connected. Specifically, the at least one connector 3 may have a first mating surface 3a and a second mating surface 3b, the first mating surface 3a and the second mating surface 3b are opposite to each other, and the first mating surface 3a and the second mating surface 3b can respectively connect the heat-absorbing component 1 and the heat-dissipating component 2. Furthermore, the at least one connector 3 has two through holes 31, which penetrate the first mating surface 3a and the second mating surface 3b. One through hole can be connected to the liquid inlet 11a of the heat absorber 1 and the liquid outlet 21b of the heat dissipation component 2, respectively. The other through hole 31 can be connected to the liquid outlet 11b of the heat absorber 1 and the liquid inlet 21a of the heat dissipation component 2, respectively. Preferably, the two through holes 31 can be connected to the aforementioned holes in the vertical direction Y. In another embodiment, there can be two connectors 3, each of which can have one through hole 31 to connect to the flow channel 11 of the heat absorber 1 and the flow channel 21 of the heat dissipation component 2, respectively. Therefore, the two through holes 31 can form the first liquid flow channel S1 and the second liquid flow channel S2 in the vertical direction Y, respectively. Preferably, the vertical distance D between the first mating surface 3a and the second mating surface 3b can be less than or equal to 5 mm, allowing the heat-absorbing component 1 and the heat-dissipating component 2 to form a relatively large step difference through the at least one connector 3. This makes it easier for the liquid cooling module M to be installed to accommodate the step differences formed by various components within the electronic device E. Furthermore, the step difference formed by the connector 3 allows the pump 12, the fin assembly T, and the fan F to be located within the interval formed by the step difference. For example, the pump 12 can be located above the heat-absorbing component 1, while the fin assembly T and the fan F can be located below the heat dissipating component 2. This avoids the pump 12, the fin assembly T, and the fan F causing an increase in the thickness of the liquid cooling module M in the vertical direction Y.

[0066] In summary, the liquid cooling heat dissipation module of this utility model achieves partial overlap between the heat absorber and the heat dissipation component in the vertical direction. Furthermore, the flow channels of the heat absorber and the heat dissipation component are connected in the vertical direction via the first and second liquid flow channels, thereby causing the heat absorber and the heat dissipation component to be misaligned and have a step difference in the vertical direction. Therefore, by installing this liquid cooling heat dissipation module in conjunction with the step differences formed by various components within the electronic device, the internal space of the electronic device can be effectively utilized, thus avoiding an increase in the overall thickness of the electronic device.

[0067] Although the present invention has been disclosed using the above-described preferred embodiments, it is not intended to limit the present invention. Any modifications and alterations made by those skilled in the art to the above embodiments without departing from the spirit and scope of the present invention shall still fall within the technical scope protected by the present invention. Therefore, the protection scope of the present invention shall include all modifications within the meaning and equivalent scope of the appended claims. Furthermore, when the above-described embodiments can be combined, the present invention includes any combination of embodiments.

Claims

1. A liquid-cooled heat dissipation module, characterized in that, include: A heat absorber having a flow channel having a liquid inlet and a liquid outlet; and A heat sink has a flow channel with an inlet and an outlet. A heat absorber and the heat sink have a relative height difference. The inlet of the heat sink is connected to the outlet of the heat absorber by a first liquid flow channel, and the outlet of the heat sink is connected to the inlet of the heat absorber by a second liquid flow channel.

2. The liquid-cooled heat dissipation module as described in claim 1, characterized in that, The heat sink is partially integrated with the heat absorber, such that the liquid inlet of the heat sink is adjacent to the liquid outlet of the heat absorber in a vertical direction to form the first liquid flow channel, and the liquid outlet of the heat sink is adjacent to the liquid inlet of the heat absorber in the vertical direction to form the second liquid flow channel.

3. The liquid-cooled heat dissipation module as described in claim 1, characterized in that, The heat sink is hot-pressed together with the heat absorber.

4. The liquid cooling heat dissipation module as described in claim 1, characterized in that, The heat absorber has a pump that drives a working fluid to circulate between the heat absorber and the heat dissipator through the first fluid flow channel and the second fluid flow channel.

5. The liquid-cooled heat dissipation module as described in claim 1, characterized in that, The heat sink is in direct or indirect thermal contact with a fin assembly.

6. The liquid-cooled heat dissipation module as described in claim 5, characterized in that, The fin assembly is located at the airflow inlet of a fan.

7. The liquid-cooled heat dissipation module as described in claim 6, characterized in that, The heat absorber has a pump that drives a working fluid to circulate between the heat absorber and the heat dissipator through the first fluid flow channel and the second fluid flow channel.

8. The liquid-cooled heat dissipation module as described in claim 1, characterized in that, It also includes a connector, through which the heat-absorbing component and the heat-dissipating component are joined. The connector has two through holes, which respectively form the first liquid flow channel and the second liquid flow channel.

9. The liquid-cooled heat dissipation module as described in claim 1, characterized in that, It also includes two connectors, through which the heat-absorbing component and the heat-dissipating component are combined. Each of the two connectors has a through hole, and each connector forms the first liquid flow channel and the second liquid flow channel through the through hole.

10. The liquid cooling heat dissipation module as described in claim 8 or 9, characterized in that, The connector has a first mating surface and a second mating surface that are opposite to each other. The two through holes pass through the first mating surface and the second mating surface respectively. The first mating surface and the second mating surface are respectively connected to the heat-absorbing component and the heat-dissipating component.

11. The liquid-cooled heat dissipation module as described in claim 10, characterized in that, Each through hole forms the first liquid flow channel and the second liquid flow channel in a vertical direction.

12. The liquid-cooled heat dissipation module as described in claim 10, characterized in that, The connector has a first mating surface and a second mating surface that are opposite each other, and the vertical distance between the first mating surface and the second mating surface is less than or equal to 5 mm.

13. An electronic device, characterized in that, include: A host computer body, wherein the host computer body has a heat source inside; and A liquid-cooled heat dissipation module as described in any one of claims 1 to 12, wherein the heat-absorbing element is in thermal contact with the heat source.

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