All-in-one computer

Abstract

The utility model relates to the technical field of heat dissipation of all-in-one machines, in particular to an all-in-one computer. Comprising an all-in-one machine body, a heat dissipation component and a fan assembly, and a heating source is arranged in the all-in-one machine body; the heat dissipation component comprises a first heat dissipation piece and a second heat dissipation piece, the first heat dissipation piece comprises a first heat conduction piece and a first cooling fin, the first cooling fin is located on one side of the heating source, one end of the first heat conduction piece is connected to the heating source, and the other end of the first heat conduction piece is connected to the first cooling fin; the second heat dissipation piece comprises a second heat conduction piece and a second cooling fin, the second cooling fin is located on the other side of the heating source, one end of the second heat conduction piece is connected to the heating source, and the other end of the second heat conduction piece is connected to the second cooling fin; the fan assembly acts on the first cooling fin and the second cooling fin so as to discharge heat out of the all-in-one machine body. According to the all-in-one computer, the heat dissipation efficiency of the all-in-one computer is effectively improved by optimizing the heat dissipation component.

Description

TECHNICAL FIELD

[0001] The utility model relates to all -in -one heat dissipation technical field, especially a computer all -in -one. BACKGROUND

[0002] With the rapid development of computer technology, computer all -in -one gradually becomes the mainstream office equipment by virtue of its integration, thin and light advantage.

[0003] In prior art, computer all -in -one usually adopts single -channel heat dissipation framework: the surface of heat source (such as CPU, GPU etc.) is directly pasted with heat dissipation fin, and heat is conducted to heat dissipation fin by single heat conduction path, and then forced convection heat dissipation is carried out by rear fan.

[0004] The above linear stacked layout has defects: its heat conduction path is single, and total thermal resistance is concentrated in the contact interface of heat conduction element and heat dissipation fin, and when heat load exceeds threshold value, heat saturation phenomenon is prone to occur, leading to poor heat dissipation effect. INVENTION CONTENTS

[0005] The technical problem to be solved by the embodiment of the utility model lies in providing a computer all -in -one to solve the problem of low internal heat dissipation efficiency of all -in -one in prior art.

[0006] The computer all -in -one provided by the embodiment of the utility model comprises:

[0007] All -in -one body, which has heat source inside;

[0008] Heat dissipation component, which comprises first heat dissipation part and second heat dissipation part, the first heat dissipation part comprises first heat conduction part and first heat dissipation fin, the first heat dissipation fin is located on one side of the heat source, one end of the first heat conduction part is connected to the heat source, and the other end is connected to the first heat dissipation fin, the second heat dissipation part comprises second heat conduction part and second heat dissipation fin, the second heat dissipation fin is located on the other side of the heat source, one end of the second heat conduction part is connected to the heat source, and the other end is connected to the second heat dissipation fin;

[0009] Fan assembly, which comprises first fan and second fan, the first fan acts on the first heat dissipation fin to discharge the heat of the first heat dissipation fin to the outside of the all -in -one body, and the second fan acts on the second heat dissipation fin to discharge the heat of the second heat dissipation fin to the outside of the all -in -one body.

[0010] In an embodiment, the heat dissipation component further comprises main heat dissipation substrate, the main heat dissipation substrate is covered at the heat source, and one end of the first heat conduction part and one end of the second heat conduction part are arranged on the side of the main heat dissipation substrate away from the heat source.

[0011] In an embodiment, the first heat-conducting member is provided with a plurality of first heat-conducting members, and the other ends of the plurality of first heat-conducting members are arranged at the first heat-dissipating fins; and / or the second heat-conducting member is provided with a plurality of second heat-conducting members, and the other ends of the plurality of second heat-conducting members are arranged at the second heat-dissipating fins.

[0012] In an embodiment, the first heat-conducting member comprises a first connecting section, a first intermediate section and a second connecting section, the first connecting section is connected to the main heat-dissipating substrate, one end of the first intermediate section is connected to the first connecting section by bending, the other end of the first intermediate section extends away from the main heat-dissipating substrate and is connected to the second connecting section by bending, and the second connecting section is connected to the first heat-dissipating fins.

[0013] In an embodiment, the first heat-dissipating fins comprise a plurality of first heat-dissipating fins and two first heat-conducting substrates, the plurality of first heat-dissipating fins are arranged between the two first heat-conducting substrates, and the plurality of first heat-dissipating fins are arranged at intervals; and / or the second heat-dissipating fins comprise a plurality of second heat-dissipating fins and two second heat-conducting substrates, the plurality of second heat-dissipating fins are arranged between the two second heat-conducting substrates, and the plurality of second heat-dissipating fins are arranged at intervals.

[0014] In an embodiment, the heat source is a CPU module arranged on a mainboard, the mainboard is located between the first heat-dissipating fins and the second heat-dissipating fins, and the main heat-dissipating substrate covers the CPU module.

[0015] In an embodiment, the heat-dissipating member further comprises an elastic connecting assembly, the elastic connecting assembly comprises a connecting rod and an elastic member, the connecting rod is arranged through the main heat-dissipating substrate and connected to the mainboard in the thickness direction of the main heat-dissipating substrate, the elastic member is arranged on the side of the main heat-dissipating substrate away from the mainboard, the elastic member is sleeved on the connecting rod and connected to the main heat-dissipating substrate, and the connecting rod is movably arranged on the main heat-dissipating substrate, so that when the connecting rod is locked to the mainboard, the main heat-dissipating substrate can move relative to the connecting rod, the elastic member is compressed to store energy, and the main heat-dissipating substrate is elastically pressed to the CPU module.

[0016] In an embodiment, the main heat-dissipating substrate is provided with a first through hole;

[0017] The connecting rod comprises a head end and a body end, the head end is arranged on the side of the main heat-dissipating substrate away from the mainboard, the body end is connected to the head end and arranged through the first through hole, the elastic member is sleeved on the body end, and the elastic member is clamped between the head end and the main heat-dissipating substrate; and the body end is further provided with a clamping groove.

[0018] The elastic connecting assembly further comprises a check ring, the check ring is clamped at the clamping groove, and the check ring is located on one side of the main heat dissipation substrate facing the main plate to limit the installation of the connecting rod on the main heat dissipation substrate.

[0019] In an embodiment, the main plate is provided with a second through hole, and the main plate further comprises a surface wall adjacent to the second through hole; the body end comprises a sliding shaft and a stud, the stud is arranged on one side of the sliding shaft away from the head end, the sliding shaft is arranged through the first through hole and abuts against the surface wall, and the stud is arranged through the second through hole and is threadedly connected to the all-in-one machine body.

[0020] In an embodiment, the heat dissipation member further comprises a pressing piece, the pressing piece is connected to the main heat dissipation substrate, and the pressing piece is arranged in a staggered manner with the CPU module, so that when the main heat dissipation substrate covers the CPU module, the pressing piece can abut against the main plate.

[0021] Compared with the prior art, the computer all-in-one machine provided in the embodiment of the present application has the beneficial effects that the computer all-in-one machine optimizes the heat dissipation member, and effectively improves the heat dissipation efficiency of the computer all-in-one machine.

[0022] Specifically, part of the heat generated by the heat source can be transmitted to the first heat dissipation fin through the first heat conduction member, and is discharged by the first fan, and another part of the heat is transmitted to the second heat dissipation fin through the second heat conduction member, and is discharged by the second fan. The present application adopts a double-path heat dissipation mode, splits the heat of the heat source into two parallel paths, reduces the total thermal resistance, and significantly improves the heat conduction efficiency compared with the single-channel design. Each heat dissipation channel only bears half of the heat load of the heat source, avoids the occurrence of heat saturation phenomenon of a single path, prevents heat accumulation in the all-in-one machine, and effectively improves the heat dissipation efficiency. In addition, the cooperative configuration of the double fans not only optimizes the heat dissipation path but also strengthens the air flow in the all-in-one machine body, improves the air exchange rate between the all-in-one machine body and the outside, and improves the heat dissipation speed. BRIEF DESCRIPTION OF DRAWINGS

[0023] The specific implementation of the present application will be further described in detail below with reference to the accompanying drawings and embodiments. In the drawings:

[0024] Figure 1 is a schematic view of the internal structure of the computer all-in-one machine provided in the embodiment of the present application;

[0025] Figure 2 is an assembly schematic view of the heat dissipation member, the main plate and the fan assembly provided in the embodiment of the present application;

[0026] Figure 3It is the disassembly schematic view of the heat dissipation component, the mainboard and the fan assembly provided by the embodiment of the utility model;

[0027] Figure 4 It is the side view of the heat dissipation component, the mainboard and the fan assembly provided by the embodiment of the utility model;

[0028] Figure 5 It is the disassembly schematic view of the heat dissipation component and the fan assembly provided by the embodiment of the utility model, wherein the direction shown by the arrow is the schematic view of the air flow direction;

[0029] Figure 6 It is Figure 5 The partial enlarged schematic view of position A in the figure;

[0030] Figure 7 It is Figure 5 The partial enlarged schematic view of position B in the figure;

[0031] Figure 8 It is Figure 5 The partial enlarged schematic view of position C in the figure;

[0032] Figure 9 It is Figure 5 The partial enlarged schematic view of position D in the figure.

[0033] The reference signs in the figure are as follows:

[0034] 1000, all-in-one computer;

[0035] 10, all-in-one computer body; 11, heat source; 111, CPU module; 12, mainboard; 121, second through hole; 13, air inlet; 14, air outlet;

[0036] 20, heat dissipation component; 21, first heat dissipation piece; 211, first heat conduction piece; 2111, first connecting section; 2112, first intermediate section; 2113, second connecting section; 212, first heat dissipation fin; 2121, first heat dissipation fin; 2122, first heat conduction base plate; 22, second heat dissipation piece; 221, second heat conduction piece; 2211, third connecting section; 2212, second intermediate section; 2213, fourth connecting section; 222, second heat dissipation fin; 2221, second heat dissipation fin; 2222, second heat conduction base plate; 23, main heat dissipation base plate; 231, first through hole; 24, elastic connecting assembly; 241, connecting rod; 2411, head end; 2412, body end; 2412a, clamping groove; 2412b, sliding shaft; 2412c, stud; 242, elastic piece; 243, check ring; 25, pressing piece; 251, soft pad;

[0037] 30, fan assembly; 31, first fan; 32, second fan. DETAILED DESCRIPTION

[0038] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The preferred embodiments of the present application will be described in detail with reference to the drawings.

[0039] The computer all-in-one machine 1000 provided by the embodiments of the present application comprises an all-in-one machine body 10, a heat dissipation component 20, and a fan assembly 30. Figure 1 Figure 3 The computer all-in-one machine 1000 comprises a heat source 11 inside the all-in-one machine body 10; the heat dissipation component 20 comprises a first heat dissipation part 21 and a second heat dissipation part 22; the first heat dissipation part 21 comprises a first heat conduction part 211 and a first heat dissipation fin 212, the first heat dissipation fin 212 is located on one side of the heat source 11, one end of the first heat conduction part 211 is connected to the heat source 11, and the other end is connected to the first heat dissipation fin 212; the second heat dissipation part 22 comprises a second heat conduction part 221 and a second heat dissipation fin 222, the second heat dissipation fin 222 is located on the other side of the heat source 11, one end of the second heat conduction part 221 is connected to the heat source 11, and the other end is connected to the second heat dissipation fin 222; the fan assembly 30 comprises a first fan 31 and a second fan 32, the first fan 31 acts on the first heat dissipation fin 212 to discharge the heat of the first heat dissipation fin 212 to the outside of the all-in-one machine body 10, and the second fan 32 acts on the second heat dissipation fin 222 to discharge the heat of the second heat dissipation fin 222 to the outside of the all-in-one machine body 10. The present application can solve the problem of poor heat dissipation and low efficiency of the computer all-in-one machine 1000 in the prior art. The computer all-in-one machine 1000 optimizes the heat dissipation component 20 to effectively improve the heat dissipation efficiency of itself.

[0040] Specifically, part of the heat generated by the heat source 11 can be transmitted to the first heat dissipation fin 212 through the first heat conduction part 211 and discharged by the first fan 31, and the other part of the heat generated by the heat source 11 can be transmitted to the second heat dissipation fin 222 through the second heat conduction part 221 and discharged by the second fan 32. The present application adopts a double-path heat dissipation mode, splits the heat of the heat source 11 into two parallel paths, reduces the total thermal resistance, and significantly improves the heat conduction efficiency compared with the single-channel design. Each heat dissipation channel only bears half of the heat load of the heat source 11, avoids the occurrence of heat saturation phenomenon in a single path, prevents heat accumulation in the all-in-one machine, and effectively improves the heat dissipation efficiency. In addition, the cooperative configuration of the double fans not only optimizes the heat dissipation path but also strengthens the air flow in the all-in-one machine body 10, improves the air exchange rate between the inside of the all-in-one machine body 10 and the outside, and thus improves the heat dissipation speed.

[0041] It is worth mentioning that when one of the fans fails, the present application can still maintain the basic heat dissipation capacity through the other fan to ensure that the computer all-in-one machine 1000 can still operate stably in the event of a sudden failure, and the computer all-in-one machine 1000 has good fault degradation capability.​

[0042] More notably, traditional all-in-one computer single-channel cooling structures typically place the heatsink directly at the heat source, and then place the fan on the side of the heatsink furthest from the heat source. This layout is a linear stacking, meaning the heatsink and fan are arranged sequentially within the internal space. Since the combined thickness of the heatsink and fan directly increases the overall thickness of the all-in-one computer, this layout easily leads to an increase in the computer's thickness. However, this application addresses this by setting a first heat-conducting component 211 and a second heat-conducting component 221. This achieves heat dissipation while simultaneously arranging the first heatsink 21 and the second heatsink 221 on both sides of the heat source 11, forming a side-by-side distribution. The thickness of the heatsink and fan is no longer directly superimposed on the thickness of the all-in-one computer 1000, thereby reducing the thickness of the all-in-one computer 1000 and improving the utilization rate of the internal space of the all-in-one computer 1000.

[0043] In this application, there are many possible types of first fan 31 and second fan 32, and no limitation is made here. For example, in this application, both first fan 31 and second fan 32 are turbo fans.

[0044] The all-in-one machine body 10 is provided with an air inlet 13 and an air outlet 14. The air inlet 13 is located near the fan assembly 30, while the air outlet 14 is located on the side of the first heat sink 212 and the direction of the heat sink's air outlet.

[0045] Reference Figure 3 In one embodiment, the heat dissipation component 20 further includes a main heat dissipation substrate 23, which covers the heat source 11. One end of the first heat-conducting element 211 and one end of the second heat-conducting element 221 are disposed on the side of the main heat dissipation substrate 23 facing away from the heat source 11. Thus, the main heat dissipation substrate 23 is positioned to cover the heat source 11, thereby fully absorbing the heat generated by the heat source 11 and concentrating the heat for rapid conduction to the first heat dissipation element 21 and the second heat dissipation element 22, improving heat dissipation efficiency.

[0046] Reference Figure 3 In one embodiment, multiple first heat-conducting elements 211 are provided, with the other end of each element disposed at the first heat sink 212. This increase in the number of first heat-conducting elements 211 increases the contact area with the main heat sink substrate 23, improving heat dissipation efficiency. Furthermore, each element can absorb heat from different parts of the main heat sink substrate 23, resulting in more uniform and efficient heat transfer. This design is similar to "multi-point heat dissipation," preventing heat from concentrating in a single area and thus improving the overall heat dissipation effect.

[0047] Similarly, multiple second heat-conducting elements 221 are provided, and the other end of the multiple second heat-conducting elements 221 is provided at the second heat sink 222.

[0048] Preferably, multiple first heat-conducting elements 211 and multiple second heat-conducting elements 221 are provided. The multiple first heat-conducting elements 211 and multiple second heat-conducting elements 221 are staggered on the main heat dissipation substrate 23 to avoid heat interference between heat-conducting elements, so that heat can be more accurately conducted to each heat dissipation path.

[0049] For example, in this application, there are two first heat-conducting elements 211 and three second heat-conducting elements 221.

[0050] Reference Figure 4 In one embodiment, the first heat-conducting component 211 includes a first connecting segment 2111, a first intermediate segment 2112, and a second connecting segment 2113. The first connecting segment 2111 is connected to the main heat-dissipating substrate 23. One end of the first intermediate segment 2112 is bent and connected to the first connecting segment 2111, and the other end extends away from the main heat-dissipating substrate 23 and is bent and connected to the second connecting segment 2113. The second connecting segment 2113 is connected to the first heat sink 212. With this configuration, the second connecting segment 2113 is higher than the first connecting segment 2111 in the thickness direction of the main heat-dissipating substrate 23, thereby providing additional installation space for the first heat sink 21, avoiding restriction by the first heat-conducting component 211, increasing the volume of the first heat sink 21, and enhancing the overall heat dissipation effect.

[0051] Similarly, the first heat-conducting component 211 includes a third connecting section 2211, a second intermediate section 2212, and a fourth connecting section 2213, which are arranged in the same way as the first heat-conducting component 211, and will not be described again here.

[0052] Reference Figure 5 - Figure 7 In one embodiment, the first heat sink 212 includes a plurality of first heat dissipation fins 2121 and two first thermally conductive substrates 2122, the plurality of first heat dissipation fins 2121 being disposed between the two first thermally conductive substrates 2122 and arranged at intervals, and one of the first thermally conductive substrates 2122 being connected to the other end of the first thermally conductive member 211; and / or, the second heat sink 222 includes a plurality of second heat dissipation fins 2221 and two second thermally conductive substrates 2222, the plurality of second heat dissipation fins 2221 being disposed between the two second thermally conductive substrates 2222 and arranged at intervals, and one of the second thermally conductive substrates 2222 being connected to the other end of the second thermally conductive member 221. With this configuration, heat can be transferred separately to a plurality of first heat dissipation fins 2121 or a plurality of second heat dissipation fins 2221 through the first heat-conducting substrate 2122 or the second heat-conducting substrate 2222. During the process of the fan generating airflow, the arrangement of a plurality of first heat dissipation fins 2121 or a plurality of second heat dissipation fins 2221 can increase the contact area with the airflow and improve the heat dissipation effect.

[0053] Furthermore, in the above scheme, a plurality of first heat dissipation fins 2121 are disposed between two first heat-conducting substrates 2122, and the plurality of first heat dissipation fins 2121 and the two first heat-conducting substrates 2122 together form a plurality of first air channels. A plurality of second heat dissipation fins 2221 are disposed between two second heat-conducting substrates 2222, and the plurality of second heat dissipation fins 2221 and the two second heat-conducting substrates 2222 together form a plurality of second air channels. The first air channels and the second air channels can guide airflow to the outside of the integrated machine body 10 to ensure that heat is discharged smoothly.

[0054] It should be noted that the arrangement of several first heat dissipation fins 2121 at intervals is perpendicular to the airflow direction of the first fan 31, and the arrangement of several second heat dissipation fins 2221 at intervals is perpendicular to the airflow direction of the second fan 32, so that each first heat dissipation fin 2121 and second heat dissipation fin 2221 can be covered by the airflow, thus ensuring the heat dissipation effect.

[0055] Preferably, the first heat sink 212 extends in the air outlet direction to increase the coverage of the interior of the all-in-one unit 10, enabling the first heat sink 212 to dissipate heat from other components inside the all-in-one unit 10 and further improve heat dissipation efficiency. Similarly, the second heat sink 222 extends in the air outlet direction.

[0056] In this application, the heat source 11 can be a graphics card module, a CPU module 111, or other working elements, which are not limited here.

[0057] Reference Figure 3 For example, in this application, the all-in-one computer 1000 also includes a motherboard 12, and the heat source 11 is a CPU module 111 disposed on the motherboard 12. The motherboard 12 is located between the first heat sink 212 and the second heat sink 222, and the main heat sink 23 covers the CPU module 111. This configuration achieves heat dissipation for the CPU module 111, ensuring that the internal temperature of the all-in-one computer 1000 is always maintained at a normal level during operation, and the performance of the all-in-one computer 1000 is reliable and stable.

[0058] Reference Figure 5 , Figure 8 as well as Figure 9In one embodiment, the heat dissipation component 20 further includes an elastic connection component 24, which includes a connecting rod 241 and an elastic element 242. In the thickness direction of the main heat dissipation substrate 23, the connecting rod 241 passes through the main heat dissipation substrate 23 and is connected to the motherboard 12; and the elastic element 242 is located on the side of the main heat dissipation substrate 23 away from the motherboard 12. The elastic element 242 is fitted onto the connecting rod 241 and is connected to the main heat dissipation substrate 23. The connecting rod 241 is movably disposed on the main heat dissipation substrate 23 so that when the connecting rod 241 locks the motherboard 12, the main heat dissipation substrate 23 can move relative to the connecting rod 241, the elastic element 242 compresses and stores energy, and the main heat dissipation substrate 23 is elastically pressed against the CPU module 111. With this configuration, the elastic connection component 24 can fix the motherboard 12 while allowing the main heat sink 23 to be elastically pressed against the CPU module 111, ensuring that the main heat sink 23 can fit tightly against the CPU module 111. During installation, it can also prevent the main heat sink 23 from excessively squeezing the CPU module 111, which could damage the CPU module 111.

[0059] Specifically, the elastic element 242 is a spring, which makes the main heat sink 23 always tend to move towards the motherboard 12. During the process of locking the motherboard 12 by the connecting rod 241, the connecting rod 241 can drive the main heat sink 23 to move towards the motherboard 12. Then the main heat sink 23 moves to contact the CPU module 111. The main heat sink 23 moves away from the motherboard 12 relative to the connecting rod 241 and overcomes the elastic force of the elastic element 242 to compress the elastic element 242. Under the reaction force of the elastic element 242, the main heat sink 23 can finally be elastically pressed onto the CPU module 111.

[0060] In one embodiment, a first through hole 231 is provided on the main heat dissipation substrate 23; the connecting rod 241 includes a head end 2411 and a body end 2412. The head end 2411 is located on the side of the main heat dissipation substrate 23 facing away from the motherboard 12, and the body end 2412 is connected to the head end 2411 and passes through the first through hole 231. An elastic member 242 is fitted onto the body end 2412 and is sandwiched between the head end 2411 and the main heat dissipation substrate 23; the body end 2412 is also provided with a slot 2412a; the elastic connecting assembly 24 also includes a retaining ring 243, which is engaged with the slot 2412a and is located on the side of the main heat dissipation substrate 23 facing the motherboard 12, so as to limit the connecting rod 241 to be installed on the main heat dissipation substrate 23. With this configuration, the head end 2411 cooperates with the retaining ring 243, preventing the body end 2412 from disengaging from the first through hole 231. This allows for the movable connection of the connecting rod 241 relative to the main heat dissipation substrate 23. The elastic element 242, fitted onto the body end 2412 and sandwiched between the head end 2411 and the main heat dissipation substrate 23, ensures that the elastic element 242 fully acts on the main heat dissipation substrate 23, ensuring a consistent direction of force application and improving the reliability and stability of the overall structure.

[0061] In one embodiment, the main board 12 is provided with a second through hole 121, and the main board 12 also includes a wall adjacent to the second through hole 121; the body end 2412 includes a sliding shaft 2412b and a stud 2412c, the stud 2412c is disposed on the side of the sliding shaft 2412b away from the head end 2411, the sliding shaft 2412b passes through the first through hole 231 and abuts against the wall, and the stud 2412c passes through the second through hole 121 and is threaded to the integrated body 10. With this configuration, the stud 2412c is threadedly connected to the all-in-one body 10. By screwing, the connecting rod 241 moves the main heat sink 23 toward the motherboard 12. The stud 2412c passes through the second through hole 121 until the sliding shaft 2412b abuts against the wall, thereby limiting the installation of the motherboard 12 into the all-in-one body 10. This configuration provides good connection stability, and the motherboard 12 and the main heat sink 23 can be fixed in one operation, simplifying the operation steps and making assembly more convenient and faster. Specifically, the slot 2412a is located at the sliding shaft 2412b.

[0062] In one embodiment, multiple elastic connection components 24 are provided and arranged circumferentially along the main heat dissipation substrate 23 to improve connection stability. For example, four elastic connection components 24 are provided, and the four elastic connection components 24 are respectively located at the four corners of the main heat dissipation substrate 23.

[0063] Reference Figure 5 and Figure 8 In one embodiment, the heat dissipation component 20 further includes a holding member 25, which is connected to the main heat dissipation substrate 23 and is offset from the CPU module 111 so that when the main heat dissipation substrate 23 is placed over the CPU module 111, the holding member 25 can abut against the motherboard 12. Thus, the holding member 25 increases the support area of ​​the heat dissipation component 20 and the motherboard 12, and can hold the motherboard 12 during installation, preventing the motherboard 12 from shifting position when the main heat dissipation substrate 23 is placed over the CPU module 111, thereby improving installation accuracy. Furthermore, the holding member 25 ensures that the motherboard 12 of the all-in-one computer 1000 maintains its relative position even when subjected to significant shaking, preventing the main heat dissipation substrate 23 from losing contact with the CPU module 111 due to misalignment, and improving the stability of its heat dissipation effect.

[0064] In one embodiment, the holding member 25 is provided with a soft pad 251, which abuts against the motherboard 12 to avoid scratching the motherboard 12. Specifically, the soft pad 251 can be a rubber pad or foam.

[0065] The position and number of the holding components 25 can be set in various ways, and technicians can adjust them freely according to the shape of the motherboard 12. No limitation is made here.

[0066] It should be understood that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of this utility model.

Claims

1. An all-in-one computer, characterized in that, include: The all-in-one unit itself contains a heat source; A heat dissipation component includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component includes a first thermally conductive component and a first heat sink. The first heat sink is located on one side of the heat source. One end of the first thermally conductive component is connected to the heat source, and the other end is connected to the first heat sink. The second heat dissipation component includes a second thermally conductive component and a second heat sink. The second heat sink is located on the other side of the heat source. One end of the second thermally conductive component is connected to the heat source, and the other end is connected to the second heat sink. A fan assembly includes a first fan and a second fan. The first fan acts on the first heat sink to exhaust the heat from the first heat sink to the outside of the all-in-one machine body. The second fan acts on the second heat sink to exhaust the heat from the second heat sink to the outside of the all-in-one machine body.

2. The all-in-one computer according to claim 1, characterized in that, The heat dissipation component further includes a main heat dissipation substrate, which is disposed over the heat source. One end of the first heat-conducting element and one end of the second heat-conducting element are disposed on the side of the main heat dissipation substrate facing away from the heat source.

3. The all-in-one computer according to claim 2, characterized in that, The first heat-conducting component is provided in multiple ways, and the other end of the multiple first heat-conducting components is provided at the first heat sink; and / or, the second heat-conducting component is provided in multiple ways, and the other end of the multiple second heat-conducting components is provided at the second heat sink.

4. The all-in-one computer according to claim 2, characterized in that, The first heat-conducting component includes a first connecting segment, a first intermediate segment, and a second connecting segment. The first connecting segment is connected to the main heat dissipation substrate. One end of the first intermediate segment is bent and connected to the first connecting segment, and the other end extends away from the main heat dissipation substrate and is bent and connected to the second connecting segment. The second connecting segment is connected to the first heat sink.

5. The all-in-one computer according to claim 2, characterized in that, The first heat sink includes a plurality of first heat dissipation fins and two first thermally conductive substrates, the plurality of first heat dissipation fins being disposed between the two first thermally conductive substrates and arranged at intervals, and one of the first thermally conductive substrates being connected to the other end of the first thermally conductive component; and / or, the second heat sink includes a plurality of second heat dissipation fins and two second thermally conductive substrates, the plurality of second heat dissipation fins being disposed between the two second thermally conductive substrates and arranged at intervals, and one of the second thermally conductive substrates being connected to the other end of the second thermally conductive component.

6. The all-in-one computer according to any one of claims 2-5, characterized in that, It also includes a motherboard, the heat source being a CPU module mounted on the motherboard, the motherboard being located between the first heat sink and the second heat sink, and the main heat dissipation substrate covering the CPU module.

7. The all-in-one computer according to claim 6, characterized in that, It also includes a flexible connection component, which includes a connecting rod and an elastic element. In the thickness direction of the main heat sink substrate, the connecting rod passes through the main heat sink substrate and is connected to the motherboard. The elastic element is located on the side of the main heat sink substrate away from the motherboard. The elastic element is fitted onto the connecting rod and is connected to the main heat sink substrate. The connecting rod is movably disposed on the main heat sink substrate so that when the connecting rod locks the motherboard, the main heat sink substrate can move relative to the connecting rod. The elastic element is compressed and stores energy, and the main heat sink substrate is elastically pressed against the CPU module.

8. The all-in-one computer according to claim 7, characterized in that, A first through hole is provided on the main heat dissipation substrate; The connecting rod includes a head end and a body end. The head end is located on the side of the main heat sink substrate facing away from the motherboard. The body end is connected to the head end and passes through the first through hole. The elastic element is fitted onto the body end and is sandwiched between the head end and the main heat sink substrate. The body end is also provided with a slot. The elastic connection assembly also includes a retaining ring, which is snapped into the slot and located on the side of the main heat sink substrate facing the motherboard, so as to limit the connection rod to be installed on the main heat sink substrate.

9. The all-in-one computer according to claim 8, characterized in that, The motherboard has a second through hole, and the motherboard also includes a wall adjacent to the second through hole; the body end includes a sliding shaft and a stud, the stud is disposed on the side of the sliding shaft away from the head end, the sliding shaft passes through the first through hole and abuts against the wall, and the stud passes through the second through hole and is threaded to the integrated machine body.

10. The all-in-one computer according to claim 7, characterized in that, The heat dissipation component further includes a retaining member, which is connected to the main heat dissipation substrate and is offset from the CPU module so that when the main heat dissipation substrate is placed over the CPU module, the retaining member can abut against the motherboard.

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