Surge suppression chip ceramic capacitor

Abstract

The utility model discloses a surge suppression chip ceramic capacitor, which comprises a packaging shell, a ceramic body, a first electrode plate, a second electrode plate, a first pin and a second pin, and is characterized in that the ceramic body is arranged in the packaging shell and comprises an upper surface and a lower surface which are opposite to each other, the upper surface is provided with a first concave part for fixing the first electrode plate, and the lower surface is provided with a second concave part for fixing the second electrode plate; a second concave part for fixing the second electrode plate is arranged on the lower surface; one end of the first pin is provided with a first convex part matched with the first concave part and is embedded into the first concave part to be welded and fixed with the first electrode slice, and the other end of the first pin penetrates out of the packaging shell; and one end of the second pin is provided with a second convex part matched with the second concave part and is embedded into the second concave part to be welded and fixed with the second electrode slice, and the other end of the second pin penetrates out of the packaging shell. Through the design that the concave part of the ceramic body and the convex part of the pin are embedded, the ceramic body and the pin are in a fastening state, the ceramic body and the pin are not separated when the capacitor is impacted by surge, and the surge suppression capability of the capacitor is improved.

Description

Technical Field

[0001] This utility model relates to the field of ceramic capacitor technology, specifically to a surge-suppressing chip ceramic capacitor. Background Technology

[0002] Ceramic capacitors are widely used in various electronic devices due to their small size, high temperature resistance, and high precision. However, when a surge occurs in a circuit, the ceramic capacitor may be subjected to overvoltage, potentially leading to breakdown, short circuits, or even explosions. It may also cause tiny fractures between the internal metal electrodes and the dielectric, ultimately resulting in capacitor failure.

[0003] The IEC 60384-14 standard describes that capacitor Y1 must withstand a surge of 1.2 / 50µs waveform with Up = 8KV; capacitor Y2 must withstand a surge of 1.2 / 50µs waveform with Up = 5KV. However, during this test, capacitor Y1 may break down. Breakdown will cause leakage, potentially leading to electric shock and endangering personal safety. Ordinary ceramic capacitors have weak surge resistance and are easily damaged by surge impacts, resulting in surge failure. This is mainly due to the tiny gaps between the solder joints and the ceramic dielectric. During a surge, the ceramic body can detach from the solder leads, generating a strong spark discharge, which also endangers personal safety. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a surge-suppressing chip ceramic capacitor.

[0005] This utility model discloses a surge-suppressing surface-mount ceramic capacitor, which includes a package housing, a ceramic body, a first electrode plate, a second electrode plate, a first lead, and a second lead. The ceramic body is disposed in the package housing and includes an upper surface and a lower surface opposite to each other. The upper surface has a first recess, and the lower surface has a second recess. The first electrode plate is fixed in the first recess, and the second electrode plate is fixed in the second recess. One end of the first lead has a first protrusion adapted to the first recess. The first protrusion is embedded in the first recess and welded to the first electrode plate. The other end of the first lead protrudes out of the package housing. One end of the second lead has a second protrusion adapted to the second recess. The second protrusion is embedded in the second recess and welded to the second electrode plate. The other end of the second lead protrudes out of the package housing.

[0006] Preferably, the first pin includes a first electrode welding portion and a first extension portion. One side of the first electrode welding portion is provided with a first protrusion. One end of the first extension portion is connected to the first electrode welding portion, and the other end extends to the outside of the package housing.

[0007] Preferably, the second pin includes a second electrode welding portion and a second extension portion. One side of the second electrode welding portion is provided with a second protrusion. One end of the second extension portion is connected to the second electrode welding portion, and the other end extends to the outside of the package housing.

[0008] Preferably, the ceramic body is cylindrical.

[0009] Preferably, a first rough surface is formed at the middle position of the side of the first protrusion facing the first concave portion, and a second rough surface is formed at the middle position of the second protrusion facing the second concave portion.

[0010] Preferably, the first extension portion includes a first bending portion and a first PCB board welding portion. The first bending portion has a multiple bending structure. The first end of the first bending portion is connected to the first electrode sheet welding portion, and its tail end is connected to the first PCB board welding portion. The first PCB board welding portions are arranged in parallel.

[0011] Preferably, the second extension portion includes a second bending portion and a second PCB board welding portion. The second bending portion has a multiple bending structure. The first end of the second bending portion is connected to the second electrode sheet welding portion, and its tail end is connected to the second PCB board welding portion. The second PCB board welding portions are arranged in parallel.

[0012] Preferably, both the first electrode sheet and the second electrode sheet are made of copper.

[0013] Preferably, both the first and second pins are made of copper.

[0014] Preferably, the outer casing is made of epoxy resin material.

[0015] The beneficial effects of this utility model are as follows: Compared with the prior art, the surge-suppressing chip ceramic capacitor, through the design of the first concave part on the upper surface of the ceramic body and the first convex part of the first pin fitting together, and the second concave part on the lower surface of the ceramic body and the second convex part of the second pin fitting together, thereby forming a tight-fitting state between the ceramic body and the pin. When subjected to surge impact, the ceramic body will not separate from the pin, thus improving the surge suppression capability of the capacitor. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0017] Figure 1 A rendering of a surge-suppressing surface-mount ceramic capacitor;

[0018] Figure 2 A cross-sectional view of a surge-suppressing chip ceramic capacitor;

[0019] Figure 3A perspective view of the internal explosion of a surface-mount ceramic capacitor used to suppress surges;

[0020] Figure 4 Two-view diagram of the internal explosion of a surface-mount ceramic capacitor to suppress surges;

[0021] Figure 5 A schematic diagram of the first pin of a surface-mount ceramic capacitor for surge suppression;

[0022] Figure 6 A schematic diagram of the second pin of a surface-mount ceramic capacitor for surge suppression.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Encapsulation shell;

[0025] 2. Ceramic body; 21. First concave portion; 22. Second concave portion;

[0026] 3. First electrode plate;

[0027] 4. Second electrode plate;

[0028] 5. First pin; 51. First protrusion; 511. First rough surface; 52. First electrode sheet welding part; 53. First extension part; 531. First bending part; 532. First PCB board welding part;

[0029] 6. Second pin; 61. Second protrusion; 611. Second rough surface; 62. Second electrode sheet welding part; 63. Second extension part; 631. Second bending part; 632. Second PCB board welding part; Detailed Implementation

[0030] The following drawings will disclose several embodiments of this utility model. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0031] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0032] Please see Figures 1-2 As shown, Figure 1 A rendering of a surge-suppressing surface-mount ceramic capacitor. Figure 2 This embodiment discloses a surge-suppressing chip ceramic capacitor, which includes a package shell 1, a ceramic body 2, a first electrode plate 3, a second electrode plate 4, a first lead 5, and a second lead 6. The ceramic body 2, the first electrode plate 3, and the second electrode plate 4 are all disposed inside the package shell 1, and the package shell 1 seals and encapsulates the ceramic body 2, the first electrode plate 3, and the second electrode plate 4.

[0033] In this embodiment, as Figures 3-4 As shown, Figure 3 A perspective view of an internal explosion of a surface-mount ceramic capacitor to suppress surges. Figure 4 A two-view diagram of the internal explosion of a surface-mount ceramic capacitor for suppressing surges. The ceramic body 2 includes an upper surface and a lower surface opposite each other. The upper surface is recessed inward to form a first recess 21. The first electrode sheet 3 covers the upper surface and is fixed in the first recess 21. The lower surface is recessed inward to form a second recess 22. The second electrode sheet 4 covers the lower surface and is fixed in the second recess 22.

[0034] Please review Figures 3-4 As shown, one end of the first pin 5 has a first protrusion 51 that matches the first recess 21. The first protrusion 51 can be fully fitted into the first recess 21 and welded to the first electrode sheet 3 fixed in the first recess 21, so that the first pin 5 and the upper surface of the ceramic body 2 are firmly bonded together. The other end of the first pin 5 extends to the outside of the package shell 1. One end of the second pin 6 has a second protrusion 61 that matches the second recess 22. The second protrusion 61 can be fully fitted into the second recess 22 and welded to the second electrode sheet 4 fixed in the second recess 22, so that the second pin 6 and the lower surface of the ceramic body 2 are firmly bonded together. The other end of the second pin 6 extends to the outside of the package shell 1.

[0035] When subjected to surge impact, the first recess 21 on the upper surface of the ceramic body 2 is completely engaged with the first protrusion 51 of the first pin 5. The first protrusion 51 is also welded to the first electrode piece 3 fixed in the first recess 21. After welding, no gap is created, making the first pin 5 and the upper surface of the ceramic body 2 firmly bonded. The second recess 22 on the lower surface of the ceramic body 2 is completely engaged with the second protrusion 61 of the second pin 6. The second protrusion 61 is also welded to the second electrode piece 4 fixed in the second recess 22. After welding, no gap is created, making the second pin 6 and the lower surface of the ceramic body 2 firmly bonded. This prevents the ceramic body 2 from separating from the first pin 5 and the second pin 6 due to impact, thereby improving the capacitor's ability to suppress surges.

[0036] In this embodiment, the encapsulation shell 1 is made of existing epoxy resin material. Alternatively, other insulating materials such as ceramic can be used as the encapsulation shell 1, and it can be made into a square or other shapes as needed. The ceramic body 2 is cylindrical, but in practical applications, it can also be in the form of discs, tubes, cylinders, stacked plates, monoliths, etc. The first electrode plate 3 and the second electrode plate 4 are made of existing metallic copper. Metallic copper has high stability and low high-frequency loss (DF value), making the ceramic capacitor less prone to overheating and short circuits when used in high-frequency circuits, thus improving the reliability of the product and extending its service life. Alternatively, other metals such as metallic silver can also be used as electrode plates. The first pin 5 and the second pin 6 are both made of metallic copper. Other metals with good conductivity, such as silver, aluminum, and steel, can also be used.

[0037] For details, please refer to Figure 5 and Figure 6 As shown, Figure 5 A schematic diagram of the first pin of a surge-suppressing surface-mount ceramic capacitor. Figure 6 The schematic diagram of the second pin of the surge-suppressing surface-mount ceramic capacitor shows that the first pin 5 includes a first electrode bonding portion 52 and a first extension portion 53. One side of the first electrode bonding portion 52 protrudes outward to form a first protrusion 51, which is adapted to the first recess 21 of the ceramic body 2. One end of the first extension portion 53 is connected to the first electrode bonding portion 52, and the other end extends to the outside of the package housing 1 for soldering onto the PCB board. The second pin 6 includes a second electrode bonding portion 62 and a second extension portion 63. One side of the second electrode bonding portion 62 protrudes outward to form a second protrusion 61, which is adapted to the second recess 22 of the ceramic body 2. One end of the second extension portion 63 is connected to the second electrode bonding portion 62, and the other end extends to the outside of the package housing for soldering onto the PCB board.

[0038] In this embodiment, one side of the first electrode welding portion 52 of the first pin 5 protrudes outward to form a first protrusion 51, and the other side is concave. Of course, it can also be flat, as long as it does not affect the fitting and fastening state between the first protrusion 51 and the upper surface of the ceramic body 2. One end of the first extension portion 53 is connected to the first electrode welding portion 52, and the other end extends out of the package shell 1 and is welded parallel to the PCB board to ensure a stable connection and also to ensure the stability and reliability of the electrical connection. Similarly, the second electrode welding portion 62 and the second extension portion 63 of the second pin 6 have the same shape and function as above, and will not be described again here.

[0039] Please review Figures 5-6 As shown, further, a first rough surface 511 is formed on the middle position of the first protrusion 51 facing the first concave portion 21, and a second rough surface 611 is formed on the middle position of the second protrusion 61 facing the second concave portion 22. In this embodiment, both the first rough surface 511 and the second rough surface 611 adopt a printed design, and the printed shape can be grid-like, striped, etc. The first rough surface 511 increases the surface area of ​​the first protrusion 51, and the second rough surface 611 increases the surface area of ​​the second protrusion 61. The increase in surface area is mainly to increase the amount of solder during welding, thereby making the first protrusion 51 and the first concave portion 21 welded more firmly. Similarly, the second protrusion 61 and the second concave portion 22 form a more stable state after welding.

[0040] Specifically, the first extension portion 53 includes a first bending portion 531 and a first PCB board welding portion 532. The first bending portion 531 is formed by multiple bending. One end of the first bending portion 531 is connected to the first electrode sheet welding portion 52, and the other end is connected to the first PCB board welding portion 532. The first PCB board welding portion 532 is located outside the package housing 1 and is arranged parallel to it. The second extension portion 63 includes a second bending portion 631 and a second PCB board welding portion 632. The second bending portion 631 is formed by multiple bending. One end of the second bending portion 631 is connected to the second electrode sheet welding portion 62, and the other end is connected to the second PCB board welding portion 632. The second PCB board welding portion 632 is located outside the package housing 1 and is arranged parallel to it. In this embodiment, the first extension portion 53 adopts the multiple bending structure of the first bending portion 531 to generate different potentials, avoiding the risk of capacitor failure. When the capacitor is horizontally welded to the PCB board through the first PCB board welding portion 532, valuable PCB surface space is saved, thereby reducing costs. Similarly, the second extension 63 has the same function as the first extension 53, and will not be described again here.

[0041] In practical applications, the ceramic body 2 is placed inside the package housing 1. The first recess 21 of the ceramic body 2 matches the first protrusion 51 of the first pin 5. A first rough surface 511 is formed in the middle of the side of the first protrusion 51 facing the first recess 21, increasing the surface area of ​​the first protrusion 51 and thus increasing the amount of solder. When it is soldered to the first electrode piece 3 fixed on the first recess 21, it fits more tightly. Similarly, the second recess 22 of the ceramic body 2 is fitted with the second protrusion 61 of the second pin 6. A second rough surface 611 is formed in the middle of the side of the second protrusion 61 facing the first recess 22, increasing the surface area of ​​the second protrusion 61 and thus increasing the amount of solder. When it is soldered to the first electrode piece 4 fixed on the second recess 22, it fits more tightly, thus making the connection between the ceramic body 2 and the first pin 5 and the second pin 6 more secure. Under surge impact, it is not easy to detach, improving the surge suppression capability of the capacitor.

[0042] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A surge-suppressing chip ceramic capacitor, characterized in that, include: The package includes a housing (1), a ceramic body (2), a first electrode plate (3), a second electrode plate (4), a first pin (5), and a second pin (6). The ceramic body (2) is disposed in the housing (1). The ceramic body (2) includes an upper surface and a lower surface. The upper surface has a first recess (21), and the lower surface has a second recess (22). The first electrode plate (3) is fixed in the first recess (21), and the second electrode plate (4) is fixed in the second recess (22). One end of the first pin (5) is provided with a first electrode plate (3) and a second electrode plate (4). The first protrusion (51) is adapted to the first recess (21), the first protrusion (51) is embedded in the first recess (21) and welded to the first electrode sheet (3), and the other end of the first pin (5) protrudes out of the package shell (1); one end of the second pin (6) is provided with a second protrusion (61) adapted to the second recess (22), the second protrusion (61) is embedded in the second recess (22) and welded to the second electrode sheet (4), and the other end of the second pin (6) protrudes out of the package shell (1).

2. The surge-suppressing chip ceramic capacitor according to claim 1, characterized in that, The first pin (5) includes a first electrode sheet welding part (52) and a first extension part (53). The first electrode sheet welding part (52) has a first protrusion (51) on one side. One end of the first extension part (53) is connected to the first electrode sheet welding part (52), and the other end extends to the outside of the package shell (1).

3. The surge-suppressing chip ceramic capacitor according to claim 1, characterized in that, The second pin (6) includes a second electrode sheet welding portion (62) and a second extension portion (63). The second electrode sheet welding portion (62) has a second protrusion (61) on one side. One end of the second extension portion (63) is connected to the second electrode sheet welding portion (62), and the other end extends to the outside of the package shell (1).

4. The surge-suppressing chip ceramic capacitor according to claim 1, characterized in that, The ceramic body (2) is cylindrical.

5. The surge-suppressing chip ceramic capacitor according to claim 1, characterized in that, A first rough surface (511) is formed at the middle position of the side of the first protrusion (51) facing the first concave part (21), and a second rough surface (611) is formed at the middle position of the side of the second protrusion (61) facing the second concave part (22).

6. The surge-suppressing chip ceramic capacitor according to claim 2, characterized in that, The first extension portion (53) includes a first bending portion (531) and a first PCB board welding portion (532). The first bending portion (531) is a multiple bending structure. The first end of the first bending portion (531) is connected to the first electrode sheet welding portion (52), and its tail end is connected to the first PCB board welding portion (532). The first PCB board welding portion (532) is arranged in parallel.

7. The surge-suppressing chip ceramic capacitor according to claim 3, characterized in that, The second extension portion (63) includes a second bending portion (631) and a second PCB board welding portion (632). The second bending portion (631) is a multiple bending structure. The first end of the second bending portion (631) is connected to the second electrode sheet welding portion (62), and its tail end is connected to the second PCB board welding portion (632). The second PCB board welding portion (632) is arranged in parallel.

8. The surge-suppressing chip ceramic capacitor according to claim 1, characterized in that, Both the first electrode sheet (3) and the second electrode sheet (4) are made of copper.

9. The surge-suppressing chip ceramic capacitor according to claim 1, characterized in that, Both the first pin (5) and the second pin (6) are made of copper.

10. The surge-suppressing chip ceramic capacitor according to claim 1, characterized in that, The outer casing (1) is made of epoxy resin.

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