Swing arm piece for improving die bonding stability

Abstract

The utility model discloses a swing arm member for improving die bonding stability, which relates to the technical field of die bonding and comprises a swing arm body, the swing arm body comprises a connecting plate and a die bonding plate, the connecting plate is fixedly connected with the die bonding plate, all sharp edges of the swing arm body are blunted and deburred, and the die bonding plate is fixedly connected with the connecting plate. The surface of the swing arm body is subjected to hardening treatment; the surface hardness of the swing arm body subjected to hardening treatment is remarkably improved, the wear resistance is enhanced, the wear in the long-term use process can be effectively reduced, the precision of the swing arm piece is ensured, the stability of die bonding is further improved, all sharp edges of the swing arm body are subjected to blunt deburring treatment, and the service life of the swing arm is prolonged. And the risk of damage to the chip is further reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of fixed crystal technology, concretely is a swing arm spare that improves fixed crystal stability. BACKGROUND

[0002] In the fixed crystal process in the semiconductor chip packaging process, the swing arm spare plays a key role, and it needs to accurately carry and place the chip to the specified position.

[0003] However, the existing swing arm spare has some problems in the use process, for example, its sharp edge can easily scratch the chip, affect the chip quality, and the surface hardness is insufficient and can be easily worn, which can reduce the precision of the swing arm spare, and further affect the stability and reliability of the fixed crystal.

[0004] Therefore, we design a swing arm spare to improve the stability of the fixed crystal to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a swing arm spare that improves the stability of the fixed crystal to solve the problems in the above background technology.

[0006] To solve the above technical problems, the utility model provides a swing arm spare that improves the stability of the fixed crystal, which comprises a swing arm body, the swing arm body comprises a connecting plate and a fixed crystal plate, the connecting plate and the fixed crystal plate are fixedly connected, all the sharp edges of the swing arm body are subjected to inverted blunt deburring treatment, and the surface of the swing arm body is subjected to hardening treatment.

[0007] Further, a positioning hole is formed in the connecting plate, and the connecting plate is connected with the driving device through the positioning hole.

[0008] Further, a fixed crystal suction nozzle is fixedly arranged on one side of the fixed crystal plate, a negative pressure device is installed in the fixed crystal plate, a gas pipe is fixedly inserted at one end of the negative pressure device, and the other end of the gas pipe is connected with the fixed crystal suction nozzle.

[0009] Further, the end face of the fixed crystal plate and the end face of the connecting plate are mutually at an included angle, and the upper surface of the fixed crystal plate is a smooth inclined plane.

[0010] Further, the material of the swing arm body is high-strength aluminum alloy, and the edges thereof are subjected to rounding treatment.

[0011] Further, an elastic buffer pad is installed on the lower surface of the fixed crystal plate.

[0012] Further, first through grooves are formed in the upper and lower surfaces of the fixed crystal plate, and second through grooves are formed in the two side surfaces of the fixed crystal plate.

[0013] Further, the shapes of the first through grooves and the second through grooves are circular.

[0014] Compared with the prior art, the utility model has the advantages that:

[0015] The arm part improves the stability and reliability of die bonding, reduces the damage of the chip in the die bonding process, and improves the quality and yield of the semiconductor chip packaging. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a top view structural schematic diagram of the utility model;

[0017] Figure 2 It is a side view structural schematic diagram of the utility model.

[0018] In the figure: 1, arm body; 2, connecting plate; 3, die bonding plate; 4, die bonding suction nozzle; 5, air pipe; 6, elastic buffer pad; 7, positioning hole; 8, first through slot; 9, second through slot. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0020] Please refer to Figure 1 and Figure 2 The utility model provides a kind of technical solutions: a kind of arm part for improving die bonding stability, including arm body 1, arm body 1 includes connecting plate 2 and die bonding plate 3, connecting plate 2 and die bonding plate 3 are fixedly connected between, arm body 1 has sharp edge and is all treated by blunt deburring, and the surface of arm body 1 is treated by hardening.

[0021] When being implemented specifically, the surface hardness of arm body 1 after hardening treatment is significantly improved, and the wear resistance is enhanced, which can effectively reduce wear during long-term use, ensure the precision of arm part, thereby improve the stability of die bonding, and further, the sharp edge of arm body 1 is treated by blunt deburring, which further reduces the risk of damaging the chip.

[0022] Please refer to Figure 1 Positioning hole 7 is formed in connecting plate 2, and connecting plate 2 is connected with driving device through positioning hole 7.

[0023] In the embodiment, the driving device is connected with the positioning hole 7 arranged on the connecting plate 2, and the driving device can drive the swing arm body 1 to rotate horizontally and move up and down to complete the die bonding action.

[0024] Referring to Figure 1 , one side of the die bonding plate 3 is fixedly provided with a die bonding suction nozzle 4, and the die bonding plate 3 is provided with a negative pressure device, one end of the negative pressure device is fixedly connected with an air pipe 5, and the other end of the air pipe 5 is connected with the die bonding suction nozzle 4.

[0025] In the embodiment, the negative pressure device in the die bonding plate 3 is turned on, the air in the air pipe 5 and the die bonding suction nozzle 4 is extracted by the vacuum pump, a negative pressure is formed in the air pipe 5 and the die bonding suction nozzle 4, and thus the end of the die bonding suction nozzle 4 generates suction force to stably adsorb the chip.

[0026] Referring to Figure 1 , the end surface of the die bonding plate 3 and the end surface of the connecting plate 2 are at an angle, and the upper surface of the die bonding plate 3 is a smooth inclined surface.

[0027] In the embodiment, the angle can form a clearance between the opposite end surfaces of the connecting plate 2 and the die bonding plate 3, facilitate the swing of the die bonding plate 3, and prevent the end surface of the connecting plate 2 from interfering with the end surface of the die bonding plate 3 when the die bonding plate 3 swings.

[0028] Referring to Figure 1 and Figure 2 , the swing arm body 1 is made of high-strength aluminum alloy, and the edges thereof are rounded.

[0029] In the embodiment, the high-strength aluminum alloy material has high strength and can withstand various stresses generated in the die bonding process, and the edges are rounded to effectively avoid scratching the chip during chip handling.

[0030] Referring to Figure 2 , the lower surface of the die bonding plate 3 is provided with an elastic buffer pad 6.

[0031] In the embodiment, when the die bonding plate 3 places the chip at the target position, the elastic buffer pad 6 can absorb part of the impact force, prevent the chip from being damaged due to the large impact force, and thus improve the quality and stability of the die bonding.

[0032] Referring to Figure 1 and Figure 2 , the first through groove 8 is arranged on the upper and lower surfaces of the die bonding plate 3, the second through groove 9 is arranged on the two side surfaces of the die bonding plate 3, and the shapes of the first through groove 8 and the second through groove 9 are circular.

[0033] In the embodiment, the first through slot 8 and the second through slot 9 are arranged to save material and simplify the processing technology. In addition, in the high-frequency high-speed swinging process of the swing arm and the up-down pick-and-place process of the chip, the circular slot reduces the windward area and the resistance, thereby improving the positioning accuracy and the production efficiency.

[0034] Working principle: The chip mounting plate 3 of the swing arm body 1 is used for placing the chip, the upper surface of which is a smooth inclined surface, and the edge of which is rounded, so as to effectively avoid scratching the chip during the chip handling process. Meanwhile, the lower surface of the chip mounting plate 3 is provided with an elastic buffer pad 6, which can absorb part of the impact force when the swing arm places the chip at the target position, so as to prevent the chip from being damaged due to the large impact force, thereby improving the quality and stability of the chip mounting.

[0035] In addition, in the manufacturing process, the swing arm body 1 is made of high-strength aluminum alloy material. First, the swing arm body 1 is polished to make the surface smoothness reach the standard, and then the surface of the swing arm body 1 is hardened by using the nitriding process to form a high-hardness nitriding layer on the surface. After such hardening treatment, the surface hardness of the swing arm body 1 is significantly improved, the wear resistance is enhanced, the wear in the long-term use process can be effectively reduced, the accuracy of the swing arm is ensured, thereby improving the stability of the chip mounting, and the swing arm body 1 has sharp edges which are all rounded and deburred, further reducing the risk of damaging the chip.

Claims

1. A swing arm member for improving stability of die bonding, comprising a swing arm body (1), characterized in that, The swing arm body (1) comprises a connecting plate (2) and a die-bonding plate (3), the connecting plate (2) and the die-bonding plate (3) are fixedly connected, all acute edges of the swing arm body (1) are subjected to deburring treatment, and the surface of the swing arm body (1) is subjected to hardening treatment.

2. The swing arm member for improving stability of die bonding according to claim 1, wherein: A positioning hole (7) is formed in the connecting plate (2), and the connecting plate (2) is connected with the driving device through the positioning hole (7).

3. The swing arm member for improving stability of die bonding according to claim 2, wherein: One side of the die-bonding plate (3) is fixedly provided with a die-bonding suction nozzle (4), a negative pressure device is installed in the die-bonding plate (3), one end of the negative pressure device is fixedly connected with an air pipe (5), and the other end of the air pipe (5) is connected with the die-bonding suction nozzle (4).

4. The swing arm component for improving die-bonding stability as described in claim 3, characterized in that: The end face of the die-bonding plate (3) and the end face of the connecting plate (2) are mutually at an angle, and the upper surface of the die-bonding plate (3) is a smooth inclined surface.

5. The swing arm member for improving stability of die bonding according to claim 4, wherein: The material of the swing arm body (1) is high-strength aluminum alloy, and the edges thereof are subjected to rounding treatment.

6. The swing arm component for improving die-bonding stability as described in claim 5, characterized in that: An elastic buffer pad (6) is installed on the lower surface of the die-bonding plate (3).

7. A swing arm component for improving die-bonding stability as described in claim 6, characterized in that: First through grooves (8) are formed on the upper and lower surfaces of the die-bonding plate (3), and second through grooves (9) are formed on the two side surfaces of the die-bonding plate (3).

8. A swing arm component for improving die-bonding stability as described in claim 7, characterized in that: The shapes of the first through grooves (8) and the second through grooves (9) are circular.

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