Hot air convection carrier of chip reflow oven

Abstract

The hot air convection carrier of the chip reflow oven comprises a rectangular body, and carrier fixing holes are formed in the two ends of the body respectively so that the carrier can be positioned on a conveying chain. A sunken groove is formed between the two carrier fixing holes, a plurality of chip fixing positions which are arranged side by side are arranged in the sunken groove, a transversely-arranged chip bearing table is arranged in the middle of each chip fixing position, and air holes allowing airflow to pass through are formed in the two sides of each chip bearing table; the sum of the areas of the two air holes is more than five times of the area of the chip bearing table, upper supporting protrusions are arranged on the two sides of the air hole in the upper end respectively, and lower supporting protrusions are arranged on the two sides of the air hole in the lower end respectively. According to the hot air convection carrier of the chip reflow oven, the chip can be supported, the surfaces of the two sides of the chip can bear the effect of hot air, and therefore the convection effect of hot air flow on the surfaces of the two sides is achieved.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing, and in particular to a hot air convection carrier for chip reflow ovens. Background Technology

[0002] During chip manufacturing, various factors can lead to problems such as poor solder joint connections and cold solder joints. Therefore, after the initial soldering is completed, to ensure that all solder joints on the chip are firmly connected and to prevent short circuits, open circuits, or burnout caused by cold solder joints, the chip needs to be reheated and re-soldered in a reflow oven. Reflow ovens achieve higher chip quality, improve product yield, and the reflow soldering process further strengthens the solder joints after the initial soldering, thereby extending the chip's operational stability and lifespan.

[0003] Current chip reflow ovens include both closed and open types. Closed reflow ovens place a batch of chips inside a sealed enclosure, then shut down the oven and heat the interior to melt the solder joints. However, closed reflow ovens are inefficient and slow for processing large batches of chips, failing to meet the demands of high-volume chip reflow soldering. Open reflow ovens, on the other hand, do not have a closed space. They use tracks to carry and move the chips, heating them with high-temperature gas as they move forward. Therefore, an appropriate carrier structure is needed to support the chips.

[0004] Figure 1 This patent was developed for an integrated chip with a via in the middle, which is produced by our company. Utility Model Content

[0005] The technical problem to be solved by this utility model embodiment is to provide a hot air convection carrier for a chip reflow oven, which solves the problem of chip support in an open reflow oven where the chip is heated by gas.

[0006] To address the aforementioned technical problems, this utility model provides a hot air convection carrier for a chip reflow oven, comprising a body in a rectangular shape, with carrier fixing holes at both ends to position the carrier on a conveyor chain; a recessed groove between the two carrier fixing holes, containing several chip fixing positions arranged side-by-side; a horizontally positioned chip support platform at the center of each chip fixing position; air vents on both sides of the chip support platform to allow airflow, with the sum of the areas of the two air vents being more than five times the area of ​​the chip support platform; upper support protrusions on both sides of the upper air vents to support the upper sides of the chip; and lower support protrusions on both sides of the lower air vents to support the lower sides of the chip.

[0007] The distance between the two opposing upper support protrusions is less than the width of the top of the chip.

[0008] The distance between the two opposing lower support protrusions is less than the width of the bottom of the chip.

[0009] Vertical support ribs are formed between two adjacent chip mounting positions; both ends of each chip support platform are connected to the support ribs.

[0010] A vertical air passage is provided between the chip carrier platform and the support rib.

[0011] The chip carrier stage has a chip positioning protrusion on its upper part. The size of the chip positioning protrusion is smaller than the size of the chip carrier stage, and the height of the chip positioning protrusion is the same as the height of the upper surface of the body.

[0012] End positioning angles are provided at both ends of the sunken groove. The end positioning angles can cooperate with the positioning extrusion parts to squeeze and support the bottom of the chip.

[0013] An end positioning post is provided above the end positioning angle, and an extrusion block is installed on the end positioning post for extruding and positioning the chip from the side.

[0014] It also includes a silicon photocell cover block, which covers and is installed on the outside of the silicon photocell of the chip.

[0015] The silicon photocell cover block is U-shaped and is connected to both sides of the chip at the silicon photocell location by clamping.

[0016] The hot air convection carrier for the chip reflow oven provided by this utility model can support the chip, and through the design of the air hole structure, both sides of the chip can withstand the hot air, so that the hot air airflow on both sides forms a convection effect. There are basically no dead points in the convection of the chip as a whole, making the chip surface temperature more uniform during the reflow process. Furthermore, the design of the silicon photo wafer cover block can further protect the silicon photo wafer surface from dust contamination. Attached Figure Description

[0017] Figure 1 This is a planar structural diagram of the chip described in the background section of this invention.

[0018] Figure 2 This is a schematic diagram of the hot air convection carrier for the chip reflow oven described in an embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of the extrusion component described in an embodiment of the present invention.

[0020] In the picture:

[0021] 1. Body; 11. Vent hole; 12. Upper support protrusion; 13. Chip positioning protrusion; 14. Air passageway; 15. Lower support protrusion; 16. Chip carrier platform; 17. Silicon wafer cover block; 18. Upper positioning edge; 19. Carrier fixing hole; 20. End positioning post; 21. Chip positioning protrusion; 22. Support rib; 23. End positioning angle;

[0022] 2. Chip;

[0023] 3. Extruded parts. Detailed Implementation

[0024] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0025] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] like Figure 2-3As shown, this utility model provides a hot air convection carrier for a chip reflow oven, including a body 1, which is rectangular in shape, and has carrier fixing holes 19 at both ends to position the carrier on a conveyor chain. Connecting block structures can be provided on the conveyor chain corresponding to the carrier fixing holes 19, and the shapes of the connecting block structures are adapted to the carrier fixing holes 19 so that the connecting block structures can be inserted into the carrier fixing holes. A recessed groove is formed between the two carrier fixing holes 19, and several chip fixing positions are arranged side-by-side in the recessed groove. Each chip fixing position can fix one chip. The chip support platform 16 is horizontally positioned in the middle of the chip fixing location. The chip support platform 16 supports a portion of the chip that does not have circuitry or soldered components. Both sides of the chip support platform 16 have vents 11 that allow airflow, and the sum of the areas of the two vents 11 is more than five times the area of ​​the chip support platform 16, ensuring that most of the chip's surface can directly withstand the airflow. Upper support protrusions 12 are provided on both sides of the upper vents 11 to provide support for the upper sides of the chip, and lower support protrusions 15 are provided on both sides of the lower vents 11 to provide support for the lower sides of the chip. This technical solution of the present invention provides support for the chip in the middle through the chip support platform 16, at the upper end through the upper support protrusions 12, and at the lower end through the lower support protrusions 15, thus achieving a three-section support structure design for the chip. This ensures that the chip is supported by the carrier and can withstand the vertical convection of airflow, while also ensuring that the middle of the chip will not deform due to airflow.

[0028] The distance between the two opposing upper support protrusions 12 is less than the width of the top of the chip.

[0029] The distance between the two opposing lower support protrusions 15 is less than the width of the bottom of the chip.

[0030] Vertical support ribs 22 are formed between two adjacent chip fixing positions; both ends of each chip support platform 16 are connected to the support ribs 22.

[0031] A vertical air passage 14 is provided between the chip carrier platform 16 and the support rib 22.

[0032] The chip carrier stage 16 has a chip positioning protrusion 21 on its upper part. The size of the chip positioning protrusion 21 is smaller than that of the chip carrier stage 16, and the height of the chip positioning protrusion 21 is the same as the height of the upper surface of the body. The chip positioning protrusion can be inserted into the through hole in the middle of the chip, so that the chip carrier stage 16 can provide support for the area around the through hole, and the chip positioning protrusion can perform preliminary positioning of the chip.

[0033] At both ends of the recessed groove, there are end positioning angles 23. The end positioning angles can cooperate with the positioning extruder 3 to provide compression support for the bottom of the chip. The extruder 3 is a long strip-shaped component with both ends that can be inserted into the arc-shaped grooves of the end positioning angles 23. The extruder 3 has a U-shaped slot structure designed for each chip, so that each chip can be positioned.

[0034] An end positioning post 20 is provided above the end positioning angle, and an extrusion block is installed on the end positioning post 20 for extruding and positioning the chip from the side.

[0035] It also includes a silicon photocell cover block 17, which covers the outside of the silicon photocell of the chip.

[0036] The silicon photonics cover block 17 is U-shaped and is connected to both sides of the chip surface at the silicon photonics location by clamping. The U-shaped shape of the silicon photonics cover block 17 actually forms a U-shaped groove structure, which can clamp and cover the surface of the silicon photonics and can also be held on the chip surface on the back side of the silicon photonics, thereby forming protection for the silicon photonics.

[0037] The hot air convection carrier for the chip reflow oven provided by this utility model can support the chip, and through the design of the air hole structure, both sides of the chip can withstand the hot air, so that the hot air airflow on both sides forms a convection effect. There are basically no dead points in the convection of the chip as a whole, making the chip surface temperature more uniform during the reflow process. Furthermore, the design of the silicon photo wafer cover block can further protect the silicon photo wafer surface from dust contamination.

[0038] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A hot air convection carrier for a chip reflow oven, comprising a body, characterized in that, The main body is rectangular in shape, with carrier fixing holes at both ends to allow the carrier to be positioned on the conveyor chain. A recessed groove is located between the two carrier fixing holes, containing several chip fixing positions arranged side-by-side. Each chip fixing position has a horizontally positioned chip support platform in the center. Both sides of the chip support platform have air vents that allow airflow, and the combined area of ​​the two air vents is more than five times the area of ​​the chip support platform. Upper support protrusions are located on both sides of the upper air vents to support the upper sides of the chip, and lower support protrusions are located on both sides of the lower air vents to support the lower sides of the chip.

2. The hot air convection carrier for the chip reflow oven according to claim 1, characterized in that, The distance between the two opposing upper support protrusions is less than the width of the top of the chip.

3. The hot air convection carrier for the chip reflow oven according to claim 1, characterized in that, The distance between the two opposing lower support protrusions is less than the width of the bottom of the chip.

4. The hot air convection carrier for the chip reflow oven according to claim 1, characterized in that, Vertical support ribs are formed between two adjacent chip mounting positions; both ends of each chip support platform are connected to the support ribs.

5. The hot air convection carrier for the chip reflow oven according to claim 4, characterized in that, A vertical air passage is provided between the chip carrier platform and the support rib.

6. The hot air convection carrier for a chip reflow oven according to claim 1, characterized in that, The chip carrier stage has a chip positioning protrusion on its upper part. The size of the chip positioning protrusion is smaller than the size of the chip carrier stage, and the height of the chip positioning protrusion is the same as the height of the upper surface of the body.

7. The hot air convection carrier for a chip reflow oven according to claim 1, characterized in that, End positioning angles are provided at both ends of the sunken groove. The end positioning angles can cooperate with the positioning extrusion parts to squeeze and support the bottom of the chip.

8. The hot air convection carrier for a chip reflow oven according to claim 1, characterized in that, An end positioning post is provided above the end positioning angle, and an extrusion block is installed on the end positioning post for extruding and positioning the chip from the side.

9. The hot air convection carrier for a chip reflow oven according to claim 1, characterized in that, It also includes a silicon photocell cover block, which covers and is installed on the outside of the silicon photocell of the chip.

10. The hot air convection carrier for a chip reflow oven according to claim 9, characterized in that, The silicon photocell cover block is U-shaped and is connected to both sides of the chip at the silicon photocell location by clamping.

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