Cooling device and semiconductor process equipment

Abstract

The utility model provides a cooling device and semiconductor process equipment, and relates to the technical field of semiconductor equipment temperature control devices. The semiconductor process equipment comprises a process chamber and the cooling device, and a heating plate is arranged in the process chamber and used for heating the wafer below the heating plate; the cooling device is used for cooling the heating disc and comprises a water cooling disc, the water cooling disc is arranged in the process cavity and located above the heating disc, the water cooling disc is provided with a cooling water channel, and an electric cooling block is fixedly attached to the side, opposite to the heating disc, of the water cooling disc. When cooling is needed, for example, when the heating disc needs to be cooled, flowing cooling water in the electric cooling block and the water cooling disc of the cooling device act together, the efficiency of the electric cooling block is higher, and therefore the whole cooling device can rapidly cool the heating disc, and the cooling efficiency is higher. In addition, the flowing cooling water can provide an environment with a proper temperature for the electric cooling block, so that the electric cooling block can be prevented from being damaged due to overheating.

Description

Technical Field

[0001] This utility model relates to the technical field of temperature control devices for semiconductor equipment, and more specifically, to a cooling device and semiconductor process equipment. Background Technology

[0002] In the existing technology, a heating plate and a water-cooling plate are set in a sealed vacuum chamber and are fixed to each other. Before heating the wafer in the vacuum chamber, the cooling water in the water-cooling plate needs to be completely drained before the heating plate can be used to heat the wafer, which is quite cumbersome. After the wafer is heated, the water-cooling plate needs to be re-circulated to cool the heating plate and the wafer. The cooling efficiency of the water-cooling plate is relatively low. Utility Model Content

[0003] The first objective of this invention is to provide a cooling device to solve the technical problem of low cooling efficiency of water-cooled plates in the prior art.

[0004] The cooling device provided by this utility model is used to cool a heating plate. It includes a water-cooled plate, which is provided with cooling water channels, and an electric cooling block is fixedly attached to the side of the water-cooled plate opposite to the heating plate.

[0005] Furthermore, the end face of the water-cooling plate opposite to the heating plate is provided with a receiving groove, the receiving groove is matched with the electric cooling block, and the electric cooling block is housed in the receiving groove.

[0006] Furthermore, a heat-conducting plate is fixed to the end face of the water-cooling plate opposite to the heating plate, and the heat-conducting plate confines the electric cooling block within the receiving groove.

[0007] Furthermore, the receiving groove includes a first receiving groove disposed at the center of the end face of the water cooling plate and a plurality of second receiving grooves disposed around the first receiving groove;

[0008] The end face of the water cooling plate opposite to the heating plate is also provided with a wire passage groove; the wire passage groove and the second receiving groove are both connected to the first receiving groove, and the wire harness of the electric cooling block located in the second receiving groove extends to the outside of the water cooling plate through the first receiving groove and the wire passage groove in sequence.

[0009] Furthermore, a cross-shaped limiting rib is provided in the center of the first receiving groove, and an electric cooling block is provided in each of the four quadrants defined by the limiting rib;

[0010] And / or, each of the second receiving slots is provided with one of the electrocooling blocks, and the wiring harness of the electrocooling block is disposed close to the first receiving slot.

[0011] Furthermore, the first receiving groove is square, and two second receiving grooves are provided on the outside of each groove wall of the first receiving groove, and each second receiving groove is set at an angle to the corresponding groove wall.

[0012] Furthermore, the cooling device also includes a lifting mechanism, which includes a driving component located outside the process chamber.

[0013] The water-cooling plate is fixedly provided with a transmission rod, the top cover of the process chamber is provided with a first through hole, the transmission rod passes through the first through hole, and a sealing component is provided between the transmission rod and the top cover;

[0014] The drive unit raises and lowers the water-cooling plate via the transmission rod, so that the water-cooling plate is away from or close to the heating plate.

[0015] Furthermore, the water-cooling plate is also fixedly provided with an inlet rod having an inlet channel and an outlet rod having an outlet channel, the inlet rod and / or the outlet rod forming the transmission rod.

[0016] Furthermore, the sealing assembly includes a bellows, with a lower flange ring and an upper flange ring fixedly disposed at the bottom and top of the bellows, respectively. The lower flange ring is fixedly connected to the top cover, and a first sealing ring is provided between the two.

[0017] And / or, the outer circumferential surface of the transmission rod is provided with an annular protrusion, the annular protrusion is fixedly connected to the upper flange ring, and a second sealing ring is provided between the two.

[0018] Furthermore, the outer circumferential surface of the transmission rod is also provided with a groove, which is located above the bellows;

[0019] A fixing plate is also fitted around the transmission rod, and the fixing plate is secured to the slot by a set screw; the fixing plate is provided with fixing screws, and the fixing screws tightly abut the upper flange ring against the top of the annular protrusion.

[0020] Furthermore, the cooling device also includes a guide assembly, which includes a guide rod and a guide block. The guide rod is fixed to the lower flange ring or the top cover and is arranged parallel to the transmission rod. The guide block is fixedly connected to the upper flange ring or the fixing plate and is movably sleeved outside the guide rod.

[0021] Furthermore, the top of the guide rod is provided with a first limiting member, which includes one of a limiting cap and an upper limiting protrusion, for preventing the guide block from continuing to move upward;

[0022] And / or, the bottom of the guide rod is provided with a second limiting member, the second limiting member including one of a buffer limiting sleeve and a lower limiting protrusion, for preventing the guide block from continuing to move downward.

[0023] The cooling device provided by this utility model can produce the following beneficial effects:

[0024] The cooling device provided by this utility model not only has cooling water channels in its water-cooled plate, but also has an electrocooling block (i.e., a semiconductor refrigeration block) fixedly attached to the side opposite the heating plate. When cooling is required, such as when cooling the heating plate, the electrocooling block and the flowing cooling water in the water-cooled plate work together. The electrocooling block is more efficient, so the entire cooling device can quickly cool the heating plate. In other words, this utility model uses a combination of water cooling and electrocooling for cooling, resulting in higher overall cooling efficiency. Furthermore, the flowing cooling water provides a suitable temperature environment for the electrocooling block, thus preventing it from overheating and being damaged.

[0025] The second objective of this invention is to provide a semiconductor process apparatus to solve the technical problem of low cooling efficiency of water-cooled pans in the prior art.

[0026] The semiconductor process equipment provided by this utility model includes a process chamber and the aforementioned cooling device. The process chamber is provided with a heating plate for heating the wafer below it; the water-cooling plate is disposed in the process chamber and located above the heating plate.

[0027] This semiconductor process equipment has all the advantages of the aforementioned cooling device, so it will not be described in detail here. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0029] Figure 1 One of the partial structural schematic diagrams of the semiconductor process equipment provided in the embodiments of this utility model;

[0030] Figure 2 A second partial structural schematic diagram of the semiconductor process equipment provided in this embodiment of the present utility model;

[0031] Figure 3 A third partial structural schematic diagram of the semiconductor process equipment provided in this embodiment of the present utility model;

[0032] Figure 4 A partial cross-sectional view of a semiconductor process equipment provided in an embodiment of this utility model;

[0033] Figure 5 for Figure 4 A magnified view of a portion of the image;

[0034] Figure 6 A schematic diagram of the bottom structure of the water-cooling plate in the cooling device provided in this embodiment of the utility model;

[0035] Figure 7 A schematic diagram of the structure of the water-cooled plate and the electric cooling block in the cooling device provided in the embodiment of this utility model.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100 - Process chamber; 110 - Chamber body; 120 - Top cover;

[0038] 210 - Heating plate; 220 - Heating wire harness; 230 - Heating vacuum electrode;

[0039] 310-Water cooling plate; 311-Cooling water channel; 312-First receiving groove; 313-Second receiving groove; 314-Wire passage groove; 315-Limiting rib; 320-Water inlet rod; 321-Water inlet channel; 322-Annular protrusion; 323-Second annular groove; 324-Second sealing ring; 325-Slot; 330-Water outlet rod; 331-Water outlet channel; 340-Electrically cooled block; 350-Electrically cooled wire harness; 360-Electrically cooled vacuum electrode; 370-Heat-conducting plate;

[0040] 400 - Sealing assembly; 410 - Bellows; 420 - Lower flange ring; 421 - First annular groove; 422 - First sealing ring; 430 - Upper flange ring; 440 - Fixing plate; 450 - Set screw; 460 - Fixing screw;

[0041] 500 - Guide assembly; 510 - Guide rod; 520 - Guide block;

[0042] 610 - Limit cap; 620 - Buffer limit sleeve. Detailed Implementation

[0043] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of this utility model and are not intended to limit it.

[0044] This embodiment provides a cooling device and a semiconductor process equipment, wherein, as Figure 4As shown, the semiconductor process equipment includes a process chamber 100 and a cooling device. The process chamber 100 includes a cavity 110, and the cavity 110 has an open sealing cover with a top cover 120. A heating plate 210 is provided inside the process chamber 100 for heating a wafer (not shown) below it. The cooling device includes a water-cooled plate 310, which is located inside the process chamber 100 and above the heating plate 210, for cooling the heating plate 210 and the wafer. Of course, the process chamber 100 also includes components for driving the wafer closer to and away from the heating plate 210 or driving the heating plate 210 closer to and away from the wafer. Since these all employ existing technology, and to highlight the cooling device, they are not shown in the figures.

[0045] The cooling device provided in this embodiment is described in detail below:

[0046] like Figure 4 As shown, the cooling device provided in this embodiment has a water-cooled plate 310 with cooling channels 311, and an electric cooling block 340 is fixedly attached to the side of the water-cooled plate 310 opposite to the heating plate 210. The refrigerant in the cooling channels 311 can be water or other coolants, such as ethylene glycol solution.

[0047] The cooling device provided in this embodiment not only has cooling water channels 311 in its water-cooled plate 310, but also has an electrocooling block 340, i.e., a semiconductor cooling block, fixedly attached to the side opposite to the heating plate 210. When cooling is required, such as when cooling the heating plate 210, the electrocooling block 340 and the flowing cooling water in the water-cooled plate 310 work together. Among them, the electrocooling block 340 is more efficient. Therefore, the entire cooling device can quickly cool the heating plate 210. That is, this embodiment uses a combination of water cooling and electrocooling for cooling, and the overall cooling efficiency of the device is higher. In addition, the flowing cooling water can also provide a suitable temperature environment for the electrocooling block 340, thereby preventing the electrocooling block 340 from overheating and being damaged.

[0048] In this embodiment, as Figure 6 and Figure 7 As shown, the end face of the water-cooling plate 310 opposite to the heating plate 210 is provided with a receiving groove, which matches the electric cooling block 340, and the electric cooling block 340 is housed in the receiving groove. That is, the electric cooling block 340 is embedded in the receiving groove, and the end face of the electric cooling block 340 opposite to the heating plate 210 and the end face of the water-cooling plate 310 opposite to the heating plate 210 are flush. With this arrangement, both can make good contact with the heating plate 210, thereby facilitating the cooling of the heating plate 210.

[0049] It should be noted that although the cooling device in this embodiment is used for semiconductor process equipment, in other embodiments of this application, the cooling device is not limited to the process chamber 100 in which semiconductor process equipment is usually in a high vacuum, but can also be used for cooling needs in other vacuum or non-vacuum environments. In that case, the arrangement of the water cooling plate 310 and the electric cooling block 340 can be determined according to the structure of the heating element that contacts the cooling device. For example, the heating element has multiple protrusions or recesses on the side opposite to the water cooling plate 310. In order to correspond to the multiple protrusions or recesses, the electric cooling block 340 can be embedded in a receiving groove with a depth greater than its thickness or directly attached to the end face of the water cooling plate 310, so that while the water cooling plate 310 has the other end face portion with the electric cooling block 340 in contact with the heating element, the end face of the electric cooling block 340 can also contact the end face of the protrusion or the bottom face of the recess on the heating element, thereby ensuring the contact area and thus ensuring the cooling efficiency.

[0050] Specifically, in this embodiment, as Figure 6 and Figure 7 As shown, the receiving groove includes a first receiving groove 312 located at the center of the end face of the water cooling plate 310 and a plurality of second receiving grooves 313 arranged around the first receiving groove 312; the end face of the water cooling plate 310 opposite to the heating plate 210 is also provided with a wire passing groove 314; the wire passing groove 314 and the second receiving groove 313 are both connected to the first receiving groove 312, and the wire harness of the electric cooling block 340 located in the second receiving groove 313 extends to the outside of the water cooling plate 310 through the first receiving groove 312 and the wire passing groove 314 in sequence. In this configuration, by using the first receiving groove 312 located in the center and the second receiving groove 313 located around the periphery, as many electric cooling blocks 340 as possible can be arranged on the end faces of the water cooling plate 310 and the heating plate 210, thereby further improving the cooling efficiency of the cooling device. By connecting the second receiving groove 313 with the first receiving groove 312, the wire harness of the electric cooling block 340 embedded in the second receiving groove 313 can enter the first receiving groove 312 and then extend out from the wire passage groove 314 together with the wire harness of the electric cooling block 340 in the first receiving groove 312. This can greatly reduce the number of wire passage grooves 314, simplify the structure of the water cooling plate 310, and also make the wire harness of the electric cooling block 340, i.e., the electric cooling wire harness 350, more organized.

[0051] In this embodiment, as Figure 2 and Figure 4 As shown, one end of the electrocooling harness 350 is connected to the electrocooling block 340, and the other end is connected to the vacuum electrode on the top cover 120, i.e., the electrocooling vacuum electrode 360 ​​in the figure, thus leading out to the outside of the process chamber 100. The harness of the heating plate 210, i.e., the heating harness 220, is connected at one end to the heating plate 210, and the other end is connected to the heating vacuum electrode 230 on the top cover 120, thus leading out to the outside of the process chamber 100.

[0052] In this embodiment, continue as follows Figure 6 and Figure 7 As shown, a cross-shaped limiting rib 315 is provided in the center of the first receiving groove 312, and an electric cooling block 340 is provided in each of the four quadrants defined by the limiting rib 315; an electric cooling block 340 is provided in each of the second receiving grooves 313, and the wiring harness of the electric cooling block 340 is set close to the first receiving groove 312. In this configuration, the cross-shaped limiting rib 315 or the groove wall of each second receiving groove 313 can limit the position of each electric cooling block 340, thereby ensuring that the position of each electric cooling block 340 is stable and reliable, the cooling area is fixed, and the phenomenon of pulling on the wiring harness due to the position change of the electric cooling block 340 is effectively avoided.

[0053] Continue as Figure 6 and Figure 7 As shown, in this embodiment, the first receiving groove 312 is square, and two second receiving grooves 313 are provided on the outside of each groove wall of the first receiving groove 312. Each second receiving groove 313 is set at an angle to the corresponding groove wall. In this way, the size of the second receiving groove 313 is relatively large, so that a relatively large electric cooling block 340 can be embedded, increasing the proportion of the end face area of ​​the electric cooling block 340 on the side opposite to the water cooling plate 310 and the heating plate 210, thereby improving the cooling efficiency of the cooling device.

[0054] In this embodiment, as Figures 2 to 4 As shown, a heat-conducting plate 370 is also fixed on the end face opposite to the heating plate 210 of the water-cooling plate 310. The heat-conducting plate 370 confines the electric cooling block 340 within the receiving groove. Specifically, the heat-conducting plate 370 can be a graphite plate. In this configuration, in addition to limiting and fixing the electric cooling block 340, the graphite plate can also distribute heat, thereby enabling the heating plate 210 to be cooled more evenly. Located between the electric cooling block 340 and the heating plate 210, it prevents the electric cooling block 340 from directly contacting the high-temperature heating plate 210, and also provides a certain degree of protection for the electric cooling block 340.

[0055] In this embodiment, as Figures 1 to 5 As shown, the cooling device also includes a lifting mechanism, which includes a driving component located outside the process chamber 100; a transmission rod is fixedly mounted on the water cooling plate 310, and a first through hole is provided on the top cover 120 of the process chamber 100, through which the transmission rod passes, and a sealing assembly 400 is provided between the transmission rod and the top cover 120; the driving component raises and lowers the water cooling plate 310 via the transmission rod, so that the water cooling plate 310 is away from or close to the heating plate 210.

[0056] In this configuration, when wafer heating is required, the water-cooling plate 310 and its onboard cooling blocks 340 can be raised together by a drive mechanism, moving them away from the heating plate 210, so that only the heating plate 210 contacts the wafer. This eliminates the need to drain the cooling water channels 311, allowing the cooling water within the channels to cool the surrounding area. This prevents the area near the cooling water channels 311 from cycling between room temperature and high temperature, effectively avoiding deformation of the cooling water channels 311 due to high temperatures and damage from thermal fatigue, thus significantly extending the lifespan of the water-cooling plate 310. Furthermore, due to the cooling effect of the cooling water, the water-cooling plate 310 can be made of materials with high thermal conductivity and a normal operating temperature lower than the process temperature. For example, some high thermal conductivity alloys soften slightly above their normal operating temperature; for instance, 6061 alloy is used to cool stainless steel at 500°C, and 6061 alloy generally has an operating temperature below 400°C. Of course, there is no need to drain the cooling water passage 311, which simplifies the drainage-related structure and control.

[0057] Specifically, in this embodiment, as Figure 4 As shown, the water-cooling plate 310 is also fixedly provided with an inlet rod 320 having an inlet channel 321 and an outlet rod 330 having an outlet channel 331. The inlet rod 320 and / or the outlet rod 330 form a transmission rod. Of course, the inlet channel 321 is connected to the inlet end of the cooling water channel 311, and the outlet channel 331 is connected to the outlet end of the cooling water channel 311. In this configuration, one or both of the inlet rod 320 and the outlet rod 330 have both water conveying and transmission functions, eliminating the need for a separate transmission rod with only a single transmission function, thus simplifying the structure of the cooling device.

[0058] In this embodiment, the driving component can be a linear driving component such as a cylinder or an electric cylinder. In other embodiments of this application, the driving component can also be a rotary motor, in which case the motor and the transmission rod can be transmitted through a transmission mechanism such as a gear and rack.

[0059] Specifically, in this embodiment, as Figure 5 As shown, the sealing assembly 400 includes a bellows 410, with a lower flange ring 420 and an upper flange ring 430 fixedly attached to its bottom and top ends, respectively. The lower flange ring 420 is fixedly connected to the top cover 120, and a first sealing ring 422 is provided between them. The outer circumferential surface of the transmission rod is provided with an annular protrusion 322, which is fixedly connected to the upper flange ring 430, and a second sealing ring 324 is provided between them. In this configuration, the first sealing ring 422 provides a sealing function between the top cover 120 and the lower flange ring 420, and the second sealing ring 324 provides a sealing function between the annular protrusion 322 and the upper flange ring 430, thereby ensuring the sealing between the transmission rod and the top cover 120 during the lifting and lowering process.

[0060] More specifically, in this embodiment, continuing as follows Figure 5 As shown, the lower end face of the lower flange ring 420 is provided with a first annular groove 421, and the first sealing ring 422 is disposed in the first annular groove 421. It should be noted that in other embodiments of this application, the first annular groove 421 may also be disposed on the upper surface of the top cover 120, in which case the first sealing ring 422 can also perform the sealing function.

[0061] In this embodiment, continue as follows Figure 5 As shown, the upper flange ring 430 is located above the annular protrusion 322, and the annular protrusion 322 has an upward-facing second annular groove 323, with the second sealing ring 324 disposed within the second annular groove 323. Of course, in other embodiments of this application, the second annular groove 323 may also be located on the lower end face of the upper flange ring 430; alternatively, the upper flange ring 430 may also be located below the annular protrusion 322, with the second annular groove 323 located on the upper end face of the upper flange ring 430 or the lower end face of the annular protrusion 322. In this case, the second sealing ring 324 can also perform a sealing function.

[0062] In this embodiment, continue as follows Figure 5 As shown, the outer circumferential surface of the transmission rod is also provided with a groove 325, which can be a recess or a flat groove, and the groove 325 is located above the bellows 410; a fixing plate 440 is also sleeved on the outside of the transmission rod, and the fixing plate 440 is fixed to the groove 325 by a set screw 450; the fixing plate 440 is provided with a fixing screw 460, and the fixing screw 460 tightly abuts the upper flange ring 430 against the upper part of the annular protrusion 322. Of course, in other embodiments of this application, the upper flange ring 430 and the annular protrusion 322 can also be directly fixedly connected by fasteners such as fastening screws.

[0063] In this embodiment, as Figure 2 As shown, the cooling device also includes a guide assembly 500, which includes a guide rod 510 and a guide block 520. The guide rod 510 is fixed to the lower flange ring 420 or the top cover 120 and is arranged parallel to the transmission rod. The guide block 520 is fixedly connected to the upper flange ring 430 or the fixing plate 440 and is movably sleeved outside the guide rod 510. The guide assembly 500 plays a guiding and limiting role in the lifting movement, which helps to ensure the smoothness of the lifting movement.

[0064] Specifically, in this embodiment, the following continues... Figure 2As shown, the top of the guide rod 510 is provided with a first limiting member, which includes a limiting cap 610, for preventing the guide block 520 from continuing to move upward; the bottom of the guide rod 510 is provided with a second limiting member, which includes a buffer limiting sleeve 620, for preventing the guide block 520 from continuing to move downward. The limiting cap 610 is used to limit the upper stop point of the lifting movement, and the buffer limiting sleeve 620 is used to limit the lower stop point of the lifting movement. Furthermore, the buffer limiting sleeve 620 can also play a buffering role when the cooling device contacts the heating plate 210, thereby avoiding impact on the heating plate 210.

[0065] It should be noted that in other embodiments of this application, the first limiting member and the second limiting member are not limited to the above-described structural forms. For example, the first limiting member can also be an upper limit protrusion provided on the guide rod 510, and the second limiting member can also be a lower limit protrusion provided on the guide rod 510. That is, as long as it can limit the lifting and lowering movement stroke, it is acceptable. Preferably, the second limiting member has a buffering function.

[0066] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0067] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to the embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cooling device for cooling a heating plate (210), characterized in that, It includes a water-cooled plate (310), which is provided with cooling water channels (311), and an electric cooling block (340) is fixedly attached to the side of the water-cooled plate (310) opposite to the heating plate (210); The water-cooling plate (310) has a receiving groove on the end face opposite to the heating plate (210). The receiving groove matches the electric cooling block (340), and the electric cooling block (340) is housed in the receiving groove. A heat-conducting plate (370) is also fixed on the end face opposite to the heating plate (210) of the water-cooling plate (310), and the heat-conducting plate (370) confines the electric cooling block (340) within the receiving groove.

2. The cooling device according to claim 1, characterized in that, The receiving groove includes a first receiving groove (312) located at the center of the end face of the water cooling plate (310) and a plurality of second receiving grooves (313) arranged around the first receiving groove (312); The end face of the water cooling plate (310) opposite to the heating plate (210) is also provided with a wire passage groove (314); the wire passage groove (314) and the second receiving groove (313) are both connected to the first receiving groove (312), and the wire harness of the electric cooling block (340) located in the second receiving groove (313) extends to the outside of the water cooling plate (310) through the first receiving groove (312) and the wire passage groove (314) in sequence.

3. The cooling device according to claim 2, characterized in that, The first receiving groove (312) is provided with a cross-shaped limiting rib (315) in the center, and each of the four quadrants defined by the limiting rib (315) is provided with an electric cooling block (340). And / or, each of the second receiving slots (313) is provided with one of the electric cooling blocks (340), and the wiring harness of the electric cooling block (340) is arranged close to the first receiving slot (312).

4. The cooling device according to claim 3, characterized in that, The first receiving groove (312) is square, and two second receiving grooves (313) are provided on the outside of each groove wall of the first receiving groove (312), and each second receiving groove (313) is set at an angle to the corresponding groove wall.

5. The cooling device according to any one of claims 1-4, characterized in that, The cooling device further includes a lifting mechanism, which includes a driving component located outside the process chamber (100); The water cooling plate (310) is fixedly provided with a transmission rod, and the top cover (120) of the process chamber (100) is provided with a first through hole. The transmission rod passes through the first through hole and a sealing assembly (400) is provided between it and the top cover (120). The drive unit raises and lowers the water-cooling plate (310) via the transmission rod, so that the water-cooling plate (310) moves away from or closer to the heating plate (210).

6. The cooling device according to claim 5, characterized in that, The water cooling plate (310) is also fixedly provided with an inlet rod (320) having an inlet channel (321) and an outlet rod (330) having an outlet channel (331), the inlet rod (320) and / or the outlet rod (330) forming the transmission rod.

7. The cooling device according to claim 5, characterized in that, The sealing assembly (400) includes a bellows (410), with a lower flange ring (420) and an upper flange ring (430) fixed at the bottom and top of the bellows (410) respectively. The lower flange ring (420) is fixed to the top cover (120), and a first sealing ring (422) is provided between the two. And / or, the outer circumferential surface of the transmission rod is provided with an annular protrusion (322), the annular protrusion (322) is fixedly connected to the upper flange ring (430), and a second sealing ring (324) is provided between the two.

8. The cooling device according to claim 7, characterized in that, The outer circumferential surface of the transmission rod is also provided with a slot (325), which is located above the bellows (410); A fixing plate (440) is also fitted around the transmission rod. The fixing plate (440) is secured to the slot (325) by a set screw (450). The fixing plate (440) is provided with fixing screws (460), which tightly abut the upper flange ring (430) against the top of the annular protrusion (322).

9. The cooling device according to claim 8, characterized in that, The cooling device further includes a guide assembly (500), which includes a guide rod (510) and a guide block (520). The guide rod (510) is fixed to the lower flange ring (420) or the top cover (120) and is arranged parallel to the transmission rod. The guide block (520) is fixedly connected to the upper flange ring (430) or the fixing plate (440) and is movably sleeved outside the guide rod (510). The top of the guide rod (510) is provided with a first limiting member, which includes one of a limiting cap (610) and an upper limiting protrusion, for preventing the guide block (520) from continuing to move upward; and / or, the bottom of the guide rod (510) is provided with a second limiting member, which includes one of a buffer limiting sleeve (620) and a lower limiting protrusion, for preventing the guide block (520) from continuing to move downward.

10. A semiconductor process apparatus, characterized in that, The device includes a process chamber (100) and a cooling device according to any one of claims 1-9, wherein a heating plate (210) is provided in the process chamber (100) for heating the wafer below it; and a water cooling plate (310) is provided in the process chamber (100) and located above the heating plate (210).

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