Packaging device for large-area difference chip

Abstract

The utility model relates to the technical field of packaging devices for large-area difference chips, and discloses a packaging device for a large-area difference chip. Comprising a filtering assembly, a fixing assembly and a bottom plate, the bottom plate is arranged above the filtering assembly, an adjusting driving mechanism is arranged on the bottom plate and comprises a threaded rod, the threaded rod is rotationally arranged on the bottom plate, the threaded rod is connected with a sliding block in a threaded and penetrating mode, and a connecting plate is fixedly arranged above the sliding block; fixing and supporting mechanisms are arranged at the two ends of the connecting plate, each fixing and supporting mechanism comprises a first sliding plate, the connecting plate is fixedly connected with the first sliding plate, the first sliding plate is slidably connected with a sliding rod, a fixing plate is arranged on the bottom plate, and telescopic rods are fixedly connected between the fixing plate and the two ends of the first sliding plate; according to the utility model, through the arrangement of the fixing assembly, the plurality of chips are fixed at the same time, the flash is removed, and the flash removing efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of packaging devices for large-area differential chips, specifically a packaging device for large-area differential chips. Background Technology

[0002] With the booming development of the modern electronics industry, chip integration is constantly increasing and functions are becoming more complex, giving rise to large-area differential chips. However, the packaging of these chips faces many challenges. As chip size increases and significant height differences exist between different areas, traditional packaging devices struggle to ensure a good connection between the chip and the packaging substrate, easily leading to unstable connections and poor signal transmission. Simultaneously, the heat dissipation requirements of large-area differential chips are more urgent during the packaging process. Traditional packaging methods cannot meet the requirements for efficient heat dissipation, resulting in excessively high chip temperatures during operation, affecting performance and reliability. Furthermore, due to the uneven chip surface, defects such as bubbles and gaps are easily generated during the filling and molding of packaging materials, reducing packaging quality. Therefore, the development of a packaging device specifically designed for large-area differential chips is urgently needed to meet their unique packaging requirements and ensure stable operation and high-efficiency performance of the chips in various electronic devices.

[0003] However, while existing technologies can remove overflow from chip packages, they still have some shortcomings: they cannot fix the chip while removing overflow from the chip package. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a packaging device for large-area differential chips.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a packaging device for large-area differential chips, comprising a filter assembly, a fixing assembly, and a base plate. The base plate is disposed above the filter assembly, and an adjustment drive mechanism is disposed on the base plate. The adjustment drive mechanism includes a threaded rod, which is rotatably disposed on the base plate. The threaded rod is threaded through and connected to a slider. A connecting plate is fixedly disposed above the slider. Fixed support mechanisms are disposed at both ends of the connecting plate. The fixed support mechanism includes a sliding plate, which is fixedly connected to the connecting plate. The sliding plate is slidably connected to a sliding rod. A fixing plate is disposed on the base plate, and a telescopic rod is fixedly connected between the fixing plate and both ends of the sliding plate.

[0006] As a further description of the above technical solution:

[0007] The base plate has a second sliding groove in the middle. The threaded rod is rotatably mounted in the second sliding groove and the slider slides in the second sliding groove. A knob is fixedly mounted on one end of the threaded rod. When the knob is turned, the slider drives the fixed support mechanism to move.

[0008] As a further description of the above technical solution:

[0009] The fixed support mechanism is provided in four sets, the slider and connecting plate are provided in two sets, and each set of connecting plates is fixedly connected to two sets of fixed support mechanisms. Slide rods are fixedly provided on both sides above the base plate, and all four sets of slide plates slide on the slide rods.

[0010] As a further description of the above technical solution:

[0011] A rubber pad is provided on the inner side of the skateboard, and a fixing groove is provided on the inner side of the fixing plate. The fixing plate is connected to the support plate through the fixing groove on the inner side. The chip is placed above the support plate and the other end of the chip abuts against the rubber pad.

[0012] As a further description of the above technical solution:

[0013] The water tank is slidably connected to a filter plate via grooves on both sides of its inner wall.

[0014] As a further description of the above technical solution:

[0015] The filter plate is provided with two sets and several sets of small holes are evenly arranged on the top of the filter plate for filtering overflow.

[0016] As a further description of the above technical solution:

[0017] The water tank has a hollow interior for holding wastewater.

[0018] This utility model has the following beneficial effects:

[0019] 1. By adopting a structural design that includes a filter assembly, a fixing assembly, and a base plate, the packaging device becomes more stable and compact, facilitating operation and maintenance. The design of the adjustment drive mechanism, through the cooperation of threaded rods and sliders, allows the fixed support mechanism to be flexibly adjusted to adapt to the packaging needs of chips of different sizes.

[0020] 2. By setting evenly distributed small holes on two sets of filter plates, the filtration efficiency is improved, ensuring the clean filtration of overflow. The cavity inside the water tank is used to hold wastewater, which facilitates the collection and treatment of wastewater and meets environmental protection requirements. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a packaging device for large-area differential chips proposed in this utility model;

[0022] Figure 2 This is a partial schematic diagram of the adjustment drive mechanism of a packaging device for large-area differential chips proposed in this utility model.

[0023] Figure 3 This is a partial schematic diagram of a fixed support mechanism for a packaging device for large-area differential chips proposed in this utility model.

[0024] Figure 4 This is a partial schematic diagram of a filter component for a packaging device for large-area differential chips proposed in this utility model.

[0025] Legend:

[0026] 1. Filter assembly; 11. Water tank; 12. Slide 1; 13. Filter plate; 2. Fixing assembly; 201. Knob; 202. Threaded rod; 203. Slider; 204. Connecting plate; 207. Slide rod; 209. Slide 2; 205. Slide plate 1; 214. Support plate; 215. Fixing groove; 213. Chip; 210. Telescopic rod; 212. Fixing plate; 211. Rubber pad; 208. Base plate. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Reference Figures 1-4 This utility model provides a packaging device for large-area differential chips, including: a filter assembly 1, a fixing assembly 2, and a base plate 208. The base plate 208 is disposed above the filter assembly 1. An adjustment drive mechanism is disposed on the base plate 208. The adjustment drive mechanism includes a threaded rod 202, which is rotatably disposed on the base plate 208. The threaded rod 202 is threaded through and connected to a slider 203. A connecting plate 204 is fixedly disposed above the slider 203. Fixed support mechanisms are disposed at both ends of the connecting plate 204. The fixed support mechanism includes a sliding plate 205. The connecting plate 204 is fixedly connected to the sliding plate 205. The sliding plate 205 is slidably connected to a sliding rod 207. A fixing plate 212 is disposed on the base plate 208, and a telescopic rod 210 is fixedly connected between the fixing plate 212 and the two ends of the sliding plate 205.

[0029] In this embodiment, the filtering component and the fixing component constitute the packaging device for large-area difference chips involved in this application, realizing a packaging device for large-area difference chips. The packaging device for large-area difference chips in this application can be used for any application that requires fixing the chip and removing chip overflow. This application does not limit the specific chip type. Generally, the chip is existing technology and belongs to the commonly known technology in the field. It is only used and not improved. Therefore, its connection method is not described in detail.

[0030] In this embodiment, the threaded rod 202 is mounted on the base plate 208, and the slider 203 is driven to move along the threaded rod by rotation. The slider 203 is threadedly connected to the threaded rod 202 and moves up and down by the rotation of the threaded rod.

[0031] In this embodiment, the fixing plate 212 is disposed on the base plate 208 and is fixedly connected to both ends of the slide plate 205 by telescopic rods 210. The fixing plate 212 and the slide plate 205 are connected, and the position between the two is adjusted to accommodate chips of different sizes.

[0032] It should be noted that the rubber pad is made of butyl rubber. Butyl rubber pads have good compressibility, abrasion resistance and elongation. Butyl rubber is resistant to acids, alkalis and polar solvents, has high chemical stability, and has extremely low water permeability, giving it excellent water resistance.

[0033] Specifically, a second slide groove 209 is provided in the middle of the base plate 208. The threaded rod 202 is rotatably mounted in the second slide groove 209 and the slider 203 slides in the second slide groove 209. A knob 201 is fixedly mounted on one end of the threaded rod 202. When the knob 201 is turned, the slider 203 drives the fixed support mechanism to move.

[0034] In this embodiment, the second slide groove 209 is located in the middle of the base plate 208 to provide a limit for the threaded rod 202. The knob 201 is fixedly located at one end of the threaded rod 202 for manual operation. By turning the knob 201, the threaded rod 202 is rotated, thereby driving the slider 203 to move along the second slide groove 209.

[0035] Specifically, there are four sets of fixed support mechanisms, two sets of sliders 203 and connecting plates 204, and each set of connecting plates 204 is fixedly connected to two sets of fixed support mechanisms. Slide rods 207 are fixedly installed on both sides above the base plate 208, and all four sets of slide plates 205 slide on the slide rods 207.

[0036] In a preferred embodiment, each set of connecting plates 204 is fixedly connected to two sets of fixed support mechanisms, so that the two sets of fixed support mechanisms work together. The slide plate 205 slides on the slide rod 207, so that the device can adapt to chips of different sizes and shapes and fix them.

[0037] Specifically, a rubber pad 211 is provided on the inner side of the slide plate 205, and a fixing groove 215 is provided on the inner side of the fixing plate 212. The fixing plate 212 is connected to the support plate 214 through the fixing groove 215 on the inner side. The chip 213 is located above the support plate 214 and the other end of the chip 213 abuts against the rubber pad 211.

[0038] It should be noted that the inner side of the slide plate 205 is provided with a rubber pad 211, which plays a role in shock absorption for the chip 213. The support plate 214 is connected by a fixing slot 215, so that the support plate 214 can be fixed on the fixing plate 212, ensuring the stability of the chip during the packaging process.

[0039] Specifically, the water tank 11 is slidably connected to the filter plate 13 via the sliding grooves 12 provided on both sides of the inner wall.

[0040] As a preferred embodiment, the filter plate 13 can slide freely along the slide groove 12 within the water tank 11, making it convenient for the user to adjust the position of the filter plate as needed.

[0041] Specifically, the filter plate 13 is provided with two sets and several sets of small holes are evenly arranged on the top of the filter plate 13 for filtering overflow.

[0042] It should be noted that the filter plates 13 are set in two groups, which improves the filtration efficiency. The small holes on the filter plates 13 prevent solid particles in the overflow material from passing through.

[0043] Specifically, the interior of water tank 11 is hollow and used to hold wastewater.

[0044] In this embodiment, by storing wastewater in the water tank 11, untreated wastewater can be prevented from being directly discharged into the environment, thereby reducing environmental pollution.

[0045] In use, the operator first places the chip 213 on the support plate 214 to support it; then, the operator turns the knob 201, which drives the threaded rod 202 to rotate, and the slider 203 slides along the second slide groove 209; the sliding of the second slide groove 209 will cause the two sets of sliding plates 205 to slide along the slide rod 207; during the sliding process, the telescopic rod 210 retracts, and the sliding plate 205 approaches the fixing plate 212. During the approach process, the sliding plate 205 clamps the chip 213 in the fixing groove 215, and the rubber pad 211 protects the chip 213; the four sets of fixing support mechanisms can work simultaneously when the knob 201 is turned to fix multiple chips 213.

[0046] This utility model discloses a packaging device for large-area chips. By controlling the rotation of the threaded rod with a knob, the precise movement of the slider is achieved, thereby adjusting the position of the slide plate to ensure accurate chip positioning. Four sets of fixing support mechanisms can work simultaneously, allowing multiple chips to be fixed at the same time, which improves packaging efficiency. Rubber pads provide protection for the chips, preventing damage to the chips during clamping and improving chip safety.

[0047] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A packaging device for large-area differential chips, characterized in that: The system includes a filter assembly (1), a fixing assembly (2), and a base plate (208). The base plate (208) is provided above the filter assembly (1). An adjustment drive mechanism is provided on the base plate (208). The adjustment drive mechanism includes a threaded rod (202). The threaded rod (202) is rotatably mounted on the base plate (208). The threaded rod (202) is threaded through and connected to a slider (203). A connecting plate (204) is fixedly provided above the slider (203). Fixed support mechanisms are provided at both ends of the connecting plate (204). The fixed support mechanism includes a sliding plate (205). The connecting plate (204) is fixedly connected to the sliding plate (205). The sliding plate (205) is slidably connected to a sliding rod (207). A fixing plate (212) is provided on the base plate (208), and a telescopic rod (210) is fixedly connected between the fixing plate (212) and the two ends of the sliding plate (205).

2. The packaging apparatus for large-area differential chips according to claim 1, characterized in that: The base plate (208) is provided with a second slide groove (209) in the middle. The threaded rod (202) is rotatably mounted in the second slide groove (209) and the slider (203) slides in the second slide groove (209). A knob (201) is fixedly mounted on one end of the threaded rod (202). When the knob (201) is turned, the slider (203) drives the fixed support mechanism to move.

3. The packaging apparatus for large-area differential chips according to claim 2, characterized in that: The fixed support mechanism is provided in four sets, the slider (203) and the connecting plate (204) are provided in two sets, and each set of connecting plate (204) is fixedly connected to two sets of fixed support mechanisms. The bottom plate (208) is fixedly provided with sliding rods (207) on both sides above, and the four sets of sliding plates (205) slide on the sliding rods (207).

4. The packaging apparatus for large-area differential chips according to claim 3, characterized in that: A rubber pad (211) is provided on the inner side of the slide plate (205), and a fixing groove (215) is provided on the inner side of the fixing plate (212). The fixing plate (212) is connected to the support plate (214) through the fixing groove (215) provided on the inner side. The chip (213) is located above the support plate (214) and the other end of the chip (213) abuts against the rubber pad (211).

5. A packaging apparatus for large-area differential chips according to claim 4, characterized in that: The water tank (11) is slidably connected to a filter plate (13) via a sliding groove (12) provided on both sides of the inner wall.

6. A packaging apparatus for large-area differential chips according to claim 5, characterized in that: The filter plate (13) is provided with two sets and several sets of small holes are evenly arranged on the top of the filter plate (13) for filtering overflow.

7. A packaging device for large-area differential chips according to claim 6, characterized in that: The water tank (11) has a hollow interior for holding wastewater.

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