Chip heat dissipation device

Abstract

The utility model discloses a chip heat dissipation device, which belongs to the technical field of chip heat dissipation and comprises a main board, four threaded cylinders are symmetrically embedded and fixed on the top side of the main board, a heat conducting plate is horizontally placed on the top side of the main board, bolts are in threaded connection between the threaded cylinders and the heat conducting plate, a chip is embedded and mounted in the middle of the top side of the main board, and the chip is connected with the heat conducting plate through bolts. Silicone grease is attached to the middle of the bottom side of the heat conducting plate, copper sheets are evenly embedded in the middle of the top side of the heat conducting plate at intervals, the bottom ends of the copper sheets are jointly and fixedly connected with a fixing frame, a fan is slidably connected to the top side of the fixing frame, four covering plates are fixedly connected to the fixing frame in a bilateral symmetry mode, and fixing columns are fixedly connected to the middles of the bottom sides of the covering plates. According to the heat dissipation device, the installation complexity of the heat dissipation device can be effectively reduced, the installation convenience of the heat dissipation device is greatly improved, and the heat dissipation device has certain practicability.

Description

Technical Field

[0001] This utility model relates to a chip heat dissipation device, specifically a chip heat dissipation device, and belongs to the field of chip heat dissipation technology. Background Technology

[0002] Chip heat dissipation devices are heat dissipation equipment installed on electronic chips or integrated circuits. Their purpose is to effectively conduct and dissipate the heat generated by the chip into the surrounding environment. Their function is to conduct the heat from the chip to the surface of the heat sink through thermally conductive materials, and then dissipate the heat through the heat sink's heat dissipation area and methods. This maintains the chip's operation within a safe operating temperature range, keeps the chip's temperature stable, and improves equipment performance and reliability. However, many existing heat dissipation devices are usually fixed with several screws. Due to the small size of the screws, misalignment or misalignment often occurs, making the installation of the heat dissipation device cumbersome. This invention can effectively reduce the complexity of heat dissipation device installation and significantly improve its ease of installation, thus possessing considerable practicality. Utility Model Content

[0003] The purpose of this invention is to provide a chip heat dissipation device to solve the above problems. It can effectively reduce the complexity of heat dissipation device installation and greatly improve the ease of installation, which has certain practicality.

[0004] This utility model achieves the above-mentioned objective through the following technical solution: a chip heat dissipation device, comprising a motherboard, characterized in that: four threaded cylinders are symmetrically fitted and fixed on the top side of the motherboard; a heat-conducting plate is horizontally placed on the top side of the motherboard; bolts are threadedly connected between the threaded cylinders and the heat-conducting plate; a chip is fitted and installed in the middle of the top side of the motherboard; silicone grease is adhered to the middle of the bottom side of the heat-conducting plate; copper sheets are evenly spaced and fitted in the middle of the top side of the heat-conducting plate; a fixing frame is fixedly connected to the bottom end of the copper sheets; a fan is slidably connected to the top side of the fixing frame; four cover plates are symmetrically fixedly connected to the left and right sides of the fixing frame; a fixing post is fixedly connected to the middle of the bottom side of each cover plate; and a snap ring is fixedly connected to the bottom end of each fixing post at intervals.

[0005] Preferably, four hollow cylinders are symmetrically fixedly connected to the top side of the heat-conducting plate, and springs are fixedly connected to the inner wall of the bottom end of the hollow cylinders. A lifting plate is fixedly connected to the top end of the springs, and the lifting plate is slidably connected to the inner wall of the hollow cylinder.

[0006] Preferably, the top side of the lifting plate is symmetrically fixedly connected with a fixing plate, and two buckle plates are rotatably connected at intervals on the side of the fixing plate near the fixing column. Two No. 1 rotators are fixedly connected at intervals on the side of the fixing plate near the fixing column.

[0007] Preferably, each of the first rotators is rotatably connected to an elastic telescopic rod in the middle, and each of the elastic telescopic rods is rotatably connected to a second rotator at its top. The top side of each second rotator is fixedly connected to the bottom side of the buckle plate.

[0008] The beneficial effects of this utility model are as follows: By setting a fixed frame, when the fixed frame and copper sheet are placed on the upper side of the heat-conducting plate, the cover plate will drive the fixed column to insert into the hollow cylinder, causing the lifting plate to compress the spring and move downward. During this process, the fixed column will drive the buckle ring to move downward together and touch the buckle plate, causing the buckle plate to compress the elastic telescopic rod through the second rotating device. At this time, the elastic telescopic rod will become shorter, and the angle between the fixed plate and the buckle plate will decrease, so that the buckle ring passes over the buckle plate and is located on the lower side of the buckle plate. At this time, due to the elastic effect of the elastic telescopic rod, the buckle plate will reset and be located on the upper side of the buckle ring. The buckle plate will give the buckle ring a downward force and lock the buckle ring, so that the fixed column cannot be pulled out of the hollow cylinder. This can fix the position of the hollow cylinder and reduce the overall number of screws used in the heat dissipation device, thereby reducing the complexity of heat dissipation device installation and improving the ease of installation of heat dissipation device. Attached Figure Description

[0009] Figure 1 This is a top view of the structure of this utility model;

[0010] Figure 2 This is a front view structural diagram of the present utility model;

[0011] Figure 3 This is a frontal cross-sectional view of the present invention.

[0012] Figure 4 This is a schematic diagram of the internal structure of the hollow cylinder in this utility model.

[0013] Figure 5 This is a front view schematic diagram of the elastic telescopic rod in this utility model;

[0014] In the diagram: 1. Mainboard, 2. Threaded cylinder, 3. Heat-conducting plate, 4. Bolt, 5. Chip, 6. Thermal grease, 7. Fixing frame, 8. Copper sheet, 9. Fan, 10. Cover plate, 11. Fixing column, 12. Clip ring, 13. Hollow cylinder, 14. Spring, 15. Lifting plate, 16. Fixing plate, 17. Clip plate, 18. Rotator No. 1, 19. Elastic telescopic rod, 20. Rotator No. 2. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Please see Figure 1-5 As shown, a chip heat dissipation device includes a motherboard 1, characterized in that: four threaded cylinders 2 are symmetrically fitted and fixed on the top side of the motherboard 1; a heat-conducting plate 3 is horizontally placed on the top side of the motherboard 1; bolts 4 are threadedly connected between the threaded cylinders 2 and the heat-conducting plate 3; a chip 5 is fitted and installed in the middle of the top side of the motherboard 1; thermal grease 6 is attached to the middle of the bottom side of the heat-conducting plate 3; copper sheets 8 are evenly spaced and fitted in the middle of the top side of the heat-conducting plate 3; and a fixing frame 7 is fixedly connected to the bottom end of the copper sheets 8. A fan 9 is slidably connected to the top side of the fixed frame 7. Four cover plates 10 are symmetrically fixed to the left and right sides of the fixed frame 7. A fixed post 11 is fixedly connected to the bottom center of each cover plate 10. A buckle ring 12 is fixedly connected to the bottom end of the fixed post 11 at intervals. Bolts 4 are used to fix the threaded cylinder 2 and the heat-conducting plate 3. Silicon grease 6 is used for heat conduction. The fan 9 is used to dissipate heat from the copper sheet 8. There is no connection between the fixed post 11 and the lifting plate 15. The buckle ring 12 is used to lock the fixed post 11, so that the fixed frame 7 is fixed to the heat-conducting plate 3.

[0017] As a technical optimization of this utility model, four hollow cylinders 13 are symmetrically fixedly connected to the top side of the heat-conducting plate 3. A spring 14 is fixedly connected to the inner wall of the bottom end of the hollow cylinder 13. A lifting plate 15 is fixedly connected to the top end of the spring 14. The lifting plate 15 is slidably connected to the inner wall of the hollow cylinder 13. The spring 14 is used to limit the excessive downward movement of the lifting plate 15.

[0018] As a technical optimization of this utility model, the top side of the lifting plate 15 is symmetrically and fixedly connected with a fixing plate 16. The side of the fixing plate 16 near the fixing column 11 is rotatably connected with two buckle plates 17 at intervals. The side of the fixing plate 16 near the fixing column 11 is fixedly connected with two first rotators 18 at intervals.

[0019] As a technical optimization of this utility model, the middle part of the first rotator 18 is rotatably connected to an elastic telescopic rod 19, the top of the elastic telescopic rod 19 is rotatably connected to a second rotator 20, and the top side of the second rotator 20 is fixedly connected to the bottom side of the buckle plate 17.

[0020] As a technical optimization of this utility model, in use, the chip 5 is first embedded and installed in the motherboard 1, then the heat-conducting plate 3 carrying the thermal grease 6 is placed on the motherboard 1, and the threaded cylinder 2 and the heat-conducting plate 3 are fixed by bolts 4. Then, the fixing frame 7 and the copper sheet 8 are embedded and placed on the upper side of the middle of the copper sheet 3. At this time, the fixing post 11 will be inserted into the hollow cylinder 13, causing the lifting plate 15 to compress the spring 14 and move downward. During this process, the fixing post 11 will drive the buckle ring 12 to move downward together and touch the buckle plate 17, so that the buckle plate 17 passes through the second rotating device 2. When the elastic telescopic rod 19 is compressed, it will become shorter and the angle between the fixing plate 16 and the buckle plate 17 will decrease, causing the buckle ring 12 to pass over the buckle plate 17 and be located below the buckle plate 17. At this time, due to the elasticity of the elastic telescopic rod 19, the buckle plate 17 will be reset and located above the buckle ring 12. The buckle plate 17 will give the buckle ring 12 a downward force and lock the buckle ring 12, so that the fixing column 11 cannot be pulled out from the hollow cylinder 13. This can fix the position of the hollow cylinder 7. Finally, the fan 9 is slidably installed on the top side of the fixing frame 7 from top to bottom.

[0021] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A chip heat dissipation device, comprising a motherboard (1), characterized in that: Four threaded cylinders (2) are symmetrically fitted and fixed on the top side of the main board (1). A heat-conducting plate (3) is horizontally placed on the top side of the main board (1). Bolts (4) are threadedly connected between the threaded cylinders (2) and the heat-conducting plate (3). A chip (5) is fitted and installed in the middle of the top side of the main board (1). Silicon grease (6) is attached to the middle of the bottom side of the heat-conducting plate (3). Copper sheets (8) are evenly spaced and fitted in the middle of the top side of the heat-conducting plate (3). A fixing frame (7) is fixedly connected to the bottom end of the copper sheets (8). A fan (9) is slidably connected to the top side of the fixing frame (7). Four cover plates (10) are symmetrically fixed to the left and right sides of the fixing frame (7). A fixing post (11) is fixedly connected to the middle of the bottom side of each cover plate (10). A buckle ring (12) is fixedly connected to the bottom end of the fixing post (11) at intervals.

2. The chip heat dissipation device according to claim 1, characterized in that: Four hollow cylinders (13) are symmetrically fixedly connected to the top side of the heat-conducting plate (3). A spring (14) is fixedly connected to the inner wall of the bottom end of the hollow cylinder (13). A lifting plate (15) is fixedly connected to the top end of the spring (14). The lifting plate (15) is slidably connected to the inner wall of the hollow cylinder (13).

3. The chip heat dissipation device according to claim 2, characterized in that: The top side of the lifting plate (15) is symmetrically fixed with a fixing plate (16). The fixing plate (16) is rotatably connected with two buckle plates (17) at intervals on the side near the fixing column (11). The fixing plate (16) is also fixedly connected with two No. 1 rotators (18) at intervals on the side near the fixing column (11).

4. The chip heat dissipation device according to claim 3, characterized in that: The middle part of the first rotator (18) is rotatably connected to an elastic telescopic rod (19), and the top of the elastic telescopic rod (19) is rotatably connected to a second rotator (20). The top side of the second rotator (20) is fixedly connected to the bottom side of the buckle plate (17).

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