Anti-interference high-heat-dissipation seven-layer circuit board

Abstract

The utility model provides an anti-interference high-heat-dissipation seven-layer circuit board, which sequentially comprises a conductive layer, a first insulating layer, a power supply layer, a second insulating layer, a grounding layer, a third insulating layer and a metal base layer from top to bottom, and graphene composite films are uniformly distributed and embedded on the edges of the sides of the metal base layer in order; a snakelike heat dissipation channel is formed in one side surface, close to the third insulating layer, of the metal base layer, and the snakelike heat dissipation channel is filled with a heat-conducting silicone grease layer; a heat conduction block is arranged at the position, away from the snake-shaped heat dissipation channel and the circuit area, of the metal base layer, and the heat conduction block is arranged close to the high heat dissipation area of the circuit board; a heat conduction block penetrates through the third insulating layer and is in contact with the grounding layer in an attached manner; the first insulating layer is provided with a plurality of honeycomb-shaped hexagonal grooves, and the honeycomb-shaped hexagonal grooves are filled with ferrite filling layers. And an anodic oxide layer is arranged on one side surface, far away from the third insulating layer, of the metal base layer. And the anti-interference and anti-corrosion functions are good, and the heat dissipation function is high.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a seven-layer circuit board with high heat dissipation and anti-interference properties. Background Technology

[0002] Chinese Patent Publication No. CN218976936U, published on May 5, 2023, discloses a corrosion-resistant PCB circuit board with a long service life. The board includes an aluminum-based heat-conducting base. Support columns are threaded to both ends of the top of the base, and connecting screws are threaded to the top of each column. A protective top plate is fixedly mounted on the top of each column using these screws. Heat dissipation fins are fixedly connected to both the front and rear sides of the base. This invention solves the problems of existing PCB circuit boards lacking protective structures, easily damaged by accidental impacts or pressure, generating heat during operation leading to increased circuit board temperature, and having insufficient corrosion resistance, thus affecting the circuit board's quality and lifespan. In practical applications, the existing technology has the following drawbacks: while it provides corrosion protection to the circuit board surface by coating an anti-corrosion layer on the outside of the high-temperature resistant layer, the sides of the circuit board are also susceptible to corrosion from moisture and salt spray during actual use, leading to decreased heat dissipation performance and weak anti-interference capabilities. Therefore, improvements are urgently needed. Utility Model Content

[0003] Based on this, the purpose of this utility model is to provide an anti-interference, high heat dissipation seven-layer circuit board with good anti-interference and anti-corrosion functions, and with high heat dissipation function.

[0004] This invention provides a seven-layer circuit board with high heat dissipation and anti-interference properties. From top to bottom, it comprises a conductive layer, a first insulating layer, a power layer, a second insulating layer, a ground layer, a third insulating layer, and a metal base layer. Graphene composite films are evenly distributed and embedded along the edges of each side of the metal base layer. A serpentine heat dissipation channel is formed on the side of the metal base layer facing the third insulating layer, and this channel is filled with a thermally conductive silicone grease layer. A heat-conducting block is positioned on the metal base layer, avoiding the serpentine heat dissipation channel and the circuit area, and is located near the high heat dissipation area of ​​the circuit board. The heat-conducting block penetrates the third insulating layer and is in contact with the ground layer. The first insulating layer has several honeycomb-shaped hexagonal grooves, each filled with a ferrite filling layer. An anodized layer is formed on the side of the metal base layer away from the third insulating layer.

[0005] Preferably, the metal base layer is an aluminum alloy base layer.

[0006] Preferably, the distance between two adjacent graphene composite films on the same side is set to 50 mm, and the width of the graphene composite film is set to 1 mm.

[0007] Preferably, the serpentine heat dissipation channel has a width of 0.5 mm and a depth of 2 mm.

[0008] Preferably, the distance between two adjacent honeycomb hexagonal slots is set to be greater than 0.5 mm.

[0009] Preferably, the ferrite filling layer is configured as a mixture of ferrite slurry and silicon nitride fiber.

[0010] The beneficial effects of this utility model are as follows: Graphene composite films are evenly and orderly embedded on each side edge of the metal substrate, significantly improving the heat dissipation efficiency of the circuit board edge and giving the side of the pad good anti-corrosion performance; a serpentine heat dissipation channel is opened on the side of the metal substrate facing the third insulating layer, which increases the heat dissipation efficiency by increasing the surface area. The serpentine heat dissipation channel is filled with a thermally conductive silicone grease layer, which can compensate for the contact thermal resistance caused by insufficient processing precision of the serpentine heat dissipation channel, forming a continuous heat conduction path. It works with the graphene composite film to form a dual heat dissipation path from the edge to the center, realizing the synergy of rapid lateral diffusion and vertical conduction of heat; ferrite filling layers are filled in the honeycomb hexagonal grooves to improve the electromagnetic interference suppression effect. The ferrite filling layer enhances the absorption of high-frequency signals and reduces the coupling between signal layers; a heat-conducting block is set to vertically conduct the heat from the high-heat area of ​​the chip to the metal substrate, reducing the interface thermal resistance; an anodized layer is set on the side of the metal substrate away from the third insulating layer, providing dual protection of corrosion resistance and surface insulation. Attached Figure Description

[0011] Figure 1 This is a cross-sectional view of the present invention.

[0012] Figure 2 This is a top view of the metal base layer.

[0013] The attached figures are labeled as follows: conductive layer 10, first insulating layer 11, power supply layer 12, second insulating layer 13, grounding layer 14, third insulating layer 15, metal base layer 16, ferrite filling layer 17, serpentine heat dissipation channel 19, heat-conducting block 20, graphene composite film 18, and anodic oxide layer 21. Detailed Implementation

[0014] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with specific embodiments and accompanying drawings.

[0015] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0016] Please refer to Figure 1-2 As shown, this utility model provides an anti-interference, high heat dissipation seven-layer circuit board, which includes, from top to bottom, a conductive layer 10, a first insulating layer 11, a power layer 12, a second insulating layer 13, a ground layer 14, a third insulating layer 15, and a metal base layer 16. Graphene composite films 18 are evenly distributed and embedded on each side edge of the metal base layer 16. A serpentine heat dissipation channel 19 is formed on the side of the metal base layer 16 facing the third insulating layer 15, and the serpentine heat dissipation channel 19 is filled with a thermally conductive silicone grease layer. A heat-conducting block 20 is set on the metal base layer 16, avoiding the serpentine heat dissipation channel 19 and the circuit area, and is set close to the high heat dissipation area of ​​the circuit board. The heat-conducting block 20 penetrates the third insulating layer 15 and is in contact with the ground layer 14. The first insulating layer 11 has several honeycomb hexagonal grooves, and each honeycomb hexagonal groove is filled with a ferrite filling layer 17. An anodized layer 21 is formed on the side of the metal base layer 16 away from the third insulating layer 15.

[0017] The metal substrate 16 is an aluminum alloy substrate. The distance between two adjacent graphene composite films 18 on the same side is set to 50 mm, and the width of the graphene composite film 18 is set to 1 mm. The serpentine heat dissipation channel 19 has a width of 0.5 mm and a depth of 2 mm. The distance between two adjacent honeycomb hexagonal grooves is set to be greater than 0.5 mm. The ferrite filling layer 17 is a layer of ferrite slurry and silicon nitride fiber hybrid material.

[0018] During production, the metal substrate is first pretreated. A serpentine heat dissipation channel is processed on the aluminum alloy substrate using an ultraviolet laser cutting machine. The pre-cut graphene composite film is then embedded into the substrate edge grooves at 50mm intervals using a hot pressing process. Silicon-based conductive adhesive is coated at the interface to reduce contact thermal resistance. A dense Al2O3 layer is generated using sulfuric acid electrolyte, followed by sealing treatment to improve corrosion resistance. A honeycomb hexagonal groove is etched on the first insulating layer of FR-4 material using a CO2 laser. A ferrite-silicon nitride mixed slurry is injected using a vacuum grouting process, and after curing, a rigid filling layer is formed. The conductive layer, copper power layer, and ground layer are then stacked sequentially, and a vacuum hot press is used to achieve bubble-free bonding of each layer. A high thermal conductivity silicone grease is injected using a precision dispensing machine, and vacuum debubbling is used to ensure a filling rate >98%. A pre-drilled hole is made in the metal substrate to insert a thermally conductive block, which can be made of copper or graphene. Reflow soldering is used to achieve a metallurgical bond with the ground layer. After all layers are aligned, they are sent to a vacuum press. Finally, surface treatment and testing are performed.

[0019] In this embodiment, graphene composite films are evenly and systematically embedded on each side edge of the metal substrate, significantly improving the heat dissipation efficiency of the circuit board edge and giving the side of the pad good corrosion resistance. A serpentine heat dissipation channel is formed on the side of the metal substrate facing the third insulating layer, which increases the heat dissipation efficiency by increasing the surface area. The serpentine heat dissipation channel is filled with a thermally conductive silicone grease layer, which can compensate for the contact thermal resistance caused by insufficient processing precision of the serpentine heat dissipation channel, forming a continuous heat conduction path. Together with the graphene composite film, it forms a dual heat dissipation path from the edge to the center, realizing the synergy of rapid lateral diffusion and vertical conduction of heat. Ferrite filling layers are filled in the honeycomb hexagonal grooves to improve the electromagnetic interference suppression effect. The ferrite filling layer enhances the absorption of high-frequency signals and reduces the coupling between signal layers. A heat-conducting block is set to vertically conduct the heat from the high-heat area of ​​the chip to the metal substrate, reducing the interface thermal resistance. An anodized layer is set on the side of the metal substrate away from the third insulating layer, providing dual protection of corrosion resistance and surface insulation.

[0020] The above-described embodiments are merely one implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A seven-layer circuit board with high heat dissipation and anti-interference properties, comprising, from top to bottom, a conductive layer (10), a first insulating layer (11), a power layer (12), a second insulating layer (13), a ground layer (14), a third insulating layer (15), and a metal base layer (16), characterized in that: The metal substrate (16) has graphene composite films (18) evenly and orderly embedded on each side edge; a serpentine heat dissipation channel (19) is opened on the side of the metal substrate (16) facing the third insulating layer (15), and the serpentine heat dissipation channel (19) is filled with a thermally conductive silicone grease layer; a heat-conducting block (20) is arranged on the metal substrate (16) avoiding the serpentine heat dissipation channel (19) and the circuit area, and the heat-conducting block (20) is arranged close to the high heat dissipation area of ​​the circuit board; the heat-conducting block (20) penetrates the third insulating layer (15) and is in contact with the ground layer (14); the first insulating layer (11) has a plurality of honeycomb hexagonal grooves, and each honeycomb hexagonal groove is filled with a ferrite filling layer (17); an anodized layer (21) is arranged on the side of the metal substrate (16) away from the third insulating layer (15).

2. The anti-interference, high heat dissipation seven-layer circuit board according to claim 1, characterized in that: The metal base layer (16) is set as an aluminum alloy base layer.

3. The anti-interference, high heat dissipation seven-layer circuit board according to claim 1, characterized in that: The distance between two adjacent graphene composite films (18) on the same side is set to 50 mm, and the width of the graphene composite film (18) is set to 1 mm.

4. The anti-interference, high heat dissipation seven-layer circuit board according to claim 1, characterized in that: The serpentine heat dissipation channel (19) has a width of 0.5 mm and a depth of 2 mm.

5. The anti-interference, high heat dissipation seven-layer circuit board according to claim 1, characterized in that: The distance between two adjacent honeycomb hexagonal slots is set to be greater than 0.5 mm.

6. The anti-interference, high heat dissipation seven-layer circuit board according to claim 1, characterized in that: The ferrite filling layer (17) is configured as a mixture of ferrite slurry and silicon nitride fiber.

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