Temperature adjusting device and energy storage heat management system comprising same

Abstract

The utility model relates to the field of energy storage heat management systems, and discloses a temperature adjusting device and an energy storage heat management system comprising the temperature adjusting device, the temperature adjusting device comprises a buffer water tank, a temperature adjusting mechanism, a first driving part and a controller, one end of the buffer water tank is connected with the heat management device, and the first driving part is arranged between the buffer water tank and the heat management device; the buffer water tank is used for providing power for circulating liquid in the heat management device to circulate between the buffer water tank and the heat management device; the other end of the temporary storage water tank is connected with the temperature adjusting mechanism, the temperature adjusting mechanism is used for adjusting the temperature of the circulating liquid in the temporary storage water tank, and the temporary storage water tank can store the circulating liquid treated by the temperature adjusting mechanism; the controller is electrically connected with the temperature adjusting mechanism, and the controller can adjust the temperature adjusting mode of the temperature adjusting mechanism based on the temperature condition of the heat management device so as to maintain the constant temperature state of the heat management device. The temperature of the circulating liquid in the heat management device can be effectively adjusted, and it is ensured that the heat management device is always in the optimal working temperature range.

Description

Technical Field

[0001] This application relates to the field of energy storage thermal management systems, and particularly to a temperature control device and an energy storage thermal management system including the same. Background Technology

[0002] Existing traditional water-cooled chiller technology, as a common cooling system, plays an important role in many fields. This system mainly consists of the following core components: compressor, condenser, expansion valve, and heat exchanger. Although this system has certain advantages in cooling performance, it also has certain limitations.

[0003] First, the compressor and heat exchanger, as key components of the system, are relatively large and occupy a significant amount of space, which makes them less flexible in space-constrained applications. At the same time, the high cost of these two components increases the overall manufacturing cost of the water chiller, hindering its large-scale application.

[0004] Secondly, this cooling mechanism relies on refrigerants such as Freon during operation. These refrigerants circulate in the water circuit, absorbing heat generated by the battery pack's water circuit to achieve the cooling effect. However, Freon and other refrigerants have a certain degree of environmental damage; leaks will damage the atmospheric ozone layer. Furthermore, the maintenance and management of the refrigerant require significant human and material resources.

[0005] Therefore, improvements are urgently needed to address the aforementioned technical issues. Summary of the Invention

[0006] In view of the above-mentioned problems in the prior art, the purpose of this application is to solve the defects of the prior art, such as large size, high cost, inconvenience of use and environmental pollution caused by the use of refrigerants.

[0007] To address the aforementioned problems, this application provides a temperature control device and an energy storage thermal management system including the same, comprising a buffer water tank, a temperature control mechanism, a first driving component, and a controller.

[0008] One end of the buffer tank is connected to the thermal management device, and the first driving component is disposed between the buffer tank and the thermal management device to provide power for the circulating liquid in the thermal management device to flow between the buffer tank and the thermal management device.

[0009] The other end of the buffer tank is connected to the temperature control mechanism, which is used to control the temperature of the circulating liquid in the buffer tank. The buffer tank can store the circulating liquid processed by the temperature control mechanism.

[0010] The controller is electrically connected to the temperature control mechanism. The controller can adjust the temperature control mode of the temperature control mechanism based on the temperature of the thermal management device in order to maintain the constant temperature state of the thermal management device.

[0011] Preferably, the temperature regulating mechanism includes a second driving component, a cooling component, a heating component, and a reversing component.

[0012] The reversing component is connected to the buffer water tank and is disposed between the cooling component and the heating component. The reversing component can change the connection mode of the pipeline based on the reversing command of the controller, so that the buffer water tank is connected to the cooling component or the heating component.

[0013] The second drive element is disposed between the reversing assembly and the buffer tank to provide power for the circulation of the circulating liquid in the temperature control mechanism.

[0014] Preferably, the cooling assembly includes a water tank radiator, a semiconductor heat exchanger, and two first temperature detectors.

[0015] Along the flow direction of the circulating liquid in the temperature control mechanism, the water tank radiator and the semiconductor heat exchanger are connected in sequence, and the two can form a closed loop through the commutation component and the buffer water tank. The water tank radiator can cool the circulating liquid based on the first cooling command of the controller.

[0016] Two first temperature detectors are respectively installed at the inlet end of the water tank radiator and the outlet end of the semiconductor heat exchanger to detect the temperature change of the circulating liquid after it has been cooled by the water tank radiator. The semiconductor heat exchanger can cool the circulating liquid based on a second cooling command generated by the controller when it is determined that the temperature difference between the two first temperature detectors does not meet the first preset temperature difference.

[0017] Preferably, the refrigeration component further includes a second temperature detector, which is located near the water tank radiator to detect the temperature of the atmospheric environment. The controller can adjust the temperature regulation mode of the temperature regulation mechanism based on the temperature detection information from the second temperature detector.

[0018] Preferably, the cooling assembly further includes a heat sink disposed near the water tank radiator and / or the semiconductor heat exchanger for dissipating heat from the water tank radiator and / or the semiconductor heat exchanger.

[0019] Preferably, the heating component includes a heater, which can form a closed loop through the commutation component and the buffer tank to heat the circulating liquid based on the heating command of the controller.

[0020] Preferably, the temperature control device further includes two third temperature detectors, which are respectively disposed at the inlet and outlet of the thermal management device to detect the temperature change of the circulating liquid after it flows through the thermal management device. The temperature control mechanism can adjust the temperature of the circulating liquid based on the re-temperature control command generated by the controller when it determines that the temperature difference between the two third temperature detectors does not meet the second preset temperature difference.

[0021] Preferably, the temperature control device further includes a first pressure detector, which is disposed between the thermal management device and the buffer tank to detect the pressure change of the circulating liquid in the pipeline between the thermal management device and the buffer tank;

[0022] The first drive unit can adjust its driving force based on the pressure change information detected by the first pressure detector.

[0023] Preferably, the temperature control device further includes a backup component, which is connected to the buffer tank to provide backup liquid to the buffer tank and to drain liquid from the buffer tank.

[0024] On the other hand, an energy storage thermal management system is also disclosed, which includes a thermal management device and a temperature regulating device as described in any of the above. The temperature regulating device is connected to the thermal management device, and the temperature regulating device can regulate the temperature of the circulating liquid of the thermal management device to maintain the constant temperature state of the thermal management device.

[0025] Based on the above technical solution, the temperature control device and energy storage thermal management system including the same described in this application have the following beneficial effects:

[0026] By connecting the temperature regulating device and the thermal management device (such as a battery pack), the temperature of the circulating liquid within the thermal management device can be effectively regulated, ensuring that the thermal management device is always within its optimal operating temperature range, thereby improving its performance and lifespan. Furthermore, the temperature regulating mechanism can precisely regulate the temperature of the circulating liquid in the buffer tank according to the controller's instructions, meeting the high-precision temperature control requirements of the thermal management device. Secondly, the electrical connection between the controller and the temperature regulating mechanism enables intelligent control of the temperature regulating device, automatically adjusting its temperature regulation mode based on the actual temperature of the thermal management device without manual intervention, thus improving the automation level and ease of operation. Finally, the design of the temperature regulating device allows it to adapt to different working environments and temperature conditions, ensuring that the thermal management device maintains a constant temperature under various circumstances. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0028] Figure 1 This is a structural block diagram of the energy storage thermal management system provided in the embodiments of this application.

[0029] Figure 2 This is a water circuit connection diagram of the energy storage thermal management system provided in the embodiments of this application.

[0030] Figure 3 This is the flow path of the circulating liquid in the cooling mode of the energy storage thermal management system provided in this application embodiment.

[0031] Figure 4 This is the flow path of the circulating liquid in the heating mode of the energy storage thermal management system provided in this application embodiment.

[0032] The reference numerals in the attached drawings are as follows: temperature control device 100, buffer water tank 11, fourth temperature detector 111, liquid level detector 112, first drive unit 12, temperature control mechanism 13, second drive unit 131, refrigeration component 132, water tank radiator 1321, semiconductor heat exchanger 1322, first temperature detector 1323, second temperature detector 1324, heat sink 1325, refrigeration pipeline 1326; heating component 133, heater 1331, liquid inlet section 13 of the heating pipeline. 32, Heating pipe outlet section 1333; Reversing assembly 134, Second pressure detector 135, Third temperature detector 14, First pressure detector 15, Backup assembly 16, Backup water tank 161, Liquid filling port 1611, Exhaust port 1612, Handle 1613, Third drive component 163, Liquid outlet valve 164, One-way check valve 165, Backup solenoid valve 166, Drain valve 167, Liquid inlet pipe 168, Liquid outlet pipe 169, Liquid return pipe 17, Liquid outlet pipe 18;

[0033] Energy storage thermal management system 200, thermal management device 21. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0035] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this application. In the description of this application, it should be understood that the terms "upper," "lower," "left," "right," "top," "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0036] like Figure 1 As shown, this application discloses a temperature control device 100, which is connected to a thermal management device 21. Specifically, the thermal management device 21 is connected to the temperature control device 100 through a return liquid pipeline 17 and an outlet liquid pipeline 18, so as to regulate the temperature of the circulating liquid in the thermal management device 21 and keep the thermal management device 21 at a constant temperature.

[0037] In this embodiment, the thermal management device 21 refers to the battery pack. It is connected to the battery pack via the temperature control device 100 and can regulate the temperature of the circulating liquid within the battery pack, maintaining it at a constant temperature. In other embodiments, the thermal management device 21 can be configured as needed, and no specific limitations are imposed.

[0038] like Figures 2-4 As shown, the temperature control device 100 includes a buffer water tank 11, a temperature control mechanism 13, a first drive component 12, and a controller.

[0039] One end of the buffer water tank 11 is connected to the thermal management device 21, and the first driving member 12 is disposed between the buffer water tank 11 and the thermal management device 21 to provide power for the circulating liquid in the thermal management device 21 to flow between the buffer water tank 11 and the thermal management device 21.

[0040] The other end of the buffer tank 11 is connected to the temperature control mechanism 13. The temperature control mechanism 13 can adjust the temperature of the circulating liquid in the buffer tank 11, and the buffer tank 11 can store the circulating liquid processed by the temperature control mechanism 13.

[0041] The controller is electrically connected to the temperature control mechanism 13. The controller can adjust the temperature control mode of the temperature control mechanism 13 based on the temperature of the thermal management device 21 in order to maintain the thermal management device 21 at a constant temperature.

[0042] In this embodiment, the temperature control mechanism 13 can adjust the temperature of the circulating liquid from the thermal management device 21 in the buffer tank 11. After the temperature adjustment is completed, the circulating liquid is stored in the buffer tank 11. When the temperature of the thermal management device 21 changes, making it unable to maintain its own constant temperature state, the circulating liquid is circulated between the buffer tank 11 and the thermal management device 21 by the driving action of the first driving member 12.

[0043] In this embodiment, the first driving component 12 refers to the driving pump, which provides power for the circulating liquid to flow between the buffer tank 11 and the thermal management device 21, ensuring the continuity and stability of the liquid circulation and improving the temperature control efficiency.

[0044] Specifically, the drive pump can adopt the following structure:

[0045] For applications requiring zero leakage, a magnetically driven pump can be selected to drive liquid flow through magnetic force.

[0046] For applications requiring low flow rate and high precision, a peristaltic pump can be selected to drive the liquid flow by squeezing the tubing.

[0047] For medium flow and pressure applications, a vane pump can be selected to use rotating vanes to draw in and discharge liquid.

[0048] For high-pressure scenarios, a plunger pump can be selected to draw in and discharge liquid through the reciprocating motion of the plunger.

[0049] Regarding the structural selection of the first driving component 12, it is necessary to consider its specific application scenarios and advantages, namely, specific application requirements, the circulation requirements of the liquid in the thermal management device 21, the properties of the liquid itself, and cost.

[0050] In summary, the temperature control device 100 with the above-described structure in this application eliminates the compressor and condenser in the traditional water chiller and replaces them with a temperature control mechanism 13 that is directly connected to the buffer water tank 11. While meeting the temperature control requirements of the thermal management device 21, it also reduces the size and cost. Furthermore, the above-described temperature control method only requires direct temperature control of the liquid in the thermal management device 21, without the need for cooling the water circuit through other refrigerants, thus achieving energy-saving and environmentally friendly effects.

[0051] Furthermore, by connecting the temperature regulating device 100 and the thermal management device 21 (such as a battery pack), the temperature of the circulating liquid in the thermal management device 21 can be effectively regulated, ensuring that the thermal management device 21 is always within the optimal operating temperature range, thereby improving the performance and lifespan of the thermal management device 21. Moreover, the temperature regulating mechanism 13 can precisely regulate the temperature of the circulating liquid in the buffer tank 11 according to the controller's instructions, meeting the high-precision temperature control requirements of the thermal management device 21. Secondly, through the electrical connection between the controller and the temperature regulating mechanism 13, intelligent control of the temperature regulating device 100 is achieved. The temperature regulating mode of the temperature regulating mechanism 13 can be automatically adjusted according to the actual temperature of the thermal management device 21 without manual intervention, improving the automation level and ease of operation of the temperature regulating device 100. Furthermore, the design of the temperature regulating device 100 enables it to adapt to different working environments and temperature conditions, ensuring that the thermal management device 21 maintains a constant temperature under various circumstances.

[0052] like Figure 2 As shown, the temperature control mechanism 13 specifically includes a second driving component 131, a cooling component 132, a heating component 133, and a reversing component 134.

[0053] The reversing component 134 is connected to the buffer water tank 11 and is located between the cooling component 132 and the heating component 133. The reversing component 134 can change the connection mode of the pipeline based on the reversing command of the controller, so that the buffer water tank 11 is connected to the cooling component 132 or the heating component 133.

[0054] The second drive unit 131 is disposed between the reversing assembly 134 and the buffer tank 11 to provide power for the circulation of the liquid in the temperature control mechanism 13.

[0055] In this embodiment, the temperature control mechanism 13 specifically includes a cooling pipe 1326 and a heating pipe, wherein a cooling component 132 is disposed on the cooling pipe 1326 and a heating component 133 is disposed on the heating pipe. A reversing component 134 is disposed between the cooling pipe 1326 and the heating pipe to change the connection direction of the pipes.

[0056] In this embodiment, the reversing component 134 refers to a three-way reversing valve. The three-way reversing valve can quickly change the flow direction of the circulating liquid according to the reversing command of the controller, reduce the stagnation time of the circulating liquid in the temperature adjustment process, and enable the buffer water tank 11 to quickly connect to the cooling component 132 or the heating component 133, thereby achieving rapid temperature adjustment and improving the temperature adjustment efficiency of the temperature adjustment mechanism 13. Furthermore, by using the three-way reversing valve, the pipeline design can be simplified, reducing the complexity of the components in the temperature adjustment mechanism 13 and the possible failure points. In addition, the three-way reversing valve has a compact structure, which can save space and is suitable for installation in space-constrained equipment.

[0057] Preferably, there are two three-way reversing valves, which are respectively installed at the two connection points of the heating pipe and the cooling pipe 1326. Thus, the buffer water tank 11 is sequentially connected to the heating pipe, the three-way reversing valves, and the cooling pipe 1326.

[0058] It is understandable that, such as Figure 3 As shown, when the three-way reversing valve receives a reversing command that requires cooling of the circulating liquid, the three-way reversing valve can connect the buffer tank 11, the heating pipeline and the cooling pipeline 1326 to form a closed loop. At this time, the heating component 133 does not work, and the heating pipeline is just a passage without any function. After the circulating liquid is discharged from the outlet end of the buffer tank 11, it can flow sequentially through the inlet section 1332 of the heating pipeline, the three-way reversing valve, the cooling pipeline 1326, the three-way reversing valve and the outlet section 1333 of the heating pipeline, and then enter from the inlet end of the buffer tank 11.

[0059] like Figure 4 As shown, when the three-way reversing valve receives a reversing command that requires heating of the circulating liquid, the three-way reversing valve can disconnect the connection between the heating pipeline and the cooling pipeline 1326, forming a loop between the heating pipeline and the buffer tank 11. This allows the circulating liquid to flow through the inlet section 1332 of the heating pipeline, the three-way reversing valve, and the outlet section 1333 of the heating pipeline in sequence after being discharged from the outlet end of the buffer tank 11, before entering from the inlet end of the buffer tank 11.

[0060] Preferably, the second driving component 131 is disposed on the heating pipeline, specifically on the liquid outlet section 1333 of the heating pipeline, that is, at the liquid outlet end of the temperature regulating mechanism 13. This arrangement allows for better management of the pressure in the pipeline of the temperature regulating mechanism 13. Furthermore, the second driving component 131 also refers to a driving pump, specifically the same as the first driving component 12, which will not be elaborated further here. The second driving component 131 needs to be matched with the first driving component 12 to ensure the consistency of the circulating liquid flow in the temperature regulating device 100.

[0061] Furthermore, since the driving pressure of the circulating liquid is different at different heights in the refrigeration pipe 1326, in order to ensure that the circulating liquid can flow smoothly in the refrigeration pipe 1326, this application also provides a second pressure detector 135 on the refrigeration pipe 1326, specifically set at the inlet and outlet ends of the refrigeration pipe 1326, to detect the pressure change of the circulating liquid in the pipe of the temperature control mechanism 13. The second driving member 131 can adjust its driving force, i.e., the range of the second driving member 131, based on the pressure change information detected by the second pressure detector 135.

[0062] For example, if the current external water pressure is 0.1 Bar and the second drive unit 131 operates at 30%, while the target pressure is 1 bar, the feedback is sent to the controller. The controller can then control the second drive unit 131 to increase its output, gradually increasing it from 30% to 60%, until the target pressure is met.

[0063] In this embodiment of the application, the second pressure detector 135 refers to a pressure sensor that enables it to measure the pressure changes of the circulating liquid in the refrigeration line 1326 in real time and with high accuracy.

[0064] like Figure 2 As shown, the cooling assembly 132 specifically includes a water tank radiator 1321, a semiconductor heat exchanger 1322, and two first temperature detectors 1323.

[0065] Along the flow direction of the circulating liquid in the temperature control mechanism 13, the water tank radiator 1321 and the semiconductor heat exchanger 1322 are connected in sequence. The two can form a closed loop through the reversing component 134 and the buffer water tank 11. The water tank radiator 1321 can cool the circulating liquid based on the first cooling command of the controller.

[0066] Two first temperature detectors 1323 are respectively installed at the liquid inlet of the water tank radiator 1321 and the liquid outlet of the semiconductor heat exchanger 1322 to detect the temperature change of the circulating liquid after it has been cooled by the water tank radiator 1321. The semiconductor heat exchanger 1322 can cool the circulating liquid based on the second cooling command generated by the controller when it is determined that the temperature difference between the two first temperature detectors 1323 does not meet the first preset temperature difference.

[0067] In this embodiment, the temperature control mechanism 13 preferentially activates the first-level cooling mode, that is, only the water tank radiator 1321 is activated to cool the circulating liquid. The water tank radiator 1321 can cool the circulating liquid based on the first cooling command sent by the controller. The two first temperature detectors 1323 can detect the temperature of the circulating liquid and send the detected temperature signal to the controller. After receiving the temperature signal, the controller can judge the temperature difference between the two temperature signals. If the temperature difference meets the first preset temperature difference, it will still operate according to the current cooling mode, that is, only the first-level cooling mode is activated. If the temperature difference does not meet the first preset temperature difference, the controller can send a second cooling command to the semiconductor heat exchanger 1322. At this time, the second-level cooling mode will be activated, that is, the water tank radiator 1321 and the semiconductor heat exchanger 1322 will be activated simultaneously to cool the circulating liquid. The second driving component 131 can drive the buffer water tank 11 that has been cooled by the water tank radiator. The circulating liquid cooled by the device 1321 re-enters the cooling pipe 1326 to cool it again. The two first temperature detectors 1323 can still detect the temperature of the circulating liquid and send the detected temperature signals to the controller. After receiving the temperature signals, the controller can judge the temperature difference between the two temperature signals. If the temperature difference meets the third preset temperature difference, it will still operate according to the current cooling mode, that is, the second-level cooling mode will be activated. If the temperature difference does not meet the third preset temperature difference, the controller will send a driving command to the second driving component 131 to drive the circulating liquid in the buffer water tank 11 to re-enter the cooling pipe 1326. At the same time, it will also send a third cooling command to the water tank radiator 1321 and / or the semiconductor heat exchanger 1322 to increase the cooling capacity of the water tank radiator 1321 and / or the semiconductor heat exchanger 1322 until the liquid temperature in the circulating water tank 11 meets the set target requirement.

[0068] In this embodiment, the cooling principle of the water tank radiator 1321 is as follows: the water tank radiator 1321 has microchannels, thermally conductive material, and heat dissipation fins inside. The microchannels are used for circulating liquid flow, and the heat dissipation fins are connected to the microchannels through the thermally conductive material, that is, the thermally conductive material is disposed on the inner wall surface of the microchannels and the surface of the heat dissipation fins. Therefore, when the circulating liquid flows in the microchannels, the circulating liquid can transfer heat to the heat dissipation fins through the thermally conductive material on the microchannel wall. The heat dissipation fins, based on their large surface area, can effectively dissipate the absorbed heat into the surrounding air. At the same time, the heat dissipation efficiency can be improved by increasing the surface area of ​​the heat dissipation fins. The heat dissipation fins in this application can maximize their heat exchange efficiency based on aerodynamic principles.

[0069] Therefore, the water tank radiator 1321 in this application can effectively transfer and dissipate the heat in the circulating liquid to the external environment, and has the advantage of high heat dissipation efficiency, thereby improving the cooling effect of the circulating liquid.

[0070] In this embodiment, the semiconductor heat exchanger 1322 is a device that utilizes the thermoelectric effect of semiconductor materials to transfer heat. Specifically, its cooling principle is as follows: when a temperature difference exists between the two ends, the semiconductor material in the semiconductor heat exchanger 1322 generates a thermoelectric effect. This effect causes the diffusion of holes on one side of the semiconductor material and electrons on the other side, forming charge carriers. The movement of these charge carriers within the semiconductor material generates an electric current. By connecting a circuit, the generated current can be converted into power. Through this power conversion, heat energy is transferred from the high-temperature side of the semiconductor material to the low-temperature side, achieving heat exchange. The low-temperature portion on the other side dissipates heat through a heat sink, thus maintaining a temperature lower than the high-temperature side. In summary, the semiconductor heat exchanger 1322 primarily utilizes the current generated by charge carriers to transfer heat energy from the high-temperature side to the low-temperature side, thereby achieving heat exchange.

[0071] In this embodiment, the first temperature detector 1323 refers to a temperature sensor that is capable of detecting the temperature of the circulating liquid in real time.

[0072] Therefore, by setting two first temperature detectors 1323, the temperature change of the circulating liquid before and after the water tank radiator 1321, as well as the temperature change of the circulating liquid after passing through the water tank radiator 1321 and the semiconductor heat exchanger 1322, can be monitored in real time, achieving more precise cooling control. The controller can determine whether the temperature difference meets the preset temperature difference requirement based on the temperature signals from the two temperature detectors, and intelligently switch to the first or second-level cooling mode, optimizing the cooling effect of the circulating liquid. When the temperature difference meets the first preset temperature difference, the temperature control mechanism 13 only activates the first-level cooling mode (only the water tank radiator 1321 works), reducing unnecessary energy consumption; when the temperature difference does not meet the preset temperature difference, the second-level cooling mode is activated (the water tank radiator 1321 and the semiconductor heat exchanger 1322 work simultaneously) to ensure its cooling effect. Furthermore, the intelligent temperature management and mode switching also reduce the need for manual intervention. In addition, the controller can dynamically adjust the cooling capacity of the water tank radiator 1321 and / or the semiconductor heat exchanger 1322 according to the temperature difference to adapt to different cooling needs.

[0073] Preferably, the cooling assembly 132 further includes a heat sink 1325, which is disposed near the water tank radiator 1321 and the semiconductor heat exchanger 1322 for dissipating heat from the water tank radiator 1321 and the semiconductor heat exchanger 1322.

[0074] In this embodiment of the application, the heat sink 1325 refers to a fan. The fan can force airflow on the heat sink fins in the water tank heat sink module and the high-temperature side of the semiconductor heat exchanger 1322, making it easier for heat to be transferred from the heat sink 1325 to the surrounding environment, accelerating heat dissipation, and thus enhancing its heat dissipation efficiency.

[0075] In addition, the heat sink 1325 is electrically connected to the controller, and the heat sink 1325 can adjust the fan speed based on the heat dissipation command of the controller, so that the cooling component 132 can adapt to different cooling requirements.

[0076] like Figure 2 As shown, the cooling assembly 132 also includes a second temperature detector 1324, which is located near the water tank radiator 1321 to detect the temperature of the ambient air. The controller can adjust the temperature control mode of the temperature control mechanism 13 based on the temperature detection information of the second temperature detector 1324.

[0077] In this embodiment, the second temperature detector 1324 is also a temperature sensor, enabling it to detect the ambient temperature of the atmosphere in real time and accurately.

[0078] In this embodiment, the controller can adjust the temperature control mode of the temperature control mechanism 13 based on the temperature of the thermal management device 21 and the ambient temperature of the second temperature detector 1324. The temperature of the thermal management device 21 takes priority, and the temperature information of the second temperature detector 1324 is considered secondarily.

[0079] Therefore, by setting a second temperature detector 1324 to detect the temperature of the atmospheric environment, the controller can better adapt to changes in the external environment and adjust the temperature regulation mode of the temperature regulation mechanism 13 according to the ambient temperature, ensuring that the temperature regulation device 100 can operate efficiently under different climatic conditions.

[0080] like Figure 2 As shown, the heating component 133 includes a heater 1331, which can form a closed loop with the reversing component 134 and the buffer tank 11 to heat the circulating liquid based on the heating command of the controller.

[0081] In this embodiment, the heater 1331 refers to a PTC heater 1331, which is installed on the heating pipeline. The PTC heater 1331 has a positive temperature coefficient characteristic. Specifically, when the temperature rises to a certain level, its resistance will increase significantly, thereby automatically limiting the current and heat generation to prevent overheating. Therefore, there is no need to set up an additional temperature control device. While meeting the heating requirements of the circulating liquid, it can also reduce the safety hazards caused by overheating.

[0082] like Figure 2 As shown, the temperature control device 100 also includes two third temperature detectors 14, which are respectively installed at the inlet and outlet of the thermal management device 21, that is, the two third temperature detectors 14 are respectively installed on the return pipe 17 and the outlet pipe 18, to detect the temperature change of the circulating liquid. The temperature control mechanism 13 can adjust the temperature of the circulating liquid based on the re-temperature control command generated by the controller when it is determined that the temperature difference between the two third temperature detectors 14 does not meet the second preset temperature difference.

[0083] In this embodiment, the third temperature detector 14 is also a temperature sensor, enabling it to detect the temperature changes of the circulating liquid in the return liquid line 17 and the outlet liquid line 18 in real time.

[0084] In this embodiment, two third temperature detectors 14 can detect the temperature of the circulating liquid and send the detected temperature signal to the controller. After receiving the temperature signal, the controller can judge the temperature difference between the two temperature signals. If the temperature difference meets the second preset temperature difference, the temperature adjustment mechanism 13 will continue to operate according to the current temperature adjustment mode. If the temperature difference does not meet the second preset temperature difference, the controller can send a re-temperature adjustment command to the temperature adjustment mechanism 13, so that the temperature adjustment mechanism 13 changes the current temperature adjustment state until the temperature difference of the circulating liquid meets the preset temperature difference requirement.

[0085] In this embodiment of the application, the second preset temperature difference is no more than 5°, and preferably the temperature difference between the two third temperature detectors 14 is zero.

[0086] Therefore, by installing temperature sensors on the return liquid line 17 and the outlet liquid line 18, the temperature change of the circulating liquid before and after flowing through the thermal management device 21 can be monitored in real time, providing accurate temperature data. When the detected temperature difference does not meet the preset temperature difference, the controller can automatically issue a readjustment command to adjust the working state of the temperature adjustment mechanism 13 to meet the temperature control requirements. Therefore, by accurately controlling the temperature of the circulating liquid, over-temperature adjustment or under-temperature adjustment can be avoided, thereby improving energy utilization efficiency.

[0087] Furthermore, since the driving pressure of the circulating liquid is different at different heights in the return pipe 17 and the outlet pipe 18, in order to ensure that the circulating liquid can flow smoothly between the buffer tank 11 and the thermal management device 21, this application also provides a first pressure detector 15. The first pressure detector 15 is set between the thermal management device 21 and the buffer tank 11. Specifically, there are two first pressure detectors 15, which are respectively set on the return pipe 17 and the outlet pipe 18, to detect the pressure change of the circulating liquid in the pipe between the thermal management device 21 and the buffer tank 11. The first driving member 12 can adjust its driving force, i.e., the range of the first driving member 12, based on the pressure change information detected by the first pressure detector 15.

[0088] In this embodiment of the application, the first pressure detector 15 refers to a pressure sensor that enables it to measure the pressure change of circulating liquid between the thermal management device 21 and the buffer tank 11 in real time and with high accuracy.

[0089] like Figure 2 As shown, the temperature control device 100 also includes a backup component 16, which is connected to the buffer tank 11 to provide backup liquid to the buffer tank 11 and to drain the liquid from the buffer tank 11.

[0090] Specifically, the backup component 16 includes a backup water tank 161, a third drive unit 163, an inlet pipe 168, and an outlet pipe 169.

[0091] The backup water tank 161 is connected to the buffer water tank 11 through the liquid inlet pipe 168 and the liquid outlet pipe 169 respectively. The third driving unit 163 is set at the liquid outlet of the backup water tank 161 to provide the power for liquid to enter the buffer water tank 11 from the backup water tank 161.

[0092] A discharge valve 164 is also provided at the discharge end of the backup water tank 161 to switch the connection between the backup water tank 161 and the buffer water tank 11.

[0093] The spare water tank 161 is equipped with a handle 1613, a liquid inlet 1611, and a vent 1612. The liquid inlet pipe 168 is equipped with a spare solenoid valve 166 and a one-way check valve 165. The spare solenoid valve 166 is normally open, that is, when the first driving member 12 drives the circulating liquid to flow between the thermal management device 21 and the buffer water tank 11, the solenoid valve is energized. At this time, the liquid inlet pipe 168 is connected, and a part of the liquid in the spare water tank 161 will enter the buffer water tank 11 through the liquid inlet pipe 168 by the driving action of the third driving member 163. The purpose is to ensure that there is sufficient liquid and pressure in the pipeline of the temperature control device 100, and to prevent the first driving member 12 and the second driving member 131 from running dry when driving the circulating liquid. Under the one-way action of the one-way check valve 165, the liquid will not flow back to the spare water tank 161.

[0094] A drain valve 167 is provided on the drain pipe 169. When the temperature control device 100 needs to be disassembled and transported relative to the thermal management device 21, the liquid in the temperature control device 100 needs to be drained. At this time, the drain valve 167 needs to be energized to connect the buffer water tank 11 and the standby water tank 161, and the liquid in the buffer water tank 11 is discharged to the standby water tank 161 through the drain pipe 169.

[0095] In addition, a fourth temperature detector 111 and a liquid level detector 112 are also provided on the buffer water tank 11.

[0096] The fourth temperature detector 111 is electrically connected to the controller, enabling the controller to determine the temperature difference between itself and the thermal management device 21 based on the temperature detection signal of the fourth temperature detector 111, and enabling the controller to adjust the temperature adjustment mode of the temperature adjustment mechanism 13.

[0097] The liquid level detector 112 is also electrically connected to the controller, enabling the controller to obtain the liquid level in the buffer tank 11 based on the liquid level height information of the liquid level detector 112. When the liquid level does not meet the preset liquid level requirements, the controller can send a liquid replenishment command to the third drive unit 163, so that the third drive unit 163 can start running based on the liquid replenishment command to replenish the liquid in the backup tank 161 to the buffer tank 11.

[0098] In this embodiment of the application, the fourth temperature detector 111 is also a temperature sensor, enabling it to detect the temperature of the circulating liquid in the buffer tank 11 in real time and accurately.

[0099] In this embodiment of the application, the liquid level detector 112 is a liquid level sensor, which is installed on the inner wall of the buffer tank 11 to detect the liquid level height of the circulating liquid in the buffer tank 11.

[0100] This application also discloses an energy storage thermal management system 200, including a thermal management device 21 and the aforementioned temperature control device. The temperature control device 100 is connected to the thermal management device 21 to regulate the temperature of the circulating liquid in the thermal management device 21, so that the thermal management device 21 maintains a constant temperature.

[0101] The foregoing description has fully disclosed the specific embodiments of this application. It should be noted that any modifications made by those skilled in the art to the specific embodiments of this application do not depart from the scope of the claims. Accordingly, the scope of the claims of this application is not limited to the foregoing specific embodiments.

Claims

1. A temperature regulating device, characterized in that, It includes a buffer water tank, a temperature control mechanism, a first drive component, and a controller. One end of the buffer tank is connected to the thermal management device, and the first driving component is disposed between the buffer tank and the thermal management device to provide power for the circulating liquid in the thermal management device to flow between the buffer tank and the thermal management device. The other end of the buffer tank is connected to the temperature control mechanism, which is used to control the temperature of the circulating liquid in the buffer tank. The buffer tank can store the circulating liquid processed by the temperature control mechanism. The controller is electrically connected to the temperature control mechanism. The controller can adjust the temperature control mode of the temperature control mechanism based on the temperature of the thermal management device in order to maintain the constant temperature state of the thermal management device.

2. The temperature regulating device according to claim 1, characterized in that, The temperature control mechanism includes a second driving component, a cooling component, a heating component, and a reversing component. The reversing component is connected to the buffer water tank and is disposed between the cooling component and the heating component. The reversing component can change the connection mode of the pipeline based on the reversing command of the controller, so that the buffer water tank is connected to the cooling component or the heating component. The second drive element is disposed between the reversing assembly and the buffer tank to provide power for the circulation of the circulating liquid in the temperature control mechanism.

3. The temperature regulating device according to claim 2, characterized in that, The cooling assembly includes a water tank radiator, a semiconductor heat exchanger, and two first temperature detectors. Along the flow direction of the circulating liquid in the temperature control mechanism, the water tank radiator and the semiconductor heat exchanger are connected in sequence, and the two can form a closed loop through the commutation component and the buffer water tank. The water tank radiator can cool the circulating liquid based on the first cooling command of the controller. Two first temperature detectors are respectively installed at the inlet end of the water tank radiator and the outlet end of the semiconductor heat exchanger to detect the temperature change of the circulating liquid after it has been cooled by the water tank radiator. The semiconductor heat exchanger can cool the circulating liquid based on a second cooling command generated by the controller when it is determined that the temperature difference between the two first temperature detectors does not meet the first preset temperature difference.

4. The temperature regulating device according to claim 3, characterized in that, The refrigeration component also includes a second temperature detector, which is located near the water tank radiator to detect the temperature of the ambient air. The controller can adjust the temperature control mode of the temperature control mechanism based on the temperature detection information from the second temperature detector.

5. The temperature regulating device according to claim 3, characterized in that, The cooling assembly further includes a heat sink, which is disposed near the water tank radiator and / or the semiconductor heat exchanger for dissipating heat from the water tank radiator and / or the semiconductor heat exchanger.

6. The temperature regulating device according to claim 2, characterized in that, The heating component includes a heater that can form a closed loop through the commutation component and the buffer tank to heat the circulating liquid based on the heating command of the controller.

7. The temperature regulating device according to claim 1, characterized in that, The temperature control device also includes two third temperature detectors, which are respectively located at the inlet and outlet of the thermal management device to detect the temperature change of the circulating liquid after it flows through the thermal management device. The temperature control mechanism can adjust the temperature of the circulating liquid based on the re-temperature control command generated by the controller when it determines that the temperature difference between the two third temperature detectors does not meet the second preset temperature difference.

8. The temperature regulating device according to claim 1, characterized in that, The temperature control device further includes a first pressure detector, which is disposed between the thermal management device and the buffer tank to detect the pressure change of the circulating liquid in the pipeline between the thermal management device and the buffer tank. The first drive unit can adjust its driving force based on the pressure change information detected by the first pressure detector.

9. The temperature regulating device according to claim 1, characterized in that, The temperature control device also includes a backup component, which is connected to the buffer tank to provide backup liquid to the buffer tank and to drain the liquid from the buffer tank.

10. An energy storage thermal management system, characterized in that, It includes a thermal management device and a temperature control device as described in any one of claims 1-9, wherein the temperature control device is connected to the thermal management device and the temperature control device is capable of adjusting the temperature of the circulating liquid of the thermal management device to maintain the thermal management device at a constant temperature.

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