Laser assembly and solid laser thereof

Abstract

The utility model relates to the technical field of laser devices, and discloses a laser assembly and a solid laser thereof, and the laser assembly comprises a liquid cooling heat dissipation block which is provided with an installation cavity arranged along the axial direction in a through manner, and is used for introducing a cooling medium; the number of the laser array modules is at least two, each laser array module comprises a strip-shaped heat conduction block and a plurality of bar units arranged in an arrayed mode, the bar units on each heat conduction block are connected in series, the heat conduction blocks are all arranged on the inner wall of the installation cavity and arranged in the circumferential direction, and the heat conduction blocks are used for conducting heat of the bar units to the liquid cooling heat dissipation block; and the heat is taken away by a cooling medium introduced into the liquid cooling heat dissipation block. By means of the mode, on the premise that it is guaranteed that the laser has high power and heat dissipation efficiency, it is guaranteed that no liquid leakage problem occurs after long-term use, the strip-shaped heat conduction blocks and the multiple strip units arranged in the extending direction of the heat conduction blocks can be replaced, and the maintenance cost of the laser is reduced.

Description

Technical Field

[0001] This application relates to the field of laser device technology, specifically to a laser assembly and its solid-state laser. Background Technology

[0002] High-power semiconductor laser-pumped solid-state lasers with cylindrical light-absorbing media (or laser crystal rods) typically emit laser light of one wavelength towards the central crystal rod through a ring-shaped arrangement of bar units. This excites the crystal rod to generate a solid-state laser of another wavelength with better beam quality. The ring-shaped laser bar units are connected in series and fixed to a liquid-cooled heat sink for heat dissipation and assembly. The liquid-cooled heat sink and the multiple bar units fixed thereon constitute an independently operating laser module.

[0003] To increase the power of semiconductor lasers, existing solid-state laser pump source modules are assembled by stacking multiple semiconductor laser modules along the crystal rod axis, thereby increasing the number of bar units that excite the crystal rod. For heat dissipation, the flow channels at the ends of the liquid cooling heat sinks in adjacent semiconductor laser modules need to be aligned so that the cooling medium can flow between the two adjacent liquid cooling heat sinks. Simultaneously, sealing rings are clamped at the opposing ends of the two adjacent liquid cooling heat sinks at positions on the inner and outer circumferences of the flow channels to seal the flow channels at the assembly gaps.

[0004] However, after long-term use, the sealing ring may experience micro-leakage due to factors such as its own material properties, corrosive environment, and alternating high and low temperature environments. If the cooling medium leaks into the laser bar unit, especially the light-emitting cavity area of ​​the bar chip, it will cause the semiconductor laser to stop emitting light or even burn out. Utility Model Content

[0005] In view of the above problems, this application provides a laser component and a solid-state laser thereof, which ensures that the laser has high power and heat dissipation efficiency, and ensures that there will be no leakage that could damage or burn out the laser after long-term use.

[0006] According to one aspect of the embodiments of this application, a laser assembly is provided, comprising: a liquid-cooled heat sink having a mounting cavity that extends through the axial direction, wherein a cooling medium is introduced into the liquid-cooled heat sink; and at least two laser array modules, each laser array module comprising a strip-shaped heat-conducting block and a plurality of bar strip units arranged along the extension direction of the heat-conducting block, wherein the plurality of bar strip units on each heat-conducting block are connected in series, the plurality of heat-conducting blocks are disposed on the inner wall of the mounting cavity and arranged circumferentially, and the light-emitting surface of the bar strip unit on each heat-conducting block faces the center of the mounting cavity, wherein the heat-conducting block is used to conduct the heat of the bar strip unit to the liquid-cooled heat sink, so that the heat is carried away by the cooling medium introduced into the liquid-cooled heat sink, thereby achieving the purpose of heat dissipation.

[0007] The laser assembly provided in this application, while ensuring high power, employs a method where all laser array modules are fixed to the same liquid-cooled heat sink. This avoids the problem of cooling medium leakage at assembly gaps when multiple liquid-cooled heat sinks are stacked, thus ensuring the long-term reliability of the laser assembly. Furthermore, to facilitate the installation and fixing of all bar units, the traditional method of arranging bar units in a ring and connecting them in series to form an array module is abandoned. Instead, the bar units are arranged in a strip shape on a heat-conducting block and connected in series. The heat-conducting block is mounted on the inner wall of the liquid-cooled heat sink, allowing for easier assembly of the bar units located near the center of the liquid-cooled heat sink, thus meeting the requirements for convenient production and assembly of the laser assembly. This structure allows the bar units to be interchanged as needed.

[0008] In one alternative embodiment, the liquid-cooled heat sink has at least two slots circumferentially formed on the inner wall of the mounting cavity. These slots extend axially along the liquid-cooled heat sink, with at least one end of each slot extending to the end of the liquid-cooled heat sink to form an insertion interface. Each heat-conducting block is inserted into its corresponding slot through one of these interfaces. By creating at least two slots on the liquid-cooled heat sink and assembling the heat-conducting blocks in a one-to-one insertion manner, the heat-conducting blocks can be accurately and conveniently positioned in their respective locations within the mounting cavity. This ensures the accuracy of the laser array module positions while simultaneously reducing the overall size of the laser assembly.

[0009] In one alternative approach, the heat-conducting block and the liquid cooling heat sink are detachably connected via threaded fasteners or threadless fasteners to improve the stability of the heat-conducting block after it is inserted into the slot.

[0010] In one alternative embodiment, the bar unit includes an insulating base, a bar chip, and a substrate. The insulating base is fixed to a heat-conducting block, and the bar chip and substrate are disposed on the side of the insulating base opposite to the heat-conducting block. The bar chip and substrate are arranged circumferentially or axially along the mounting cavity. The insulating base serves to insulate the heat-conducting block from the bar chip and substrate. The circumferential arrangement of the bar chip and substrate along the mounting cavity allows the bar chips on different laser array modules to cooperate in forming a multi-layered ring array that emits laser light towards the center of the mounting cavity, thereby achieving full excitation of the crystal bar when applied to semiconductor laser-pumped solid-state lasers.

[0011] In one alternative approach, on the same laser array module, the substrates of two adjacent bar units are electrically connected to each other by welding interconnect electrodes.

[0012] In one alternative approach, the substrate in each bar unit includes a positive electrode substrate and a negative electrode substrate respectively disposed on both sides of the bar chip; on the same laser array module, the negative electrode substrate in the preceding bar unit and the positive electrode substrate in the following bar unit are arranged opposite each other along the extension direction of the heat-conducting block and are electrically connected to each other through interconnecting electrode sheets. This arrangement facilitates the soldering operation of the interconnecting electrode sheets between the negative electrode substrate and the positive electrode substrate.

[0013] In one alternative approach, on the same laser array module, a positive electrode is connected to the positive substrate of the first bar unit, and a negative electrode is connected to the negative substrate of the last bar unit.

[0014] In one alternative embodiment, the insulating base protrudes from the positive and negative substrates on both sides, respectively, and interconnect electrode plates, positive electrode leads, and negative electrode leads are disposed on the protruding portions. By configuring the insulating base to protrude from the positive and negative substrates on both sides, and placing the interconnect electrode plates, positive electrode leads, and negative electrode leads on the protruding portions of the insulating base, the insulating base not only provides corresponding support for the interconnect electrode plates, positive electrode leads, and negative electrode leads, ensuring their structural stability and thus ensuring the reliability of the electrical connections on the laser array module, but also isolates them from the heat-conducting block.

[0015] In one alternative approach, the liquid-cooled heat sink has multiple axially extending channels arranged on its outer periphery, which are radially opposite to each laser array module. First, the axial extension of the channels allows the cooling medium to flow more quickly through the heat sink and remove heat. Second, the multiple channels increase the cooling medium flow rate, thus removing more heat. Finally, by arranging the multiple channels on the outer periphery of the mounting cavity and radially opposite each laser array module, the heat dissipation path distance between the channels and the laser array modules is shortened, allowing heat generated by the laser array modules to be transferred to the cooling medium in the channels more quickly, thereby achieving efficient heat dissipation for each laser array module.

[0016] According to another aspect of the embodiments of this application, a semiconductor laser-pumped solid-state laser is provided, including a crystal rod and the semiconductor laser-pumped solid-state laser as described above. The crystal rod is housed in a mounting cavity, and the semiconductor laser bar unit is used to emit laser light toward the crystal rod when energized. The crystal rod is used to output solid-state laser light after absorbing the semiconductor laser light emitted by the bar unit.

[0017] The semiconductor laser-pumped solid-state laser provided in this application adopts any of the laser components described above, so that the semiconductor laser-pumped solid-state laser, while having high power, will not suffer damage to the laser or even burn out the bar after long-term use due to leakage of the cooling medium. Furthermore, the semiconductor laser-pumped solid-state laser is easy to manufacture and assemble, and its maintenance and upkeep costs are relatively low.

[0018] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0019] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0020] Figure 1 An exploded view of two adjacent laser modules in an existing semiconductor laser-pumped solid-state laser;

[0021] Figure 2 A perspective view of a laser assembly provided for an embodiment of this utility model;

[0022] Figure 3 A perspective view of a liquid-cooled heat sink provided in another embodiment of the present invention;

[0023] Figure 4 A perspective view of the laser array module in its arranged state as provided in an embodiment of this utility model;

[0024] Figure 5 A perspective view of a laser assembly provided for another embodiment of the present invention;

[0025] Figure 6 A perspective view of the laser array module provided for an embodiment of this utility model;

[0026] Figure 7 A top view of a laser array module provided in an embodiment of this utility model;

[0027] Figure 8 This is a top view of a laser array module provided in another embodiment of the present invention.

[0028] The reference numerals in the detailed embodiments are as follows:

[0029] 10. Laser module; 11. Laser bar unit; 12. Heat sink; 13. Coolant flow channel; 14. First sealing ring; 15. Second sealing ring; 16. Connection hole.

[0030] 100. Laser components;

[0031] 110. Liquid cooling heatsink; 111. Mounting cavity; 112. Slot; 113. Connector; 114. Flow channel; 115. Through hole;

[0032] 120. Laser array module; 121. Heat-conducting block; 1211. Threaded hole; 122. Bar unit; 1221. Insulating base; 1222. Bar chip; 1223. Substrate; 12231. Positive electrode substrate; 12232. Negative electrode substrate;

[0033] 130. Threaded fasteners;

[0034] 140. Interconnecting electrode plates;

[0035] 151. Positive electrode; 152. Negative electrode. Detailed Implementation

[0036] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0038] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0039] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0040] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0041] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0042] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0043] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0044] With the rapid development of the laser industry, high-quality beams generated by semiconductor laser-pumped solid-state lasers have been widely used in fields such as intelligent manufacturing, industrial processing, material handling, scientific research, medical aesthetics, and laser ranging.

[0045] The assembly structure of two adjacent laser modules 10 in an existing semiconductor laser-pumped solid-state laser is as follows: Figure 1As shown in the explosion diagram, multiple laser bar units 11 arranged circumferentially in each laser module 10 are connected in series and energized to emit lasers. The coolant channels 13 on the heat sink 12 of the laser module 10 are axially continuous (i.e., in the direction shown by arrow A in the figure). During assembly, the two adjacent laser modules 10 are fitted together at their opposite ends, and the coolant channels 13 on the two heat sinks 12 are aligned so that the cooling medium can flow from the coolant channel 13 on the previous heat sink 12 into the coolant channel 13 on the next heat sink 12. Considering that the assembly gap between two adjacent heat sinks 12 may cause the cooling medium to leak, a first sealing ring 14 and a second sealing ring 15 are clamped at the opposite ends of the two adjacent heat sinks 12 and at the inner and outer peripheries of the coolant channels 13 to seal the assembly gap at the coolant channels 13. The two heat sinks 12 can be connected and fixed to each other by screws through the connecting holes 16 at the end corners.

[0046] When the semiconductor laser-pumped solid-state laser is not working, the heat sink 12 is generally at room temperature. However, when it is working, the temperature of the heat sink 12 is relatively high. After long-term use, the alternating high and low temperature environment will have a certain impact on the material of the sealing ring, which is prone to sealing failure. At the same time, under the long-term corrosion of the cooling medium, the sealing failure will be further aggravated. Once the seal fails, the leaked cooling medium is very likely to affect the laser, especially the light-emitting cavity surface of the laser bar unit, causing damage to the laser or even the bar to burn out, affecting the long-term service life of the laser.

[0047] In view of the above problems, this application addresses the issues of cooling medium leakage, laser power, and the manufacturability and assembly of semiconductor laser-pumped solid-state lasers from multiple perspectives, and proposes a novel method for packaging laser components used to constitute semiconductor laser-pumped solid-state lasers. Specifically, a single liquid-cooled heat sink with a large axial dimension is used, and heat is dissipated through the cooling medium within this heat sink. This prevents the cooling medium from flowing through areas with assembly gaps, thereby solving the problem of cooling medium leakage.

[0048] To increase laser power, multiple laser bar units need to be arranged both circumferentially and axially. However, given the large axial dimension of the liquid cooling heat sink, if the existing method of assembling multiple laser bar units in a ring to form a laser module and then assembling it on the liquid cooling heat sink is still used, the laser module located in the central region along the axial direction is difficult to assemble due to the surrounding space constraints. To address this, this application arranges multiple bar units axially and connects them in series to form a linear laser array module. This laser array module is assembled into slots on the liquid cooling heat sink using a plug-in method. This not only facilitates assembly but also allows for individual disassembly and replacement when a laser array module fails, enabling replacement as needed and reducing laser maintenance and upkeep costs. Multiple such laser array modules are inserted into the entire liquid cooling heat sink, arranged circumferentially, thereby emitting high-power semiconductor laser towards the central crystal rod.

[0049] According to one aspect of an embodiment of this application, a laser assembly is provided, as detailed in the following reference. Figure 2 The figure shows the structure of a laser assembly. As shown, the laser assembly 100 includes a liquid-cooled heat sink 110 and at least two laser array modules 120. The liquid-cooled heat sink 110 has a mounting cavity 111 that extends through the laser along the axial direction (in the direction indicated by the double arrow X in the figure). Specifically, the liquid-cooled heat sink 110 can, in addition to serving as a mounting cavity for... Figure 2 The annular columnar structure shown (i.e., the mounting cavity 111 is completely enclosed on all sides) can also be... Figure 3 The semi-annular columnar structure shown (i.e., the outer periphery of the mounting cavity 111 is partially closed) can also be a partially annular (greater than or less than 1 / 2 annular) columnar structure. The specific design is not limited here and can be adjusted according to the actual product requirements. When a semiconductor laser-pumped solid-state laser is formed using the laser assembly 100, the mounting cavity 111 is used to accommodate the crystal rod.

[0050] Please combine further Figure 4 , Figure 4 The diagram shows a structure with at least two laser array modules 120 arranged in an array, as shown below. Figure 2 and Figure 4 As shown, each laser array module 120 includes a strip-shaped heat-conducting block 121 and a plurality of bar strip units 122 arranged in the direction indicated by the double arrow X. The plurality of bar strip units 122 on each heat-conducting block 121 are connected in series. The plurality of heat-conducting blocks 121 are disposed on the inner wall of the mounting cavity 111 and arranged circumferentially. The light-emitting surface of the bar strip unit 122 on each heat-conducting block 121 faces the center of the mounting cavity 111.

[0051] Specifically, both the liquid-cooled heat sink 110 and the heat-conducting block 121 can be made of copper, aluminum, or other materials with high thermal conductivity. The liquid-cooled heat sink 110 is used to circulate a cooling medium, and the heat-conducting block 121 is used to conduct the heat generated by the bar unit 122 during operation to the liquid-cooled heat sink 110, where the cooling medium circulated within the liquid-cooled heat sink 110 carries away the heat. The laser assembly 100 provided in this embodiment, while ensuring high power, uses a method where all laser array modules 120 are fixed to the same liquid-cooled heat sink 110 to avoid the problem of cooling medium leakage at assembly gaps when multiple liquid-cooled heat sinks 110 are stacked together, thus ensuring the long-term reliability of the laser assembly 100. Based on this, in order to facilitate the installation and fixation of all bar units 122, the traditional method of arranging bar units in a ring and connecting them in series to form an array module in lasers is abandoned. Instead, the bar units 122 are arranged in a strip shape on the heat-conducting block 121 and connected in series. The heat-conducting block 121 is set on the inner wall of the mounting cavity 111 on the liquid cooling heat sink 110. This makes it easier to assemble the bar units located near the middle position inside the liquid cooling heat sink 110, thus meeting the conditions for convenient production and assembly of the laser assembly 100.

[0052] Furthermore, since the bar units 122 are arranged in a bar shape on the heat-conducting block 121 and connected in series to form the laser array module 120, when a laser array module 120 fails, the corresponding laser array module 120 can be directly removed for repair or replaced with a new laser array module 120, which helps to reduce the maintenance difficulty and maintenance cost of the laser assembly 100.

[0053] Furthermore, to facilitate the positioning and assembly of the heat-conducting block 121 in the mounting cavity 111, such as... Figure 2 and Figure 4 As shown, the liquid cooling heat sink 110 has at least two slots 112 circumferentially opened on the inner wall of the mounting cavity. The slots 112 extend in the direction indicated by the double arrow X, and at least one end of each slot 112 extends to the end of the liquid cooling heat sink 110 to form an insertion interface 113. Each heat conduction block 121 is inserted into the corresponding slot 112 through an insertion interface 113.

[0054] By opening at least two slots 112 on the liquid cooling heat sink 110 and assembling the heat conduction block 121 into the slots 112 in a one-to-one correspondence manner, the heat conduction block 121 can be accurately and conveniently positioned in the corresponding position in the mounting cavity 111, so as to ensure the accuracy of the position of each laser array module 120 and reduce the volume of the entire laser assembly 100.

[0055] In order to better and more efficiently dissipate heat from each laser array module 120, such as Figure 2As shown, multiple flow channels 114 extending in the direction indicated by the double arrow X can be formed on the liquid cooling heat sink 110. The multiple flow channels 114 are disposed on the outer periphery of the mounting cavity 111 and are radially opposite to each laser array module 120 along the liquid cooling heat sink 110.

[0056] First, the flow channels extending along the axial direction (i.e., the direction indicated by the double arrow X) of the liquid-cooled heat sink 110 allow the cooling medium to flow through the liquid-cooled heat sink 110 more quickly and carry away its heat. Second, multiple flow channels 114 can increase the flow rate of the cooling medium, thereby removing more heat. Finally, by setting multiple flow channels 114 on the outer periphery of the mounting cavity 111 and radially opposite each laser array module 120, the heat dissipation path distance between the flow channels 114 and the laser array module 120 is shortened, and the heat generated by the laser array module 120 can be transferred to the cooling medium in the flow channels 114 more quickly, thereby achieving efficient heat dissipation for each laser array module 120.

[0057] To improve the stability of the heatsink 121 after it is inserted into the slot 112, the heatsink 121 can also be detachably connected to the liquid cooling heatsink 110 via threaded fasteners after it is inserted into the slot 112. Please refer to the following for details. Figure 4 and further combine Figure 5 In the specific embodiment shown in the figure, the heat-conducting block 121 has a threaded hole 1211 on the side opposite to the bar unit 122, and the liquid cooling heat sink 110 has a through hole 115 on its outer periphery. The threaded fastener 130 passes through the through hole 115 from the outside and connects to the threaded hole 1211 to fix the heat-conducting block 121 to the liquid cooling heat sink 110.

[0058] It is understood that in other embodiments, the liquid cooling heat sink 110 may have a sidewall at the end of the slot 112 away from the insertion interface 113, and a through hole is provided on the sidewall. Correspondingly, the inner end of the heat conduction block 121 inserted into the slot 112 is provided with a threaded hole, and a threaded fastener passes through the through hole and connects with the threaded hole to fix the heat conduction block 121.

[0059] Of course, the heat-conducting block 121 can also be detachably connected to the liquid cooling heat sink 110 in a threadless manner, for example, by directly riveting it into the slot 112 for fixation. In order to facilitate the pressing of the heat-conducting block 121, the heat-conducting block 121 and the slot 112 can be wedge-shaped to fit each other.

[0060] like Figure 6The image shows a laser array module 120. The bar unit 122 may include an insulating base 1221, a bar chip 1222, and a substrate 1223. The insulating base 1221 is fixed to the heat-conducting block 121. The bar chip 1222 and the substrate 1223 are disposed on the side of the insulating base 1221 away from the heat-conducting block 121. The insulating base 1221 insulates the heat-conducting block 121 from the bar chip 1222 and the substrate 1223. The bar chip 1222 and the substrate 1223 are arranged circumferentially along the mounting cavity 111 so that the bar chips 1222 on different laser array modules 120 cooperate to form a multi-layer ring array that emits laser light toward the center of the mounting cavity 111. This allows for full excitation of the crystal bar when applied to a semiconductor laser-pumped solid-state laser.

[0061] The insulating base 1221 can be made of aluminum nitride ceramic or other insulating materials with high thermal conductivity, such as insulating silicon nitride, silicon carbide, and diamond. The substrate 1223 can be made of a material with high electrical and thermal conductivity that matches the coefficient of thermal expansion of the bar chip 1222, such as copper-tungsten alloy, copper / silver-diamond composite material, copper, or molybdenum-copper alloy.

[0062] The substrate 1223 and the bar chip 1222 can be fixed together by soldering or other bar bonding techniques. Specifically, when forming the bar unit 122, it can be assembled together in the order of substrate 1223-bar chip 1222-substrate 1223 using a pre-designed and processed jig, and placed on the insulating base 1221. If a bar unit 122 has multiple bar chips 1222, they are assembled in the order of substrate 1223-bar chip 1222-substrate 1223-bar chip 1222-substrate 1223. After assembly, they are soldered together with gold-tin or tin alloy solder using a reflow process to form the bar unit 122. The above is only an exemplary forming process of the bar unit 122 provided in this application, and it does not constitute a limitation on the specific forming method of the bar unit 122.

[0063] like Figure 7 As shown in the top view of the laser array module 120, on the same laser array module 120, the substrates 1223 of two adjacent bar units 122 can be electrically connected to each other by welding interconnecting electrode sheets 140. The interconnecting electrode sheets 140 can be made of metal strips or blocks with high conductivity and low cost, such as aluminum or copper.

[0064] Please continue reading. Figure 7Each bar unit 122 has a substrate 1223 including a positive substrate 12231 and a negative substrate 12232 respectively disposed on both sides of the bar chip 1222. On the same laser array module 120, the negative substrate 12232 in the previous bar unit 122 and the positive substrate 12231 in the next bar unit 122 are arranged opposite to each other in the direction shown by the double arrow X and are electrically connected to each other through the interconnect electrode sheet 140. This arrangement makes it easier to perform the welding process of the interconnect electrode sheet 140 between the negative substrate 12232 and the positive substrate 12231.

[0065] Furthermore, such as Figure 7 As shown, on the same laser array module 120, the first bar unit 122 ( Figure 7 The positive electrode 151 is connected to the positive substrate 12231 in the leftmost bar unit 122. The last bar unit 122 ( Figure 7 The negative electrode 152 is connected to the negative electrode substrate 12232 in the rightmost bar unit 122.

[0066] The positive electrode 151 and the negative electrode 152 can be made of materials with high thermal conductivity and high electrical conductivity, such as copper, copper-tungsten, molybdenum-copper, diamond / copper / silver / aluminum composite materials, etc.

[0067] Specifically, for the processing of the laser array module 120, after forming multiple bar units 122, the heat-conducting block 121, multiple bar units 122, interconnect electrode sheet 140, positive electrode lead 151, and negative electrode lead 152 can be placed into a pre-designed and processed fixture according to their respective positions. After assembly, a reflow process is used to weld the multiple bar units 122 to the heat-conducting block 121, the interconnect electrode sheet 140 to the substrate 1223, the positive electrode lead 151 to the positive substrate 12231 in the first bar unit 122, and the negative electrode lead 152 to the negative substrate 12232 in the last bar unit 122, forming the laser array module 120. Of course, in addition to using a reflow process and welding with tin-based / indium-based solder, it can also be achieved by laser welding or resistance welding, which do not require solder. The specific method is not limited here.

[0068] During production and processing, it is necessary to ensure that the heat-conducting block 121 is not charged. That is, the heat-conducting block 121 needs to be insulated from the bar chip 1222, the substrate 1223, the interconnect electrode sheet 140, the positive electrode lead 151, and the negative electrode lead 152. The heat-conducting block 121 is insulated from the bar chip 1222 and the substrate 1223 through the insulating base 1221. The heat-conducting block 121 can be insulated from the interconnect electrode sheet 140, the positive electrode lead 151, and the negative electrode lead 152 by forming air gaps. In other words, the interconnect electrode sheet 140 can be welded and fixed between the negative electrode substrate 12232 and the positive electrode substrate 12231 in an overlapping manner. The positive electrode lead 151 and the negative electrode lead 152 are welded and fixed to the corresponding positive electrode substrate 12231 and negative electrode substrate 12232 in a suspended manner, thereby achieving insulation between the heat-conducting block 121 and the components in the circuit structure.

[0069] Based on this, after the laser array module 120 is formed, the heat-conducting block 121 is not charged. After assembling and fixing multiple laser array modules 120 with the liquid-cooled heat sink 110 and encapsulating them to form a semiconductor laser-pumped solid-state laser, the positive electrode 151 on each laser array module 120 is connected to the positive terminal of the power supply, and the negative electrode 152 on each laser array module 120 is connected to the negative terminal of the power supply. The resulting current is as follows: Figure 7 As shown by the dashed arrow, current can flow through each bar chip 1222 to make it work and emit laser light.

[0070] Regarding the aforementioned method of welding and fixing the interconnecting electrode 140 in an overlapping manner, while welding and fixing the positive electrode 151 and negative electrode 152 in a suspended manner, considering the poor structural stability of the overlapping and suspended states, which can easily lead to circuit failure, in order to improve circuit stability, such as... Figure 7 As shown, the insulating base 1221 protrudes from the positive electrode substrate 12231 and the negative electrode substrate 12232 on both sides, and the protruding portion is provided with interconnect electrode sheet 140, positive electrode lead-out electrode 151 and negative electrode lead-out electrode 152.

[0071] By setting the two sides of the insulating base 1221 to protrude from the positive electrode substrate 12231 and the negative electrode substrate 12232 respectively, and setting the interconnect electrode sheet 140, the positive electrode lead-out electrode 151 and the negative electrode lead-out electrode 152 on the protruding parts on both sides of the insulating base 1221, the insulating base 1221 can not only provide corresponding support for the interconnect electrode sheet 140, the positive electrode lead-out electrode 151 and the negative electrode lead-out electrode 152, ensuring the stability of their structure, and thus ensuring the reliability of the bar on the laser array module 120, but also isolate and insulate them from the heat-conducting block 121.

[0072] In addition, such as Figure 8 As shown in the top view of the single laser array module 120, the bar chip 1222 and substrate 1223 can also be arranged along the axial direction of the mounting cavity 111 (i.e., the extension direction of the heat-conducting block 121). Correspondingly, the interconnect electrode 140 is directly connected between the negative electrode substrate 12232 of the previous bar unit 122 and the positive electrode substrate 12231 of the next bar unit 122. The positive electrode lead-out electrode 151 is also connected to the first positive electrode substrate 12231, and the negative electrode lead-out electrode 152 is connected to the last negative electrode substrate 12232. During operation, Figure 8 From a visual perspective, the current flows in a straight line from left to right through the light-emitting layers of each bar chip. For this arrangement, the materials and assembly methods of the components can be the same as in the above embodiment, and will not be elaborated upon here.

[0073] According to another aspect of the embodiments of this application, a semiconductor laser-pumped solid-state laser is also provided. The semiconductor laser-pumped solid-state laser includes a crystal rod and a laser assembly 100 provided in any of the above embodiments. The crystal rod is housed in a mounting cavity 111. A bar unit 122 is used to emit laser light toward the crystal rod when energized. The crystal rod is used to output solid-state laser light after absorbing the semiconductor laser light emitted by the bar unit 122.

[0074] The semiconductor laser-pumped solid-state laser provided in this application adopts the laser component 100 in any of the above embodiments, so that the semiconductor laser-pumped solid-state laser will not burn out due to leakage of cooling medium after long-term use, even with high power. Furthermore, the semiconductor laser-pumped solid-state laser can be easily manufactured and assembled, and its maintenance difficulty and maintenance cost are relatively low.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way.

Claims

1. A laser assembly, characterized in that, include: A liquid-cooled heat sink has an axially extending mounting cavity for introducing a cooling medium. The laser array module is configured to have at least two components. Each laser array module includes a strip-shaped heat-conducting block and multiple bar units arranged along the extension direction of the heat-conducting block. The multiple bar units on each heat-conducting block are connected in series. The multiple heat-conducting blocks are disposed on the inner wall of the mounting cavity and arranged circumferentially. The light-emitting surface of the bar unit on each heat-conducting block faces the center of the mounting cavity. The heat-conducting block is used to conduct the heat of the bar unit to the liquid-cooled heat sink, so that the heat is carried away by the cooling medium introduced into the liquid-cooled heat sink.

2. The laser assembly according to claim 1, characterized in that, The liquid cooling heat sink has at least two slots circumferentially formed on the inner wall of the mounting cavity. The slots extend axially along the liquid cooling heat sink, and at least one end of each slot extends to the end of the liquid cooling heat sink to form an insertion interface. Each heat conduction block is inserted into the corresponding slot through an insertion interface.

3. The laser assembly according to claim 1, characterized in that, The heat-conducting block and the liquid-cooled heat dissipation block are detachably connected by threaded fasteners or threadless fasteners.

4. The laser assembly according to claim 1, characterized in that, The bar unit includes an insulating base, a bar chip, and a substrate. The insulating base is fixed to the heat-conducting block. The bar chip and the substrate are disposed on the side of the insulating base away from the heat-conducting block, and the bar chip and the substrate are arranged circumferentially or axially along the mounting cavity.

5. The laser assembly according to claim 4, characterized in that, On the same laser array module, the substrates of two adjacent bar units are electrically connected to each other by welding interconnecting electrode sheets.

6. The laser assembly according to claim 5, characterized in that, The substrate in each bar unit includes a positive electrode substrate and a negative electrode substrate respectively disposed on both sides of the bar chip; On the same laser array module, the negative electrode substrate in the previous bar unit and the positive electrode substrate in the next bar unit are arranged opposite each other along the extension direction of the heat-conducting block and are electrically connected to each other through the interconnecting electrode sheet.

7. The laser assembly according to claim 6, characterized in that, On the same laser array module, a positive electrode is connected to the positive substrate in the first bar unit, and a negative electrode is connected to the negative substrate in the last bar unit.

8. The laser assembly according to claim 7, characterized in that, The insulating base protrudes from the positive electrode substrate and the negative electrode substrate on both sides, and the interconnect electrode sheet, the positive electrode lead-out electrode and the negative electrode lead-out electrode are disposed on the protruding portion.

9. The laser assembly according to any one of claims 1-8, characterized in that, The liquid-cooled heat sink has multiple axially extending channels arranged on its outer periphery and opposite each laser array module along the radial direction of the heat sink.

10. A semiconductor laser-pumped solid-state laser, characterized in that, The device includes a crystal rod and a laser assembly according to any one of claims 1-9, wherein the crystal rod is housed within the mounting cavity, the bar unit is configured to emit laser light toward the crystal rod when energized, and the crystal rod is configured to output solid-state laser light after absorbing the semiconductor laser light emitted by the bar unit.

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