Large-bandwidth 220G terahertz emission front end
By designing a high-bandwidth 220G terahertz transmission front-end, simultaneous transmission of multi-channel signals was achieved, reducing production costs. Furthermore, it provides a variety of transmission systems under the MIMO framework, adapting to terahertz imaging and detection under complex conditions.
Patent Information
- Application Number
- CN202423002456.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-06
AI Technical Summary
Existing technologies are difficult to implement simultaneous transmission of terahertz signals across multiple channels, and have high production costs, making them unsuitable for the complex requirements of terahertz imaging and detection.
A high-bandwidth 220G terahertz transmission front-end was designed, including a frequency doubler, a filter, an amplifier, a 1-to-2 power divider, first and second 1-to-4 power dividers, and multiple transmitter frequency multiplier and amplification modules. Through multi-stage frequency conversion and signal distribution, 64 terahertz signals can be transmitted simultaneously.
It significantly reduces the production cost of terahertz front-ends, enables simultaneous transmission of multiple channels under MIMO, and adapts to terahertz imaging and detection under complex conditions.
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Figure CN223652260U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic components technology, specifically to a high-bandwidth 220G terahertz transmitting front end. Background Technology
[0002] In recent years, the terahertz frequency band has attracted increasing attention due to its unique advantages. Compared to X-rays, terahertz energy is very low, so it does not damage materials when used for object detection. Terahertz waves have strong penetrating power, capable of penetrating materials such as ceramics, fats, carbon plates, fabrics, and plastics with minimal attenuation. Many biological macromolecules have vibrational and rotational frequencies in the terahertz band, so rich biological and material information can be obtained using terahertz waves. Furthermore, the short wavelength of high-frequency terahertz waves provides millimeter or sub-millimeter level resolution and high spatial resolution. Therefore, terahertz waves are widely used in signal communication, imaging detection, security protection, and biomedicine, demonstrating broad application value.
[0003] Currently, with the rapid development of my country's aerospace industry, more and more new aerospace composite materials, thermal insulation materials, semiconductor materials, energetic materials, and other non-metallic materials are being used. The detection and quality evaluation of their internal defects have become crucial factors affecting the reliability of spacecraft and payloads. Terahertz waves offer advantages and characteristics that meet the application requirements of most non-destructive testing (NDT) applications. Utilizing terahertz imaging detection technology can solve the problem of detecting and evaluating the internal defects of non-metallic materials such as aerospace composite materials, thermal insulation materials, semiconductor materials, and energetic materials, promoting quality control in the research and production process of new materials, and facilitating their application in aerospace equipment, semiconductor integrated circuits, and other fields.
[0004] Therefore, a terahertz transmitting front-end is needed. Summary of the Invention
[0005] This invention aims to solve the problem of terahertz signal transmission by providing a high-bandwidth 220G terahertz transmission front-end that can simultaneously transmit multiple channels of signals, significantly reducing the manufacturing cost of the terahertz front-end. At the same time, the simultaneous transmission of multiple channels provides the ability for the signal to operate under the MIMO system, facilitating the transmission of terahertz signals in various systems and adapting to terahertz imaging and detection under complex conditions and scenarios.
[0006] This utility model provides a high-bandwidth 220G terahertz transmitter front end, including a frequency doubler, a filter, an amplifier, and a 1-to-2 power divider connected in sequence. The two outputs of the 1-to-2 power divider are respectively connected to a first 1-to-4 power divider and a second 1-to-4 power divider. The outputs of the first 1-to-4 power divider and the second 1-to-4 power divider are each connected to four transmitter frequency multiplier amplification modules.
[0007] The transmitter frequency multiplier module includes a sub-channel amplifier and a frequency multiplier sub-channel connected in sequence. The frequency multiplier sub-channel includes a single-pole four-throw switch and four sub-channel dual-paths connected to the output terminals of the single-pole four-throw switch. The sub-channel dual-path includes a sub-channel second frequency multiplier, a sub-channel path amplifier, a single-pole double-throw switch, and a first third frequency multiplier and a second third frequency multiplier connected to the two ports of the single-pole double-throw switch in sequence. The output ports of the first third frequency multiplier and the second third frequency multiplier are the output ports of the high-bandwidth 220G terahertz transmitter front-end.
[0008] The frequency multiplier amplification has 8 channels, the number of dual-channel sub-channels is 32, and the large bandwidth 220G terahertz transmitter front-end outputs 64 terahertz transmission signals.
[0009] In a preferred embodiment of the large bandwidth 220G terahertz transmitting front-end described in this utility model, the input signal of the large bandwidth 220G terahertz transmitting front-end is a low frequency signal of 15G-21.7GHz, the input signal of the 8-channel transmitter frequency multiplier amplification module is a frequency band signal of 30G-42.4GHz, the output signal is a frequency band signal of 60-84.8GHz, and the output signal of the frequency multiplier amplification sub-channel is a frequency band signal of 180GHz-260GHz.
[0010] In the present invention, a high-bandwidth 220G terahertz transmitting front-end has, as a preferred embodiment, a transmitter frequency multiplier amplification module output signal gain of 5dBm.
[0011] In the present invention, a high-bandwidth 220G terahertz transmitting front-end is preferably provided in which a frequency doubler, a filter, and an amplifier are integrated on a single chip.
[0012] In a preferred embodiment of the high-bandwidth 220G terahertz transmitting front-end described in this utility model, a transmitter frequency multiplier amplification module is integrated on a single chip.
[0013] The high-bandwidth 220G terahertz transmitting front-end of this utility model, as a preferred embodiment, includes a transmitter frequency multiplier amplification module comprising 8 control ports.
[0014] In a preferred embodiment of the large bandwidth 220G terahertz transmitting front-end described in this utility model, the transmitter frequency multiplier amplification module includes a voltage regulator for providing negative power.
[0015] In the preferred embodiment of the large bandwidth 220G terahertz transmitting front-end described in this utility model, the positive voltage of the transmitter frequency multiplier amplification module is +5.5V and the negative voltage is -5.5V.
[0016] In a preferred embodiment of the large bandwidth 220G terahertz transmitting front-end described in this utility model, four countersunk holes are provided on the transmitter frequency multiplier amplification module. The diameter of the countersunk holes is 3.2mm and the depth is 4.5mm. A through hole with a diameter of 1.8mm is provided inside the countersunk holes.
[0017] This utility model has the following advantages:
[0018] To achieve independent control over the entire terahertz industry chain, from chips, devices, components, modules, algorithms to complete instruments, this invention provides a high-bandwidth 220G terahertz transmitting front-end to enable terahertz signal transmission. Compared to other terahertz transmitting front-ends, this front-end can simultaneously transmit multiple channels of signals, significantly reducing the manufacturing cost of terahertz front-ends. Simultaneously, the simultaneous transmission of multiple channels provides the ability to operate under MIMO (Multi-Input Multiple-Output) systems, facilitating the transmission of terahertz signals in various systems and adapting to complex conditions and scenarios for terahertz imaging and detection. Attached Figure Description
[0019] Figure 1a This is a schematic diagram of a high-bandwidth 220G terahertz transmitting front-end;
[0020] Figure 1b This is a schematic diagram of a frequency doubling amplifier sub-channel for a high-bandwidth 220G terahertz transmitter front-end.
[0021] Figure 2a Right view of a high-bandwidth 220G terahertz transmitter front end;
[0022] Figure 2b A top view of a high-bandwidth 220G terahertz transmitter front-end;
[0023] Figure 2c Left view of a high-bandwidth 220G terahertz transmitter front end;
[0024] Figure 3a A schematic diagram of a frequency multiplier amplifier structure for a high-bandwidth 220G terahertz transmitter front-end;
[0025] Figure 3b A side view of a frequency multiplier amplifier for a high-bandwidth 220 GHz terahertz transmitter front-end;
[0026] Figure 4a Right view of a power distribution link for a high-bandwidth 220G terahertz transmitter front-end;
[0027] Figure 4b A top view of a power distribution link for a high-bandwidth 220G terahertz transmitter front-end;
[0028] Figure 4c Left view of a power distribution link for a high-bandwidth 220G terahertz transmitter front-end;
[0029] Figure 5 This is a schematic diagram of the transmitter frequency multiplier amplification module structure for a high-bandwidth 220G terahertz transmitter front-end.
[0030] Figure label:
[0031] 1. Frequency doubler; 2. Filter; 3. Amplifier; 4. 1-to-2 power divider; 5. First 1-to-4 power divider; 6. Second 1-to-4 power divider; 7. Transmitter frequency multiplier module; 71. Sub-channel amplifier; 72. Frequency multiplier sub-channel; 721. Single-pole four-throw switch; 722. Sub-channel dual-path; 7221. Sub-channel frequency doubler; 7222. Sub-channel path amplifier; 7223. Single-pole double-throw switch; 7224. First frequency tripler; 7225. Second frequency tripler; 8. Countersunk hole. Detailed Implementation
[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0033] Example 1
[0034] like Figures 1a-1b As shown, a high-bandwidth 220G terahertz transmitter front-end includes a frequency doubler 1, a filter 2, an amplifier 3, and a 1-to-2 power divider 4 connected in sequence. The two output terminals of the 1-to-2 power divider 4 are respectively connected to a first 1-to-4 power divider 5 and a second 1-to-4 power divider 6. The output terminals of the first 1-to-4 power divider 5 and the second 1-to-4 power divider 6 are each connected to four transmitter frequency multiplier amplifier modules 7.
[0035] The transmitter frequency multiplier module 7 includes a sub-channel amplifier 71 and a frequency multiplier amplification sub-channel 72 connected in sequence. The frequency multiplier amplification sub-channel 72 includes a single-pole quad-throw switch 721 and four sub-channel dual-paths 722 respectively connected to the output terminal of the single-pole quad-throw switch 721. The sub-channel dual-path 722 includes a sub-channel second frequency multiplier 7221, a sub-channel path amplifier 7222, a single-pole double-throw switch 7223 connected in sequence, and a first third frequency multiplier 7224 and a second third frequency multiplier 7225 respectively connected to the two ports of the single-pole double-throw switch 7223. The output ports of the first third frequency multiplier 7224 and the second third frequency multiplier 7225 are the output ports of the high-bandwidth 220G terahertz transmitter front-end.
[0036] The frequency multiplier amplification sub-channel 72 has 8 channels, the sub-channel dual-path 722 has 32 channels, and the large bandwidth 220G terahertz transmitting front-end outputs 64 terahertz transmitting signals.
[0037] The input signal of the high-bandwidth 220G terahertz transmitting front-end is a low-frequency signal of 15G-21.7GHz. The input signal of the 8-channel transmitter frequency multiplier amplification module 7 is a frequency band signal of 30G-42.4GHz and the output signal is a frequency band signal of 60-84.8GHz. The output signal of the frequency multiplier amplification sub-channel 72 is a frequency band signal of 180GHz-260GHz.
[0038] The gain of the output signal of the transmitter frequency multiplier module 7 is 5dBm;
[0039] The frequency doubler 1, filter 2 and amplifier 3 are integrated on a single chip;
[0040] A transmitter frequency multiplier amplifier module 7 is integrated on a single chip;
[0041] The transmitter frequency multiplier module 7 includes 8 control ports;
[0042] The transmitter frequency multiplier module 7 includes a voltage regulator for providing a negative power supply;
[0043] The positive voltage of transmitter frequency multiplier module 7 is +5.5V, and the negative voltage is -5.5V;
[0044] The transmitter frequency multiplier module 7 is provided with four countersunk holes 8. The diameter of the countersunk holes 8 is 3.2mm and the depth is 4.5mm. A through hole with a diameter of 1.8mm is provided inside the countersunk holes 8.
[0045] This utility model consists of 64 transceiver links, and its scheme is as follows: Figures 1a-1b As shown, the 64-channel 180GHz-260GHz 12th harmonic frequency source consists of a frequency doubling local oscillator link, a bandpass filter, a switching amplifier link, and a power divider link, realizing a transmit signal of -5 to 0dBm.
[0046] First, the input 15G-21.7GHz low-frequency signal is doubled to obtain a 30G-42.4GHz signal. After passing through two power splitters, the signal is distributed to the 8-channel transmitter frequency multiplier module 7. The 8 channels are controlled by a single-pole four-throw switch to obtain 32 signals. After being doubled again, the signal is obtained as a 60-84.8GHz signal. It is then divided into 64 signals by a single-pole double-throw switch. The 64 signals are tripled to obtain the final 180GHz-260GHz transmission signal.
[0047] The specific implementation structure of the terahertz transmitting front end is as follows: Figures 2a-2c As shown, it consists of a frequency multiplier module, a local oscillator power distribution module, and eight parallel frequency multiplier modules. It amplifies a 15GHz-21.7GHz input signal through twelve frequency multiplications to achieve 64 channels of 180GHz-260GHz terahertz transmission signals.
[0048] The transmitter amplifies the signal frequency to the 30GHz-42.4GHz range after frequency doubling. The transmitter's frequency doubling amplification module is integrated on a chip. Figures 3a-3b The hardware structure includes MCP1401 pull-down, driver FDN352AP, SN74HC04PWR NOT gate, LT1964 and driver MADR-009443. The frequency multiplier amplifier has 8 control ports. Transmit channels 1 and 2 are controlled by "Transmit Channel Control 1 (1P)", with the pull-down state being the default state and transmit channel 1 is working. Transmit channels 3 and 4 are controlled by "Transmit Channel Control 2 (3P)", with the pull-down state being the default state and transmit channel 3 is working. Transmit channels 5 and 6 are controlled by "Transmit Channel Control 3 (5P)", with the pull-down state being the default state and transmit channel 5 is working. Transmit channels 7 and 8 are controlled by "Transmit Channel Control 4 (7P)", with the pull-down state being the default state and transmit channel 7 is working. 2P and 4P are connected to a positive voltage of +5.5V; 6P is connected to a negative power supply of -5.5V; 8P and 10P are grounded; 9P, 11P, 13P, and 14P are used for transmit path switching and control; 12P is used for transmit modulation, with the pull-down state being the default state and it is not working.
[0049] The 64-channel transmitter local oscillator power divider network amplifies the generated 15GHz-21.7GHz signal and distributes it to different antenna modules. A power divider amplifier splits the frequency-doubled amplified signal in two, and then a 1-to-4 power divider splits the amplified signal into eight channels. The specific structure is as follows: Figures 4a-4c As shown.
[0050] After being doubled and divided twice, the signal is formed into an 8-channel 30GHz-42.4GHz frequency band signal. Using an 8-channel transmitter frequency multiplier module, the signal can be amplified sixfold, reaching the 180GHz-260GHz frequency band. The 8-channel six-fold frequency multiplier module uses an LT1964 regulator to provide the negative power supply and an LT1965 regulator to provide the 5V positive power supply. A single frequency multiplier module structure diagram is shown below. Figure 5 As shown.
[0051] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A high-bandwidth 220G terahertz transmitting front-end, characterized in that: The system includes a frequency doubler (1), a filter (2), an amplifier (3), and a 1-to-2 power divider (4) connected in sequence. The two output terminals of the 1-to-2 power divider (4) are respectively connected to a first 1-to-4 power divider (5) and a second 1-to-4 power divider (6). The output terminals of the first 1-to-4 power divider (5) and the second 1-to-4 power divider (6) are each connected to four transmitter frequency multiplier amplification modules (7). The transmitter frequency multiplier module (7) includes a sub-channel amplifier (71) and a frequency multiplier sub-channel (72) connected in sequence. The frequency multiplier sub-channel (72) includes a single-pole four-throw switch (721) and four sub-channel dual-paths (722) respectively connected to the output terminal of the single-pole four-throw switch (721). The sub-channel dual-path (722) includes a sub-channel double frequency multiplier (7221), a sub-channel path amplifier (7222), a single-pole double-throw switch (7223), and a first third frequency multiplier (7224) and a second third frequency multiplier (7225) respectively connected to the two ports of the single-pole double-throw switch (7223). The output ports of the first third frequency multiplier (7224) and the second third frequency multiplier (7225) are the output ports of the large bandwidth 220G terahertz transmitter front end. The frequency multiplier amplification sub-channel (72) has 8 channels, the number of dual-channel sub-channels (722) is 32 channels, and the large bandwidth 220G terahertz transmitting front-end outputs 64 terahertz transmitting signals.
2. The high-bandwidth 220G terahertz transmitting front-end according to claim 1, characterized in that: The input signal of the high-bandwidth 220G terahertz transmitting front-end is a low-frequency signal of 15G-21.7GHz. The input signal of the 8-channel transmitter frequency multiplier amplification module (7) is a frequency band signal of 30G-42.4GHz and the output signal is a frequency band signal of 60-84.8GHz. The output signal of the frequency multiplier amplification sub-channel (72) is a frequency band signal of 180GHz-260GHz.
3. The high-bandwidth 220G terahertz transmitting front-end according to claim 1, characterized in that: The gain of the output signal of the transmitter frequency multiplier module (7) is 5dBm.
4. The high-bandwidth 220G terahertz transmitting front-end according to claim 1, characterized in that: The frequency doubler (1), the filter (2) and the amplifier (3) are integrated on a single chip.
5. The high-bandwidth 220G terahertz transmitting front-end according to claim 1, characterized in that: One of the transmitter frequency multiplier modules (7) is integrated on a single chip.
6. The high-bandwidth 220G terahertz transmitting front-end according to claim 1, characterized in that: The transmitter frequency multiplier module (7) includes 8 control ports.
7. The high-bandwidth 220G terahertz transmitting front-end according to claim 1, characterized in that: The transmitter frequency multiplier module (7) includes a voltage regulator for providing a negative power supply.
8. The high-bandwidth 220G terahertz transmitting front-end according to claim 1, characterized in that: The positive voltage of the transmitter frequency multiplier module (7) is +5.5V and the negative voltage is -5.5V.
9. The high-bandwidth 220G terahertz transmitting front-end according to claim 1, characterized in that: The transmitter frequency multiplier module (7) is provided with four countersunk holes (8), the diameter of the countersunk holes (8) is 3.2 mm and the depth is 4.5 mm, and a through hole with a diameter of 1.8 mm is provided inside the countersunk holes (8).
Citation Information
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