Portable modular OLT device

Abstract

The utility model discloses a portable modular OLT device. The portable modular OLT device comprises a control module, a first shell, a second shell and a bottom plate, the control module comprises an FPGA module, a circuit board, an optical driving chip and an optical module. A first shell is mounted at the front end of the bottom plate, and a second shell is mounted at the rear end; the circuit board is installed in the middle of the first shell. The FPGA module and the optical driving chip are arranged on the circuit board; the optical module is arranged in the middle of the second shell; one end of the optical module is connected with the circuit board, and the other end of the optical module extends outwards and is provided with a wiring port. The OLT device is small in size and high in compatibility, and can meet the requirements of quick access and use of the OLT device in different scenes.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to a portable modular OLT device. Background Technology

[0002] An optical line terminal (OLT) is a device used in optical communication networks. As the access point of an optical fiber network, the OLT is located on the service provider's side and connects to the splitter at the user end via optical fiber, thereby connecting to each user's ONU (Optical Network Unit) or ONT (Optical Network Terminal).

[0003] Currently, most OLT devices on the market are quite large and have complex structures. These traditional OLT devices generally consist of multiple large modules, including but not limited to main control boards, power supply modules, and service boards. These modules communicate and work together through complex interconnection lines. Due to their large size, they often require significant space during installation. In space-constrained locations, such as small server rooms or temporary workstations, finding suitable installation locations for large OLT devices is difficult, posing a significant challenge to deployment. Furthermore, their large size makes handling or moving the devices extremely difficult, requiring substantial manpower and resources and potentially causing damage during transport. Additionally, existing OLT devices cannot be directly used via SFP (Small Form-factor Pluggable) interfaces, which limits their compatibility with other devices. Utility Model Content

[0004] The purpose of this invention is to provide a portable modular OLT device that is small in size, highly compatible, and can meet the needs of rapid access and use of OLT devices in different scenarios. The specific technical solution is as follows:

[0005] A portable modular OLT device includes a control module, a first housing, a second housing, and a base plate. The control module includes an FPGA module, a circuit board, an optical driver chip, and an optical module. The first housing is mounted on the front end of the base plate, and the second housing is mounted on the rear end. The circuit board is mounted in the middle of the first housing. The FPGA module and the optical driver chip are disposed on the circuit board. The optical module is disposed in the middle of the second housing. One end of the optical module is connected to the circuit board, and the other end extends outward and is provided with a wiring port.

[0006] Preferably, it also includes a guide rail and a slider; the guide rail is installed on the top surface of the second housing, and the slider is installed in the middle of the guide rail; a locking block is installed at the front end of the slider.

[0007] Preferably, it further includes a pull rod; the pull rod is mounted at the rear end of the second housing; one end of the pull rod is hinged to the rear end of the second housing.

[0008] Preferably, it also includes a U-shaped rod; the U-shaped rod is disposed at the rear end of the slider, and one end of the U-shaped rod is connected to the end of the pull rod that is hinged to the second housing.

[0009] Preferably, it also includes a heat dissipation component; the heat dissipation component is disposed on the bottom surface of the second housing.

[0010] Preferably, the heat dissipation assembly includes a bump, a first heat sink, and a second heat sink; the bump is disposed on the bottom surface of the second housing, and the first heat sink is disposed in the middle of the bump; one end of the first heat sink extends into the interior of the second housing; the second heat sink is installed inside the first housing and the second housing; one end of the first heat sink extending into the interior of the second housing is connected to the second heat sink.

[0011] Preferably, the first heat sink and the second heat sink are copper sheets.

[0012] Preferably, the front end of the circuit board is provided with a connection contact point.

[0013] Compared with existing technologies, this utility model has the following beneficial effects:

[0014] This invention utilizes an optical module for photoelectric signal conversion. Its interface allows external wiring to send signals to the optical driver chip and FPGA module, achieving efficient conversion between optical and electrical signals and providing a foundation for data transmission. The optical driver chip monitors the overall operating current and voltage of the device in real time, ensuring the device remains within a safe and stable range. This creates a stable working environment for the FPGA and optical modules, guaranteeing stable data transmission and preventing damage caused by current and voltage fluctuations. The FPGA module manages and schedules data from the optical module and external devices, classifying, buffering, and forwarding data according to different network requirements. This enables connection and management of multiple user terminals, ensuring stable network service for each user and significantly improving network performance and user experience. The first and second outer shells securely fix the circuit board, preventing components from loosening or being damaged due to vibration or impact, ensuring the device's stability in various operating environments. Furthermore, they allow the device to connect to an SFP interface, facilitating easy connection to devices with SFP interfaces, reducing the size of the OLT device and improving its portability. For example, it can be directly connected to a switch via the SFP interface to perform the functions of a traditional OLT device. After being connected to a switch, the powerful functions of the switch can be fully utilized to achieve wider network coverage and more efficient data processing. This invention supports a maximum of 16 ONUs in a network, which can meet the needs of small and medium-sized networks and provide users with stable and high-speed network connection services. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0016] Figure 1 This is a front structural diagram of the present invention.

[0017] Figure 2 This is a schematic diagram of the back structure of this utility model.

[0018] Figure 3 This is a cross-sectional view of the present invention.

[0019] Figure 4 This is a rear view of the present invention.

[0020] Explanation of key figure labels:

[0021] 1-Control module, 2-First housing, 3-Slider, 4-Guide rail, 5-Second housing, 6-Base plate, 7-Pull rod, 8-Protrusion, 9-Heat dissipation assembly, 10-First heat sink, 11-Optical module, 12-Second heat sink. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] In the description of this utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "top surface", "bottom surface", "inner", "outer", "inner side", "outer side", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If the terms "first," "second," and "third" are used in the description, they are for descriptive purposes and to distinguish technical features, and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the sequential relationship of the indicated technical features.

[0025] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. The embodiments of this utility model will now be described based on its overall structure.

[0026] Example 1

[0027] A portable modular OLT device, as shown in the figure, includes a control module, a first housing, a second housing, and a base plate. The control module includes an FPGA module, a circuit board, an optical driver chip, and an optical module. The first housing is mounted on the front end of the base plate, and the second housing is mounted on the rear end. The circuit board is mounted in the middle of the first housing. The FPGA module and the optical driver chip are mounted on the circuit board. The optical module is located in the middle of the second housing. One end of the optical module is connected to the circuit board, and the other end extends outward and is provided with a wiring port.

[0028] Next, the working principle of this embodiment will be described in detail so that those skilled in the art can better understand this utility model:

[0029] The optical module is used for photoelectric signal conversion. The connector on the optical module is used to connect external lines and send signals to the optical driver chip and FPGA module on the circuit board. The optical driver chip plays a protective role; by monitoring the overall operating current and voltage of the device in real time, it immediately activates the corresponding adjustment control device to ensure that the operating current and voltage are always within a safe and stable range when an abnormality is detected. This creates a stable working environment for the FPGA module and the optical module, ensuring their continuous and stable operation without interference from current and voltage fluctuations. The FPGA module manages and schedules data from the optical module and external devices. It can classify, cache, and forward data according to different network requirements, enabling the connection and management of multiple user terminals. For example, when multiple users connect to the OLT device through a fiber optic network, the FPGA module can identify and allocate different bandwidth resources, ensuring that each user receives stable network service. Furthermore, the first and second housings play a fixing role in the device. On one hand, they are used to firmly fix the circuit board, ensuring that the circuit board maintains a stable position under various operating environments and preventing components on the circuit board from loosening or being damaged due to vibration or impact. On the other hand, the first and second shells work together to connect the entire device into the SFP interface, enabling the device to be easily connected to devices with SFP interfaces. This greatly improves the device's compatibility and ease of use, meeting the needs for rapid access and use in different scenarios.

[0030] Example 2

[0031] The difference between this embodiment and embodiment 1 is that it also includes a guide rail and a slider; the guide rail is installed on the top surface of the second housing, and the slider is installed in the middle of the guide rail; a locking block is installed at the front end of the slider.

[0032] A guide rail is mounted on the top surface of the second housing, with a slider installed in the middle of the guide rail. A locking block is mounted at the front end of the slider. The position of the locking block can be adjusted by moving the slider on the guide rail, thus connecting to the SFP interface. The guide rail on the top surface of the second housing provides a track for the slider to move. The slider can slide on the guide rail, thereby moving the locking block mounted at the front end. When it is necessary to connect the device to a device with an SFP interface, the position of the slider on the guide rail can be adjusted to make the locking block mate with the SFP interface and achieve a stable connection.

[0033] The working principle of this embodiment is the same as that of Embodiment 1.

[0034] Example 3

[0035] The difference between this embodiment and Embodiment 2 is that it also includes a pull rod; the pull rod is mounted at the rear end of the second housing; one end of the pull rod is hinged to the rear end of the second housing. The pull rod is used to remove the entire device from the SFP interface.

[0036] The pull rod is mounted at the rear end of the second housing and hinged at one end to the second housing. The pull rod can rotate along the rear end of the second housing. When it is necessary to remove the device from the SFP interface, the entire device can be pulled out of the interface by pulling the pull rod. The pull rod design facilitates quick disassembly of the device when needed, improving the ease of use of the device.

[0037] The working principle of this embodiment is the same as that of Embodiment 1.

[0038] Example 4

[0039] The difference between this embodiment and embodiment 3 is that it also includes a U-shaped rod; the U-shaped rod is disposed at the rear end of the slider, and one end of the U-shaped rod is connected to the end of the pull rod that is hinged to the second housing.

[0040] When the entire device is installed inside the SFP interface, the U-shaped rod is used to push the locking block. When the pull rod is rotated, the U-shaped rod rotates together with the pull rod, pushing the locking block so that the locking block pops out of the SFP interface slot, achieving quick disassembly.

[0041] The working principle of this embodiment is the same as that of Embodiment 1.

[0042] Example 5

[0043] The difference between this embodiment and embodiment 4 is that it also includes a heat dissipation component; the bottom surface of the second housing is provided with the heat dissipation component. The heat dissipation component serves to dissipate heat. During device operation, components such as the FPGA module, optical driver chip, and optical module generate heat. The heat dissipation component can dissipate this heat in a timely manner, preventing the internal temperature of the device from becoming too high, thereby ensuring that each component can operate stably in a suitable temperature environment, extending the service life of the device, and improving the reliability of the device.

[0044] The working principle of this embodiment is the same as that of Embodiment 1.

[0045] Example 6

[0046] The difference between this embodiment and embodiment 5 is that the heat dissipation component includes a bump, a first heat sink, and a second heat sink; the bump is disposed on the bottom surface of the second housing, and the first heat sink is disposed in the middle of the bump; one end of the first heat sink extends into the interior of the second housing; the second heat sink is installed inside the first housing and the second housing; one end of the first heat sink extending into the interior of the second housing is connected to the second heat sink.

[0047] The first and second heat sinks serve a heat dissipation function. The second heat sink is located inside both the first and second outer shells, dissipating the heat generated during the overall operation of the device to the outside through the first heat sink. The protrusion is located on the bottom surface of the second outer shell, providing support and a mounting position for the first heat sink. During operation, the second heat sink absorbs heat generated inside the device and transfers it to the first heat sink. The first heat sink then dissipates the heat to the outside, achieving efficient heat dissipation. This heat dissipation structure is rationally designed and effectively dissipates heat from inside the device, ensuring stable operation.

[0048] The working principle of this embodiment is the same as that of Embodiment 1.

[0049] Example 7

[0050] The difference between this embodiment and Embodiment 6 is that the first and second heat sinks are made of copper. Using copper as heat sinks improves heat dissipation efficiency, further enhances the heat dissipation effect of the device, and ensures that the device remains within a suitable temperature range during operation.

[0051] The working principle of this embodiment is the same as that of Embodiment 1.

[0052] Example 8

[0053] The difference between this embodiment and embodiment 7 is that the front end of the circuit board is provided with connecting contacts. These connecting contacts serve a connecting function, used to connect the entire device into the equipment to be used.

[0054] The working principle of this embodiment is the same as that of Embodiment 1.

[0055] In summary, this invention achieves photoelectric signal conversion through an optical module. Its interface allows external wiring to send signals to the optical driver chip and FPGA module, realizing efficient conversion between optical and electrical signals and providing a foundation for data transmission. The optical driver chip monitors the overall operating current and voltage of the device in real time, ensuring the device remains within a safe and stable range. This creates a stable working environment for the FPGA and optical modules, guaranteeing data transmission stability and preventing damage caused by current and voltage fluctuations. The FPGA module manages and schedules data from the optical module and external devices, classifying, buffering, and forwarding data according to different network requirements. This enables connection and management of multiple user terminals, ensuring stable network service for each user and significantly improving network performance and user experience. The first and second outer shells firmly secure the circuit board, preventing components from loosening or being damaged due to vibration or impact, ensuring the device's stability in various operating environments. Furthermore, they allow the device to connect to an SFP interface, facilitating easy connection to devices with SFP interfaces, reducing the size of the OLT device and improving its portability. For example, it can be directly connected to a switch via the SFP interface to perform the functions of a traditional OLT device. After being connected to a switch, the powerful functions of the switch can be fully utilized to achieve wider network coverage and more efficient data processing. This invention supports a maximum of 16 ONUs in a network, which can meet the needs of small and medium-sized networks and provide users with stable and high-speed network connection services.

[0056] The foregoing description of specific exemplary embodiments of the present invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the present invention to the precise forms disclosed, and it is obvious that many changes and variations can be made based on the above teachings. Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. The purpose of selecting and describing exemplary embodiments is to explain the specific principles of the present invention and its practical application, so that those skilled in the art, after reading this specification, can make modifications, substitutions, variations, and various choices and changes to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, variations, and choices and changes are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A portable modular OLT device, characterized in that, It includes a control module, a first housing, a second housing, and a base plate; the control module includes an FPGA module, a circuit board, an optical driver chip, and an optical module; the first housing is installed at the front end of the base plate, and the second housing is installed at the rear end; The circuit board is installed in the middle of the first housing; the FPGA module and the optical driver chip are disposed on the circuit board; the optical module is disposed in the middle of the second housing; one end of the optical module is connected to the circuit board, and the other end extends outward and is provided with a wiring port.

2. The portable modular OLT device according to claim 1, characterized in that, It also includes a guide rail and a slider; the guide rail is installed on the top surface of the second housing, and the slider is installed in the middle of the guide rail; a locking block is installed at the front end of the slider.

3. A portable modular OLT device according to claim 1, characterized in that, It also includes a pull rod; the pull rod is mounted at the rear end of the second housing; one end of the pull rod is hinged to the rear end of the second housing.

4. A portable modular OLT device according to claim 1, characterized in that, It also includes a U-shaped rod; the U-shaped rod is disposed at the rear end of the slider, and one end of the U-shaped rod is connected to the end of the pull rod that is hinged to the second housing.

5. A portable modular OLT device according to claim 1, characterized in that, It also includes a heat dissipation component; the bottom surface of the second housing is provided with the heat dissipation component.

6. A portable modular OLT device according to claim 5, characterized in that, The heat dissipation assembly includes a protrusion, a first heat sink, and a second heat sink; the protrusion is disposed on the bottom surface of the second housing, and the first heat sink is disposed in the middle of the protrusion; one end of the first heat sink extends into the interior of the second housing. The second heat sink is installed inside the first housing and the second housing; one end of the first heat sink extends into the second housing and is connected to the second heat sink.

7. A portable modular OLT device according to claim 6, characterized in that, The first and second heat sinks are made of copper sheets.

8. A portable modular OLT device according to claim 1, characterized in that, The circuit board has a connection contact point at its front end.

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