Circuit board assembly and electronic equipment

Abstract

The utility model provides a circuit board assembly and electronic equipment, and belongs to the technical field of electronic equipment. The shielding cover is fixed on the circuit board; and the reinforcing member is connected with the circuit board and the shielding case.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a circuit board assembly and an electronic device. Background Technology

[0002] In related technologies, electronic devices typically use shielding covers on circuit boards to reduce electromagnetic interference and achieve electromagnetic shielding for the components inside the shielding cover. However, under impact conditions such as drops or stress, the shielding cover and circuit board may crack, leading to shielding failure. Utility Model Content

[0003] The purpose of this application is to provide a circuit board assembly and electronic device that can effectively solve the technical problems of shielding and circuit board cracking.

[0004] In a first aspect, embodiments of this application provide a circuit board assembly, including:

[0005] Circuit board;

[0006] The shielding cover is fixed to the circuit board;

[0007] The reinforcement components are connected to the circuit board and the shielding cover.

[0008] Secondly, embodiments of this application provide an electronic device, including: a circuit board assembly as provided in the first aspect.

[0009] In this embodiment of the application, the circuit board assembly includes a circuit board, a shielding cover, and a reinforcing member. The shielding cover is fixed on the circuit board, and the reinforcing member is disposed on the circuit board and the shielding cover, thereby increasing the connection strength between the circuit board and the shielding cover, reducing the possibility of cracking of the shielding cover and the circuit board, and improving the reliability of the shielding cover. Attached Figure Description

[0010] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0011] Figure 1 One of the cross-sectional views of a circuit board assembly provided in one embodiment of this application is shown;

[0012] Figure 2 A second cross-sectional view of a circuit board assembly provided in one embodiment of this application is shown;

[0013] Figure 3 A schematic diagram of one embodiment of the circuit board assembly provided in this application is shown;

[0014] Figure 4 A third cross-sectional view of a circuit board assembly provided in one embodiment of this application is shown;

[0015] Figure 5 One of the enlarged partial views of a circuit board assembly provided in one embodiment of this application is shown;

[0016] Figure 6 One of the cross-sectional views of a circuit board in a circuit board assembly provided in one embodiment of this application is shown;

[0017] Figure 7 A fourth cross-sectional view of a circuit board assembly provided in one embodiment of this application is shown;

[0018] Figure 8 This is a second partial enlarged view of a circuit board assembly provided in one embodiment of this application;

[0019] Figure 9 A second cross-sectional view of a circuit board in a circuit board assembly provided in one embodiment of this application is shown;

[0020] Figure 10 A schematic diagram of a circuit board in a circuit board assembly provided in one embodiment of this application is shown;

[0021] Figure 11 Fifth cross-sectional view of a circuit board assembly provided in one embodiment of this application is shown;

[0022] Figure 12 Sixth cross-sectional view of a circuit board assembly provided in one embodiment of this application is shown;

[0023] Figure 13 This is shown as a third partial enlarged view of a circuit board assembly provided in one embodiment of this application;

[0024] Figure 14 A cross-sectional view of a circuit board assembly provided in one embodiment of this application is shown in Figure 7.

[0025] Figure 15 A fourth partial enlarged view of a circuit board assembly provided in one embodiment of this application is shown;

[0026] Figure 16 A second schematic diagram of a circuit board assembly provided in one embodiment of this application is shown;

[0027] Figure 17 A third schematic diagram of a circuit board assembly provided in one embodiment of this application is shown;

[0028] Figure 18 A schematic diagram of a circuit board and a speaker in a circuit board assembly provided in one embodiment of this application is shown;

[0029] Figure 19 A schematic diagram of a partial structure of an electronic device provided in one embodiment of this application is shown.

[0030] Figures 1 to 19 Figure label:

[0031] 100 Circuit board assembly, 110 Circuit board, 112 Through hole, 114 Receiving cavity, 1142 Drain hole, 1144 Cavity, 116 Surface layer, 118 Inner layer, 120 Shielding cover, 122 Edge, 124 Side wall, 126 Top wall, 130 Reinforcing member, 132 Adhesive, 134 Reinforcing film, 140 Speaker, 142 Rear cavity, 150 First electronic component, 160 Second electronic component, 200 Electronic device, 210 Device body. Detailed Implementation

[0032] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0033] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0034] In the description of this application, it should be understood that the terms "upper" and "inner", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] The following is combined Figures 1 to 19This application describes a circuit board assembly 100 and an electronic device according to embodiments thereof.

[0037] Firstly, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 7 , Figure 11 , Figure 12 and Figure 14 As shown, this application embodiment provides a circuit board assembly 100, including: a circuit board 110; a shielding cover 120 fixed on the circuit board 110; and a reinforcement member 130 connected to the circuit board 110 and the shielding cover 120.

[0038] In this embodiment of the application, the circuit board assembly 100 includes a circuit board 110, a shield 120, and a reinforcement 130. The shield 120 is fixed on the circuit board 110, and the reinforcement 130 is disposed on the circuit board 110 and the shield 120, thereby increasing the connection strength between the circuit board 110 and the shield 120, reducing the possibility of cracking of the shield 120 and the circuit board 110, and improving the reliability of the shield 120.

[0039] like Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, in one possible implementation, the reinforcement 130 includes adhesive 132, and the circuit board 110 has a receiving cavity 114 on the side facing the shield 120, with at least a portion of the adhesive 132 located within the receiving cavity 114.

[0040] Specifically, the reinforcement 130 includes an adhesive 132, which strengthens the connection between the shielding cover 120 and the circuit board 110. The circuit board 110 has a receiving cavity 114 on the side facing the shielding cover 120, and at least a portion of the adhesive 132 is located in the receiving cavity 114, increasing the contact area between the adhesive 132 and the circuit board 110, improving the connection strength between the adhesive 132 and the circuit board 110, thereby reducing the possibility of the adhesive 132 detaching from the circuit board 110, and further improving the connection strength between the shielding cover 120 and the circuit board 110.

[0041] That is, during manufacturing, the shielding cover 120 is first fixed on the circuit board 110, and then adhesive is applied so that the fluid adhesive 132 flows into the receiving cavity 114. After the adhesive 132 cures, the shielding cover 120 and the circuit board 110 are reinforced.

[0042] Furthermore, the adhesive 132 strengthens the connection between the shielding cover 120 and the circuit board 110. The adhesive 132 can be placed near the pads of the shielding cover 120 to reinforce the stress between the shielding cover 120 and the circuit board 110, and enhance the sealing effect between the circuit board 110 and the shielding cover 120.

[0043] Since the adhesive 132, the shielding cover 120, and the green oil on the surface of the circuit board 110 are three different materials with different surface roughness and properties, a receiving cavity 114 is carved out on the circuit board 110. Before curing, the adhesive 132 has good fluidity, so the adhesive 132 can overflow into the receiving cavity 114. After being cured by ultraviolet (UV) or heat, the adhesive 132 is cured and formed, forming a root structure in the inner layer 118 of the circuit board 110. This increases the pull-out force between the shielding cover 120 and the circuit board 110, reduces the risk of the adhesive 132 coming off, and improves the reliability of the sealing and connection of the adhesive 132.

[0044] Specifically, the circuit board 110 has a multi-layer structure. According to the circuit design requirements of the project, traces, vias and cavities 114 are arranged on different layers. After processing, they are pressed together layer by layer to form a complete cavity 114.

[0045] As mentioned above, the adhesive 132 can be used to reinforce and effectively seal the areas of the shield 120 that require sealing.

[0046] Specifically, the cavity 114 can be connected to the entire circuit board 110, or it can exist only in a part of the stack of the circuit board 110. The cavity 114 is filled with the fluidity of the adhesive 132 and then the adhesive 132 is cured. The adhesive 132 forms a root structure in the circuit board 110, reducing the possibility of the adhesive 132 detaching from the circuit board 110.

[0047] In the embodiments provided in this application, adhesive 132 is applied to certain areas of the shielding cover 120. After the adhesive 132 cures, the rigid adhesive 132 provides support and reinforcement for the shielding cover 120 and acts as a seal to prevent air leakage. To ensure a strong bond between the adhesive 132 and the circuit board 110 and the shielding cover 120, an additional receiving cavity 114 is designed on the circuit board 110. Utilizing the fluidity of the adhesive 132 before curing, it fully penetrates into the inner layer 118 of the circuit board 110, increasing the contact area between the adhesive 132 and the circuit board 110, and ensuring the reliability of the bonding and sealing between the adhesive 132 and the circuit board 110.

[0048] like Figure 7 , Figure 8 , Figure 9 and Figure 10As shown, in one possible implementation, the receiving cavity 114 includes: a flow guide hole 1142; a cavity 1144 connected to the flow guide hole 1142, the cavity 1144 being located on the side of the flow guide hole 1142 away from the shielding cover 120, and the cross-sectional area (S1+S2) of the cavity 1144 being larger than the cross-sectional area (S1) of the flow guide hole 1142.

[0049] Specifically, the receiving cavity 114 includes a flow guide hole 1142 and a cavity 1144. The flow guide hole 1142 and the cavity 1144 are connected. The cavity 1144 is located on the side of the flow guide hole 1142 away from the shielding cover 120. Thus, when the adhesive 132 is applied, the adhesive 132 can flow into the cavity 1144 through the flow guide hole 1142. After the adhesive 132 solidifies, it reinforces the circuit board 110 and the shielding cover 120.

[0050] Furthermore, the cross-sectional area (S1+S2) of the cavity 1144 is larger than the cross-sectional area (S1) of the guide hole 1142. As a result, after the adhesive 132 solidifies, the adhesive 132 located in the cavity 1144 cannot detach from the circuit board 110 through the guide hole 1142, thereby further improving the connection strength between the adhesive 132 and the circuit board 110 and enhancing the reinforcement effect of the adhesive 132 between the circuit board 110 and the shielding cover 120.

[0051] That is, during the process of processing the circuit board 110 stacking, a larger cavity 1144 is pre-cut on the inner layer 118, and a smaller guide hole 1142 is opened on the outer layer 116. The guide hole 1142 connects the cavity 1144 and the external space of the circuit board 110. After processing, they are pressed together into a circuit board 110.

[0052] When the adhesive 132 is in a liquid state before curing, it flows through the smaller guide holes 1142 on the surface layer 116 and into the larger cavity 1144 in the inner layer 118, filling the cavity 1144. After curing by ultraviolet light or heat, it forms a "large inside and small outside" riveting structure, which improves the reliability of the connection between the adhesive 132 and the circuit board 110, ensures the consistency of the seal between the shield 120 and the circuit board 110, and provides a better reinforcement effect.

[0053] like Figure 9 As shown, in one possible implementation, the flow guide hole 1142 is located on the surface layer 116 of the circuit board 110, and the cavity 1144 is located on the inner layer 118 of the circuit board 110.

[0054] Specifically, the circuit board 110 has a multi-layer structure, with the flow guide hole 1142 disposed on the surface layer 116 of the circuit board 110 and the cavity 1144 disposed on the inner layer 118 of the circuit board 110, thereby reducing the processing difficulty of the circuit board 110.

[0055] like Figure 3As shown, in one possible implementation, the number of receiving cavities 114 is at least two, and the at least two receiving cavities 114 are distributed around the circumference of the shield 120.

[0056] Specifically, the number of receiving cavities 114 is at least two, and the at least two receiving cavities 114 are distributed around the shield 120 to reduce the encroachment of the receiving cavities 114 on the circuit board 110 and facilitate the design of the wiring on the circuit board 110.

[0057] like Figure 5 and Figure 8 As shown, in one possible implementation, the side where the shield 120 and the circuit board 110 are connected has an edge 122, and the adhesive 132 covers at least a portion of the edge 122.

[0058] Specifically, the shielding cover 120 has an edge 122 connected to the circuit board 110. The adhesive 132 covers at least part of the edge 122, thereby increasing the contact area between the adhesive 132 and the shielding cover 120 and increasing the connection strength between the adhesive 132 and the shielding cover 120. Furthermore, with this reinforcement method, the adhesive 132 and the circuit board 110 sandwich the edge 122 in the middle, thereby further reducing the possibility of cracking of the shielding cover 120 and the circuit board 110.

[0059] like Figure 12 , Figure 13 , Figure 14 and Figure 15 As shown, in one possible implementation, the reinforcement 130 also includes a reinforcement film 134, which covers at least a portion of the shielding cover 120, at least a portion of the adhesive 132, and at least a portion of the circuit board 110.

[0060] Specifically, the reinforcement 130 also includes a reinforcement film 134, which covers at least a portion of the shielding cover 120, at least a portion of the adhesive 132, and at least a portion of the circuit board 110, thereby further increasing the connection strength between the shielding cover 120 and the circuit board 110 and reducing the possibility of cracking of the shielding cover 120 and the circuit board 110.

[0061] Among them, the reinforcing membrane 134 can be a three-dimensional (3D) shielding membrane.

[0062] Optionally, such as Figure 12 and Figure 13As shown, the reinforcement component 130 includes adhesive 132 and a reinforcing film 134. After the shielding cover 120 is soldered onto the circuit board 110, adhesive is applied to the outside of the shielding cover 120. The adhesive 132 flows into the receiving cavity 114. Then, the reinforcing film 134 is applied to cover and seal the area. After heating and molding, the reinforcing film 134 can be tightly bonded to the circuit board 110. The adhesive 132 and the reinforcing film 134 work together to reinforce the connection between the shielding cover 120 and the circuit board 110, thereby improving the connection strength and sealing effect between the shielding cover 120 and the circuit board 110.

[0063] Optionally, such as Figure 14 and Figure 15 As shown, the reinforcement component 130 includes adhesive 132 and a reinforcing film 134. After the shielding cover 120 is soldered onto the circuit board 110, adhesive is applied to the outside of the shielding cover 120. The adhesive 132 flows into the cavity 1144 through the guide hole 1142. Then, the reinforcing film 134 is applied to cover and seal the cavity. After heating and molding, the reinforcing film 134 can be tightly bonded to the circuit board 110. The adhesive 132 and the reinforcing film 134 work together to reinforce the connection between the shielding cover 120 and the circuit board 110, thereby improving the connection strength and sealing effect between the shielding cover 120 and the circuit board 110.

[0064] like Figure 5 , Figure 8 , Figure 13 and Figure 15 As shown, in one possible implementation, the reinforcement 130 includes a reinforcement film 134 that covers at least a portion of the shielding cover 120 and at least a portion of the circuit board 110.

[0065] Specifically, the reinforcement 130 includes a reinforcement film 134 that covers at least a portion of the shielding cover 120 and at least a portion of the circuit board 110, thereby increasing the connection strength between the shielding cover 120 and the circuit board 110 and reducing the possibility of cracking of the shielding cover 120 and the circuit board 110.

[0066] Among them, the reinforcing membrane 134 can be a three-dimensional (3D) shielding membrane.

[0067] After the shielding cover 120 is soldered onto the circuit board 110, the reinforcing film 134 is applied for sealing. After being heated and formed, the reinforcing film 134 can fit tightly against the circuit board 110. The reinforcing film 134 is used to reinforce the connection between the shielding cover 120 and the circuit board 110, thereby improving the connection strength and sealing effect between the shielding cover 120 and the circuit board 110.

[0068] Furthermore, when the reinforcing film 134 has an electromagnetic shielding function, when the second electronic component 160 around the shielding cover 120 needs to be additionally electromagnetically shielded, the reinforcing film 134 can be extended to the second electronic component 160 and covered on it to achieve the shielding effect and achieve the shielding effect on the electronic component. Since the reinforcing film 134 has a low density and thin thickness, it can also reduce the weight and thickness of the circuit board assembly 100.

[0069] like Figure 11 , Figure 12 and Figure 13 As shown, in one possible implementation, the reinforcing film 134 has an electromagnetic shielding function, and the circuit board assembly 100 further includes: a first electronic component 150 disposed on the circuit board 110 and located inside the shielding cover 120; and a second electronic component 160 disposed on the circuit board 110 and located outside the shielding cover 120, with the reinforcing film 134 covering the second electronic component.

[0070] Specifically, the reinforcing film 134 has electromagnetic shielding function. The circuit board assembly 100 also includes a first electronic component 150 and a second electronic component 160. The first electronic component 150 is disposed on the circuit board 110 and is located within the space formed by the shielding cover 120 and the circuit board 110. The second electronic component 160 is disposed on the circuit board 110 and is located outside the space formed by the shielding cover 120 and the circuit board 110. The reinforcing film 134 covers the second electronic component 160. That is, the first electronic component 150 is shielded by the shielding cover 120, and the second electronic component 160 is shielded by the reinforcing film 134. The reinforcing film 134 is lightweight, which is beneficial to the weight reduction of electronic equipment.

[0071] This structure is applicable to both cases where the reinforcement 130 includes adhesive 132 and cases where the reinforcement 130 does not include adhesive 132.

[0072] That is, the reinforcing film 134 can be formed by heating. After forming, the reinforcing film 134 is tightly attached to the circuit board 110, the shielding cover 120 and the second electronic component 160, thereby ensuring the reliability of the seal between the circuit board 110 and the shielding cover 120. In addition, the reinforcing film 134 has an electromagnetic shielding function. The reinforcing film 134 can cover the second electronic component 160 outside the shielding cover 120, thereby playing an electromagnetic shielding role. It can reduce the volume or number of shielding covers 120 and save space on the circuit board 110. Since the reinforcing film 134 has low density and thinness, it can also reduce the weight and thickness of the circuit board assembly 100.

[0073] Optionally, such as Figure 11As shown, the reinforcing film 134 reinforces the circuit board 110 and the shielding cover 120. The shielding cover 120 is soldered to the circuit board 110 via pads. The reinforcing film 134 can be placed near the pads of the shielding cover 120. The reinforcing film 134 strengthens the connection between the circuit board 110 and the shielding cover 120 and improves the sealing effect of the circuit board 110 and the shielding cover 120. The reinforcing film 134 can be formed by heating. After forming, the reinforcing film 134 is tightly attached to the circuit board 110 and the shielding cover 120.

[0074] By using the reinforcing membrane 134 to cover the shielding cover 120 that requires sealing, a double sealing effect can be achieved, improving the reliability of the seal between the shielding cover 120 and the circuit board 110.

[0075] Optionally, such as Figure 12 and Figure 13 As shown, the reinforcement component 130 includes adhesive 132 and a reinforcing film 134. After the shielding cover 120 is soldered onto the circuit board 110, adhesive is applied to the outside of the shielding cover 120. The adhesive 132 flows into the receiving cavity 114. Then, the reinforcing film 134 is applied to cover and seal the area. After heating and molding, the reinforcing film 134 can be tightly bonded to the circuit board 110. The adhesive 132 and the reinforcing film 134 work together to reinforce the connection between the shielding cover 120 and the circuit board 110, thereby improving the connection strength and sealing effect between the shielding cover 120 and the circuit board 110.

[0076] Furthermore, when the reinforcing film 134 has an electromagnetic shielding function, when the second electronic component 160 around the shielding cover 120 needs to be additionally electromagnetically shielded, the reinforcing film 134 can be extended to the second electronic component 160 and covered on it to achieve the shielding effect and achieve the shielding effect on the electronic component. Since the reinforcing film 134 has a low density and thin thickness, it can also reduce the weight and thickness of the circuit board assembly 100.

[0077] Optionally, such as Figure 14 and Figure 15 As shown, the reinforcement component 130 includes adhesive 132 and a reinforcing film 134. After the shielding cover 120 is soldered onto the circuit board 110, adhesive is applied to the outside of the shielding cover 120. The adhesive 132 flows into the cavity 1144 through the guide hole 1142. Then, the reinforcing film 134 is applied to cover and seal the cavity. After heating and molding, the reinforcing film 134 can be tightly bonded to the circuit board 110. The adhesive 132 and the reinforcing film 134 work together to reinforce the connection between the shielding cover 120 and the circuit board 110, thereby improving the connection strength and sealing effect between the shielding cover 120 and the circuit board 110.

[0078] Furthermore, when the reinforcing film 134 has an electromagnetic shielding function, when the second electronic component 160 around the shielding cover 120 needs to be additionally electromagnetically shielded, the reinforcing film 134 can be extended to the second electronic component 160 and covered on it to achieve the shielding effect and achieve the shielding effect on the electronic component. Since the reinforcing film 134 has a low density and thin thickness, it can also reduce the weight and thickness of the circuit board assembly 100.

[0079] The shielding cover 120 and the circuit board 110 are reinforced with adhesive 132, improving the connection strength and sealing effect between them. Furthermore, a "larger inside, smaller outside" accommodating cavity 114 is designed in the circuit board 110, and the adhesive 132 itself forms a riveting structure, reducing the possibility of the adhesive 132 and the circuit board 110 detaching. Then, a reinforcing film 134 is used to cover the shielding cover 120 and the circuit board 110, achieving a double sealing effect and improving the reliability of the seal between them. Simultaneously, the reinforcing film 134 can also cover surrounding devices requiring shielding, saving space on the circuit board 110 and increasing the utilization rate of the reinforcing film 134.

[0080] like Figure 5 , Figure 8 , Figure 13 and Figure 15 As shown, in one possible implementation, the shield 120 includes: a sidewall 124 connected to the circuit board 110; and a top wall 126 located on the side of the sidewall 124 opposite to the circuit board 110; wherein, the reinforcing film 134 covers at least a portion of the sidewall 124 and at least a portion of the top wall 126.

[0081] Specifically, the shielding cover 120 includes a side wall 124 and a top wall 126. The side wall 124 is connected to the circuit board 110, and the top wall 126 is located on the side of the side wall 124 away from the circuit board 110. The reinforcing film 134 covers at least a portion of the side wall 124 and at least a portion of the top wall 126, thereby increasing the contact area between the reinforcing film 134 and the shielding cover 120 and improving the connection strength between the reinforcing film 134 and the shielding cover 120. Furthermore, with this reinforcement method, the reinforcing film 134 and the circuit board 110 sandwich the shielding cover 120 in the middle, thereby further reducing the possibility of cracking of the shielding cover 120 and the circuit board 110.

[0082] This structure is applicable to both cases where the reinforcement 130 includes adhesive 132 and cases where the reinforcement 130 does not include adhesive 132.

[0083] like Figure 3 As shown, in one possible implementation, the reinforcement 130 is connected to a portion of the shield 120 along the circumference of the shield 120.

[0084] Specifically, along the circumference of the shielding cover 120, the reinforcement 130 is connected to a portion of the shielding cover 120. This arrangement allows the reinforcement 130 to be placed at weak points in the connection between the shielding cover 120 and the circuit board 110, thereby reducing the investment in reinforcement 130 and lowering production costs. Since the shape and pad positions of the shielding cover 120 vary, the weak points in the connection between the shielding cover 120 and the circuit board 110 can be determined through simulation or experimentation.

[0085] That is, the reinforcement 130 is only set at the weak point between the shield 120 and the circuit board 110. This point can be understood as the stress risk area between the circuit board 110 and the shield 120, where the circuit board 110 and the shield 120 are prone to cracking.

[0086] This structure is applicable to both cases where the reinforcement 130 includes adhesive 132 and cases where the reinforcement 130 does not include adhesive 132.

[0087] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 7 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 As shown, as one possible implementation, it further includes: a speaker, disposed on a circuit board, the speaker having a rear cavity, the rear cavity being connected to the interior of a shielding cover; wherein, as... Figure 2 As shown, the rear cavity and the shield are located on the same side of the circuit board, or as... Figure 3 , Figure 4 , Figure 5 , Figure 7 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 As shown, the rear cavity and the shield are located on both sides of the circuit board. The circuit board has through holes that connect the interior of the shield and the rear cavity.

[0088] Specifically, the circuit board assembly 100 also includes a speaker 140, which is disposed on the circuit board 110. The speaker 140 has a rear cavity 142. The speaker and the shield are disposed on the same side of the circuit board. The rear cavity 142 is connected to the interior of the shield. That is, the interior space of the shield is used as an expansion cavity for the rear cavity, thereby increasing the volume of the speaker 140's acoustic cavity and improving the sound quality and volume of the speaker 140. Furthermore, the reinforcement 130 reduces the possibility of a decrease in the sound quality and volume of the speaker 140 due to cracks in the shield 120 and the circuit board 110.

[0089] Alternatively, the circuit board assembly 100 may also include a speaker 140, which is disposed on the circuit board 110. The speaker 140 has a rear cavity 142. The speaker and the shield are respectively disposed on both sides of the circuit board. The circuit board has through holes, and the interior of the rear cavity 142 and the interior of the shield are connected through the through holes. That is, the interior space of the shield is used as an expansion cavity for the rear cavity, thereby increasing the volume of the speaker 140's acoustic cavity, improving the sound quality and volume of the speaker 140, etc., and using the reinforcement 130 to reduce the possibility of the speaker 140's sound quality and volume being reduced due to cracks in the shield 120 and the circuit board 110.

[0090] The speaker 140 uses a semi-sealed box. The rear cavity 142 of the speaker 140 has an opening. The box is sealed with the circuit board 110 using sealing materials such as foam. The opening of the speaker 140 is connected to the through hole 112 on the circuit board 110, so that the airflow generated by the speaker 140 can smoothly enter the interior of the shield 120 through the through hole 112, that is, enter the interior of the shield 120, so as to reuse the internal space of the shield 120, thereby expanding the rear cavity 142 of the speaker 140 and improving the sound quality and volume of the speaker 140.

[0091] This allows the shield 120 to be shaped as needed to meet the requirements of the speaker 140.

[0092] The circuit board assembly 100 provided in this application can alleviate the stress problem between the circuit board 110 and the shield 120. It can be reinforced by applying glue to the bottom of the shield 120 and / or by setting a reinforcing film 134 on the shield 120, thereby solving problems such as stress concentration and weak stress.

[0093] Specifically, such as Figure 16 As shown, a shielding cover 120 is provided on the top surface of the circuit board 110. The speaker 140 can be mounted on the circuit board 110, or the circuit board 110 can be hollowed out, and the speaker 140 can be mounted in the empty space of the circuit board 110, as shown. Figure 17 As shown, part of the speaker 140 is connected to the bottom surface (Bot) of the circuit board 110, as... Figure 18 As shown, the circuit board 110 has a through hole 112. Figure 18 The dashed line in the image indicates the location of the shielding cover 120.

[0094] As shown above, the speaker 140 forms a rear cavity 142 on the bottom surface of the circuit board 110, and the through hole 112 connects the rear cavity 142 and the interior of the shield 120.

[0095] Secondly, such as Figure 19As shown, this application provides an electronic device 200, including a circuit board assembly 100 as provided in the first aspect embodiment.

[0096] The electronic device 200 provided in this application embodiment includes the circuit board assembly 100 provided in the first aspect embodiment, and therefore has all the beneficial effects of the circuit board assembly 100 provided in the first aspect embodiment, which will not be described in detail here.

[0097] Specifically, the electronic device 200 includes a device body 210, and a circuit board assembly 100 is disposed on the device body 210.

[0098] The electronic device can be a terminal or any other device besides an electronic device. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, handheld computer, vehicle-mounted electronic device, private network communication terminal equipment (such as a walkie-talkie), mobile internet device (MID), augmented reality / virtual reality / mixed reality device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM, or self-service machine, etc. The embodiments of this application do not specifically limit it.

[0099] In the description of this specification, references to terms such as "an embodiment" or "specific embodiment" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0100] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that, include: Circuit board; A shielding cover is fixed to the circuit board; The reinforcement component is connected to the circuit board and the shielding cover.

2. The circuit board assembly according to claim 1, characterized in that, The reinforcement includes an adhesive, and the circuit board has a receiving cavity on the side facing the shield, with at least a portion of the adhesive located within the receiving cavity.

3. The circuit board assembly according to claim 2, characterized in that, The receiving cavity includes: Guide hole; The cavity is connected to the flow guide hole, and the cavity is located on the side of the flow guide hole away from the shield. The cross-sectional area of ​​the cavity is larger than the cross-sectional area of ​​the flow guide hole.

4. The circuit board assembly according to claim 3, characterized in that, The flow guide hole is located on the surface layer of the circuit board, and the cavity is located on the inner layer of the circuit board.

5. The circuit board assembly according to claim 2, characterized in that, The number of the receiving cavities is at least two, and the at least two receiving cavities are distributed around the circumference of the shield.

6. The circuit board assembly according to claim 2, characterized in that, The shield and the circuit board are connected on one side with an edge, and the adhesive covers at least part of the edge.

7. The circuit board assembly according to claim 2, characterized in that, The reinforcement also includes a reinforcement film that covers at least a portion of the shielding cover, at least a portion of the adhesive, and at least a portion of the circuit board.

8. The circuit board assembly according to claim 1, characterized in that, The reinforcement includes a reinforcement film that covers at least a portion of the shield and at least a portion of the circuit board.

9. The circuit board assembly according to claim 7 or 8, characterized in that, The reinforcing membrane has electromagnetic shielding function, and the circuit board assembly further includes: The first electronic component is disposed on the circuit board and located inside the shielding cover; A second electronic component is disposed on the circuit board, located outside the shielding cover, and the reinforcing film covers the second electronic component.

10. The circuit board assembly according to claim 7 or 8, characterized in that, The shielding cover includes: The sidewall is connected to the circuit board; The top wall is located on the side of the side wall opposite to the circuit board; The reinforcing membrane covers at least a portion of the sidewalls and at least a portion of the top wall.

11. The circuit board assembly according to any one of claims 1 to 8, characterized in that, Along the circumference of the shield, the reinforcement is connected to a portion of the shield.

12. The circuit board assembly according to any one of claims 1 to 8, characterized in that, Also includes: A loudspeaker is mounted on the circuit board, the loudspeaker having a rear cavity that is connected to the interior of the shielding cover; The rear cavity and the shielding cover are located on the same side of the circuit board, or the rear cavity and the shielding cover are located on opposite sides of the circuit board. The circuit board has a through hole that connects the interior of the shielding cover and the rear cavity.

13. An electronic device, characterized in that, include: The circuit board assembly as described in any one of claims 1 to 12.

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